EP2377379A1 - Agencement de transfert de chaleur et boîtier électronique comprenant un agencement de transfert de chaleur et procédé de commande de transfert de chaleur - Google Patents

Agencement de transfert de chaleur et boîtier électronique comprenant un agencement de transfert de chaleur et procédé de commande de transfert de chaleur

Info

Publication number
EP2377379A1
EP2377379A1 EP09788464A EP09788464A EP2377379A1 EP 2377379 A1 EP2377379 A1 EP 2377379A1 EP 09788464 A EP09788464 A EP 09788464A EP 09788464 A EP09788464 A EP 09788464A EP 2377379 A1 EP2377379 A1 EP 2377379A1
Authority
EP
European Patent Office
Prior art keywords
heat transfer
electronic component
refrigerant
component housing
condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09788464A
Other languages
German (de)
English (en)
Inventor
Klas Hedberg
Gustaf Wigren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of EP2377379A1 publication Critical patent/EP2377379A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures

Definitions

  • the present invention relates to a heat transfer arrangement comprising a refrigerant circuit.
  • a refrigerant is arranged to self-circulate in the refrigerant circuit.
  • the invention also relates to an electronic component housing comprising such a heat transfer arrangement and a method of controlling heat transfer from such an electronic housing.
  • thermosiphons Heat transfer systems utilizing a refrigerant circulating through an evaporator and a condenser are well known. Such heat transfer systems wherein the refrigerant self- circulates, i.e. gravity and buoyancy are forces driving the circulation of the refrigerant, are sometimes referred to as thermosiphons.
  • Some electronic component housings need to be cooled due to the heat generated by the electronic components inside the housing.
  • a cooling fan directing air through the housing is sufficient for some applications and/or under certain operating conditions.
  • a heat transfer system utilizing a refrigerant which evaporates in an evaporator and condenses in a condenser, might be required.
  • the evaporator would be arranged to use heat from the electronic components to evaporate the refrigerant and in this way cool the electronic components.
  • WO99/60709 discloses a method and an apparatus for cooling electronic components of radio base stations installed at elevated locations.
  • An evaporator of a thermosiphon cooling system is in thermal contact with heat-generating electronic components to be cooled.
  • a condenser of the thermosiphon cooling system is arranged above the evaporator.
  • the condenser is constructed and arranged for natural convection of ambient air.
  • a modern radio communication system comprises a radio access network and a number of communication devices.
  • the radio access network is built up of several nodes, in particular, radio base stations.
  • the primary task of a radio base station is to send and receive information to/from the communication devices within a cell served by the radio base station. In many cases, the base station is run 24 hours a day.
  • the radio base station comprises an electronic component housing. Inside the electronic component housing there are arranged electronic components and circuitry for performing different tasks of the radio base station.
  • the circuitry may comprise a power control unit, a radio unit, comprising a radio amplifier, and a filtering unit for performing corresponding tasks.
  • Heat generated in the circuitry of the base station, in particular the radio unit, may not always dissipate naturally to a sufficiently high degree. Instead, heat is accumulated in the circuitry and temperature of the circuitry increases. The increased temperature of the circuitry may impair the performance of circuitry within the radio base station, e.g. the circuitry within the radio base station may fail. Consequently, unpredicted interruptions in operation of the base station may occur.
  • thermosiphon cooling system as disclosed in WO99/60709, mentioned above, could be used to cool the electronic component housing.
  • WO99/60709 does however not disclose how cooling may be controlled in a thermosiphon cooling system. Under certain conditions it is namely desirable to not cool the electronic component housing in order to avoid a too low temperature inside the electronic component housing, which also could harm the electronic components and circuitry inside the electronic component housing.
  • An object of the present invention is to obviate the above disadvantage and provide an improved heat transfer arrangement with a refrigerant arranged to self-circulate.
  • the object is achieved by a heat transfer arrangement comprising a refrigerant circuit.
  • the refrigerant circuit comprises an evaporator adapted to be arranged inside an electronic component housing, a condenser adapted to be arranged outside the electronic component housing, a first conduit leading from the evaporator to the condenser, and a second conduit leading from the condenser to the evaporator.
  • a refrigerant is present in the refrigerant circuit and in use, under first temperature conditions, is arranged to self-circulate in the refrigerant circuit by evaporating in the evaporator, rising as a gas through the first conduit, condensing in the condenser and flowing through the second conduit to the evaporator.
  • a further separate gas or separate gas mixture is present in a quantity such that in use, under second temperature conditions, said quantity of further separate gas or separate gas mixture expands inside the condenser to thereby displace refrigerant from the condenser.
  • the further separate gas or separate gas mixture remains separate from the refrigerant. That is, the further separate gas or separate gas mixture may be mixed with the refrigerant in the refrigerant circuit but it will remain, under intended operating conditions, a separate gas or separate gas mixture different from the refrigerant.
  • a prevailing pressure inside the refrigerant circuit is primarily determined by the pressure of gas inside the refrigerant circuit because a liquid, i.e. in this case liquid refrigerant, is incompressible.
  • the pressure inside the refrigerant circuit is dependent on refrigerant saturation pressure at prevailing temperature.
  • the pressure inside the refrigerant circuit is high due to high refrigerant saturation pressure.
  • the pressure inside the refrigerant circuit decreases due to a lower refrigerant saturation pressure.
  • the temperature inside and/or outside the electronic component housing is generally higher than under the second temperature conditions.
  • the further separate gas or separate gas mixture will expand in comparison with refrigerant in gas form.
  • the refrigerant in gas form will thus be displaced from the condenser and an inner heat transfer surface thereof. Heat transfer in the condenser is reduced and thus also the heat transferred from the electronic component housing.
  • a constant weight of the refrigerant and a constant weight of the further separate gas or separate gas mixture may be present in the refrigerant circuit.
  • a heat transfer arrangement with an uncomplicated refrigerant circuit can be used. There is no need for any additional devices for actively adding or removing the refrigerant and/or the further separate gas or separate gas mixture from the refrigerant circuit to control heat transfer.
  • the further separate gas or separate gas mixture may be present in the refrigerant circuit at a fixed weight ratio with respect to the refrigerant.
  • a heat transfer arrangement with an uncomplicated refrigerant circuit can be used and there is no need for any additional devices for adding or removing the refrigerant and/or the further separate gas or separate gas mixture from the refrigerant circuit to control heat transfer.
  • the refrigerant circuit may be defined as comprising only components flowed through by refrigerant during the self-circulation of refrigerant.
  • the weight ratio of the further separate gas or gas mixture may be in the interval of 3% - 40% of the refrigerant.
  • the weight ratio of the further separate gas or gas mixture may be in the interval of 5% - 25% of the refrigerant.
  • the refrigerant may have a molecular structure referred to as R134a.
  • R 134a is a refrigerant having suitable properties and will operate in temperature intervals commonly occurring for electronic component housings.
  • Other refrigerants may also be suitable, as well as e.g. water, methanol or acetone.
  • the separate gas may be nitrogen or the separate gas mixture may be air. Nitrogen and air are readily available and will remain separate from the refrigerant in the refrigerant circuit.
  • the condenser and/or the evaporator may be arranged at an angle of 5 - 60 degrees from a horizontal line. In this way vertical installation height of the heat transfer arrangement may be reduced while still a respective external heat transfer surface of the evaporator and/or the condenser may be available for lateral exposure.
  • the condenser and/or the evaporator may be of plate and fin type.
  • an electronic component housing may comprise a heat transfer arrangement as discussed above. According to example embodiments it may further comprise a first gas moving device for circulating a gas such as air inside the electronic component housing over an outer surface area of the evaporator. In this way cold gas may be transported from the evaporator to electronic components and warm gas from the electronic components to the evaporator.
  • a gas such as air inside the electronic component housing over an outer surface area of the evaporator.
  • the electronic component housing may comprise a second gas moving device for blowing ambient air over an outer surface area of the condenser.
  • Heat transfer between ambient air and the condenser may be improved by mechanically transporting air over the outer heat transfer surface.
  • the electronic component housing may comprise two of the above mentioned heat transfer arrangements, the evaporators of which are arranged adjacent to each other inside the electronic component housing. Cooling effect may in this way be increased inside the electronic housing while space requirement for a collective heat transfer arrangement is kept low inside the electronic housing.
  • the electronic component housing may be part of a radio base station.
  • a method of controlling heat transfer from an electronic component housing, e.g. as mentioned above, to an environment may comprise the steps of: - Self-circulating the refrigerant in the refrigerant circuit, under first temperature conditions, by evaporating in the evaporator, rising as a gas through the first conduit, condensing in the condenser and flowing through the second conduit to the evaporator.
  • a step of controlling the first gas moving device to circulate a gas inside the electronic component housing over the outer surface area of the evaporator may be included.
  • the step of controlling the first gas moving device may include: Reducing a speed of the first gas moving device to a minimum speed when a limit temperature in the interval of +5 to +30 degrees Celsius inside the electronic component housing is reached, and maintaining the minimum speed when a temperature inside the electronic component housing is lower than the limit temperature. In this way a minimum circulation of gas inside the electronic component housing is ensured.
  • the step of stopping the second gas moving device may be performed when a temperature inside the electronic component housing is in the interval of +5 to +20 degrees Celsius and the second gas moving device is maintained stopped at even lower temperatures inside the electronic component housing.
  • Heat exchange between the condenser and the environment will in this way be reduced and thus also heat transferred from inside the electronic component housing to the environment.
  • the heat transfer arrangement will contribute less to further cooling of the electronic component housing and favourable temperature conditions may more easily be maintained inside the electronic component housing.
  • Fig. 1 illustrates schematically a heat transfer arrangement according to example embodiments
  • Fig. 2 illustrates schematically an electronic component housing according to example embodiments comprising a heat transfer arrangement
  • Fig. 3 illustrates schematically an electronic component housing according to example embodiments comprising two heat transfer arrangements
  • Fig. 4 illustrates an exemplary method for controlling heat transfer from an electronic housing.
  • the common abbreviation "e.g.” which derives from the Latin phrase “exempli gratia,” may be used to introduce or specify a general example or examples of a previously mentioned item, and is not intended to be limiting of such item. If used herein, the common abbreviation “i.e.”, which derives from the Latin phrase “id est,” may be used to specify a particular item from a more general recitation.
  • connection to another element, it can be directly coupled or connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly coupled” or “directly connected” to another element, there are no intervening elements present.
  • FIG. 1 illustrates schematically a heat transfer arrangement according to example embodiments.
  • a refrigerant circuit 102 comprises an evaporator 104, a first conduit 106, a condenser 108 and a second conduit 110. Inside the refrigerant circuit 102 there is a refrigerant and a further separate gas or further separate gas mixture. The refrigerant in liquid form inside the evaporator 104 evaporates and rises in gas form through the first conduit 106 to the condenser 108. Inside the condenser 108 the refrigerant in gas form condenses to liquid and flows through the second conduit 110 back to the evaporator 104. In this manner the refrigerant self-circulates in the refrigerant circuit 102.
  • Fig. 2 illustrates schematically an electronic component housing according to example embodiments comprising a heat transfer arrangement.
  • the electronic component housing 202 is adapted to house electronic components 204.
  • the electric component housing 202 may be a radio base station and the electric components 204 may be part of devices associated with such a radio base station, e.g. a radio unit.
  • the heat transfer arrangement is adapted to cool the electronic components 204 and comprises a refrigerant circuit 102.
  • An evaporator 104 of the refrigerant circuit 102 is arranged inside the electric component housing 202.
  • a first conduit 106 leads from the evaporator 104 to a condenser 108 arranged outside the electronic component housing 202.
  • a second conduit 110 leads back to the evaporator 104.
  • the refrigerant circuit is filled with a refrigerant and a further separate gas or further separate gas mixture.
  • the refrigerant self-circulates inside the refrigerant circuit 102.
  • a first gas moving device e.g. a first fan 206
  • a second gas moving device e.g. a second fan 208
  • the condenser 108 and also the second fan 208 may be arranged in a non-shown separate housing. Suitably such a separate housing communicates with ambient environment.
  • the evaporator 104 may be arranged at an acute angle ⁇ from a horizontal line, e.g. 5 - 60 degrees. Also the condenser 108 may arranged at an acute angle, the same as ⁇ or different from ⁇ .
  • the electronic components 204 inside the electronic component housing 202 generate heat.
  • construction of the electronic component housing 202 and on ambient conditions such as temperature, air movement (e.g. wind) and precipitation (e.g. rain) the temperature inside the electronic component housing 202 may increase to a level which could harm the electronic components 204.
  • the heat transfer arrangement and primarily the evaporator 104 of the refrigerant circuit 102 is arranged to cool the inside air of the electronic component housing 202 to avoid such harmful temperature levels.
  • a suitable aim of example embodiments may be to keep the temperature inside the electronic component housing 202 below +60 degrees Celsius.
  • the refrigerant self-circulates inside the refrigerant circuit 102 as explained above with reference to Fig. 1.
  • the first fan 206 may circulate the air, as indicated by arrow 210, inside the electronic component housing 202 past the evaporator 104 and the electronic components 204. Circulation in another direction than indicated by arrow 210 is also possible.
  • the condenser 108 the refrigerant in gas form will condense to liquid form by emitting heat to the ambient environment. Transfer of heat from the condenser 108 to the ambient environment may be increased by switching on the second fan 208 to blow ambient air over an outer surface area of the condenser 108, e.g. in the direction indicated by arrow 212.
  • a suitable aim of example embodiments may be to keep the temperature inside the electronic component housing 202 above +5 degrees Celsius.
  • Fig. 3 illustrates schematically an electronic component housing according to example embodiments.
  • Evaporators 104, 104' of the refrigerant circuits 102, 102' are arranged adjacent each other inside the electronic component housing 202.
  • a circulating gas inside the electric component housing 202 will be cooled in two steps as it flows first over an outer surface of one evaporator 104 and then over an outer surface of the other evaporator 104'.
  • a higher temperature efficiency is achieved and the circulating gas inside the electronic component housing 202 will be cooled to a lower temperature than if only one refrigerant circuit would be used.
  • the gas inside the electronic component housing 202 may be circulated in any direction but the direction indicated by arrow 302 is advantageous when condensers 108, 108', of the refrigerant circuits 102, 102' are arranged as shown in Fig. 3 and ambient air is blown as indicated by arrow 304.
  • the electronic component housing may for instance be a radio base station, from which heat is to be transferred to an ambient environment.
  • Ambient conditions and conditions inside an electronic component housing are such that a refrigerant self-circulates 402 inside a refrigerant circuit of a heat transfer arrangement for transferring heat from the electronic component housing to the environment.
  • a fan adapted to blow ambient air over a condenser of the refrigerant circuit is controlled 404, e.g. speed controlled.
  • Temperature inside the electronic component housing is monitored 406. If the temperature is above a limit value, e.g. +10 degrees Celsius, control of the second fan continues.
  • the second fan is stopped 408 and heat transfer from the electronic component housing reduced.
  • self-circulation in the refrigerant circuit decreases further 410 due to the separate gas or separate gas mixture displacing refrigerant in gas form from an inner heat exchange surface of the condenser and heat exchange from the electronic component housing to the environment by means of the heat transfer arrangement is reduced to a minimum.
  • the temperature limit value inside the electronic component housing may suitably be selected within the interval +5 to +20 degrees Celsius.
  • a refrigerant inside a refrigerant circuit of a heat transfer arrangement there is a refrigerant and a further separate gas or further separate gas mixture.
  • the refrigerant may be R134a and the separate gas may be nitrogen.
  • a separate gas mixture to be used may be air.
  • R 134a is a name for 1 ,1,1 ,2- Tetrafluoroethane, it has the formula CH 2 FCF 3
  • the refrigerant and the separate gas or separate gas mixture are present at a fixed weight ratio inside the refrigerant circuit, i.e. the refrigerant circuit, during manufacturing, is filled with a predetermined quantity of refrigerant and a predetermined quantity of the separate gas or separate gas mixture and then sealed. Once ready for installation, e.g. in an electronic component housing, the refrigerant circuit contents remain unaltered.
  • the refrigerant circuit Having a refrigerant and a separate gas or separate gas mixture inside the refrigerant circuit will give the refrigerant circuit a different characteristic compared to if the refrigerant circuit would be filled will refrigerant only.
  • the cooling capacity of the refrigerant circuit will depend on temperature: The cooling capacity is high when the temperature is high and the cooling capacity is low when the temperature is low.
  • a weight ratio interval of further interest would be separate gas or separate gas mixture at 5 - 25%.
  • the temperature inside an electronic component housing may be kept within favourable limits.
  • gas moving devices such as the above exemplified first and second fans, the temperature inside an electronic component housing is easily controlled.
  • the volume ratio between refrigerant in gas form and the separate gas or separate gas mixture inside the refrigerant circuit is dependent on the pressure inside the refrigerant circuit, which in turn depends on the temperature inside the electronic component housing and the ambient temperature.
  • the refrigerant exists inside the refrigerant circuit in both liquid form and gas form.
  • the separate gas or separate gas mixture only exists in gas form inside the refrigerant circuit.
  • a high pressure inside the refrigerant circuit depends on more refrigerant being in gas form than at a low pressure. The higher the pressure inside the refrigerant circuit, the less volume the separate gas or separate gas mixture will occupy inside the refrigerant circuit.
  • the separate gas or separate gas mixture expands in comparison with refrigerant in gas form. Since the separate gas or separate gas mixture is lighter than liquid refrigerant the separate gas or separate gas mixture will expand inside the condenser and displace refrigerant in gas form from the condenser and an inner heat transfer surface thereof.
  • the gas, e.g. air, inside the electronic component housing is circulated by the first fan, over the outer surface area of the evaporator and towards the electronic components.
  • the speed of the first fan may suitably be controlled. Even though the first fan could be stopped at low temperatures inside the electronic component housing, it is suitable to maintain a minimum speed of the first fan e.g. to avoid local heat build up at electronic components.
  • the refrigerant self-circulates in the refrigerant circuit and the second fan is controlled to blow air over the outer surface of the condenser to improve heat transfer from the condenser to the environment.
  • a desired temperature may be maintained inside the electronic component housing by means of the heat transfer arrangement but without the aid of the second fan.
  • the second fan is stopped to decrease the heat transfer between the condenser and the environment.
  • the refrigerant still self-circulates in this situation and a desired temperature is maintained inside the electronic component housing.
  • An additional or separate criterion for stopping the second fan may be when a temperature inside the electronic component housing is in the interval of +5 to +20 degrees Celsius.
  • a desired temperature may be maintained inside the electronic component housing without the aid of the heat transfer arrangement, heat transfer from the electronic component housing to the environment is reduced to a minimum due to the separate gas or separate gas mixture having expanded to such an extent inside the condenser that self-circulation of the refrigerant has been reduced to a minimum.
  • first and second fans may be any other gas moving devices suitable for producing a flow of gas over an outer surface of an evaporator or condenser.
  • a heating apparatus may be arranged to heat the inside of the electronic component housing to avoid too low temperatures inside the electronic component housing even when the heat transfer from the electronic component housing is minimal. Heating could become necessary under certain ambient conditions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention porte sur un agencement de transfert de chaleur qui comprend un circuit de réfrigérant (102). Le circuit de réfrigérant (102) comprend un évaporateur (104) conçu pour être agencé à l'intérieur d'un boîtier de composant électronique (202), un condenseur (108) conçu pour être agencé à l'extérieur du boîtier de composant électronique (202), un premier conduit (106) menant de l'évaporateur (104) au condenseur (108), et un second conduit menant du condenseur (108) à l'évaporateur (104). Un réfrigérant est présent dans le circuit de réfrigérant (102) et en utilisation, dans des premières conditions de température, est conçu pour circuler de lui-même dans le circuit de réfrigérant (102) par évaporation dans l'évaporateur (104), montant sous la forme d'un gaz dans le premier conduit, condensant dans le condenseur (108) et circulant dans le second circuit jusqu'à l'évaporateur (104). Dans le circuit de réfrigérant (102), un autre gaz séparé ou mélange de gaz séparé est présent en une quantité telle qu'en utilisation, dans des secondes conditions de température, ladite quantité d'autre gaz séparé ou mélange de gaz séparé se détend à l'intérieur du condenseur (108) pour ainsi déplacer du réfrigérant à partir du condenseur (108). Un transfert de chaleur est ainsi commandé. L'invention porte également sur un boîtier de composant électronique comprenant un tel agencement de transfert de chaleur et sur un procédé de commande de transfert de chaleur à partir d'un tel boîtier électronique.
EP09788464A 2009-01-15 2009-01-15 Agencement de transfert de chaleur et boîtier électronique comprenant un agencement de transfert de chaleur et procédé de commande de transfert de chaleur Withdrawn EP2377379A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2009/050028 WO2010082875A1 (fr) 2009-01-15 2009-01-15 Agencement de transfert de chaleur et boîtier électronique comprenant un agencement de transfert de chaleur et procédé de commande de transfert de chaleur

Publications (1)

Publication Number Publication Date
EP2377379A1 true EP2377379A1 (fr) 2011-10-19

Family

ID=41056740

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09788464A Withdrawn EP2377379A1 (fr) 2009-01-15 2009-01-15 Agencement de transfert de chaleur et boîtier électronique comprenant un agencement de transfert de chaleur et procédé de commande de transfert de chaleur

Country Status (3)

Country Link
US (1) US20110271696A1 (fr)
EP (1) EP2377379A1 (fr)
WO (1) WO2010082875A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010145434A1 (fr) * 2009-06-15 2010-12-23 华为技术有限公司 Échangeur de chaleur, procédé de dissipation de chaleur par l'échangeur de chaleur et appareil de communication
AU2012232968B2 (en) * 2011-10-31 2014-11-13 Abb Technology Ag Thermosiphon cooler arrangement in modules with electric and/or electronic components
AU2012232967B2 (en) 2011-10-31 2015-01-15 Abb Technology Ag Cabinet with modules having a thermosiphon cooler arrangement
DE102012108108B4 (de) * 2012-08-31 2014-04-10 Rittal Gmbh & Co. Kg Schaltschrank mit einem Kühlgerät für die passive Schaltschrankkühlung
WO2016157818A1 (fr) * 2015-03-31 2016-10-06 パナソニックＩｐマネジメント株式会社 Dispositif de refroidissement
EP3185664A1 (fr) * 2015-12-22 2017-06-28 ABB Technology Oy Appareil de refroidissement
CN205808194U (zh) * 2016-06-13 2016-12-14 深圳市英维克科技股份有限公司 换热器模组
JP7131158B2 (ja) * 2018-07-19 2022-09-06 株式会社デンソー 空調装置
US11035620B1 (en) * 2020-11-19 2021-06-15 Richard W. Trent Loop heat pipe transfer system with manifold

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672443A (en) * 1969-01-28 1972-06-27 Teledyne Inc Thermal control and power flattening for radioisotopic thermodynamic power system
US3958627A (en) * 1974-10-15 1976-05-25 Grumman Aerospace Corporation Transverse variable conductance heat pipe
US5289869A (en) * 1992-12-17 1994-03-01 Klein John F Closed loop feedback control variable conductance heat pipe
US5771967A (en) * 1996-09-12 1998-06-30 The United States Of America As Represented By The Secretary Of The Navy Wick-interrupt temperature controlling heat pipe
US20030180589A1 (en) * 2002-03-25 2003-09-25 Sarraf David B. Flat plate fuel cell cooler
US20030183381A1 (en) * 2002-03-26 2003-10-02 Garner Scott D. Multiple temperature sensitive devices using two heat pipes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5644502A (en) * 1995-05-04 1997-07-01 Mmr Technologies, Inc. Method for efficient counter-current heat exchange using optimized mixtures
US6041850A (en) * 1996-07-26 2000-03-28 General Electric Company Temperature control of electronic components
SE9801747D0 (sv) * 1998-05-18 1998-05-18 Ericsson Telefon Ab L M Kondensor för anslutning till en kylkrets för kylning av elektronikenheter
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
US6695039B1 (en) * 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
US6837063B1 (en) * 2003-07-31 2005-01-04 Dell Products L.P. Power management of a computer with vapor-cooled processor
US7522417B2 (en) * 2006-03-30 2009-04-21 Wisconsin Alumni Research Foundation Multi-mode fluid cooling system and method
US7422052B2 (en) * 2006-04-20 2008-09-09 Delphi Technologies, Inc. Low profile thermosiphon

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3672443A (en) * 1969-01-28 1972-06-27 Teledyne Inc Thermal control and power flattening for radioisotopic thermodynamic power system
US3958627A (en) * 1974-10-15 1976-05-25 Grumman Aerospace Corporation Transverse variable conductance heat pipe
US5289869A (en) * 1992-12-17 1994-03-01 Klein John F Closed loop feedback control variable conductance heat pipe
US5771967A (en) * 1996-09-12 1998-06-30 The United States Of America As Represented By The Secretary Of The Navy Wick-interrupt temperature controlling heat pipe
US20030180589A1 (en) * 2002-03-25 2003-09-25 Sarraf David B. Flat plate fuel cell cooler
US20030183381A1 (en) * 2002-03-26 2003-10-02 Garner Scott D. Multiple temperature sensitive devices using two heat pipes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
MOAVENINEJADA & M M HEYHATA S: "Study of a Variable Conductance Two-Phase Closed Thermosyphon With Two-Component Working Fluid", HEAT TRANSFER ENGINEERING, HEMISPHERE PUB, WASHINGTON, DC, US, vol. 31, no. 13, 1 January 2010 (2010-01-01), pages 1082 - 1090, XP008162798, ISSN: 0145-7632, [retrieved on 20111012], DOI: 10.1080/01457631003640347 *
See also references of WO2010082875A1 *

Also Published As

Publication number Publication date
US20110271696A1 (en) 2011-11-10
WO2010082875A1 (fr) 2010-07-22

Similar Documents

Publication Publication Date Title
US20110271696A1 (en) Heat Transfer Arrangement and Electronic Housing Comprising a Heat Transfer Arrangement and Method of Controlling Heat Transfer
US20200113083A1 (en) System and method for cooling electronic devices
AU2015200871B2 (en) Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
JP5857964B2 (ja) 電子機器冷却システム
US8966922B2 (en) Air-side economizer facilitating liquid-based cooling of an electronics rack
US7660109B2 (en) Apparatus and method for facilitating cooling of an electronics system
US9258927B2 (en) Heat transfer arrangement and electronic housing comprising a heat transfer arrangement
WO2014126005A1 (fr) Mécanisme de refroidissement pour centre informatique
US20030094266A1 (en) Cabinet having heat exchanger integrally installed between roof and solar shield
KR20100045490A (ko) 보조 냉각 장치
EP2719268B1 (fr) Système de refroidissement en boucle à pompe
US9763358B2 (en) Apparatus with diffusion-absorption cycle
WO2015075916A1 (fr) Dispositif d'enceinte d'appareil électronique et système de refroidissement d'appareil électronique
EP2420116B1 (fr) Agencement de transfert thermique et boîtier électronique comprenant un agencement de transfert thermique et procédé de commande de transfert thermique
JP2011227829A (ja) データセンタの冷却システム
US9198329B2 (en) Method and cabinet for controlling temperature in the cabinet
JP2011163665A (ja) 空調システムの運転方法
CN112234803A (zh) 变频器、制冷系统及其控制方法
EP2767782B1 (fr) Appareil de refroidissement
JP5702508B2 (ja) データセンタの冷却機構
JP2012507854A (ja) 電子機器の温度調整のためのネットワークノードにおけるシステム
KR20060005848A (ko) 공기조화기의 실외기
Kennedy Rittal White Paper 507: Understanding Data Center Cooling Energy Usage & Reduction Methods
EP2444760A2 (fr) Refroidissement de condensateurs dans des circuits de réfrigération
KR20160039954A (ko) 공기조화기 및 공기조화기용 방열장치

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110609

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20130612

17Q First examination report despatched

Effective date: 20130709

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20131120