EP2425312A4 - Improvements in or relating to data centers - Google Patents

Improvements in or relating to data centers Download PDF

Info

Publication number
EP2425312A4
EP2425312A4 EP10770275.5A EP10770275A EP2425312A4 EP 2425312 A4 EP2425312 A4 EP 2425312A4 EP 10770275 A EP10770275 A EP 10770275A EP 2425312 A4 EP2425312 A4 EP 2425312A4
Authority
EP
European Patent Office
Prior art keywords
relating
data centers
centers
data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10770275.5A
Other languages
German (de)
French (fr)
Other versions
EP2425312B1 (en
EP2425312A2 (en
Inventor
Robert Tozer
Cullen Bash
Chandrakant Patel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Enterprise Development LP
Original Assignee
Hewlett Packard Enterprise Development LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Enterprise Development LP filed Critical Hewlett Packard Enterprise Development LP
Publication of EP2425312A2 publication Critical patent/EP2425312A2/en
Publication of EP2425312A4 publication Critical patent/EP2425312A4/en
Application granted granted Critical
Publication of EP2425312B1 publication Critical patent/EP2425312B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
EP10770275.5A 2009-04-29 2010-04-28 Improvements in or relating to data centers Active EP2425312B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/432,170 US7903404B2 (en) 2009-04-29 2009-04-29 Data centers
PCT/US2010/032809 WO2010127025A2 (en) 2009-04-29 2010-04-28 Improvements in or relating to data centers

Publications (3)

Publication Number Publication Date
EP2425312A2 EP2425312A2 (en) 2012-03-07
EP2425312A4 true EP2425312A4 (en) 2017-09-06
EP2425312B1 EP2425312B1 (en) 2020-05-27

Family

ID=43030180

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10770275.5A Active EP2425312B1 (en) 2009-04-29 2010-04-28 Improvements in or relating to data centers

Country Status (5)

Country Link
US (1) US7903404B2 (en)
EP (1) EP2425312B1 (en)
CN (1) CN102576240B (en)
BR (1) BRPI1007612A2 (en)
WO (1) WO2010127025A2 (en)

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US8959941B2 (en) 2011-07-21 2015-02-24 International Business Machines Corporation Data center cooling with an air-side economizer and liquid-cooled electronics rack(s)
US8955347B2 (en) 2011-07-21 2015-02-17 International Business Machines Corporation Air-side economizer facilitating liquid-based cooling of an electronics rack
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US8760863B2 (en) 2011-10-31 2014-06-24 International Business Machines Corporation Multi-rack assembly with shared cooling apparatus
US8817474B2 (en) 2011-10-31 2014-08-26 International Business Machines Corporation Multi-rack assembly with shared cooling unit
JP5824662B2 (en) * 2011-11-08 2015-11-25 パナソニックＩｐマネジメント株式会社 Cooling device for cooling rack servers and data center equipped with the same
US8964373B2 (en) 2011-12-16 2015-02-24 Paul F. Rembach System for cooling buildings containing heat generating electronics
US8537536B1 (en) 2011-12-16 2013-09-17 Paul F. Rembach Rapid deployment mobile data center
US9429335B2 (en) 2012-01-11 2016-08-30 Hewlett Packard Enterprise Development Lp Adiabatic cooling unit
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US9395974B1 (en) * 2012-06-15 2016-07-19 Amazon Technologies, Inc. Mixed operating environment
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US9485887B1 (en) 2012-06-15 2016-11-01 Amazon Technologies, Inc. Data center with streamlined power and cooling
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US9774190B2 (en) 2013-09-09 2017-09-26 Inertech Ip Llc Multi-level medium voltage data center static synchronous compensator (DCSTATCOM) for active and reactive power control of data centers connected with grid energy storage and smart green distributed energy sources
US10254021B2 (en) 2013-10-21 2019-04-09 Inertech Ip Llc Cooling systems and methods using two cooling circuits
US11306959B2 (en) 2013-11-06 2022-04-19 Inertech Ip Llc Cooling systems and methods using two circuits with water flow in series and counter flow arrangement
US20160018139A1 (en) * 2014-07-21 2016-01-21 Phononic Devices, Inc. Integration of thermosiphon tubing into accept heat exchanger
JP6138093B2 (en) * 2014-09-10 2017-05-31 シムックス株式会社 Server cooling system and cooling method thereof
US10993353B2 (en) * 2014-09-29 2021-04-27 Hewlett Packard Enterprise Development Lp Fan controlled ambient air cooling of equipment in a controlled airflow environment
WO2016057854A1 (en) 2014-10-08 2016-04-14 Inertech Ip Llc Systems and methods for cooling electrical equipment
EP3210297B1 (en) 2014-10-21 2021-03-10 Inertech IP LLC Systems and methods for controlling multi-level diode-clamped inverters using space vector pulse width modulation (svpwm)
US10193380B2 (en) 2015-01-13 2019-01-29 Inertech Ip Llc Power sources and systems utilizing a common ultra-capacitor and battery hybrid energy storage system for both uninterruptible power supply and generator start-up functions
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
US10931190B2 (en) 2015-10-22 2021-02-23 Inertech Ip Llc Systems and methods for mitigating harmonics in electrical systems by using active and passive filtering techniques
US11255611B2 (en) 2016-08-02 2022-02-22 Munters Corporation Active/passive cooling system
US11839062B2 (en) 2016-08-02 2023-12-05 Munters Corporation Active/passive cooling system
CN108471693B (en) * 2018-03-20 2021-01-15 联想(北京)有限公司 Evaporation type heat dissipation system
EP4087379A1 (en) * 2019-09-23 2022-11-09 Rittal GmbH & Co. KG Switch cabinet arrangement with at least one it rack or switch cabinet housing and with at least one cooling device and corresponding method
US11672105B2 (en) * 2020-01-16 2023-06-06 Meta Platforms, Inc. Data center cooling using a heat pipe

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US20090019875A1 (en) * 2007-07-19 2009-01-22 American Power Conversion Corporation A/v cooling system and method

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US20040037045A1 (en) * 2002-08-14 2004-02-26 Phillips Alfred L. Thermal bus for electronics systems
US7278273B1 (en) * 2003-12-30 2007-10-09 Google Inc. Modular data center
US20060002084A1 (en) * 2004-06-30 2006-01-05 Wen Wei Telecom equipment chassis using modular air cooling system
WO2008004280A1 (en) * 2006-07-04 2008-01-10 Fujitsu Limited Heat radiation unit, heat radiator, and electronic apparatus
US20080055852A1 (en) * 2006-09-06 2008-03-06 Airbus Deutschland Gmbh Aircraft Electronics Cooling Apparatus For An Aircraft Having A Liquid Cooling System
US20080062647A1 (en) * 2006-09-13 2008-03-13 Sun Microsystems, Inc. Balanced chilled fluid cooling system for a data center in a shipping container
US20090019875A1 (en) * 2007-07-19 2009-01-22 American Power Conversion Corporation A/v cooling system and method

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Title
See also references of WO2010127025A2 *

Also Published As

Publication number Publication date
US7903404B2 (en) 2011-03-08
CN102576240B (en) 2015-07-29
EP2425312B1 (en) 2020-05-27
BRPI1007612A2 (en) 2016-02-16
CN102576240A (en) 2012-07-11
EP2425312A2 (en) 2012-03-07
WO2010127025A3 (en) 2011-02-10
WO2010127025A8 (en) 2012-02-02
WO2010127025A2 (en) 2010-11-04
US20100277863A1 (en) 2010-11-04

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