EP2475046A1 - Electronic device with magnetic retention of an electronic component - Google Patents
Electronic device with magnetic retention of an electronic component Download PDFInfo
- Publication number
- EP2475046A1 EP2475046A1 EP11305012A EP11305012A EP2475046A1 EP 2475046 A1 EP2475046 A1 EP 2475046A1 EP 11305012 A EP11305012 A EP 11305012A EP 11305012 A EP11305012 A EP 11305012A EP 2475046 A1 EP2475046 A1 EP 2475046A1
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- EP
- European Patent Office
- Prior art keywords
- component
- electronic device
- magnet
- cavity
- card
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/6205—Two-part coupling devices held in engagement by a magnet
Definitions
- the present invention relates to electronic devices configured to receive and / or connect an electronic chip component of integrated circuits.
- the invention relates to devices such as cell phones, PDAs, portable audio devices, game terminals capable of connecting removable or detachable components.
- the electronic components may be in particular form of integrated circuit card, smart card or other form, CMS ....
- the devices may more specifically be memory cards including type SD, MMC, Memory stick ....
- the devices themselves may be portable and detachable components capable of receiving other components.
- the invention also relates to form adapters for enabling the connection of an electronic chip component to a connector of a host device.
- the present invention specifically targets a set consisting of a reduced-size card, including SIM card and an associated host card, including a memory card.
- the memory cards referred to have all different formats and a generally rectangular shape, with longitudinal conductive pads arranged on or in one of the main parallel faces and in the vicinity of a transverse edge of the map.
- SIM card connector is on a main surface and the SIM card is kept in contact on the PCMCIA card by interaction with a computer slot wall.
- SIM cards having 5 ⁇ 5 mm 2 and 0.6 mm thickness are contemplated.
- the invention aims to solve the aforementioned drawbacks.
- the invention aims to facilitate the insertion or removal and the holding in position of the electronic chip component (microcard) with respect to its host device without any risk of loss of the chip component during handling.
- the invention proposes an electronic device comprising means of connection to a chip component of integrated circuits and means for holding the connection position of the component;
- the device is distinguished in that the position holding means are configured to exert a magnetic holding force (F) on said component.
- the invention also relates to an electronic system comprising an electronic device and an electronic chip component held in position by magnetic force in a dedicated location E, against the device.
- the invention has the advantage of avoiding a risk of loss of the chip component supported by a host device when it is removed from the device.
- the invention also has the advantage of avoiding locking means and having a simplest possible construction. In fact, there may be little structural impact on the construction of the host device and none on that of the microcard.
- the card is here a subscriber identification card (SIM) of a reduced size. It measures approximately 5 mm x 5 mm with a thickness of approximately 600 ⁇ m; The component or card may have a weight of less than about 0.1 to 0.5 grams.
- SIM subscriber identification card
- the card is obtained by overmolding a plastic or resin material on a module comprising an integrated circuit chip connected to contact pads coming to the surface of the card.
- the component may consist of a chip or several chips stacked or juxtaposed with or without coating or packaging. These chips may include an interface including an antenna etched on the silicon or deposited on surfaces of the chip.
- the chip may have for example a dimension of 3 X 3 mm of main surface and 0.1 mm to 0.3 mm thick.
- an integrated circuit chip (which, by definition, comprises a semiconductor material), in particular a smart card, is attracted by a flat-type magnet (1 mm thick and 5 ⁇ 5 mm in area) and sufficient to be held in place and / or to connect an interface in a host device.
- the chip comprises in itself a material or alloy adapted to cooperate with a magnet so as to undergo a force of attraction or repulsion.
- the chip may comprise contact pads (projecting or not) of its active surface, an RF antenna, any other means of communication (capacitive, optical ”).
- the electronic device 1A comprises connection means (C) for connecting any host.
- the connection can make it possible to connect a component 3 (directly or via an electrical or electronic circuit) with the host of the device.
- Component 3 to chip of integrated circuits.
- These means may be of any type to provide a communication link and / or electrical connection via these connection means and / or communication.
- the connection can be of the type with electrical contacts 2B as at figure 4 or non-contact type, in particular via an antenna interface, capacitive, optical, inductive winding, etc.
- the device it is illustrated here by a memory card type SD 2.1 mm thick;
- the card may include one or more cavities or location for connection and / or storage of one or more components.
- each component is associated with an application, a game, a right of use and / or physical and / or logical access.
- a user positions a component in a communication or connection location according to his need.
- the device may include a host device such as a reader, a form adapter for connecting a component of a generation in a connector provided for a component of another generation.
- the device here also includes a surface connector C for connecting a compatible reader.
- This card also optionally includes ( Fig. 3 ) a connector 12 and a slot 13 for receiving and connecting an SD microcard (1B).
- the device also comprises means 4 for holding the component in position against it.
- the device comprises at least one location (E) of the component.
- the location coincides with a cavity 8 for receiving the component.
- the location may also be on the surface of the device without a cavity.
- the holding means 4 in position are configured to exert a magnetic holding force F on said component 3.
- the device 1A comprises a material 4 capable of magnetically interacting with a material of the component.
- the device comprises at least one permanent magnet 4 and the component comprises either another magnet or a ferromagnetic material 16 (steel, iron, etc.).
- the interaction can be an attraction (magnet / steel) or a repulsion (magnet / magnet with identical pole opposite).
- the magnet can be arranged in the device as illustrated in FIG. figure 3 . It comprises a main face 7 preferably substantially equivalent to that of the component and a thickness of 1 mm; It is arranged facing a location (E) of a main surface 9 of the component when it is in the connection position to exert a frontal attraction force F on the component.
- the metal of the contact pads 16 is used as a material interacting with the magnet.
- the ranges contain a layer of ferromagnetic material such as steel, coated with an anticorrosion material (stainless treatment, copper / nickel or chromium, gold, platinum tin, silver, palladium, platinum
- the tests carried out for the insertion of the component 3 have been very conclusive, because the magnetic attraction force constitutes an aid for the positioning, centering and insertion of the card into the cavity.
- There is a positioning, automatic sliding of the card in the cavity which is convenient for the user.
- the electrical contact is immediate with a pressure force directly related to the power of the magnet and concentration of ferromagnetic particles in the board.
- the connector of the device preferably comprises spring blades 2 or a coil spring for each contact.
- the invention provides any other means of elastic connection or not.
- the connector may comprise tracks arranged on an elastic support; the contacts may themselves be of conductive elastic material (conductive elastomer for example).
- the materials interacting with each other can be distributed at different places in the device and in the component.
- the magnet may be in the card and / or in the device. If disposed in the device, the magnet may be preferably constituted by a plate or sheet placed behind a printed circuit (PCB here a thickness of 200 microns) and / or a connector 2B of the device for connecting the component.
- PCB printed circuit
- the interaction material with the magnet of the device can be placed on any face of the component; It can be placed in particular on the rear face of the opposite component to the face having a communication interface.
- the interaction material may be another magnet or a ferromagnetic material.
- the device may carry a ferromagnetic material intended to cooperate with a magnet in the component.
- the material of the device itself (ex: silicon / iron alloy) is sufficiently ferromagnetic to interact with the magnet;
- the material can be added by stacking or redirecting methods.
- the general structures of the device and the component remain unchanged.
- the component its external shape remains unchanged since a ferromagnetic version of the contact pads is used.
- the areas are not ferromagnetic, for example made by printing conductive material (ink, screen printing, aluminum, copper or a non-sensitive material to magnetism (copper 7), it is possible to add a ferromagnetic metallization in particular at least one sheet having the desired properties, for example on the rear face of the card or on at least one of its sides or slices.
- the component may conform to the smart card 3 of the figure 1 ;
- the contact pads may include the interaction material with the central magnet 3. This configuration has the advantage of being closer to the component while minimizing the overall thickness of the device.
- the magnets can be arranged on the printed circuit of the device, around a possible connector and have an overall thickness even smaller.
- all or part of the surface of the component outside the contact areas may comprise a coating or a paint comprising ferromagnetic or magnetic particles or an alloy / combination producing an equivalent effect.
- Fig. 4A illustrates a preferred arrangement of the magnet and interaction material facing each other via their respective major faces.
- FIG. 4B there is illustrated another possible arrangement for the host device. It comprises at least two magnets 15a, 15b disposed on either side of a central location (E) of the component. The magnets exert a lateral force (L) parallel to one of the main faces of the component.
- a host card 1A may comprise a connector comprising leaf springs 2; They are arranged so that the component exceeds the receiving cavity 8 while being supported on the uncompressed blades. Then, when inserting the host card in a host device, the component is pushed into the cavity in the direction of the arrow to improve or guarantee the electrical contact and then slid with the card in a slot 13B. The component is held down in the cavity against a restoring force of the spring blades because it comes to bear against its back face against an inner wall of the slot.
- the slot can belong to any device, reader, device 20.
- the device 1A is therefore intended to cooperate with a wall of a slot 19 of a host apparatus 20 to counteract elastic forces of a connector of the device on the component.
- the receiving cavity 8 of the component 3 comprises a recess 9 on one of the flanges 10 of the cavity to facilitate the extraction of the component. It is however possible to eject the component simply by a sharp blow of the card on the hollow of the hand so as to collect the component in the hand.
- the figure 7 illustrates another embodiment of an assembly between a host device 1A and a component 3;
- the device preferably comprises an outwardly opening cavity 8 for receiving said component 3 so that its contact pads are facing outwards;
- the device 1A is intended to serve as a wedge for the component in a receiving slot 22.
- the contact pads of the component connect pads of a connector of a device or other host device receiving device 1A.
- the connector opens into the slot towards the contact pads 16.
- the device may comprise a magnet 4 placed above the component and exerting a repulsive force towards a connector placed in the cavity below the component.
- the device 1A comprises a mark keying device 23 disposed on one of the surfaces 24 of the device in the vicinity of the cavity and intended to correspond to a mark 25 disposed on the component.
- the figure 2 illustrates a microcard 1B micro SD type; It has a location (E) in a receiving cavity of the card 3.
- the microcard is intended to be inserted into a slot of a host apparatus 20.
- the connector is here composed of pads 2B of conductive elastic material.
- Two magnets (not shown) can be arranged as in Figure 4B on both sides of the cavity to reduce clutter.
Abstract
Description
La présente invention concerne des dispositifs électroniques configurés pour recevoir et/ou connecter un composant électronique à puce de circuits intégrés.The present invention relates to electronic devices configured to receive and / or connect an electronic chip component of integrated circuits.
En particulier, l'invention concerne des dispositifs tels que des téléphones cellulaires, les PDA, dispositifs audio portables, des terminaux de jeu aptes à connecter des composants amovibles ou détachables. Les composants électroniques peuvent être sous forme notamment de carte à circuit intégrés, carte à puce ou autre forme, CMS.... Les dispositifs peuvent plus être spécifiquement des cartes mémoire notamment de type SD, MMC, Memory stick.... Le cas échéant, les dispositifs peuvent être eux-mêmes des composants portables et détachables aptes à recevoir d'autres composants.In particular, the invention relates to devices such as cell phones, PDAs, portable audio devices, game terminals capable of connecting removable or detachable components. The electronic components may be in particular form of integrated circuit card, smart card or other form, CMS .... The devices may more specifically be memory cards including type SD, MMC, Memory stick .... The case Where appropriate, the devices themselves may be portable and detachable components capable of receiving other components.
L'invention concerne également des adaptateurs de forme pour permettre la connexion d'un composant à puce électronique dans un connecteur d'un dispositif hôte.The invention also relates to form adapters for enabling the connection of an electronic chip component to a connector of a host device.
La présente invention vise spécifiquement un ensemble composé d'une carte au format réduit, notamment carte SIM et une carte hôte associée, notamment une carte à mémoire. Les cartes à mémoire visées ont toutes différents formats et une forme générale rectangulaire, avec des plages conductrices longitudinales agencées sur ou dans l'une des faces principales parallèles et au voisinage d'un bord transversal de la carte.The present invention specifically targets a set consisting of a reduced-size card, including SIM card and an associated host card, including a memory card. The memory cards referred to have all different formats and a generally rectangular shape, with longitudinal conductive pads arranged on or in one of the main parallel faces and in the vicinity of a transverse edge of the map.
Les dispositifs existants tels que des appareils photographiques, lecteurs, prévoient des moyens de verrouillage ou de maintien additionnels tels que des couvercles ou capots articulés ou coulissants. Ces systèmes de maintien constituent une source de complication mécanique ou d'épaisseur supplémentaire du dispositif et rendent la manoeuvre de connexion compliquée comme expliquée ci-après, par exemple en quatre temps :
- retrait d'une carte à mémoire hôte d'une fente de réception d'un appareil de lecture,
- déverrouillage et ouverture d'un couvercle de maintien de carte réduite dans la carte hôte,
- insertion de la carte réduite dans une cavité de la carte hôte,
- fermeture et verrouillage du couvercle, insertion de la carte hôte dans l'appareil hôte.
- removing a host memory card from a receiving slot of a reading device,
- Unlocking and opening a reduced card retention cover in the host card
- insertion of the reduced card in a cavity of the host card,
- closing and locking the cover, inserting the host card into the host device.
Il existe des cartes à mémoire notamment au format PCMCIA qui constituent également un lecteur de carte SIM au format ISO 7816 et qui se dispense de moyens de maintien de type couvercle. Le connecteur de la carte SIM est sur une surface principale et la carte SIM est maintenue en contact sur la carte PCMCIA par interaction avec une paroi de fente d'ordinateur.There are memory cards in particular in PCMCIA format which also constitute a SIM card reader in ISO 7816 format and which dispenses with lid type holding means. The SIM card connector is on a main surface and the SIM card is kept in contact on the PCMCIA card by interaction with a computer slot wall.
D'autre part, on assiste à une diminution du poids et dimension d'objets portables à puce électronique tels des cartes à puce. Ainsi, par exemple, on envisage des cartes SIM ayant 5x5 mm2 et de 0,6 mm d'épaisseur.On the other hand, there is a decrease in the weight and size of smart electronic objects such as smart cards. So, by For example, SIM cards having 5 × 5
Or, il est très facile de perdre ce composant du fait de sa petite dimension et de son poids plume au gré du vent ou d'une vibration. L'application de systèmes sans couvercle ci-dessus aux systèmes composés de cartes à mémoires hôtes et microcartes réduites envisagées aujourd'hui n'est pas satisfaisante car à chaque extraction de la carte à mémoire de son hôte (appareils photographiques, etc) comporte un risque de perte de la microcarte réduite.However, it is very easy to lose this component because of its small size and featherweight with the wind or a vibration. The application of systems without cover above to the systems composed of reduced host and microcard cards envisaged today is not satisfactory because each extraction of the memory card from its host (cameras, etc) has a risk of loss of the reduced microcard.
L'invention a pour objectif de résoudre les inconvénients précités.The invention aims to solve the aforementioned drawbacks.
L'invention vise à faciliter l'insertion ou le retrait et le maintien en position du composant à puce électronique (microcarte) vis à vis de son dispositif hôte sans aucun risque de perte du composant à puce pendant la manipulation.The invention aims to facilitate the insertion or removal and the holding in position of the electronic chip component (microcard) with respect to its host device without any risk of loss of the chip component during handling.
A cet effet, l'invention propose un dispositif électronique comportant des moyens de connexion à un composant à puce de circuits intégrés et des moyens de maintien en position de connexion du composant;For this purpose, the invention proposes an electronic device comprising means of connection to a chip component of integrated circuits and means for holding the connection position of the component;
Le dispositif se distingue en ce que les moyens de maintien en position sont configurés pour exercer une force (F) de maintien de type magnétique sur ledit composant.The device is distinguished in that the position holding means are configured to exert a magnetic holding force (F) on said component.
Selon d'autres caractéristiques de l'invention :
- Le dispositif comprend un matériau apte à interagir magnétiquement avec un matériau du composant ;
- Le matériau comprend au moins un aimant ;
- Le dispositif comporte au moins deux aimants disposés de part et d'autre d'un emplacement (E) du composant ;
- le composant est une carte avec des plages ou plots de contact ferromagnétiques (16) ou est une puce de circuits intégrés.
- L'aimant est sous forme d'au moins une feuille oui plaque ;
- L'aimant est disposé derrière une plaque de circuit imprimé (26) et/ou derrière un connecteur porté par le circuit imprimé ;
- Le composant porte un aimant destiné à coopérer avec un autre aimant ou un matériau ferromagnétique du dispositif.
- le composant peut comprendre ou est constitué d'un matériau ferromagnétique.
- The device comprises a material capable of magnetically interacting with a material of the component;
- The material comprises at least one magnet;
- The device comprises at least two magnets arranged on either side of a location (E) of the component;
- the component is a board with ferromagnetic pads or contact pads (16) or is a chip of integrated circuits.
- The magnet is in the form of at least one sheet yes plate;
- The magnet is disposed behind a printed circuit board (26) and / or behind a connector carried by the printed circuit;
- The component carries a magnet for cooperating with another magnet or a ferromagnetic material of the device.
- the component may comprise or consist of a ferromagnetic material.
L'invention a également pour objet un système électronique comportant un dispositif électronique et un composant à puce électronique maintenu en position par force magnétique dans un emplacement dédié E, contre le dispositif.The invention also relates to an electronic system comprising an electronic device and an electronic chip component held in position by magnetic force in a dedicated location E, against the device.
L'invention a l'avantage d'éviter un risque de perte du composant à puce supporté par un dispositif hôte lorsque celui-ci est retiré du dispositif.The invention has the advantage of avoiding a risk of loss of the chip component supported by a host device when it is removed from the device.
L'invention a aussi l'avantage de s'affranchir de moyens de verrouillage et d'avoir une construction la plus simple possible. En fait, il peut y avoir peu d'impact de structure sur la construction du dispositif hôte et aucun sur celle de la microcarte.The invention also has the advantage of avoiding locking means and having a simplest possible construction. In fact, there may be little structural impact on the construction of the host device and none on that of the microcard.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description détaillée qui suit pour la compréhension de laquelle on se reportera aux dessins annexés dans lesquels :
- la
figure 1 est une vue en perspective qui représente schématiquement un premier mode de réalisation d'un dispositif hôte conforme aux enseignements de l'invention et un composant sous en cours de mise en place dans le dispositif hôte; - la
figure 2 est une vue en coupe longitudinale qui représente schématiquement une microcarte hôte de lafigure 1 en cours d'insertion dans une fente d'un dispositif hôte ; - les
figures 3 et 4 sont respectivement une vue de dessous du mode de réalisation de lafigure 1 et une coupe longitudinale de cette vue de dessus, la microcarte SD étant retirée; - les
figures 4A et 4B illustrent schématiquement deux configurations des moyens de rappel magnétiques du composant conformes à l'invention. - la
figure 5 illustre l'insertion du dispositif dans un appareil hôte et sa coopération avec le dispositif pour une bonne connexion électrique ; - la
figure 6 illustre des moyens facilitant l'extraction du composant de sa cavité ainsi que sa coupe selon BB; - la
figure 7 illustre un assemblage d'une carte hôte avec une microcarte pour une connexion de la microcarte dans un dispositif ou appareil hôte; - les
figures 8 et 9 illustrent respectivement une première et seconde cavité ou emplacement de réception du composant ; - les
figures 10 et 11 illustrent deux types de détrompeur.
- the
figure 1 is a perspective view which schematically shows a first embodiment of a host device according to the teachings of the invention and a sub-component being implemented in the host device; - the
figure 2 is a longitudinal sectional view which schematically shows a microcar host of thefigure 1 during insertion into a slot of a host device; - the
Figures 3 and 4 are respectively a bottom view of the embodiment of thefigure 1 and a longitudinal section of this view from above, the micro SD card being removed; - the
Figures 4A and 4B schematically illustrate two configurations of the magnetic return means of the component according to the invention. - the
figure 5 illustrates the insertion of the device into a host device and its cooperation with the device for a good electrical connection; - the
figure 6 illustrates means facilitating the extraction of the component from its cavity and its section along BB; - the
figure 7 illustrates an assembly of a host card with a microcard for connection of the microcard to a host device or apparatus; - the
Figures 8 and 9 respectively illustrate a first and second cavity or receiving location of the component; - the
Figures 10 and 11 illustrate two types of polarizer.
Dans la description qui va suivre, des éléments identiques, similaires ou analogues seront désignés par les mêmes chiffres de référence.In the following description, identical, similar or similar elements will be designated by the same reference numerals.
On a représenté sur les
D'autres formats de composant sont concernés par l'invention, notamment le format CMSD.Other component formats are concerned by the invention, in particular the CMSD format.
Le cas échéant, le composant peut être constitué d'une puce ou plusieurs puces empilées ou juxtaposées avec ou sans enrobage ou conditionnement. Ces puces peuvent comprendre une interface notamment à antenne gravée sur le silicium ou déposée sur des surfaces de la puce. La puce peut avoir par exemple une dimension de 3 X 3 mm de surface principale et de 0,1 mm à 0,3 mm d'épaisseur.If necessary, the component may consist of a chip or several chips stacked or juxtaposed with or without coating or packaging. These chips may include an interface including an antenna etched on the silicon or deposited on surfaces of the chip. The chip may have for example a dimension of 3 X 3 mm of main surface and 0.1 mm to 0.3 mm thick.
On a constaté avec étonnement qu'une puce de circuit intégré (comportant par définition un matériau semi-conducteur), notamment de carte à puce, est attirée par un aimant du type plat (1mm d'épaisseur et 5x5 mm de surface) et de manière suffisante pour être maintenu en place et/ou connecter une interface dans un dispositif hôte. La puce comprend en elle-même un matériau ou alliage adapté à coopérer avec un aimant de manière à subir une force d'attraction ou de répulsion. La puce peut comprendre des plots de contacts (saillants ou non) de sa surface active, une antenne RF, tout autre moyen de communication (capacitif, optique...)It has been surprisingly found that an integrated circuit chip (which, by definition, comprises a semiconductor material), in particular a smart card, is attracted by a flat-type magnet (1 mm thick and 5 × 5 mm in area) and sufficient to be held in place and / or to connect an interface in a host device. The chip comprises in itself a material or alloy adapted to cooperate with a magnet so as to undergo a force of attraction or repulsion. The chip may comprise contact pads (projecting or not) of its active surface, an RF antenna, any other means of communication (capacitive, optical ...)
Le dispositif électronique 1A comporte des moyens de connexion (C) destinés à connecter un hôte quelconque. La connexion peut permettre de mettre en relation de communication de données un composant 3, (directement ou par l'intermédiaire d'un circuit électrique ou électronique) avec l'hôte du dispositif. Le composant 3 à puce de circuits intégrés. Ces moyens peuvent être de tout type pour assurer une liaison de communication et/ou connexion électrique via ces moyens de connexion et/ou de communication. La liaison peut être de type à contacts électriques 2B comme à la
Quant au dispositif, il est illustré ici par une carte à mémoire de type SD de 2,1 mm d'épaisseur; En application de ci-dessus, la carte peut comporter une ou plusieurs cavités ou emplacement pour connexion et/ou rangement d'un ou plusieurs composants. Par exemple, chaque composant est associé à une application, un jeu, un droit d'utilisation et/ou d'accès physique et/ou logique. Un utilisateur positionne un composant dans un emplacement de communication ou connexion en fonction de son besoin.As for the device, it is illustrated here by a memory card type SD 2.1 mm thick; In application of above, the card may include one or more cavities or location for connection and / or storage of one or more components. For example, each component is associated with an application, a game, a right of use and / or physical and / or logical access. A user positions a component in a communication or connection location according to his need.
Le dispositif peut être notamment un appareil hôte comme un lecteur, un adaptateur de forme pour connecter un composant d'une génération dans un connecteur prévu pour un composant d'une autre génération. Le dispositif comporte ici également un connecteur C en surface pour connecter un lecteur compatible. Cette carte comporte également de manière facultative (
Le dispositif comporte également des moyens 4 de maintien en position du composant contre lui. Le dispositif comprend au moins un emplacement (E) du composant. Dans l'exemple, l'emplacement coïncide avec une cavité 8 de réception du composant. L'emplacement peut être aussi en surface du dispositif sans cavité.The device also comprises
Selon une caractéristique, les moyens de maintien 4 en position sont configurés pour exercer une force F de maintien de type magnétique sur ledit composant 3. Le dispositif 1A comprend un matériau 4 apte à interagir magnétiquement avec un matériau du composant. Dans l'exemple, le dispositif comprend au moins un aimant permanent 4 et le composant comporte soit un autre aimant, soit un matériau 16 ferromagnétique (acier, fer...). L'interaction peut être une attraction (aimant / acier) ou une répulsion (aimant/aimant avec pôle identique en regard).According to one characteristic, the holding means 4 in position are configured to exert a magnetic holding force F on said
L'aimant peut être disposé dans le dispositif comme illustré à la
De manière avantageuse, on utilise le métal des plages de contact 16 comme matériau interagissant avec l'aimant. Les plages contiennent une couche de matériau ferromagnétique tel que l'acier, revêtue d'une matière anticorrosion (traitement inoxydable, cuivre/ nickel ou chrome, or, platine étain, argent, palladium, platineAdvantageously, the metal of the
Les essais effectués pour l'insertion du composant 3 ont été très concluants, car la force d'attraction magnétique constitue une aide au positionnement, centrage et introduction de la carte dans la cavité. On entend un bruit de claquement lors de l'introduction de la carte qui atteste de sa bonne insertion dans la cavité et qui rassure l'utilisateur du maintien instantané de la carte par le dispositif. On observe un positionnement, glissement automatique de la carte dans la cavité qui est pratique pour l'utilisateur. Le contact électrique est immédiat avec une force de pression directement fonction de la puissance de l'aimant et concentration de particules ferromagnétiques dans la carte.The tests carried out for the insertion of the
Le connecteur du dispositif comprend de préférence des lames ressorts 2 ou un ressort hélicoïdal pour chaque contact. Toutefois, l'invention prévoit tout autre moyen de connexion élastique ou non. En particulier, le connecteur peut comprendre des pistes disposés sur un support élastique ; les contacts peuvent être eux-mêmes en matière conductrice élastique (élastomère conducteur par exemple).The connector of the device preferably comprises
Les matériaux interagissant entre eux peuvent être répartis à différents endroits dans le dispositif et dans le composant.The materials interacting with each other can be distributed at different places in the device and in the component.
L'aimant, par exemple, peut être dans la carte et/ou dans le dispositif. Si disposé dans le dispositif, l'aimant peut être constitué de préférence par une plaque ou feuille placée derrière un circuit imprimé (PCB ici une épaisseur de 200 µm) et/ou un connecteur 2B du dispositif destiné à connecter le composant. Concernant le composant, le matériau d'interaction avec l'aimant du dispositif peut être placé sur une face quelconque du composant ; Il peut être placé notamment sur la face arrière du composant opposée à la face comportant une interface de communication. Le matériau d'interaction peut être un autre aimant ou un matériau ferromagnétique.The magnet, for example, may be in the card and / or in the device. If disposed in the device, the magnet may be preferably constituted by a plate or sheet placed behind a printed circuit (PCB here a thickness of 200 microns) and / or a
Alternativement, par rapport aux exemples illustrés sur les figures, le dispositif peut porter un matériau ferromagnétique destiné à coopérer avec un aimant dans le composant. Le matériau du dispositif lui-même (ex : alliage silicium/fer) est suffisamment ferromagnétique pour interagir avec l'aimant ; Le matériau peut être ajouté par des méthodes d'empilage ou de redirection.Alternatively, with respect to the examples illustrated in the figures, the device may carry a ferromagnetic material intended to cooperate with a magnet in the component. The material of the device itself (ex: silicon / iron alloy) is sufficiently ferromagnetic to interact with the magnet; The material can be added by stacking or redirecting methods.
Grâce à l'invention, les structures générales du dispositif et du composant restent inchangées. Pour le composant, sa forme externe demeure inchangée puisque on utilise une version ferromagnétique des plages de contact. Dans le cas où les plages ne sont pas ferromagnétiques, par exemple réalisée par impression de matière conductrice (encre, sérigraphie, aluminium, cuivre ou une matière non sensible au magnétisme (cuivre...), il est possible d'adjoindre une métallisation ferromagnétique notamment au moins une feuille ayant les propriétés recherchées, par exemple sur la face arrière de la carte ou sur au moins un de ses côtés ou tranches.Thanks to the invention, the general structures of the device and the component remain unchanged. For the component, its external shape remains unchanged since a ferromagnetic version of the contact pads is used. In the case where the areas are not ferromagnetic, for example made by printing conductive material (ink, screen printing, aluminum, copper or a non-sensitive material to magnetism (copper ...), it is possible to add a ferromagnetic metallization in particular at least one sheet having the desired properties, for example on the rear face of the card or on at least one of its sides or slices.
Le composant peut être conforme à la carte à puce 3 de la
Alternativement, tout ou partie de la surface du composant en dehors des plages de contact, peut comporter un revêtement ou une peinture comportant des particules ferromagnétiques ou magnétiques ou un alliage / combinaison produisant un effet équivalent.Alternatively, all or part of the surface of the component outside the contact areas may comprise a coating or a paint comprising ferromagnetic or magnetic particles or an alloy / combination producing an equivalent effect.
La figue 4A illustre un agencement préféré de l'aimant et du matériau d'interaction en regard l'un de l'autre via leur face principale respective. A la
A la
Le dispositif 1A est donc destiné à coopérer avec une paroi d'une fente 19 d'un appareil hôte 20 pour contrer des forces élastiques d'un connecteur du dispositif sur le composant.The
A la
La
Aux
Aux
La
La microcarte est destinée à être insérée dans une fente d'un appareil hôte 20. Le connecteur est ici composé de plots 2B en matière conductrice élastique. Deux aimants (non représentés) peuvent être disposés comme à la
Claims (14)
caractérisé en ce que les moyens (4) de maintien en position sont configurés pour exercer une force (F) de maintien de type magnétique sur ledit composant 3.Electronic device (1A, 1B) comprising connection means (2) to an integrated circuit chip component (3) and means (4) for holding the component in the connection position,
characterized in that the holding means (4) are configured to exert a magnetic holding force (F) on said component 3.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11305012A EP2475046A1 (en) | 2011-01-06 | 2011-01-06 | Electronic device with magnetic retention of an electronic component |
ES11804711.7T ES2638303T3 (en) | 2011-01-06 | 2011-12-29 | Electronic device with magnetic retention of an electronic component |
PCT/EP2011/074261 WO2012093066A1 (en) | 2011-01-06 | 2011-12-29 | Electronic device having magnetic hold of an electronic component |
EP11804711.7A EP2661790B1 (en) | 2011-01-06 | 2011-12-29 | Electronic device with magnetically holding device of electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11305012A EP2475046A1 (en) | 2011-01-06 | 2011-01-06 | Electronic device with magnetic retention of an electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2475046A1 true EP2475046A1 (en) | 2012-07-11 |
Family
ID=43629105
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11305012A Withdrawn EP2475046A1 (en) | 2011-01-06 | 2011-01-06 | Electronic device with magnetic retention of an electronic component |
EP11804711.7A Active EP2661790B1 (en) | 2011-01-06 | 2011-12-29 | Electronic device with magnetically holding device of electronic component |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11804711.7A Active EP2661790B1 (en) | 2011-01-06 | 2011-12-29 | Electronic device with magnetically holding device of electronic component |
Country Status (3)
Country | Link |
---|---|
EP (2) | EP2475046A1 (en) |
ES (1) | ES2638303T3 (en) |
WO (1) | WO2012093066A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160045284A (en) * | 2014-10-17 | 2016-04-27 | 삼성전자주식회사 | Tray, jig for separating tray and electronic device therof |
CN106877033A (en) * | 2017-03-28 | 2017-06-20 | 张昊 | A kind of automatically controlled device for ejecting of SIM |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020014535A1 (en) * | 2000-03-02 | 2002-02-07 | Kabushiki Kaisha Toshiba | Memory card and card socket |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2653246A1 (en) * | 1989-10-18 | 1991-04-19 | Guerin Georges | Assembly of memory card and rapid-passage reading totem |
-
2011
- 2011-01-06 EP EP11305012A patent/EP2475046A1/en not_active Withdrawn
- 2011-12-29 ES ES11804711.7T patent/ES2638303T3/en active Active
- 2011-12-29 EP EP11804711.7A patent/EP2661790B1/en active Active
- 2011-12-29 WO PCT/EP2011/074261 patent/WO2012093066A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020014535A1 (en) * | 2000-03-02 | 2002-02-07 | Kabushiki Kaisha Toshiba | Memory card and card socket |
Also Published As
Publication number | Publication date |
---|---|
EP2661790B1 (en) | 2017-03-22 |
WO2012093066A1 (en) | 2012-07-12 |
EP2661790A1 (en) | 2013-11-13 |
ES2638303T3 (en) | 2017-10-19 |
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