EP2392220A1 - Einlegesohle und Schuh, der einen elektronischen Chip umfasst - Google Patents
Einlegesohle und Schuh, der einen elektronischen Chip umfasst Download PDFInfo
- Publication number
- EP2392220A1 EP2392220A1 EP10005748A EP10005748A EP2392220A1 EP 2392220 A1 EP2392220 A1 EP 2392220A1 EP 10005748 A EP10005748 A EP 10005748A EP 10005748 A EP10005748 A EP 10005748A EP 2392220 A1 EP2392220 A1 EP 2392220A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- insole
- chip
- shoe
- module
- receptacle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000004146 energy storage Methods 0.000 claims description 9
- 238000005187 foaming Methods 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 9
- 238000005266 casting Methods 0.000 claims description 8
- 238000001746 injection moulding Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims 1
- 238000004064 recycling Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B17/00—Insoles for insertion, e.g. footbeds or inlays, for attachment to the shoe after the upper has been joined
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B3/00—Footwear characterised by the shape or the use
- A43B3/34—Footwear characterised by the shape or the use with electrical or electronic arrangements
Definitions
- the present invention relates to an insole and a shoe comprising an electronic chip.
- a shoe comprising an electronic chip is known from the document DE 20 2004 012 749 A1 .
- This shoe has an integrated transponder to transmit timing data to external measuring systems.
- the chip may be cast in the material of the sole at a previously defined point, sewn into the shoe upper portion, e.g. at the top right of the instep, or cast into an intermediate sole or sole insert. In case of a failure of the electronic chip, the chip cannot be removed or replaced without damaging the shoe.
- the object of the invention is to provide a shoe, in particular a sports shoe, with an electronic chip in a more cost efficient way compared to the prior art, wherein the chip can easily be replaced or removed in case of failure or for recycling.
- the chip can be made separately from the insole body, which may prove advantageous in terms of production efficiency.
- the manufacturers of insoles and electronic chips operate in different fields of technology and have different fields of expertise.
- the production performance can be optimized.
- prefabricated chips can be mated with prefabricated insole bodies having different functions, shapes and/or sizes.
- said chip is embodied as a microprocessor and/or an active and/or passive transponder chip.
- a microprocessor may be suitable for carrying out complex operations.
- An active transponder chip is operative at any time required.
- a passive transponder chip requires an external power input, e.g. by means of electromagnetic induction or the like, but can be made very compact in size.
- said chip is accommodated in a heel portion, in an arch portion and/or in a ball portion of said insole.
- the position of the chip can be chosen in accordance with specific needs for specific applications.
- a body of said insole is made by foaming, casting, injection molding, laminating, punching, stamping and/or cutting, wherein said chip is preferably integrally formed or detachably combined with said insole body.
- the named methods prove to be useful and efficient in mass production.
- the chip forms an inherent part of the insole and/or is embedded in the material of said insole, a wearing comfort is not deteriorated by the chip.
- the insole After forming the insole by foaming, casting, injection molding and/or laminating, the insole may be tailored to its final shape and size by punching, stamping or cutting.
- said chip is accommodated between different layers of said insole.
- the chip can be undetachably combined with the insole.
- said chip or a module comprising said chip is received within a receptacle of the insole.
- the chip or module can be removably fitted into said receptacle.
- the receptacle may be a recess, indent, concave, hole or the like provided in the insole and may be formed by punching, stamping or cutting the insole.
- a mold or die for forming the insole may be provided with a male portion or protrusion or an insert for forming the receptacle.
- a preformed receptacle may be placed into the mold or die for forming the insole prior to the introduction of the material forming the insole, such that the preformed receptacle becomes an inherent part of the insole.
- the chip or module as well as the receptacle receiving same may have standardized dimensions. Therefore, the chip or module may be fitted into different insoles having different sizes and shapes, and may easily be replaced in case of failure or removed for recycling. As such, the costs for manufacturing the insole can be reduced.
- said receptacle receives said chip or module comprising said chip from a top side from or a bottom side of said insole.
- the chip or module cannot be detached from the insole when a user wears a shoe provided with the insole and stands on the top side of the insole. When the user takes the shoe off, the chip or module can easily be replaced.
- the chip or module is trapped between the insole and the sole of the shoe. Hence, even in the case the user takes the shoe off, the chip or module cannot be detached.
- said chip or module comprising said chip fits into said receptacle such that it completely closes, fills and/or seals said receptacle, wherein the surface of chip or module is preferably flush with adjacent surface of the insole.
- Said receptacle and said chip or module may have complementary shapes.
- the chip or module may function as a cover of the receptacle and seal the receptacle in watertight fashion so as to prevent sweat or the like from entering.
- the chip is located on a side of the module facing the receptacle, such that the chip is provided in a watertight environment when the module closes and seals the receptacle.
- the insole according to this configuration provides a good wearing comfort and secures functionality of the chip over a long period of time.
- said chip or module comprising said chip and an insole body are substantially made from the same material, preferably from plastic, most preferably from ethylenvinylacetate (EVA), polyurethane (PU) and/or silicone.
- EVA ethylenvinylacetate
- PU polyurethane
- silicone ethylenvinylacetate
- the chip or module comprising said chip and the insole body can be made from different materials with different viscosity properties and elasticity properties.
- said insole comprises energy generation means and/or energy storage means powering said chip, preferably a battery, most preferably a button-type battery.
- An energy generation means in accordance with the present invention may, for example, convert the pumping action the insole undergoes during walking or running into electrical power in order to power the chip.
- An energy storage means in accordance with the present invention may be a button-type battery, which is flat and consumes little space. Therefore, a wearing comfort is not deteriorated by such type of battery.
- the battery is positioned next to the chip, such that a thickness of the insole can be minimized.
- said chip and/or the energy generation means and/or the energy storage means is sealed in a watertight fashion.
- the energy generation means and/or the energy storage means may be accommodated in a watertight receptacle comprising a watertight lining and/or a watertight cover.
- the energy generation means and/or energy storage means may be positioned on a side of the cover facing the receptacle or on a side of the receptacle facing the cover.
- the energy generation means and/or energy storage means may be provided in/on a module comprising the chip and/or may be received in the same receptacle as the chip or module.
- the receptacle may comprise a watertight lining and/or a watertight cover, wherein the module may function as a watertight cover of said receptacle.
- a shoe in particular a sports shoe, comprising a module provided with an electronic chip, wherein said module is detachably combined with said shoe, wherein said module is inserted and removed through the opening that receives a foot of a user of said shoe.
- the module comprising the electronic chip may be a retrofit device that can be removably accommodated in a predetermined space within said shoe without being visible from the outside. In case of failure or for recycling, the module can be easily replaced or removed.
- the module may comprise any one of the features of the module named above.
- said module can be received in a receptacle of said shoe.
- the module can be removably fitted into said receptacle without interfering with the foot of the user during use and without deteriorating the wearing comfort of the shoe.
- the module and the receptacle receiving same may have standardized dimensions. Accordingly, the same module may be fitted into different shoes, and may easily be replaced or removed in case of failure or for recycling. As such, the costs for manufacturing and recycling of shoes furnished with the chip can be reduced.
- the module and the receptacle may be configured as described above.
- said receptacle is provided in/on an insole, a lining, a tongue, an instep or a sole of said shoe.
- the insole may comprise any one of the features of the insole named above.
- the object of the invention is also solved by a method of manufacturing an insole comprising an electronic chip, wherein a body of said insole is made by foaming, casting, injection molding, laminating, punching, stamping and/or cutting, wherein the chip is integrally formed or detachably combined with said insole.
- the insole may comprise any one of the features of the insole named above.
- Fig. 1 is a top view of an insole 1 in accordance with a first embodiment of the present invention.
- the insole 1 depicted in Fig. 1 is configured for a sports shoe such as a football shoe or a running shoe. For ease of description, only a right insole 1 is depicted and described.
- the insole 1 may have symmetrical configurations for left and right shoes.
- the insole 1 has a heel portion 3, an arch portion 4 and a ball portion 5, the portions being designated in accordance with the respective portions of a foot of a user standing thereon in use.
- an electronic chip 2 is integrally formed with the material of the insole 1 and embedded in an arch portion 4 of the insole 1.
- the chip 2 is embodied as a passive transponder chip that is powered and activated by moving the chip 2 through a magnetic field.
- the insole 1 is preferably made by a method comprising the following steps:
- Fig. 2 is a perspective view of an insole 1 in accordance with a second embodiment of the present invention.
- a receptacle 8 for a module 10 carrying an electronic chip 2 and a button-type battery 9 as an energy storage means for powering said chip 2 is defined between two adjacent layers 6, 7 of the insole 1 in an arch portion thereof.
- the chip 2 is embodied as a microprocessor and/or an active transponder.
- the battery 9 and the chip 2 are connected by means of flexible conductors.
- the insole 1 has a top side A and a bottom side B. In use, the top side A faces a foot of a user and the bottom side B faces a sole of a shoe furnished with the insole 1.
- the insole 1 is preferably made by a method comprising the following steps:
- Fig. 3 is a perspective view of a shoe 11 in accordance with the present invention.
- the shoe 11 depicted in Fig. 3 is a sports shoe, in particular a running shoe. For ease of description, only the right shoe is described.
- the left shoe may be configured likewise in a symmetrical fashion.
- the shoe 11 comprises an opening 12 that receives a right foot of a user during use, a lining 13, a tongue 14, an instep 15 and a sole 16.
- a module 10 provided with an electronic chip 2 and a button-type battery 9 as an energy storage means for powering said chip 2 is detachably combined with said shoe 11, wherein the module 10 is inserted and removed through the opening 12.
- the module 10 is received in a receptacle 8 provided in an insole 1, preferably in the insole 1 according to the second embodiment.
- the receptacle 8 may alternatively be provided in/on the lining 13, the tongue 14, the vamp 15 or the sole 16.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10005748A EP2392220A1 (de) | 2010-06-02 | 2010-06-02 | Einlegesohle und Schuh, der einen elektronischen Chip umfasst |
US13/151,016 US20110296710A1 (en) | 2010-06-02 | 2011-06-01 | Insole Comprising an Electronic Chip |
EP11004536A EP2392221A1 (de) | 2010-06-02 | 2011-06-03 | Einlegesohle mit elektronischen Chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10005748A EP2392220A1 (de) | 2010-06-02 | 2010-06-02 | Einlegesohle und Schuh, der einen elektronischen Chip umfasst |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2392220A1 true EP2392220A1 (de) | 2011-12-07 |
Family
ID=43085829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10005748A Withdrawn EP2392220A1 (de) | 2010-06-02 | 2010-06-02 | Einlegesohle und Schuh, der einen elektronischen Chip umfasst |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP2392220A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476285A (zh) * | 2011-02-17 | 2013-12-25 | 耐克国际有限公司 | 带传感器系统的鞋 |
CN108323865A (zh) * | 2018-05-16 | 2018-07-27 | 深圳市泰科汉泽精密电子有限公司 | 一种多功能的鞋子 |
EP3076820B1 (de) | 2013-12-04 | 2018-11-07 | Schawbel Technologies LLC | Beheizte innensohle mit abnehmbarer und wiederaufladbarer batterie |
DE102018215035A1 (de) * | 2018-09-04 | 2020-03-05 | Rhenoflex Gmbh | Versteifungselement sowie Verfahren zur Herstellung eines Versteifungselements |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010049890A1 (en) * | 2000-06-06 | 2001-12-13 | John Hirsch | Shoe wear indicator |
DE202004012749U1 (de) | 2004-08-14 | 2004-10-14 | Illian, Holger | Laufschuh mit integriertem passivem bzw. aktivem Miniatur-Transponder zur Übermittlung von Daten zur Zeitmessung an externe Mess-Systeme |
FR2855725A1 (fr) | 2003-06-05 | 2004-12-10 | Bernard Coeuret | Chaussure |
US20050261609A1 (en) * | 2004-05-24 | 2005-11-24 | 6121438 Canada Inc. | Foot sensor apparatus, method & system |
US20070033838A1 (en) * | 2005-08-15 | 2007-02-15 | Luce Nicola J | Intelligent sneaker insole |
US20070260421A1 (en) * | 2006-05-03 | 2007-11-08 | Nike, Inc. | Athletic or other performance sensing systems |
-
2010
- 2010-06-02 EP EP10005748A patent/EP2392220A1/de not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010049890A1 (en) * | 2000-06-06 | 2001-12-13 | John Hirsch | Shoe wear indicator |
FR2855725A1 (fr) | 2003-06-05 | 2004-12-10 | Bernard Coeuret | Chaussure |
US20050261609A1 (en) * | 2004-05-24 | 2005-11-24 | 6121438 Canada Inc. | Foot sensor apparatus, method & system |
DE202004012749U1 (de) | 2004-08-14 | 2004-10-14 | Illian, Holger | Laufschuh mit integriertem passivem bzw. aktivem Miniatur-Transponder zur Übermittlung von Daten zur Zeitmessung an externe Mess-Systeme |
US20070033838A1 (en) * | 2005-08-15 | 2007-02-15 | Luce Nicola J | Intelligent sneaker insole |
US20070260421A1 (en) * | 2006-05-03 | 2007-11-08 | Nike, Inc. | Athletic or other performance sensing systems |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103476285A (zh) * | 2011-02-17 | 2013-12-25 | 耐克国际有限公司 | 带传感器系统的鞋 |
EP3076820B1 (de) | 2013-12-04 | 2018-11-07 | Schawbel Technologies LLC | Beheizte innensohle mit abnehmbarer und wiederaufladbarer batterie |
EP3076820B2 (de) † | 2013-12-04 | 2021-11-10 | Schawbel Technologies LLC | Beheizte innensohle mit abnehmbarer und wiederaufladbarer batterie |
CN108323865A (zh) * | 2018-05-16 | 2018-07-27 | 深圳市泰科汉泽精密电子有限公司 | 一种多功能的鞋子 |
DE102018215035A1 (de) * | 2018-09-04 | 2020-03-05 | Rhenoflex Gmbh | Versteifungselement sowie Verfahren zur Herstellung eines Versteifungselements |
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Ipc: A43B 17/00 20060101AFI20140604BHEP Ipc: A43B 3/00 20060101ALI20140604BHEP |
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