EP2416056A2 - Method of assembling an airtight LED light bulb - Google Patents
Method of assembling an airtight LED light bulb Download PDFInfo
- Publication number
- EP2416056A2 EP2416056A2 EP10192415A EP10192415A EP2416056A2 EP 2416056 A2 EP2416056 A2 EP 2416056A2 EP 10192415 A EP10192415 A EP 10192415A EP 10192415 A EP10192415 A EP 10192415A EP 2416056 A2 EP2416056 A2 EP 2416056A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- bulb envelope
- bulb
- envelope
- flange
- flame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to a method of assembling a light bulb, and more particularly to a method of assembling an airtight LED light bulb.
- a conventional LED light bulb has a heat-sink housing 60, an LED device, a bulb envelope 70, a stem device and a cap 80.
- the heat-sink housing 60 is made of metal, has a top edge and is used to dissipate heat generated from the LED device.
- the bulb envelope 70 is securely combined with the top edge of the heat-sink housing 60.
- the LED device is mounted in the heat-sink housing 60 and the bulb envelope 70.
- the stem device is securely connected with the LED device and is detachably mounted in the heat-sink housing 60.
- the cap 80 is mounted securely around the stem device.
- the conventional LED light bulb has following drawbacks.
- the present invention tends to provide a method of assembling an airtight LED light bulb to obviate the aforementioned problems.
- the main objective of the invention is to provide a method of assembling an airtight LED light bulb.
- a method of assembling an airtight LED light bulb has steps of: connecting a stem device with an LED device, drying the LED device, connecting a stem device with a bulb envelope, extracting air in the bulb envelope via a pipe, filling the bulb envelope with nitrogen or inert gas via the pipe, sealing an opening of the pipe which is located outside the bulb envelope to make the bulb envelope completely airtight and connecting a cap with the bulb envelope. Because the bulb envelope is airtight, the moisture in the environment can not damage the LED device and the steps of extracting air in the bulb envelope via the pipe and filling the bulb envelope with nitrogen or inert gas via the pipe are feasible. Consequently, the LED device will not easily be oxidized or dampened, so the lifespan of the LED light bulb can be prolonged.
- a method of assembling an airtight LED light bulb in accordance with the present invention comprises following steps:
- the wires 12 are respectively mounted though the base 11 and each wire 12 has a supporting end 121 and a connecting end 122.
- the supporting ends 121 of the wires 12 are mounted outside and securely on the first end of the base 11 and are made of steel.
- the connecting ends 122 of the wires 12 are adjacent to the flange 111.
- the pipe 13 is made of glass, is securely mounted in and protrudes out from the base 11 and has two opposite openings.
- the LED device 20 is mounted securely on and electrically connected with the supporting ends 121 of the wires 12 and has at least one LED. Because the supporting ends 121 are made of steel, the wires 12 can support the LED device 20 stably. Drying the LED device 20:
- time of drying the LED device 20 ranges from 10 to 15 minutes and the temperature of drying the LED device 20 ranges from 120 to 125 degree Celsius.
- the bulb envelope 30 is stood and the torch F is tilted downwards slightly.
- the flame F1 aims at the flange 111 (assuming the flame F1 is straight jetted out along a line which the torch F is located).
- a flame angle ⁇ is defined as an angle between the flame F1 and a horizontal line at which the flange 111 is located.
- the flame angle ⁇ ranges from 5°to 15°. Because the flame F1 is tilted downwards, a temperature distribution of the bulb envelope 30 and the stem device 10 is changed to prevent the LED device 20 from being burnt out.
- the bulb envelope 30 is stood upside down and the torch F is mounted latitudinally, and the flame F1 aims at the flange 111.
- the flame F1 melts the flange 111
- air in the bulb envelope 30 is also heated up. Accordingly, air in the upside-down bulb envelope 30 will not convect to flow toward and damage the LED device 20.
- Air in bulb envelope 30 is extracted via the pipe 13.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
- The present invention relates to a method of assembling a light bulb, and more particularly to a method of assembling an airtight LED light bulb.
- With reference to
Fig. 6 , a conventional LED light bulb has a heat-sink housing 60, an LED device, abulb envelope 70, a stem device and acap 80. The heat-sink housing 60 is made of metal, has a top edge and is used to dissipate heat generated from the LED device. Thebulb envelope 70 is securely combined with the top edge of the heat-sink housing 60. The LED device is mounted in the heat-sink housing 60 and thebulb envelope 70. The stem device is securely connected with the LED device and is detachably mounted in the heat-sink housing 60. Thecap 80 is mounted securely around the stem device. However, the conventional LED light bulb has following drawbacks. - 1. Easy damage to the LED device:
- Because the heat-sink housing 60 and the
bulb envelope 70 are combined with each other with glue, gaps may be formed between the heat-sink housing 60 and thebulb envelope 70. Gaps may also be formed between the stem device and the heat-sink housing 60 because the stem device is detachably mounted in the heat-sink housing 60. The moisture in the environment may enter the bulb and damage the LED device via the gaps and the reliability of the LED device is reduced. The PCB or conductors of the LED device are easily oxidized or dampened. Consequently, the lifespan of the LED light bulb is shortened.
- Because the heat-sink housing 60 and the
- 2. Weak versatility of the heat-sink housing 60:
- A shape of the heat-
sink housing 60 has to correspond to that of thebulb envelope 70 so as to facilitate the assembly of the heat-sink housing 60 and thebulb envelope 70. However, to change the shape of the heat-sink housing 60 requires new molds, and this increases a manufacturing cost and is not versatile.
- A shape of the heat-
- 3. Inefficient illumination:
- A coating of an inner surface of the
bulb envelope 70 helps light reflection and enhances illumination. However, a surface area of the inner surface of thebulb envelope 70 is small and the heat-sink housing 60 blocks part of light. Accordingly, the illumination of the conventional LED light bulb is inefficient.
- A coating of an inner surface of the
- 4. Poor insulation:
- The heat-
sink housing 60 is usually made of metal to help dissipate heat. However, the metallic heat-sink housing 60 is not insulating, may cause users to get an electric shock and is not safe.
- The heat-
- To overcome the shortcomings, the present invention tends to provide a method of assembling an airtight LED light bulb to obviate the aforementioned problems.
- The main objective of the invention is to provide a method of assembling an airtight LED light bulb.
- A method of assembling an airtight LED light bulb has steps of: connecting a stem device with an LED device, drying the LED device, connecting a stem device with a bulb envelope, extracting air in the bulb envelope via a pipe, filling the bulb envelope with nitrogen or inert gas via the pipe, sealing an opening of the pipe which is located outside the bulb envelope to make the bulb envelope completely airtight and connecting a cap with the bulb envelope. Because the bulb envelope is airtight, the moisture in the environment can not damage the LED device and the steps of extracting air in the bulb envelope via the pipe and filling the bulb envelope with nitrogen or inert gas via the pipe are feasible. Consequently, the LED device will not easily be oxidized or dampened, so the lifespan of the LED light bulb can be prolonged.
- Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
-
-
Fig. 1 is a block diagram of steps of a method of assembling an airtight LED light bulb in accordance with the present invention; -
Fig. 2 is a perspective view of a stem device connected with an LED device of the airtight LED light bulb made inFig. 1 ; -
Fig. 3 is an operational side view in partial section of the airtight LED light bulb inFig, 1 showing the step of connecting the stem device with a bulb envelope, wherein the bulb envelope is stood and the torch is tilted downwards slightly; -
Fig. 4 is an operational side view in partial section of the airtight LED light bulb inFig. 1 showing an alternative step of connecting the stem device with a bulb envelope, wherein the bulb envelope is stood upside down and the torch is mounted latitudinally; -
Fig. 5 is a perspective view of the airtight LED light bulb inFig. 1 showing a cap combined with the bulb envelope to form a finished airtight LED light bulb; and -
Fig. 6 is a side view of a conventional LED light bulb in accordance with the prior art. - With reference to
Figs. 1 to 3 , a method of assembling an airtight LED light bulb in accordance with the present invention comprises following steps: - Connecting a
stem device 10 with an LED device 20:- A
stem device 10 is connected with an LED (Light Emitting Diode)device 20. Thestem device 10 has abase 11, twowires 12 and apipe 13. Thebase 11 is made of glass, is hollow and has a first end, a second end and aflange 111. The second end of thebase 11 is opposite to the first end of thebase 11. Theflange 111 is funnel-shaped and radially protrudes from the second end of thebase 11.
- A
- The
wires 12 are respectively mounted though thebase 11 and eachwire 12 has a supportingend 121 and a connectingend 122. The supportingends 121 of thewires 12 are mounted outside and securely on the first end of thebase 11 and are made of steel. The connectingends 122 of thewires 12 are adjacent to theflange 111. Thepipe 13 is made of glass, is securely mounted in and protrudes out from thebase 11 and has two opposite openings. - The
LED device 20 is mounted securely on and electrically connected with the supportingends 121 of thewires 12 and has at least one LED. Because the supportingends 121 are made of steel, thewires 12 can support theLED device 20 stably. Drying the LED device 20: - The
LED device 20 is dried to reduce the moisture of theLED device 20. Because the moisture absorbed by theLED device 20 will vaporize and condense to cause damage to theLED device 20 and to shorten a lifespan of theLED device 20, the step can evaporate water in theLED device 20 before being assembled. The step of drying theLED device 20 is not processed and useless in a method of assembling a conventional LED light bulb because the moisture in the environment still can damage the LED device via gaps between the heat-sink housing 60 and thebulb envelope 70 as shown inFig. 6 . - Preferably, time of drying the
LED device 20 ranges from 10 to 15 minutes and the temperature of drying theLED device 20 ranges from 120 to 125 degree Celsius. Connecting thestem device 10 with a bulb envelope 30: - A
bulb envelope 30 is prepared and theLED device 20 is put in thebulb envelope 30. Thebulb envelope 30 is hollow, is made of glass and has an end and aneck 31. Theneck 31 is formed at the end of thebulb envelope 30 and has an opening. The opening of theneck 31 is axially formed through theneck 31, and theLED device 20 is put in thebulb envelope 30 via the opening of theneck 31. When theLED device 20 is inserted into thebulb envelope 30 via the opening of theneck 31, theflange 111 abuts theneck 31. Theflange 111 and theneck 31 are melted by a flame F1 of a torch F with thebulb envelope 30 and thestem device 10 being simultaneously rotated, such that theflange 111 and theneck 31 are seamlessly connected securely with each other. One of the openings of thepipe 13 is located outside thebulb envelope 30 and an inner space of thebulb envelope 30 communicates with the environment via the openings of thepipe 13. - Preferably, with further reference to
Fig. 3 , thebulb envelope 30 is stood and the torch F is tilted downwards slightly. The flame F1 aims at the flange 111 (assuming the flame F1 is straight jetted out along a line which the torch F is located). A flame angle θ is defined as an angle between the flame F1 and a horizontal line at which theflange 111 is located. Preferably, the flame angle θ ranges from 5°to 15°. Because the flame F1 is tilted downwards, a temperature distribution of thebulb envelope 30 and thestem device 10 is changed to prevent theLED device 20 from being burnt out. - Alternatively, with reference to
Fig. 4 , thebulb envelope 30 is stood upside down and the torch F is mounted latitudinally, and the flame F1 aims at theflange 111. When the flame F1 melts theflange 111, air in thebulb envelope 30 is also heated up. Accordingly, air in the upside-downbulb envelope 30 will not convect to flow toward and damage theLED device 20. - Extracting air in the
bulb envelope 30 via thepipe 13. - Air in
bulb envelope 30 is extracted via thepipe 13. - Filling the
bulb envelope 30 with nitrogen or inert gas via the pipe 13: - The
bulb envelope 30 is filled with nitrogen or inert gas, such as neon and argon, via thepipe 13. Nitrogen or inert gas can reduce the risk of oxidization of theLED device 20, prolong the lifespan of theLED device 20 and facilitate to dissipate heat generated from theLED device 20. Consequently, the conventional heat-sink housing 60 is not necessary. Because thebulb envelope 30 is airtight, the steps of extracting air in thebulb envelope 30 via thepipe 13 and filling thebulb envelope 30 with nitrogen or inert gas via thepipe 13 are feasible. - Sealing the opening of the
pipe 13 which is located outside thebulb envelope 30 to make thebulb envelope 30 completely airtight: - The
pipe 13 is melted by the flame F1 to seal the opening of thepipe 13 which is located outside thebulb envelope 30 to make thebulb envelope 30 completely airtight. - Connecting a
cap 40 with the bulb envelope 30: - A
cap 40 is mounted securely around theneck 31 with glue to be connected securely with theenvelope 30. Thecap 40 is electrically connected with the connecting ends 122 of thewires 12 according to corresponding electrodes. - From the above description, it is noted that the present invention has the following advantages:
- 1. The
bulb envelope 30 is airtight:- Because the
bulb envelope 30 is made of glass as a whole and seamless, thestem device 10 is seamlessly connected with thebulb envelope 30 and the opening of thepipe 13 is sealed, thebulb envelope 30 is completely airtight. Because thebulb envelope 30 is airtight, the moisture in the environment can not damage theLED device 20 and the steps of extracting air in thebulb envelope 30 via thepipe 13 and filling thebulb envelope 30 with nitrogen or inert gas via thepipe 13 are feasible. Consequently, theLED device 20 will not easily be oxidized or dampened, the lifespan of the airtight LED light bulb can be prolonged and the reliability of the airtight LED light bulb can be enhanced.
- Because the
- 2. Excellent versatility of the bulb envelope 30:
- Because the
bulb envelope 30 is made of glass as a whole, a shape of thebulb envelope 30 can be easily changed after theglass bulb envelope 30 being heated. - Moreover, the shape of the
bulb envelope 30 is versatile to fitdifferent caps 40.
- Because the
- 3. Efficient illumination:
- A coating of an inner surface of the
bulb envelope 30 is not necessary because a surface area of the inner surface of thebulb envelope 30 is large enough to let light project out widely. Moreover, light emitted from theLED device 20 is not blocked by the heat-sink housing 60, so the airtight LED light bulb made by the method of assembling an airtight LED light bulb in accordance with the present invention has an efficient illumination.
- A coating of an inner surface of the
- 4. Excellent insulation:
- Because the airtight LED light bulb does not have the conventional heat-
sink housing 60 and is made of glass, the insulating airtight LED light bulb prevents users from getting an electric shock and is safe.
- Because the airtight LED light bulb does not have the conventional heat-
- Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and function of the invention, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (6)
- A method of assembling an airtight LED light bulb comprising steps of:connecting a stem device with an LED device, wherein the stem device is connected with the LED device having at least one LED and has a hollow base made of glass and having
a first end;
a second end opposite to the first end of the base; and
a flange radially protruding from the second end of the base;two wires respectively mounted though the base, and each wire having
a supporting end mounted outside and securely on the first end of the base and electrically connected securely with the LED device; and
a connecting end adjacent to the flange; anda pipe made of glass, securely mounted in and protruding out from the base and having two opposite openings;drying the LED device;connecting the stem device with a bulb envelope, wherein
the bulb envelope is hollow, is made of glass as a whole and has
an end; and
a neck formed at the end of the bulb envelope, abutted the flange and having an opening axially formed through the neck;
the flange and the neck are melted by a flame of a torch with the bulb envelope and the stem device being simultaneously rotated such that the flange and the neck are seamlessly connected securely with each other; and
one of the openings of the pipe is located outside the bulb envelope to make an inner space of the bulb envelope communicate with the environment via the openings of the pipe;extracting air in the bulb envelope via the pipe;filling the bulb envelope with nitrogen or inert gas via the pipe;sealing the opening of the pipe which is located outside the bulb envelope to make the bulb envelope completely airtight; andconnecting a cap with the bulb envelope, wherein the cap is mounted securely around the neck and is electrically connected with the connecting ends of the wires according to corresponding electrodes. - The method of assembling an airtight LED light bulb as claimed in claim 1, wherein in the step of drying the LED device, time of drying the LED device ranges from 10 to 15 minutes and the temperature of drying the LED device ranges from 120 to 125 degree Celsius.
- The method of assembling an airtight LED light bulb as claimed in claim 1, wherein in the step of connecting the stem device with a bulb envelope, the bulb envelope is stood upside down, the torch is mounted latitudinally and the flame aims at the flange.
- The method of assembling an airtight LED light bulb as claimed in claim 2, wherein in the step of connecting the stem device with a bulb envelope, the bulb envelope is stood upside down, the torch is mounted latitudinally and the flame aims at the flange.
- The method of assembling an airtight LED light bulb as claimed in claim 1, wherein in the step of connecting the stem device with a bulb envelope, the bulb envelope is stood, the torch is tilted downwards and the flame aims at the flange; a flame angle is defined as an angle between the flame and a horizontal line at which the flange is located; and the flame angle ranges from 5°to 15°.
- The method of assembling an airtight LED light bulb as claimed in claim 2, wherein in the step of connecting the stem device with a bulb envelope, the bulb envelope is stood, the torch is tilted downwards and the flame aims at the flange; a flame angle is defined as an angle between the flame and a horizontal line at which the flange is located; and the flame angle ranges from 5°to 15°.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW099126083A TW201207315A (en) | 2010-08-05 | 2010-08-05 | Method for manufacturing LED light |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2416056A2 true EP2416056A2 (en) | 2012-02-08 |
EP2416056A3 EP2416056A3 (en) | 2012-07-11 |
EP2416056B1 EP2416056B1 (en) | 2014-03-05 |
Family
ID=44907507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10192415.7A Not-in-force EP2416056B1 (en) | 2010-08-05 | 2010-11-24 | Method of assembling an airtight LED light bulb |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2416056B1 (en) |
JP (1) | JP5255665B2 (en) |
ES (1) | ES2458793T3 (en) |
TW (1) | TW201207315A (en) |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103292193A (en) * | 2013-06-07 | 2013-09-11 | 上虞远东照明有限公司 | Semiconductor LED bulb light |
CN103307464A (en) * | 2012-03-12 | 2013-09-18 | 浙江锐迪生光电有限公司 | Light-emitting diode (LED) bulb |
WO2013135153A1 (en) * | 2012-03-12 | 2013-09-19 | 浙江锐迪生光电有限公司 | Led lighting column and led lamp using same |
CN103322465A (en) * | 2012-03-20 | 2013-09-25 | 浙江锐迪生光电有限公司 | LED street lamp |
CN103353064A (en) * | 2013-04-23 | 2013-10-16 | 杭州鸿德照明科技有限公司 | Highly efficient and environmentally protective pyramid LED incandescent lamp |
WO2013154932A1 (en) * | 2012-04-13 | 2013-10-17 | Cree, Inc. | Gas cooled led lamp |
US8591062B2 (en) | 2012-04-13 | 2013-11-26 | Cree, Inc. | LED lamp |
CN103672531A (en) * | 2014-01-10 | 2014-03-26 | 佛山电器照明股份有限公司 | LED (light-emitting diode) bulb |
US9052093B2 (en) | 2013-03-14 | 2015-06-09 | Cree, Inc. | LED lamp and heat sink |
US9234638B2 (en) | 2012-04-13 | 2016-01-12 | Cree, Inc. | LED lamp with thermally conductive enclosure |
USD748296S1 (en) | 2013-03-14 | 2016-01-26 | Cree, Inc. | LED lamp |
US9310065B2 (en) | 2012-04-13 | 2016-04-12 | Cree, Inc. | Gas cooled LED lamp |
US9310028B2 (en) | 2012-04-13 | 2016-04-12 | Cree, Inc. | LED lamp with LEDs having a longitudinally directed emission profile |
US9322543B2 (en) | 2012-04-13 | 2016-04-26 | Cree, Inc. | Gas cooled LED lamp with heat conductive submount |
US9395074B2 (en) | 2012-04-13 | 2016-07-19 | Cree, Inc. | LED lamp with LED assembly on a heat sink tower |
US9395051B2 (en) | 2012-04-13 | 2016-07-19 | Cree, Inc. | Gas cooled LED lamp |
DE102015206797A1 (en) * | 2015-04-15 | 2016-10-20 | Osram Gmbh | Lamp with LEDs |
WO2016198448A1 (en) * | 2015-06-11 | 2016-12-15 | Philips Lighting Holding B.V. | Light bulb with solid-state lighting devices |
US9951909B2 (en) | 2012-04-13 | 2018-04-24 | Cree, Inc. | LED lamp |
WO2018086109A1 (en) * | 2016-11-14 | 2018-05-17 | GE Lighting Solutions, LLC | Led bulb with glass envelope |
EP3450820A3 (en) * | 2017-09-01 | 2019-04-03 | Liquidleds Lighting Corporation | Led light bulb and manufacturing method thereof |
EP2535640B2 (en) † | 2010-09-08 | 2020-09-23 | Zhejiang Ledison Optoelectronics Co., Ltd. | Led lamp bulb and led lighting bar capable of emitting light over 4 pi |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5414718B2 (en) * | 2011-03-09 | 2014-02-12 | スタンレー電気株式会社 | Manufacturing method of light emitting diode |
JP6161872B2 (en) * | 2011-07-14 | 2017-07-12 | 三菱電機照明株式会社 | LIGHT EMITTING DIODE LAMP, LIGHTING APPARATUS, AND LIGHT EMITTING DIODE LAMP |
CN103363355A (en) * | 2013-07-08 | 2013-10-23 | 华南理工大学 | Two-channel radiating LED lamp |
HK1207250A2 (en) * | 2014-10-15 | 2016-01-22 | 新照明設計有限公司 號 | Substrate for led package, a tridimensional led package having the substrate, a light bulb having the tridimensional led package and methods for producing the same led led led |
CN104613346A (en) * | 2015-01-16 | 2015-05-13 | 新照明设计有限公司 | Manufacturing method for bulb with three-dimensional LED package |
CN104595872A (en) * | 2015-01-16 | 2015-05-06 | 新照明设计有限公司 | Manufacturing method of spiral LED (Light-Emitting Diode) packaged lamp bulb |
WO2017036733A1 (en) * | 2015-09-01 | 2017-03-09 | Philips Lighting Holding B.V. | Lighting device with a wireless communication antenna |
US10380177B2 (en) | 2015-12-02 | 2019-08-13 | International Business Machines Corporation | Expansion of a question and answer database |
CN107364112A (en) * | 2016-05-11 | 2017-11-21 | 亿光电子工业股份有限公司 | The method and system of 3D printing light fixture product is provided |
CN111750290B (en) * | 2020-06-08 | 2022-06-21 | 广州瑞塔光电科技有限公司 | Waterproof anticorrosion laser lamp |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0438534Y2 (en) * | 1986-07-23 | 1992-09-09 | ||
DE20018435U1 (en) * | 2000-10-27 | 2001-02-22 | Shining Blick Enterprises Co., Ltd., Taipeh/T'ai-pei | Light bulb with bendable lamp bulbs contained therein |
JP2002216706A (en) * | 2001-01-16 | 2002-08-02 | Harison Toshiba Lighting Corp | Manufacturing method of bulb |
US20040201990A1 (en) * | 2003-04-10 | 2004-10-14 | Meyer William E. | LED lamp |
US20050007010A1 (en) * | 2003-07-09 | 2005-01-13 | Han-Ming Lee | Structure of the stem of LED chip unit bulb |
TWI421439B (en) * | 2008-03-21 | 2014-01-01 | Liquidleds Lighting Corp | Glass package LED bulb and its manufacturing method |
TW201037212A (en) * | 2009-04-02 | 2010-10-16 | Liquidleds Lighting Corp | LED light bulb |
-
2010
- 2010-08-05 TW TW099126083A patent/TW201207315A/en not_active IP Right Cessation
- 2010-11-24 EP EP10192415.7A patent/EP2416056B1/en not_active Not-in-force
- 2010-11-24 ES ES10192415.7T patent/ES2458793T3/en active Active
-
2011
- 2011-02-22 JP JP2011035316A patent/JP5255665B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
None |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2535640B2 (en) † | 2010-09-08 | 2020-09-23 | Zhejiang Ledison Optoelectronics Co., Ltd. | Led lamp bulb and led lighting bar capable of emitting light over 4 pi |
CN103307464B (en) * | 2012-03-12 | 2015-09-23 | 浙江锐迪生光电有限公司 | A kind of LED bulb |
CN103307464A (en) * | 2012-03-12 | 2013-09-18 | 浙江锐迪生光电有限公司 | Light-emitting diode (LED) bulb |
WO2013135153A1 (en) * | 2012-03-12 | 2013-09-19 | 浙江锐迪生光电有限公司 | Led lighting column and led lamp using same |
EP2827046A4 (en) * | 2012-03-12 | 2015-09-30 | Zhejiang Ledison Optoelectronics Co Ltd | Led lighting column and led lamp using same |
CN103322465A (en) * | 2012-03-20 | 2013-09-25 | 浙江锐迪生光电有限公司 | LED street lamp |
CN103322465B (en) * | 2012-03-20 | 2016-01-20 | 浙江锐迪生光电有限公司 | A kind of LED street lamp |
US9310065B2 (en) | 2012-04-13 | 2016-04-12 | Cree, Inc. | Gas cooled LED lamp |
US9395074B2 (en) | 2012-04-13 | 2016-07-19 | Cree, Inc. | LED lamp with LED assembly on a heat sink tower |
US8757839B2 (en) | 2012-04-13 | 2014-06-24 | Cree, Inc. | Gas cooled LED lamp |
USRE48489E1 (en) | 2012-04-13 | 2021-03-30 | Ideal Industries Lighting Llc | Gas cooled LED lamp |
US9951909B2 (en) | 2012-04-13 | 2018-04-24 | Cree, Inc. | LED lamp |
US8591062B2 (en) | 2012-04-13 | 2013-11-26 | Cree, Inc. | LED lamp |
US9234638B2 (en) | 2012-04-13 | 2016-01-12 | Cree, Inc. | LED lamp with thermally conductive enclosure |
WO2013154932A1 (en) * | 2012-04-13 | 2013-10-17 | Cree, Inc. | Gas cooled led lamp |
US9810379B2 (en) | 2012-04-13 | 2017-11-07 | Cree, Inc. | LED lamp |
US9410687B2 (en) | 2012-04-13 | 2016-08-09 | Cree, Inc. | LED lamp with filament style LED assembly |
US9310028B2 (en) | 2012-04-13 | 2016-04-12 | Cree, Inc. | LED lamp with LEDs having a longitudinally directed emission profile |
US9322543B2 (en) | 2012-04-13 | 2016-04-26 | Cree, Inc. | Gas cooled LED lamp with heat conductive submount |
US9353937B2 (en) | 2012-04-13 | 2016-05-31 | Cree, Inc. | Gas cooled LED lamp |
US8752983B2 (en) | 2012-04-13 | 2014-06-17 | Cree, Inc. | Gas cooled LED lamp |
US9395051B2 (en) | 2012-04-13 | 2016-07-19 | Cree, Inc. | Gas cooled LED lamp |
US9651239B2 (en) | 2013-03-14 | 2017-05-16 | Cree, Inc. | LED lamp and heat sink |
USD748296S1 (en) | 2013-03-14 | 2016-01-26 | Cree, Inc. | LED lamp |
US9052093B2 (en) | 2013-03-14 | 2015-06-09 | Cree, Inc. | LED lamp and heat sink |
CN103353064A (en) * | 2013-04-23 | 2013-10-16 | 杭州鸿德照明科技有限公司 | Highly efficient and environmentally protective pyramid LED incandescent lamp |
CN103292193A (en) * | 2013-06-07 | 2013-09-11 | 上虞远东照明有限公司 | Semiconductor LED bulb light |
CN103672531A (en) * | 2014-01-10 | 2014-03-26 | 佛山电器照明股份有限公司 | LED (light-emitting diode) bulb |
DE102015206797A1 (en) * | 2015-04-15 | 2016-10-20 | Osram Gmbh | Lamp with LEDs |
WO2016198448A1 (en) * | 2015-06-11 | 2016-12-15 | Philips Lighting Holding B.V. | Light bulb with solid-state lighting devices |
CN107743566A (en) * | 2015-06-11 | 2018-02-27 | 飞利浦照明控股有限公司 | Bulb with solid state illumination device |
US10072826B2 (en) | 2015-06-11 | 2018-09-11 | Philips Lighting Holding B.V. | Light bulb with solid-state lighting devices |
WO2018086109A1 (en) * | 2016-11-14 | 2018-05-17 | GE Lighting Solutions, LLC | Led bulb with glass envelope |
EP3450820A3 (en) * | 2017-09-01 | 2019-04-03 | Liquidleds Lighting Corporation | Led light bulb and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
EP2416056B1 (en) | 2014-03-05 |
ES2458793T3 (en) | 2014-05-07 |
JP2012038704A (en) | 2012-02-23 |
EP2416056A3 (en) | 2012-07-11 |
TW201207315A (en) | 2012-02-16 |
JP5255665B2 (en) | 2013-08-07 |
TWI372842B (en) | 2012-09-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2416056B1 (en) | Method of assembling an airtight LED light bulb | |
US8167677B2 (en) | Method of assembling an airtight LED light bulb | |
JP6391769B2 (en) | Manufacturing method of lighting device | |
US20160369949A1 (en) | LED Filament Lamp | |
JP2013123027A5 (en) | ||
US10788166B2 (en) | Type of LED lamp structure and its preparation process | |
CN105065945A (en) | LED bulb lamp | |
CN103225757B (en) | LED lamp bulb and manufacturing method thereof | |
US20170292692A1 (en) | LED Lamp Bulb | |
CN102374392B (en) | Manufacturing method of LED (light emitting diode) lamp fitting | |
JP6176901B2 (en) | Light emitting diode lamp and lighting fixture | |
JP6261174B2 (en) | Light emitting diode lamp and lighting device | |
JP6271059B1 (en) | LED glass tube lamp | |
CN203892942U (en) | LED bulb | |
US20080278057A1 (en) | Bulb-shaped outer envelope for lamps, method for manufacture thereof, and compact fluorescent lamp therewith | |
US9863585B2 (en) | Light source assembly and method for producing the same | |
JP6176902B2 (en) | Light emitting diode lamp and lighting fixture | |
US20180100625A1 (en) | Led light bulb and fabrication method thereof | |
CN104033758B (en) | LED bulb | |
CN108317414A (en) | A kind of manufacturing method and LED bulb of LED bulb | |
JP3210405U (en) | LED baud lamp using filament LED | |
CN204328953U (en) | A kind of radiator structure of indoor LED lamp | |
CN203963560U (en) | A kind of illuminating lamp | |
RU81289U1 (en) | LAMPS WITH UPPER LIGHT BULB | |
EP3193073A1 (en) | A lighting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
PUAL | Search report despatched |
Free format text: ORIGINAL CODE: 0009013 |
|
AK | Designated contracting states |
Kind code of ref document: A3 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21Y 101/02 20060101ALN20120604BHEP Ipc: F21K 99/00 20100101AFI20120604BHEP |
|
17P | Request for examination filed |
Effective date: 20130107 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21Y 101/02 20060101ALN20130426BHEP Ipc: F21K 99/00 20100101AFI20130426BHEP |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21K 99/00 20100101AFI20130529BHEP Ipc: F21Y 101/02 20060101ALN20130529BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20131010 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LIQUIDLEDS LIGHTING CORPORATION |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 655138 Country of ref document: AT Kind code of ref document: T Effective date: 20140315 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602010013932 Country of ref document: DE Effective date: 20140417 |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2458793 Country of ref document: ES Kind code of ref document: T3 Effective date: 20140507 |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: T3 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 655138 Country of ref document: AT Kind code of ref document: T Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140605 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140605 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140705 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602010013932 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140707 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
26N | No opposition filed |
Effective date: 20141208 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602010013932 Country of ref document: DE Effective date: 20141208 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: LU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20141124 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20141130 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20141130 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20141124 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 6 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140606 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20101124 Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 7 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 8 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20140305 |
|
RIC2 | Information provided on ipc code assigned after grant |
Ipc: F21Y 101/02 20000101ALN20130529BHEP Ipc: F21K 99/00 20160101AFI20130529BHEP |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: NL Payment date: 20201119 Year of fee payment: 11 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20201130 Year of fee payment: 11 Ref country code: ES Payment date: 20201214 Year of fee payment: 11 Ref country code: FR Payment date: 20201119 Year of fee payment: 11 Ref country code: DE Payment date: 20201125 Year of fee payment: 11 Ref country code: GB Payment date: 20201123 Year of fee payment: 11 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 20201119 Year of fee payment: 11 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 602010013932 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MM Effective date: 20211201 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20211124 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20211130 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20211130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20211201 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20211124 Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20220601 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20211130 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20211124 |
|
REG | Reference to a national code |
Ref country code: ES Ref legal event code: FD2A Effective date: 20230217 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20211125 |