EP2384372A4 - White-colored copper alloy with reduced nickel content - Google Patents
White-colored copper alloy with reduced nickel contentInfo
- Publication number
- EP2384372A4 EP2384372A4 EP09813496.8A EP09813496A EP2384372A4 EP 2384372 A4 EP2384372 A4 EP 2384372A4 EP 09813496 A EP09813496 A EP 09813496A EP 2384372 A4 EP2384372 A4 EP 2384372A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- white
- copper alloy
- alloy
- nickel content
- reduced nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adornments (AREA)
- Conductive Materials (AREA)
Abstract
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9571908P | 2008-09-10 | 2008-09-10 | |
US9573308P | 2008-09-10 | 2008-09-10 | |
US10627508P | 2008-10-17 | 2008-10-17 | |
PCT/US2009/056201 WO2010030597A2 (en) | 2008-09-10 | 2009-09-08 | White-colored copper alloy with reduced nickel content |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2384372A2 EP2384372A2 (en) | 2011-11-09 |
EP2384372A4 true EP2384372A4 (en) | 2013-11-20 |
Family
ID=42005710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09813496.8A Withdrawn EP2384372A4 (en) | 2008-09-10 | 2009-09-08 | White-colored copper alloy with reduced nickel content |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP2384372A4 (en) |
JP (3) | JP2012502189A (en) |
KR (3) | KR101859438B1 (en) |
CN (1) | CN102149834B (en) |
AU (3) | AU2009291971A1 (en) |
CA (1) | CA2736881A1 (en) |
MX (1) | MX2011002500A (en) |
WO (1) | WO2010030597A2 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012014851A1 (en) * | 2011-09-22 | 2013-03-28 | Kme Germany Gmbh & Co. Kg | Copper material for the production of a silver-colored product with an antimicrobial surface |
NZ628592A (en) * | 2012-04-24 | 2017-05-26 | Aereus Tech Inc | Coatings, coated surfaces, and methods for production thereof |
CN103773992B (en) * | 2012-10-19 | 2016-03-30 | 北京金鹏振兴铜业有限公司 | The hexa-atomic brass alloys of high-strength corrosion-resisting |
CN104870670B (en) | 2012-10-26 | 2017-12-22 | 仕龙阀门公司 | The antimicrobial copper alloy of white |
CN103074516A (en) * | 2013-01-28 | 2013-05-01 | 江西理工大学 | Low-nickel leadless free-cutting cupronickel and preparation method thereof |
US9381588B2 (en) | 2013-03-08 | 2016-07-05 | Lotus BioEFx, LLC | Multi-metal particle generator and method |
US20160235073A1 (en) * | 2013-10-07 | 2016-08-18 | Sloan Valve Company | White antimicrobial copper alloy |
CN104046816A (en) * | 2014-06-05 | 2014-09-17 | 锐展(铜陵)科技有限公司 | Preparation method of high-strength copper alloy wire for automobile industry |
CN104046812B (en) * | 2014-06-05 | 2016-08-24 | 锐展(铜陵)科技有限公司 | A kind of automobile preparation method of high expanded copper alloy wire |
CN106148757A (en) * | 2015-04-20 | 2016-11-23 | 沈阳万龙源冶金新材料科技有限公司 | One Albatra metal |
KR20190061639A (en) | 2017-11-28 | 2019-06-05 | (주)퀀텀바이오 | Cu-Fe NANO POWDER AND METHOD FOR MANUFACTURING THE SAME |
CN109897988A (en) * | 2019-03-08 | 2019-06-18 | 嘉善雄真金属钮扣厂(普通合伙) | A kind of metal button and its production technology using composite material |
CN110055451A (en) * | 2019-04-28 | 2019-07-26 | 杭州鼎好新材料有限公司 | A kind of health care composite material and preparation method |
CN110157945B (en) * | 2019-04-29 | 2021-08-31 | 宁波博威新材料有限公司 | Softening-resistant copper alloy and preparation method and application thereof |
CN112063882B (en) * | 2020-09-15 | 2021-10-12 | 九牧厨卫股份有限公司 | Lead-free copper alloy for casting and preparation method thereof |
CN113604702A (en) * | 2021-07-20 | 2021-11-05 | 佛山市麦欧金属有限公司 | Copper alloy special for laser cutting 925 silver plate and processing method |
CN115522099B (en) * | 2022-11-07 | 2023-07-21 | 广州番禺职业技术学院 | Cast white copper ornament material and preparation method thereof |
CN115992324B (en) * | 2023-02-15 | 2024-08-02 | 宁波金田铜业(集团)股份有限公司 | Low nickel zinc white copper wire and preparation method thereof |
CN117305649B (en) * | 2023-11-29 | 2024-02-27 | 中铝科学技术研究院有限公司 | Copper alloy material and preparation method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3332482A1 (en) * | 1982-10-19 | 1984-04-19 | Mitsubishi Kinzoku K.K., Tokyo | COPPER ALLOY WITH HIGH OXIDATION RESISTANCE SUITABLE FOR LADDERS IN SEMICONDUCTOR DEVICES, AND COMPOSITE MATERIAL CONTAINING THIS ALLOY |
EP0399658A2 (en) * | 1989-05-23 | 1990-11-28 | Luis Gomez | Purification of fluids |
CN1327899A (en) * | 2000-12-25 | 2001-12-26 | 吉林大学 | Multi-element Cu-base solder for soldering low-alloy chilled cast iron |
DE102009032371A1 (en) * | 2009-07-08 | 2011-01-13 | Berkenhoff Gmbh | Additional material for soldering steel sheets |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2445868A (en) | 1944-08-28 | 1948-07-27 | Olin Ind Inc | Copper base alloys |
US2772962A (en) | 1954-01-21 | 1956-12-04 | Westinghouse Electric Corp | Cu-mn-zn resistance alloy |
US3778236A (en) | 1972-03-29 | 1973-12-11 | Olin Corp | Plated copper base alloy article |
US3778237A (en) | 1972-03-29 | 1973-12-11 | Olin Corp | Plated copper base alloy article |
JPS5641096A (en) * | 1979-09-10 | 1981-04-17 | Mitsubishi Metal Corp | Low melting point cu-mn system soldering material having excellent wetting property and fluidity |
JPS62133035A (en) * | 1985-12-05 | 1987-06-16 | Nippon Mining Co Ltd | White copper alloy |
JPS62243750A (en) * | 1986-04-15 | 1987-10-24 | Nippon Mining Co Ltd | Manufacture of copper alloy excellent in property of proof stress relaxation |
JPS6314831A (en) * | 1986-07-04 | 1988-01-22 | Nippon Mining Co Ltd | White copper alloy |
JPS6318029A (en) * | 1986-07-10 | 1988-01-25 | Nippon Mining Co Ltd | Copper alloy for wear-resistant machine parts such as bearing, gears, and the like |
JPH05345939A (en) * | 1990-12-26 | 1993-12-27 | Nikko Kinzoku Kk | White copper alloy |
DE4140262C1 (en) * | 1991-12-06 | 1993-06-09 | Wieland-Werke Ag, 7900 Ulm, De | |
ATE188747T1 (en) | 1994-05-31 | 2000-01-15 | Europa Metalli Spa | COPPER-ZINC-MANGANESE ALLOY FOR PRODUCING OBJECTS THAT COME IN PROLONGED DIRECT CONTACT WITH HUMAN SKIN |
DE19624731A1 (en) * | 1996-06-21 | 1998-01-02 | Berkenhoff Gmbh | Alloy, especially for the manufacture of eyeglass frames, jewelry, etc. |
JP3311606B2 (en) * | 1996-10-15 | 2002-08-05 | 三宝伸銅工業株式会社 | Copper-based alloy |
EP0911419A1 (en) | 1997-10-21 | 1999-04-28 | Ykk Corporation | Nickel-free copper alloy |
JP3750897B2 (en) | 1999-04-16 | 2006-03-01 | Ykk株式会社 | Nickel-free white copper alloy |
DE60003555T2 (en) * | 1999-05-05 | 2004-04-29 | Olin Corp., New Haven | COPPER ALLOY WITH GOLDEN APPEARANCE |
JP2001003125A (en) * | 1999-06-17 | 2001-01-09 | Ykk Corp | Nickel-free white copper alloy material |
JP2003113454A (en) * | 2001-10-05 | 2003-04-18 | Ykk Corp | Method for manufacturing nickel-free white copper alloy, and nickel-free white copper alloy |
JP3915889B2 (en) | 2001-10-26 | 2007-05-16 | Ykk株式会社 | Nickel-free white copper alloy and method for producing nickel-free white copper alloy |
-
2009
- 2009-09-08 MX MX2011002500A patent/MX2011002500A/en active IP Right Grant
- 2009-09-08 WO PCT/US2009/056201 patent/WO2010030597A2/en active Application Filing
- 2009-09-08 CA CA2736881A patent/CA2736881A1/en not_active Abandoned
- 2009-09-08 AU AU2009291971A patent/AU2009291971A1/en not_active Abandoned
- 2009-09-08 KR KR1020177004136A patent/KR101859438B1/en active IP Right Grant
- 2009-09-08 CN CN200980134815.6A patent/CN102149834B/en not_active Expired - Fee Related
- 2009-09-08 JP JP2011526932A patent/JP2012502189A/en active Pending
- 2009-09-08 EP EP09813496.8A patent/EP2384372A4/en not_active Withdrawn
- 2009-09-08 KR KR1020177004135A patent/KR101859435B1/en active IP Right Grant
- 2009-09-08 KR KR1020117005536A patent/KR20110053998A/en not_active Application Discontinuation
-
2015
- 2015-07-03 JP JP2015134430A patent/JP6170099B2/en not_active Expired - Fee Related
-
2016
- 2016-06-14 AU AU2016203972A patent/AU2016203972A1/en not_active Abandoned
-
2017
- 2017-06-29 JP JP2017127282A patent/JP2017197847A/en active Pending
-
2018
- 2018-06-29 AU AU2018204756A patent/AU2018204756A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3332482A1 (en) * | 1982-10-19 | 1984-04-19 | Mitsubishi Kinzoku K.K., Tokyo | COPPER ALLOY WITH HIGH OXIDATION RESISTANCE SUITABLE FOR LADDERS IN SEMICONDUCTOR DEVICES, AND COMPOSITE MATERIAL CONTAINING THIS ALLOY |
EP0399658A2 (en) * | 1989-05-23 | 1990-11-28 | Luis Gomez | Purification of fluids |
CN1327899A (en) * | 2000-12-25 | 2001-12-26 | 吉林大学 | Multi-element Cu-base solder for soldering low-alloy chilled cast iron |
DE102009032371A1 (en) * | 2009-07-08 | 2011-01-13 | Berkenhoff Gmbh | Additional material for soldering steel sheets |
Non-Patent Citations (3)
Title |
---|
See also references of WO2010030597A2 * |
SPIEKERMANN P: "LEGIERUNGEN - EIN BESONDERES PATENTRECHTLICHES PROBLEM? - LEGIERUNGSPRUEFUNG IM EUROPAEISCHEN PATENTAMT -", MITTEILUNGEN DER DEUTSCHEN PATENTANWAELTE, HEYMANN, KOLN, DE, 1 January 1993 (1993-01-01), pages 178 - 190, XP000961882, ISSN: 0026-6884 * |
WEAVER ET AL: "Survival of Clostridium difficile on copper and steel: futuristic options for hospital hygiene", JOURNAL OF HOSPITAL INFECTION, ACADEMIC PRESS, LONDON, GB, vol. 68, no. 2, 22 January 2008 (2008-01-22), pages 145 - 151, XP022457563, ISSN: 0195-6701, DOI: 10.1016/J.JHIN.2007.11.011 * |
Also Published As
Publication number | Publication date |
---|---|
AU2016203972A1 (en) | 2016-07-07 |
AU2009291971A1 (en) | 2010-03-18 |
CA2736881A1 (en) | 2010-03-18 |
JP2017197847A (en) | 2017-11-02 |
MX2011002500A (en) | 2011-04-07 |
KR101859438B1 (en) | 2018-05-21 |
AU2018204756A1 (en) | 2018-07-19 |
CN102149834B (en) | 2013-06-12 |
KR101859435B1 (en) | 2018-05-21 |
KR20170020554A (en) | 2017-02-22 |
JP6170099B2 (en) | 2017-07-26 |
KR20170020553A (en) | 2017-02-22 |
KR20110053998A (en) | 2011-05-24 |
WO2010030597A2 (en) | 2010-03-18 |
JP2015221943A (en) | 2015-12-10 |
WO2010030597A3 (en) | 2010-07-01 |
JP2012502189A (en) | 2012-01-26 |
EP2384372A2 (en) | 2011-11-09 |
CN102149834A (en) | 2011-08-10 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20131021 |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/05 20060101ALI20131015BHEP Ipc: C22C 9/04 20060101AFI20131015BHEP |
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17Q | First examination report despatched |
Effective date: 20150923 |
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Effective date: 20190930 |
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18D | Application deemed to be withdrawn |
Effective date: 20200211 |