EP2474040A4 - Aluminum paste for a back electrode of solar cell - Google Patents

Aluminum paste for a back electrode of solar cell

Info

Publication number
EP2474040A4
EP2474040A4 EP10813967.6A EP10813967A EP2474040A4 EP 2474040 A4 EP2474040 A4 EP 2474040A4 EP 10813967 A EP10813967 A EP 10813967A EP 2474040 A4 EP2474040 A4 EP 2474040A4
Authority
EP
European Patent Office
Prior art keywords
solar cell
back electrode
aluminum paste
paste
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10813967.6A
Other languages
German (de)
French (fr)
Other versions
EP2474040A2 (en
Inventor
Chang-Mo Lee
Seung-Yong Lee
Dae-Sung Lim
Hyung-Sub Choi
Seung-Kwon Hong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongwoo Fine Chem Co Ltd
Original Assignee
Dongwoo Fine Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongwoo Fine Chem Co Ltd filed Critical Dongwoo Fine Chem Co Ltd
Publication of EP2474040A2 publication Critical patent/EP2474040A2/en
Publication of EP2474040A4 publication Critical patent/EP2474040A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01038—Strontium [Sr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
EP10813967.6A 2009-09-04 2010-09-03 Aluminum paste for a back electrode of solar cell Withdrawn EP2474040A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20090083460 2009-09-04
KR1020100085604A KR20110025614A (en) 2009-09-04 2010-09-01 Aluminium paste for a back electrode of solar cell
PCT/KR2010/005998 WO2011028058A2 (en) 2009-09-04 2010-09-03 Aluminum paste for a back electrode of solar cell

Publications (2)

Publication Number Publication Date
EP2474040A2 EP2474040A2 (en) 2012-07-11
EP2474040A4 true EP2474040A4 (en) 2013-05-22

Family

ID=43933110

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10813967.6A Withdrawn EP2474040A4 (en) 2009-09-04 2010-09-03 Aluminum paste for a back electrode of solar cell

Country Status (6)

Country Link
EP (1) EP2474040A4 (en)
JP (1) JP2013504199A (en)
KR (1) KR20110025614A (en)
CN (1) CN102549760A (en)
TW (1) TW201133508A (en)
WO (1) WO2011028058A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101276669B1 (en) * 2011-07-15 2013-06-19 주식회사 케이씨씨 Back contact composition for silicon solar cell comprising metal-containing organic additive
US10170645B2 (en) 2011-11-04 2019-01-01 Heraeus Precious Metals North America Conshohocken Llc Organic vehicle for electroconductive paste
US9899545B2 (en) 2013-03-27 2018-02-20 Cheil Industries, Inc. Composition for forming solar cell electrode and electrode produced from same
RU2531519C1 (en) * 2013-05-27 2014-10-20 Закрытое акционерное общество "Монокристалл" ЗАО "Монокристалл" Aluminium paste for silicon solar cells
JP2015115400A (en) * 2013-12-10 2015-06-22 東洋アルミニウム株式会社 Conductive aluminum paste

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1739690A1 (en) * 2004-07-01 2007-01-03 Toyo Aluminium Kabushiki Kaisha Paste composition and solar cell element employing same
WO2007046199A1 (en) * 2005-10-18 2007-04-26 Toyo Aluminium Kabushiki Kaisha Aluminum paste composition and solar cell device making use of the same
EP1939943A1 (en) * 2005-10-20 2008-07-02 Toyo Aluminium Kabushiki Kaisha Paste composition and solar battery element using the same
US20090120490A1 (en) * 2007-11-14 2009-05-14 Gigastorge Corporation Solar cell

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8076570B2 (en) * 2006-03-20 2011-12-13 Ferro Corporation Aluminum-boron solar cell contacts
KR101280489B1 (en) * 2007-05-09 2013-07-01 주식회사 동진쎄미켐 A paste for producing electrode of solar cell

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1739690A1 (en) * 2004-07-01 2007-01-03 Toyo Aluminium Kabushiki Kaisha Paste composition and solar cell element employing same
WO2007046199A1 (en) * 2005-10-18 2007-04-26 Toyo Aluminium Kabushiki Kaisha Aluminum paste composition and solar cell device making use of the same
US20090250103A1 (en) * 2005-10-18 2009-10-08 Haruzo Katoh Aluminum paste composition and solar cell element using the same
EP1939943A1 (en) * 2005-10-20 2008-07-02 Toyo Aluminium Kabushiki Kaisha Paste composition and solar battery element using the same
US20090120490A1 (en) * 2007-11-14 2009-05-14 Gigastorge Corporation Solar cell

Also Published As

Publication number Publication date
KR20110025614A (en) 2011-03-10
JP2013504199A (en) 2013-02-04
WO2011028058A2 (en) 2011-03-10
TW201133508A (en) 2011-10-01
CN102549760A (en) 2012-07-04
EP2474040A2 (en) 2012-07-11
WO2011028058A3 (en) 2011-07-14

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: LEE, SEUNG-YONG

Inventor name: HONG, SEUNG-KWON

Inventor name: CHOI, HYUNG-SUB

Inventor name: LEE, CHANG-MO

Inventor name: LIM, DAE-SUNG

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20130423

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 31/0224 20060101AFI20130417BHEP

Ipc: C03C 8/02 20060101ALI20130417BHEP

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