EP2416561A4 - Solid imaging element and production method therefor, radiation imaging device and production method therefor, and inspection method for solid imaging element - Google Patents

Solid imaging element and production method therefor, radiation imaging device and production method therefor, and inspection method for solid imaging element

Info

Publication number
EP2416561A4
EP2416561A4 EP10758583.8A EP10758583A EP2416561A4 EP 2416561 A4 EP2416561 A4 EP 2416561A4 EP 10758583 A EP10758583 A EP 10758583A EP 2416561 A4 EP2416561 A4 EP 2416561A4
Authority
EP
European Patent Office
Prior art keywords
production method
imaging element
method therefor
solid imaging
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10758583.8A
Other languages
German (de)
French (fr)
Other versions
EP2416561B1 (en
EP2416561A1 (en
Inventor
Kazuki Fujita
Ryuji Kyushima
Harumichi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of EP2416561A1 publication Critical patent/EP2416561A1/en
Publication of EP2416561A4 publication Critical patent/EP2416561A4/en
Application granted granted Critical
Publication of EP2416561B1 publication Critical patent/EP2416561B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/32—Transforming X-rays
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/767—Horizontal readout lines, multiplexers or registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
    • A61B6/03—Computed tomography [CT]
    • A61B6/032—Transmission computed tomography [CT]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
    • A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
    • A61B6/4233—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Medical Informatics (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Veterinary Medicine (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Heart & Thoracic Surgery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Public Health (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Pulmonology (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of Radiation (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP10758583.8A 2009-04-01 2010-03-26 Semiconductor imaging element and production method therefor, radiation imaging device and production method therefor, and test method for semiconductor imaging element Active EP2416561B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009089257A JP5248395B2 (en) 2009-04-01 2009-04-01 Solid-state imaging device and manufacturing method thereof, radiation imaging apparatus and manufacturing method thereof, and inspection method of solid-state imaging device
PCT/JP2010/055420 WO2010113811A1 (en) 2009-04-01 2010-03-26 Solid imaging element and production method therefor, radiation imaging device and production method therefor, and inspection method for solid imaging element

Publications (3)

Publication Number Publication Date
EP2416561A1 EP2416561A1 (en) 2012-02-08
EP2416561A4 true EP2416561A4 (en) 2013-07-17
EP2416561B1 EP2416561B1 (en) 2017-04-19

Family

ID=42828102

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10758583.8A Active EP2416561B1 (en) 2009-04-01 2010-03-26 Semiconductor imaging element and production method therefor, radiation imaging device and production method therefor, and test method for semiconductor imaging element

Country Status (6)

Country Link
US (1) US8653466B2 (en)
EP (1) EP2416561B1 (en)
JP (1) JP5248395B2 (en)
KR (1) KR101650604B1 (en)
CN (1) CN102388602B (en)
WO (1) WO2010113811A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8729485B2 (en) * 2012-02-17 2014-05-20 Luxen Technologies, Inc. Parallel mode readout integrated circuit for X-ray image sensor
US20130228697A1 (en) * 2012-03-02 2013-09-05 Luxen Technologies, Inc. Fast readout x-ray image sensor
RU2512886C1 (en) * 2013-04-26 2014-04-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Национальный минерально-сырьевой университет "Горный" Device to compensate high harmonics and correct grid power ratio
JP6188433B2 (en) * 2013-06-07 2017-08-30 浜松ホトニクス株式会社 Solid-state imaging device
CN105182396B (en) * 2015-06-29 2018-04-24 苏州瑞派宁科技有限公司 A kind of channel multiplexing method that detector signal is read
KR102018189B1 (en) * 2017-12-20 2019-09-04 주식회사 에이치앤아비즈 Apparatus and method for controlling a binning mode of an x-ray detector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003319270A (en) * 2002-04-24 2003-11-07 Canon Inc Image pickup apparatus composed of light or radiation sensor and inspecting method therefor
EP1568983A1 (en) * 2002-12-06 2005-08-31 Inter Action Corporation Instrument for testing solid-state imaging device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07120758B2 (en) * 1983-09-06 1995-12-20 松下電器産業株式会社 Method for manufacturing color solid-state imaging device
US4965671A (en) * 1987-06-26 1990-10-23 U.S. Philips Corp. Picture pick-up device including a solid-state sensor and an electronic shutter operating with a minimum and maximum number of reset pulses
US5043820A (en) * 1989-03-27 1991-08-27 Hughes Aircraft Company Focal plane array readout employing one capacitive feedback transimpedance amplifier for each column
WO1991004633A1 (en) * 1989-09-23 1991-04-04 Vlsi Vision Limited I.c. sensor
JPH0451785A (en) * 1990-06-20 1992-02-20 Olympus Optical Co Ltd Solid-state image pickup device
JPH04242974A (en) * 1990-12-29 1992-08-31 Kanegafuchi Chem Ind Co Ltd Manufacture of image sensor
US5892540A (en) * 1996-06-13 1999-04-06 Rockwell International Corporation Low noise amplifier for passive pixel CMOS imager
JP2001008237A (en) 1999-06-18 2001-01-12 Matsushita Electric Ind Co Ltd Inspection method for mos-type solid-state image pickup element and mos-type solid-state image pickup element using the inspection method
CN1720435A (en) * 2002-12-06 2006-01-11 株式会社英特埃库迅 Instrument for testing solid-state imaging device
JP2006128244A (en) 2004-10-27 2006-05-18 Sony Corp Solid-state image pickup device and method of inspecting same
JP4899327B2 (en) * 2005-03-15 2012-03-21 カシオ計算機株式会社 Shift register circuit, drive control method thereof, and drive control apparatus
JP2007067622A (en) * 2005-08-30 2007-03-15 Konica Minolta Holdings Inc Radiation imaging device
JP4286872B2 (en) * 2007-01-16 2009-07-01 シャープ株式会社 Semiconductor device provided with light receiving means, semiconductor device inspection method, and semiconductor device inspection device
JP2008270650A (en) * 2007-04-24 2008-11-06 Matsushita Electric Ind Co Ltd Optical device, and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003319270A (en) * 2002-04-24 2003-11-07 Canon Inc Image pickup apparatus composed of light or radiation sensor and inspecting method therefor
EP1568983A1 (en) * 2002-12-06 2005-08-31 Inter Action Corporation Instrument for testing solid-state imaging device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010113811A1 *

Also Published As

Publication number Publication date
KR101650604B1 (en) 2016-08-23
US20120012753A1 (en) 2012-01-19
KR20110132555A (en) 2011-12-08
JP5248395B2 (en) 2013-07-31
WO2010113811A1 (en) 2010-10-07
US8653466B2 (en) 2014-02-18
EP2416561B1 (en) 2017-04-19
JP2010245623A (en) 2010-10-28
CN102388602B (en) 2014-07-16
EP2416561A1 (en) 2012-02-08
CN102388602A (en) 2012-03-21

Similar Documents

Publication Publication Date Title
HK1215733A1 (en) Exposure method, exposure apparatus, and device manufacturing method
HK1206436A1 (en) Exposure apparatus, exposure method, and device manufacturing method
GB201003663D0 (en) Ultra thin neutron detector, method for manufacturing the neutron detector and neutron imaging apparatus
EP2465436A4 (en) Radiation image pickup device and image pickup method by radiation
GB2489850B (en) Method and apparatus for acquiring radiation data
EP2657722A4 (en) Method for manufacturing metal grating structure, metal grating structure manufactured by the method, and x-ray imaging device using the metal grating structure
BRPI0924284A2 (en) imaging apparatus and imaging method
EP2516994A4 (en) System and method for dense-stochastic-sampling imaging
EP2416570A4 (en) Calibration device, method, and program for onboard camera
EP2482060A4 (en) Radiation inspection device for object security inspection and inspection method thereof
EP2595189A4 (en) Solid-state imaging element, process for producing solid-state imaging element, and electronic device
EP2592654A4 (en) Imaging device, and method for manufacturing imaging device
EP2457118A4 (en) Imaging device and imaging method
EP2403232A4 (en) Imaging device and imaging method
HK1144276A1 (en) Device and method for diagnosing abnormality
BR112012002715A2 (en) imaging apparatus and method
GB2475416B (en) An imaging device, a related system and method of fabrication
GB0904080D0 (en) Imaging method
EP2511747A4 (en) Imaging device and imaging method
EP2244294A4 (en) Method for manufacturing radiation detector, radiation detector, and radiation image pickup device
BR112012000518A2 (en) x-ray imaging apparatus and method
HK1169492A1 (en) Exposure apparatus, exposure method and device manufacturing method
EP2416561A4 (en) Solid imaging element and production method therefor, radiation imaging device and production method therefor, and inspection method for solid imaging element
EP2457369A4 (en) Imaging apparatus and imaging method
EP2416560A4 (en) Solid imaging element and production method therefor, radiation imaging device and production method therefor, and inspection method for solid imaging element

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110921

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20130618

RIC1 Information provided on ipc code assigned before grant

Ipc: H04N 5/335 20110101AFI20130612BHEP

Ipc: H01L 27/146 20060101ALI20130612BHEP

Ipc: G01T 1/20 20060101ALI20130612BHEP

Ipc: G01T 1/24 20060101ALI20130612BHEP

Ipc: H01L 27/14 20060101ALI20130612BHEP

Ipc: H04N 5/32 20060101ALI20130612BHEP

Ipc: A61B 6/03 20060101ALI20130612BHEP

17Q First examination report despatched

Effective date: 20160122

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20161019

GRAJ Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR1

GRAL Information related to payment of fee for publishing/printing deleted

Free format text: ORIGINAL CODE: EPIDOSDIGR3

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

INTC Intention to grant announced (deleted)
GRAR Information related to intention to grant a patent recorded

Free format text: ORIGINAL CODE: EPIDOSNIGR71

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

INTG Intention to grant announced

Effective date: 20170309

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: CH

Ref legal event code: NV

Representative=s name: SERVOPATENT GMBH, CH

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 886939

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170515

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602010041685

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20170419

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 886939

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170419

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170720

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170719

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170719

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170819

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602010041685

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

26N No opposition filed

Effective date: 20180122

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20180331

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180326

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180326

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180326

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20100326

REG Reference to a national code

Ref country code: CH

Ref legal event code: PCAR

Free format text: NEW ADDRESS: WANNERSTRASSE 9/1, 8045 ZUERICH (CH)

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170419

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170419

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602010041685

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H04N0005335000

Ipc: H04N0025000000

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230509

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FI

Payment date: 20240315

Year of fee payment: 15

Ref country code: DE

Payment date: 20240130

Year of fee payment: 15

Ref country code: GB

Payment date: 20240201

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240213

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20240401

Year of fee payment: 15