EP2389273A4 - Ultrasonic treatment device - Google Patents

Ultrasonic treatment device

Info

Publication number
EP2389273A4
EP2389273A4 EP09838694A EP09838694A EP2389273A4 EP 2389273 A4 EP2389273 A4 EP 2389273A4 EP 09838694 A EP09838694 A EP 09838694A EP 09838694 A EP09838694 A EP 09838694A EP 2389273 A4 EP2389273 A4 EP 2389273A4
Authority
EP
European Patent Office
Prior art keywords
treatment device
ultrasonic treatment
ultrasonic
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09838694A
Other languages
German (de)
French (fr)
Other versions
EP2389273A1 (en
EP2389273B1 (en
Inventor
Esa Rouvinen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELPRO Oy
Original Assignee
ELPRO Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELPRO Oy filed Critical ELPRO Oy
Publication of EP2389273A1 publication Critical patent/EP2389273A1/en
Publication of EP2389273A4 publication Critical patent/EP2389273A4/en
Application granted granted Critical
Publication of EP2389273B1 publication Critical patent/EP2389273B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B39/00—Burnishing machines or devices, i.e. requiring pressure members for compacting the surface zone; Accessories therefor
    • B24B39/006—Peening and tools therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
EP09838694.9A 2009-01-26 2009-01-26 Ultrasonic treatment device Not-in-force EP2389273B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FI2009/050064 WO2010084234A1 (en) 2009-01-26 2009-01-26 Ultrasonic treatment device

Publications (3)

Publication Number Publication Date
EP2389273A1 EP2389273A1 (en) 2011-11-30
EP2389273A4 true EP2389273A4 (en) 2012-08-22
EP2389273B1 EP2389273B1 (en) 2013-07-17

Family

ID=42355575

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09838694.9A Not-in-force EP2389273B1 (en) 2009-01-26 2009-01-26 Ultrasonic treatment device

Country Status (2)

Country Link
EP (1) EP2389273B1 (en)
WO (1) WO2010084234A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102981008B (en) * 2012-11-14 2014-09-10 天津大学 Ultrasonic impact needle speed measurement experiment equipment and application thereof
JP7311098B2 (en) 2017-05-09 2023-07-19 国立大学法人東海国立大学機構 Vibration cutting device, vibration device and cutting method
RU199454U1 (en) * 2020-03-10 2020-09-02 федеральное государственное бюджетное образовательное учреждение высшего образования "Санкт-Петербургский горный университет" DEVICE FOR BORING HOLES IN PRODUCTS FROM CORROSION RESISTANT ALUMINUM ALLOYS

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741173A (en) * 1995-12-15 1998-04-21 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Method and apparatus for machining semiconductor material
US5968841A (en) * 1997-05-06 1999-10-19 International Business Machines Corporation Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
US20070077871A1 (en) * 2005-07-28 2007-04-05 Moo-Yong Park Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4203434C2 (en) * 1992-02-06 1994-03-31 Ppv Verwaltungs Ag Zuerich Machine for grinding a workpiece
JPH08153759A (en) * 1994-11-29 1996-06-11 Nec Yamagata Ltd Single-point bonder and manufacture of semiconductor device
DE29713448U1 (en) * 1997-07-29 1997-10-23 Spaichingen Gmbh Maschf Device for ultrasound processing of workpieces
US6932876B1 (en) * 1998-09-03 2005-08-23 U.I.T., L.L.C. Ultrasonic impact machining of body surfaces to correct defects and strengthen work surfaces
JP2002210409A (en) * 2000-11-20 2002-07-30 Sony Corp Method and device for oscillating ultrasonic vibration
FI6947U1 (en) 2005-11-23 2006-01-30 Elpro Oy Processing device for leveling the surface of a workpiece

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5741173A (en) * 1995-12-15 1998-04-21 Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag Method and apparatus for machining semiconductor material
US5968841A (en) * 1997-05-06 1999-10-19 International Business Machines Corporation Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
US20070077871A1 (en) * 2005-07-28 2007-04-05 Moo-Yong Park Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010084234A1 *

Also Published As

Publication number Publication date
WO2010084234A1 (en) 2010-07-29
EP2389273A1 (en) 2011-11-30
EP2389273B1 (en) 2013-07-17

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