EP2532048B1 - Stacked microstrip antenna - Google Patents

Stacked microstrip antenna Download PDF

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Publication number
EP2532048B1
EP2532048B1 EP10805580.7A EP10805580A EP2532048B1 EP 2532048 B1 EP2532048 B1 EP 2532048B1 EP 10805580 A EP10805580 A EP 10805580A EP 2532048 B1 EP2532048 B1 EP 2532048B1
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Prior art keywords
patch element
dielectric
microstrip antenna
patch
antenna
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EP10805580.7A
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German (de)
French (fr)
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EP2532048A1 (en
EP2532048B8 (en
Inventor
Michael Sabielny
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Hensoldt Sensors GmbH
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Airbus Defence and Space GmbH
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array

Definitions

  • the invention relates to a stacked microstrip antenna according to the preamble of patent claim 1.
  • US 7,050,004 B2 describes a microstrip antenna whose ground plane is formed by a movable diaphragm whose position relative to the microstrip antenna element can be changed by applying a voltage.
  • US 5,363,067 A describes a microstrip line with two adjacent conductors above a ground plane.
  • the space above the two conductors is formed by a respective cavity within a dielectric substrate.
  • the dielectric properties of the substrate layers are specifically controlled by introducing a further material into microsocopic cavities within the substrate layer (so-called metamaterials).
  • WO 2007/149046 A1 describes an antenna configuration in which an air cavity is located on both sides of the lower patch element.
  • the separator which separates the lower from the upper patch element, consists of a frame comprising the patch element and a dielectric layer thereon, which carries the upper patch element. Similar in the WO 2007/149046 A1 is also in the JP 2 252304 A the separator between the lower and upper patch element is constructed in two pieces from a frame comprising the lower patch element and a plate arranged thereon. The lower patch element sits on a solid material without cavities.
  • the object of the invention is to provide a generic stacked microstrip antenna, which is advantageous in terms of manufacturing technology, without the required weak electromagnetic coupling of the patch elements is lost.
  • An advantageous embodiment of the invention is the subject of a subclaim.
  • a separator is placed between the two stacked patch elements into which, e.g. by drilling or milling, one or two air cavities are introduced.
  • the separator according to the invention thus reduces to a type of support frame for the structure of the antenna, while the air cavities significantly reduce the effective dielectric constant between the patch elements.
  • the separator can be used particularly advantageously a conventional RF circuit board base material (100, Chandler AZ 85226-3415, USA S. Roosevelt Avenue eg RO 4003 ® C from Rogers Corporation, Microwave Materials Division,).
  • RF circuit board base material 100, Chandler AZ 85226-3415, USA S. Roosevelt Avenue eg RO 4003 ® C from Rogers Corporation, Microwave Materials Division,
  • Such materials usually consist of a resin with incorporated therein fiberglass inserts. The have a good stability and are manufacturing technically unproblematic. The relative relative to an HF foam material comparatively high relative dielectric constant of these materials is compensated by the one introduced cavity or two cavities.
  • the Fig. 1 and 2 each show an embodiment of the stacked microstrip antenna according to the invention with two superimposed microstrip antenna elements 1 and 10 and the ground surface 100.
  • the said conductive parts 1,10,100 are each separated by dielectric layers 5,6,7.
  • the latter consist of conventional HF printed circuit board base material and naturally have a high dielectric constant ⁇ r .
  • the lower patch element 1 is the fed patch element of the antenna, while the upper patch element 10 is the parasitic patch element.
  • the parasitic patch 10 oscillates with the signal emitted by the powered patch 1, thus improving the overall device impedance bandwidth.
  • a separator 5 is present between the two stacked patch elements 1, 10, which at the same time serves as a carrier for the upper patch element 10.
  • the material of the separator 5 is an air-filled, cuboid or cylindrical Hollow cavity 20, which is located in the embodiment shown immediately below the parasitic patch element 10. With this air cavity 20, the effective dielectric constant between the two patch elements 1, 10 is significantly reduced, resulting in the desired increased impedance bandwidth of the antenna.
  • the dielectric layer 6 between the lower patch element 1 and the ground surface 100 is formed continuously (solid material), that is to say in particular has no cavities. Thus, there is a relatively high dielectric constant between these two conductors, which is also conducive to achieving increased antenna bandwidth.
  • FIG. 2 A variant of the in Fig. 1 shown embodiment shows the Fig. 2 , Instead of just one cavity, there are two separate cavities 21 in the separator 5 below the parasitic patch element 10. The two cavities 21 were produced here by drilling in the material of the separator 5.

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Description

Die Erfindung betrifft eine gestapelte Mikrostreifen-Antenne nach dem Oberbegriff des Patentanspruchs 1.The invention relates to a stacked microstrip antenna according to the preamble of patent claim 1.

Der Fachliteratur folgend (z.B. R. B. Waterhouse, Ed., "Microstrip Patch Antennas - A Designers Guide", Kluwer Acad. Publishers, 2003, p. 90 ) darf die elektromagnetische Kopplung der beiden übereinander liegenden Mikrostreifen-AntennenElemente (im Folgenden auch kurz als Patch-Elemente bezeichnet) der Antenne nur schwach sein, damit eine breite Impedanzbandbreite erzielt werden kann. Die technische Konsequenz ist das Verwenden von HF-Schaummaterialien als Separator und Träger zwischen den beiden Patch-Elementen, da derartige Schäume eine niedrige Dielektrizitätskonstante εr aufweisen. Eine derartige Lösung mit HF-Schaummaterialien ist aus der US 7,636,063 B2 sowie aus der EP 1 793 451 A1 bekannt. Diese Schäume sind für Standard-PCB-Prozesse jedoch zu temperatur-und druckempfindlich, was zu komplizierten und kostspieligen Herstellungsverfahren führt.Following the technical literature (eg RB Waterhouse, Ed., "Microstrip Patch Antennas - A Designers Guide", Kluwer Acad. Publishers, 2003, p. 90 ), the electromagnetic coupling of the two superimposed microstrip antenna elements (also referred to below as patch elements) of the antenna must be weak, so that a broad impedance bandwidth can be achieved. The technical consequence is the use of HF foam materials as a separator and carrier between the two patch elements, since such foams have a low dielectric constant ε r . Such a solution with HF foam materials is from the US 7,636,063 B2 as well as from the EP 1 793 451 A1 known. However, these foams are too temperature and pressure sensitive for standard PCB processes, resulting in complicated and expensive manufacturing processes.

In der bereits genannten US 7,636,063 B2 sowie der US 6,333,719 B1 wird darüber hinaus ein weiterer Ansatz beschrieben, bei der der Zwischenraum zwischen den beiden Patch-Elementen komplett von einem Hohlraum gebildet wird. Der dadurch notwendige äußere Träger für eines der beiden Patch-Elemente ist als Gehäuse oder Radom ausgebildet. Dies führt ebenfalls zu aufwändigen und kostspieligen Herstellverfahren.In the already mentioned US 7,636,063 B2 as well as the US 6,333,719 B1 Furthermore, another approach is described in which the gap between the two patch elements is completely formed by a cavity. The thus required outer support for one of the two patch elements is designed as a housing or radome. This also leads to complex and costly production process.

In ZIVANOVIC, B.; WELLER, T.M.; MELAIS, S.; MEYER, T.; "The effect of alignment tolerance on multilayer air cavity microstrip patches," IEEE Antennas and Propagation Society International, Symposium, 381-384, 9-15 June 2007, doi: 10.1109/APS.2007.4395510; URL: http://ieeexplore.ieee.org/stamp/stamp. jsp?tp=&arnumber=439551 0&isnumber=4395410 ist eine Mikrostreifen-Antenne aus einem einzelnen Mikrostreifen-Antennen-Element über einer Massefläche beschrieben, wobei der dazwischen liegende dielektrische Separator eine Kavität aufweist.In ZIVANOVIC, B .; WELLER, TM; MELAIS, S .; MEYER, T .; "IEEE Antennas and Propagation Society International, Symposium, 381-384, 9-15 June 2007, doi: 10.1109 / APS.2007.4395510;" The effect of alignment tolerance on multilayer air cavity microstrip patches; URL: http://ieeexplore.ieee.org/stamp/stamp. jsp? tp = & arnumber = 439551 0 & isnumber = 4395410 For example, a microstrip antenna is described from a single microstrip antenna element over a ground plane, with the intervening dielectric separator having a cavity.

LAGER, I.E.; SIMEONI, M.; "Experimental investigation of the mutual coupling reduction by means of cavity enclosure of patch antennas," First European Conference on Antennas and Propagation, 1-5, 6-10 Nov. 2006, doi: 10.1109/EUCAP.2006.4584577; URL: http://ieeexplore.ieee.org/stamp/stamp. jsp?tp=&arnumber=4584577&isnumber=4584476 beschreiben eine Maßnahme zur Entkopplung einzelner, auf einer HF-Leiterplatte nebeneinander angeordneter Mikrostreifenantennen einer HF-Gruppenantenne. Dabei werden die einzelnen Mikrostreifenantennen jeweils von Durchkontaktierungen umgeben. BEARING, IE; SIMEONI, M .; Antennas, First European Conference on Antennas and Propagation, 1-5, 6-10 Nov. 2006, doi: 10.1109 / EUCAP.2006.4584577; URL: http://ieeexplore.ieee.org/stamp/stamp. jsp? tp = ArNumber = 4584577 & isnumber = 4584476 describe a measure for the decoupling of individual microstrip antennas of an RF array antenna arranged next to one another on an HF printed circuit board. The individual microstrip antennas are each surrounded by plated-through holes.

US 7,050,004 B2 beschreibt eine Mikrostreifen-Antenne, deren Massefläche durch eine bewegliche Membran gebildet ist, deren Lage relativ zum Mikrostreifen-Antennen-Element durch Anlegen einer Spannung verändert werden kann. US 7,050,004 B2 describes a microstrip antenna whose ground plane is formed by a movable diaphragm whose position relative to the microstrip antenna element can be changed by applying a voltage.

US 5,363,067 A beschreibt eine Mikrostreifen-Leitung mit zwei nebeneinander liegenden Leitern oberhalb einer Massefläche. Der Raum oberhalb der beiden Leiter wird durch jeweils eine Kavität innerhalb eines dielektrischen Substrats gebildet. US 5,363,067 A describes a microstrip line with two adjacent conductors above a ground plane. The space above the two conductors is formed by a respective cavity within a dielectric substrate.

In der US 2004/0189527 A1 werden die dielektrischen Eigenschaften der Substratschichten, welche zwischen den beiden Patchelementen bzw. unterhalb des unteren Patchelements angeordnet sind, gezielt gesteuert, indem ein weiteres Material in mikrosokopische Hohlräume innerhalb der Substratschicht eingebracht wird (sogenannte Metamaterialien).In the US 2004/0189527 A1 For example, the dielectric properties of the substrate layers, which are arranged between the two patch elements or underneath the lower patch element, are specifically controlled by introducing a further material into microsocopic cavities within the substrate layer (so-called metamaterials).

WO 2007/149046 A1 beschreibt eine Antennenkonfiguration, bei der sich eine Luftkavität auf beiden Seiten des unteren Patchelements befindet. Der Separator, der das untere vom oberen Patchelement trennt, besteht aus einem das unter Patchelement umfassenden Rahmen sowie einer darauf angeordneten dielektrischen Schicht, welche das obere Patchelement trägt. Ähnlich wie in der WO 2007/149046 A1 ist auch in der JP 2 252304 A der Separator zwischen unterem und oberen Patchelement zweistückig aus einem das untere Patchelement umfassenden Rahmen und darauf angeordneter Platte aufgebaut. Das untere Patchelement sitzt dabei auf einem Vollmaterial ohne Hohlräume. WO 2007/149046 A1 describes an antenna configuration in which an air cavity is located on both sides of the lower patch element. The separator, which separates the lower from the upper patch element, consists of a frame comprising the patch element and a dielectric layer thereon, which carries the upper patch element. Similar in the WO 2007/149046 A1 is also in the JP 2 252304 A the separator between the lower and upper patch element is constructed in two pieces from a frame comprising the lower patch element and a plate arranged thereon. The lower patch element sits on a solid material without cavities.

Aufgabe der Erfindung ist es, eine gattungsgemäße gestapelte Mikrostreifen-Antenne zu schaffen, die herstellungstechnisch vorteilhaft ist, ohne dass die gebotene schwache elektromagnetische Kopplung der Patch-Elemente verloren geht.The object of the invention is to provide a generic stacked microstrip antenna, which is advantageous in terms of manufacturing technology, without the required weak electromagnetic coupling of the patch elements is lost.

Diese Aufgabe wird mit dem Gegenstand des Patentanspruch 1 gelöst. Eine vorteilhafte Ausführung der Erfindung ist Gegenstand eines Unteranspruchs.This object is achieved with the subject of claim 1. An advantageous embodiment of the invention is the subject of a subclaim.

Gemäß der Erfindung wird zwischen den beiden übereinander liegenden Patch-Elementen ein Separator angeordnet, in den, z.B. durch Bohren oder Fräsen, eine oder zwei Luftkavitäten eingebracht sind.According to the invention, a separator is placed between the two stacked patch elements into which, e.g. by drilling or milling, one or two air cavities are introduced.

Dadurch ist es möglich, ein Separatormaterial zu verwenden, das herstellungstechnisch vorteilhaft ist, auch wenn dessen Dielektrizitätskonstante εr im Hinblick auf die gewünschte schwache Kopplung zwischen den Patch-Elementen nicht optimal (d.h. relativ hoch) ist. Die notwendige Anpassung erfolgt durch die in den Separator eingebrachten Kavitäten, welche die effektive Dielektrizitätskonstante zwischen den Patch-Elementen deutlich herabgesetzt. Die Folge ist eine deutliche Reduktion der elektromagnetischen Kopplung der Patch-Elemente.This makes it possible to use a separator material that is advantageous in terms of production, even if its dielectric constant ε r is not optimal (ie relatively high) with regard to the desired weak coupling between the patch elements. The necessary adaptation is effected by the cavities introduced into the separator, which markedly reduce the effective dielectric constant between the patch elements. The result is a significant reduction of the electromagnetic coupling of the patch elements.

Der erfindungsgemäße Separator reduziert sich somit auf eine Art von Halterahmen für die Struktur der Antenne, während die Luftkavitäten die effektive Dielektrizitätskonstante zwischen den Patch-Elementen deutlich heruntersetzen.The separator according to the invention thus reduces to a type of support frame for the structure of the antenna, while the air cavities significantly reduce the effective dielectric constant between the patch elements.

Als Separator kann besonders vorteilhaft ein konventionelles HF-Leiterplatten-Basismaterial (z.B. RO 4003® C der Firma Rogers Corporation, Microwave Materials Division, 100 S. Roosevelt Avenue, Chandler AZ 85226-3415, USA) verwendet werden. Derartige Materialien bestehen üblicherweise aus einem Harz mit darin eingebrachten Glasfasereinlagen. Die weisen eine gute Stabilität auf und sind herstellungstechnisch unproblematisch. Die gegenüber einem HF-Schaummaterial vergleichsweise hohe relative Dielektrizitätskonstante dieser Materialien wird durch die eine eingebrachte Kavität bzw. zwei Kavitäten kompensiert.As the separator can be used particularly advantageously a conventional RF circuit board base material (100, Chandler AZ 85226-3415, USA S. Roosevelt Avenue eg RO 4003 ® C from Rogers Corporation, Microwave Materials Division,). Such materials usually consist of a resin with incorporated therein fiberglass inserts. The have a good stability and are manufacturing technically unproblematic. The relative relative to an HF foam material comparatively high relative dielectric constant of these materials is compensated by the one introduced cavity or two cavities.

Mit der Erfindung werden insbesondere die folgenden Vorteile erzielt:

  • Durch die niedrige effektive Dielektrizitätskonstante wird eine Bandbreitenvergrößerung der Antenne ermöglicht.
  • Es können HF-Standardmaterialien und PCB-Standardprozesse zur Antennenherstellung verwendet werden, so dass kostengünstige Herstellungsverfahren ermöglicht werden.
  • Die Verfügbarkeit von robusten und breitbandigen Antennen wird ermöglicht.
  • Unabhängigkeit von technisch schwer herstellbaren, diffizilen Antennen-Lösungen basierend auf HF-Schäumen.
  • Vielseitige Anwendung dieser Technologie z.B. als Strahlerelemente für 3D-T/R-Module oder als zirkular polarisierte, strukturintegrierte Antennen.
  • Prinzipiell anwendbar für einen weiten Frequenzbereich.
In particular, the following advantages are achieved with the invention:
  • Due to the low effective dielectric constant, an increase in the bandwidth of the antenna is made possible.
  • RF standard materials and standard PCB manufacturing processes can be used to enable low cost manufacturing processes.
  • The availability of robust and broadband antennas is made possible.
  • Independence of technically difficult to manufacture, sophisticated antenna solutions based on HF foams.
  • Versatile application of this technology eg as radiator elements for 3D-T / R modules or as circular polarized, structurally integrated antennas.
  • In principle applicable for a wide frequency range.

Die Erfindung wird anhand von Fig. näher erläutert. Es zeigen:

Fig. 1
eine erste Ausführung der erfindungsgemäßen Antenne;
Fig. 2
eine zweite Ausführung der erfindungsgemäßen Antenne.
The invention will be explained in more detail with reference to FIG .. Show it:
Fig. 1
a first embodiment of the antenna according to the invention;
Fig. 2
a second embodiment of the antenna according to the invention.

Die Fig. 1 und 2 zeigen jeweils eine Ausführung der erfindungsgemäßen gestapelten Mikrostreifen-Antenne mit zwei übereinander angeordneten Mikrostreifen-Antennen-Elementen 1 und 10 sowie der Massefläche 100. Die genannten leitfähigen Teile 1,10,100 sind jeweils durch dielektrische Schichten 5,6,7 voneinander getrennt. Letztere bestehen aus konventionellem HF-Leiterplatten-Basismaterial und weisen naturgemäß eine hohe Dielektrizitätskonstante εr auf. Beim unteren Patch-Element 1 handelt es sich um das gespeiste Patch-Element der Antenne, während das obere Patch-Element 10 das parasitäre Patch-Element ist. Wie bei derartigen Antennen üblich, schwingt das parasitäre Patch-Element 10 mit dem Signal, das vom gespeisten Patch-Element 1 emittiert wird und verbessert somit die Impedanzbandbreite der Gesamtanordnung.The Fig. 1 and 2 each show an embodiment of the stacked microstrip antenna according to the invention with two superimposed microstrip antenna elements 1 and 10 and the ground surface 100. The said conductive parts 1,10,100 are each separated by dielectric layers 5,6,7. The latter consist of conventional HF printed circuit board base material and naturally have a high dielectric constant ε r . The lower patch element 1 is the fed patch element of the antenna, while the upper patch element 10 is the parasitic patch element. As is usual with such antennas, the parasitic patch 10 oscillates with the signal emitted by the powered patch 1, thus improving the overall device impedance bandwidth.

Gemäß der Erfindung ist zwischen den beiden gestapelten Patch-Elementen 1,10 ein Separator 5 vorhanden, der gleichzeitig als Träger für das obere Patch-Element 10 dient. In das Material des Separators 5 ist ein luftgefüllter, quader- oder zylinderförmiger Hohlraum 20 hineingefräßt, der sich in der gezeigten Ausführung unmittelbar unterhalb des parasitären Patch-Elements 10 befindet. Mit dieser Luftkavität 20 wird die effektive Dielektrizitätskonstante zwischen den beiden Patch-Elementen 1,10 wesentlich herabgesetzt, was zu der gewünschten erhöhten Impedanzbandbreite der Antenne führt.According to the invention, a separator 5 is present between the two stacked patch elements 1, 10, which at the same time serves as a carrier for the upper patch element 10. In the material of the separator 5 is an air-filled, cuboid or cylindrical Hollow cavity 20, which is located in the embodiment shown immediately below the parasitic patch element 10. With this air cavity 20, the effective dielectric constant between the two patch elements 1, 10 is significantly reduced, resulting in the desired increased impedance bandwidth of the antenna.

Die dielektrische Schicht 6 zwischen unterem Patch-Element 1 und Massefläche 100 ist durchgängig ausgebildet (Vollmaterial), weist also insbesondere keine Hohlräume auf. Somit besteht zwischen diesen beiden Leitern eine relativ hohe dielektrische Konstante, was ebenfalls förderlich für die Erzielung einer erhöhten Antennenbandbreite ist.The dielectric layer 6 between the lower patch element 1 and the ground surface 100 is formed continuously (solid material), that is to say in particular has no cavities. Thus, there is a relatively high dielectric constant between these two conductors, which is also conducive to achieving increased antenna bandwidth.

Eine Variante zu der in Fig. 1 gezeigten Ausführung zeigt die Fig. 2. Anstatt lediglich einer Kavität sind dort zwei getrennte Kavitäten 21 im Separator 5 unterhalb des parasitären Patch-Elements 10 vorhanden. Die beiden Kavitäten 21 wurden hier durch Bohren in dem Material des Separators 5 erzeugt.A variant of the in Fig. 1 shown embodiment shows the Fig. 2 , Instead of just one cavity, there are two separate cavities 21 in the separator 5 below the parasitic patch element 10. The two cavities 21 were produced here by drilling in the material of the separator 5.

Claims (2)

  1. Stacked microstrip antenna having the following layer construction:
    - a ground surface (100),
    - a dielectric layer (6), adjoining the top side of the ground surface (100),
    - a lower patch element (1), adjoining the top side of the dielectric layer (6),
    - a dielectric separator layer (5), above the lower patch element (1),
    - an upper patch element (10), which adjoins the top side of the dielectric separator layer (5), wherein
    - the dielectric separator layer (5) has only one or two air cavities (20, 21) between lower (1) and upper patch element (10),
    characterized in that
    - the lower patch element (1) adjoins the underside of the dielectric separator layer (5);
    - the dielectric layer (6) between ground surface (100) and lower patch element (1) consists of a solid material without cavities.
  2. Stacked microstrip antenna according to Claim 1, characterized in that the dielectric separator layer (5) consists of an RF printed circuit board base material.
EP10805580.7A 2010-02-04 2010-11-26 Stacked microstrip antenna Active EP2532048B8 (en)

Applications Claiming Priority (2)

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DE102010006809A DE102010006809A1 (en) 2010-02-04 2010-02-04 Stacked microstrip antenna
PCT/DE2010/001377 WO2011095144A1 (en) 2010-02-04 2010-11-26 Stacked microstrip antenna

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EP2532048A1 EP2532048A1 (en) 2012-12-12
EP2532048B1 true EP2532048B1 (en) 2016-07-13
EP2532048B8 EP2532048B8 (en) 2016-08-24

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KR (1) KR101701946B1 (en)
AU (1) AU2010345007B2 (en)
DE (1) DE102010006809A1 (en)
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WO (1) WO2011095144A1 (en)

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US7636063B2 (en) * 2005-12-02 2009-12-22 Eswarappa Channabasappa Compact broadband patch antenna
US7450072B2 (en) * 2006-03-28 2008-11-11 Qualcomm Incorporated Modified inverted-F antenna for wireless communication
WO2007149046A1 (en) 2006-06-22 2007-12-27 Meds Technologies Pte Ltd Quasi-planar circuits with air cavities

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DE102010006809A1 (en) 2011-08-04
KR101701946B1 (en) 2017-02-02
WO2011095144A1 (en) 2011-08-11
AU2010345007A9 (en) 2013-01-24
AU2010345007B2 (en) 2015-12-24
JP2013519275A (en) 2013-05-23
EP2532048A1 (en) 2012-12-12
EP2532048B8 (en) 2016-08-24
KR20130008007A (en) 2013-01-21
US9196965B2 (en) 2015-11-24
IL221150A (en) 2015-10-29
US20130002491A1 (en) 2013-01-03
AU2010345007A1 (en) 2012-09-06

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