EP2363925A1 - Connecteur électrique avec compensation de diaphonie - Google Patents

Connecteur électrique avec compensation de diaphonie Download PDF

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Publication number
EP2363925A1
EP2363925A1 EP10150431A EP10150431A EP2363925A1 EP 2363925 A1 EP2363925 A1 EP 2363925A1 EP 10150431 A EP10150431 A EP 10150431A EP 10150431 A EP10150431 A EP 10150431A EP 2363925 A1 EP2363925 A1 EP 2363925A1
Authority
EP
European Patent Office
Prior art keywords
conductor
conducting
pair
metal
conducting wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10150431A
Other languages
German (de)
English (en)
Inventor
Ying-Ming Ku
Yi-Huang Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YFC BonEagle Electric Co Ltd
Original Assignee
YFC BonEagle Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YFC BonEagle Electric Co Ltd filed Critical YFC BonEagle Electric Co Ltd
Priority to EP10150431A priority Critical patent/EP2363925A1/fr
Publication of EP2363925A1 publication Critical patent/EP2363925A1/fr
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/6608Structural association with built-in electrical component with built-in single component
    • H01R13/6625Structural association with built-in electrical component with built-in single component with capacitive component

Definitions

  • the present invention relates to an electrical connector, and more particularly to an electrical connector with a crosstalk compensation provided by installing metal conducting wires in parallel or metal plates.
  • the interconnection components such as PCBs, electrical connectors, and cables are developed toward the trend of high data-rate and high density.
  • high-frequency effects caused by the interconnection components can not be ignored.
  • the wire communication interface can not be replaced by the wireless communication interface. Accordingly, the issue of the high-frequency effect is necessary to be overcome.
  • the crosstalk noise results from the coupled capacitance between adjacent electrical wires. Hence, the crosstalk noise is produced when signals are sent through adjacent traces on the printed circuit board. Also, the effect of the crosstalk noise can not be overlooked for the entire circuit.
  • U.S. Patent 5,299,956 disclosed a low crosstalk electrical connector system.
  • Fig. 1 is a circuit diagram of a prior art electrical connecting apparatus.
  • the electrical connector system mainly includes an electrical connection apparatus, and the electrical connection apparatus includes an electrical connector 10A and a circuit board 20A.
  • the electrical connector 10A includes at least one first conductor T1, a second conductor R1, a third conductor R2, and a fourth conductor T2. More particularly, a first signal pair (not labeled) is composed of the first conductor T1 and the second conductor R1; a second signal pair (not labeled) is composed of the third conductor R2 and the fourth conductor T2.
  • first conductor T1 and the second conductor R1 are adjacent to and parallel to one another through at least a major portion of the electrical connector 10A.
  • the third conductor R2 is adjacent to and parallel to the first conductor T1
  • the fourth conductor T2 is adjacent to and parallel to the second conductor R1 the electrical connector 10A thereby forming a first group of signal paths (not labeled).
  • the crosstalk noise is induced between the first signal loop pair and the second signal loop pair when signals are applied to either of the signal loop pairs.
  • the third conductor R2 is adjacent to and parallel to the second conductor R1
  • the fourth conductor T2 is adjacent to and parallel to the first conductor T1 for at least a portion of the substrate forming a second group of signal paths (not labeled).
  • the second group of signal paths is formed by adjusting the relative position of the conductors (T1, R1, T2, R2) to counteract the induced crosstalk noise.
  • the electrical connector with crosstalk compensation can not suitably provide a compensation capacitance to cancel the induced crosstalk noise when the crosstalk noise magnitude is significantly varied.
  • an electrical connector with crosstalk compensation is provided to solve the above-mentioned problems.
  • the electrical connector with crosstalk compensation includes a substrate, a first conducting group, a second conducting group, a first metal conducting wire, and a second metal conducting wire.
  • the first conducting group is installed on the substrate and has at least four conductors. More particularly, the four conductors include a first conductor, a second conductor, a third conductor, and a fourth conductor, respectively. Also, two conductors form a conducting pair in pairs. Namely, the first conductor and the second conductor form a first conducting pair, and the third conductor and the fourth conductor form a second conducting pair.
  • the second conducting group is installed on the substrate and has at least four conductors. More particularly, the four conductors include a first conductor, a second conductor, a third conductor, and a fourth conductor, respectively. Also, two conductors form a conducting pair in pairs. Namely, the first conductor and the second conductor form a first conducting pair, and the third conductor and the fourth conductor form a second conducting pair.
  • first conducting pair of the second conducting group is electrically connected to the first conducting pair of the first conducting group to form a first signal loop pair
  • second conducting pair of the second conducting group is electrically connected to the second conducting pair of the first conducting group to form a second signal loop pair
  • the first metal conducting wire is electrically connected to the second conductor of the second conducting group.
  • the second metal conducting wire is electrically connected to the fourth conductor of the second conducting group.
  • the first metal conducting wire and the second metal conducting wire are installed in parallel on the substrate to obtain a compensation capacitance to reduce and even cancel a crosstalk noise induced between the first signal loop pair and the second signal loop pair when signals are sent through either of the two signal loop pairs.
  • the electrical connector with crosstalk compensation includes a substrate 10, a first conducting group G1, a second conducting group G2, a first metal conducting wire C1, and a second metal conducting wire C2.
  • the substrate 10 is a printed circuit board.
  • the first conducting group G1 is installed on the substrate 10 and has at least four conductors. More particularly, the four conductors include a first conductor T11, a second conductor R11, a third conductor T12, and a fourth conductor R12, respectively. Also, two conductors form a conducting pair in pairs. Namely, the first conductor T11 and the second conductor R11 form a first conducting pair S11, and the third conductor T12 and the fourth conductor R12 form a second conducting pair S12.
  • the second conducting group G2 is installed on the substrate 10 and has at least four conductors. More particularly, the four conductors include a first conductor T21, a second conductor R21, a third conductor T22, and a fourth conductor R22, respectively. Also, two conductors form a conducting pair in pairs. Namely, the first conductor T21 and the second conductor R21 form a first conducting pair S21, and the third conductor T22 and the fourth conductor R22 form a second conducting pair S22.
  • the first conducting pair S21 of the second conducting group G2 is electrically connected to the first conducting pair S11 of the first conducting group G1 to form a first signal loop pair L1.
  • the second conducting pair S22 of the second conducting group G2 is electrically connected to the second conducting pair S12 of the first conducting group G1 to form a second signal loop pair L2.
  • first metal conducting wire C1 is electrically connected to the second conductor R21 of the second conducting group G2.
  • the second metal conducting wire C2 is electrically connected to the fourth conductor R22 of the second conducting group G2. More particularly, the first metal conducting wire C1 and the second metal conducting wire C2 are both of the line structure.
  • An induced crosstalk noise is produced between the first signal loop pair L1 and the second signal loop pair L2 when signals are sent through either of the first signal loop pair L1 and the second signal loop pair L2. More particularly, magnitude of the crosstalk noise is determined by a coupled capacitance between the first signal loop pair L1 and the second signal loop pair L2.
  • a capacitance Crlr2 which is used to compensate the induced crosstalk noise, is provided by installing the first metal conducting wire C1 and the second metal conducting wire C2 in parallel on the substrate 10.
  • the second conductor R21 and the fourth conductor R22 of the second conducting group G2 are electrically connected to the first metal conducting wire C1 and the second metal conducting wire C2, respectively.
  • the second conductor R21 is electrically connected to the first metal conducting wire C1
  • the fourth conductor R22 is electrically connected to the second metal conducting wire C2. It is assumed that the specification, such as length, width, pitch of the first metal conducting wire C 1 and the second metal conducting wire C2 are the same. By definition, the linear relative permittivity of vacuum is equal to 1. Hence, the compensation capacitance Crlr2 could be calculated.
  • the crosstalk noise induced between the first signal loop pair L1 and the second signal loop pair L2 can be reduced and even canceled when signals are sent through either of the two signal loop pairs L1, L2.
  • the equivalent capacitance Crlr2 can be obtained by electrically connecting the second conductor R21 to the second metal conducting wire C2 and electrically connecting the fourth conductor R22 to the first metal conducting wire C1.
  • the difference between this embodiment and the above-mentioned embodiment is only the connection relationship. Hence, the detail description is omitted here for conciseness.
  • Fig. 3A and Fig. 3B is a circuit diagram and a schematic view of a second embodiment of the electrical connector, respectively.
  • a compensation capacitance between the first signal loop pair L1 and the second signal loop pair L2 can be also obtained in this embodiment.
  • the capacitance Ctlt2 which is also used to compensate the induced crosstalk noise, is provided by installing the first metal conducting wire C1 and the second metal conducting wire C2 in parallel on the substrate 10.
  • the first conductor T21 and the third conductor T22 of the second conducting group G2 are electrically connected to the first metal conducting wire C1 and the second metal conducting wire C2, respectively.
  • the linear relative permittivity of vacuum is equal to 1.
  • the compensation capacitance Ctlt2 could be calculated.
  • the crosstalk noise induced between the first signal loop pair L1 and the second signal loop pair L2 can be reduced and even canceled when signals are sent through either of the two signal loop pairs L1, L2.
  • the equivalent capacitance Ctlt2 can be provided by electrically connecting the first conductor T21 to the second metal conducting wire C2 and electrically connecting the third conductor T22 to the first metal conducting wire C1.
  • the difference between this embodiment and the above-mentioned embodiment is only the connection relationship. Hence, the detail description is omitted here for conciseness.
  • Fig. 4A and Fig. 4B are a circuit diagram and a schematic view of a third embodiment of the electrical connector.
  • This embodiment is same as the first embodiment in that the capacitance Crlr2, which is used to compensate the induced crosstalk noise, is provided by installing the first metal conducting wire C1 and the second metal conducting wire C2 in parallel on the substrate 10.
  • the second conductor R21 and the fourth conductor R22 of the second conducting group G2 are electrically connected to the first metal conducting wire C1 and the second metal conducting wire C2, respectively.
  • the difference between the two embodiments is that the first metal conducting wire C1 and the second metal conducting wire C2 are both the comb-shaped structure in this embodiment.
  • the compensation capacitance is proportional to the area between the metal conducting wires.
  • the first metal conducting wire C1 and the second metal conducting wire C2 are interleavingly installed (namely staggered to each other) on the substrate 10 to increase the area between thereof.
  • Fig. 5A and Fig. 5B is a circuit diagram and a schematic view of a fourth embodiment of the electrical connector.
  • This embodiment is same as the second embodiment in that the capacitance Ctlt2, which is used to compensate the induced crosstalk noise, is provided by installing the first metal conducting wire C1 and the second metal conducting wire C2 in parallel on the substrate 10.
  • the first conductor T21 and the third conductor T22 of the second conducting group G2 are electrically connected to the first metal conducting wire C1 and the second metal conducting wire C2, respectively.
  • the difference between the two embodiments is that the first metal conducting wire C1 and the second metal conducting wire C2 are both the comb-shaped structure in this embodiment.
  • the compensation capacitance is proportional to the area between the metal conducting wires.
  • the first metal conducting wire C1 and the second metal conducting wire C2 are interleavingly installed (namely staggered to each other) on the substrate 10 to increase the area between thereof.
  • Fig. 6A and Fig. 6B are a circuit diagram and a schematic view of a fifth embodiment of the electrical connector.
  • the electrical connector further includes a first metal plate P1 and a second metal plate P2.
  • the first metal plate P1 is electrically connected to first conductor T11 of the first conducting group G1
  • the second metal plate P2 is electrically connected to third conductor T12 of the first conducting group G1.
  • first metal plate P1 and the second metal plate P2 are considered in this embodiment, namely, the first metal conducting wire C1 and the second metal conducting wire C2 are not considered.
  • first metal plate P1 and the second metal plate P2 are designed according to the equation 1 and actual use thereof.
  • the specification such as area, pitch of the first metal plate P1 and the second metal plate P2 are the same. Also, the relative permittivity of the printed circuit board is determined. Hence the compensation capacitance Ctlt2 can be calculated according to the specification.
  • the crosstalk noise induced between the first signal loop pair L1 and the second signal loop pair L2 can be reduced and even canceled when signals are sent through either of the two signal loop pairs L1, L2.
  • first metal conducting wire C1 and the second metal conducting wire C2 are considered. Namely, the second conductor R21 and the fourth conductor R22 of the second conducting group G2 are electrically connected to the first metal conducting wire C1 and the second metal conducting wire C2, respectively. Also, the first conductor T1 and the third conductor T12 of the first conducting group G1 are electrically connected to the first metal plate P1 and the second metal plate P2, respectively.
  • the specification, such as length, width, pitch of the first metal conducting wire C1 and the second metal conducting wire C2, and the first metal plate P1 and the second metal plate P2 can be designed.
  • the crosstalk noise induced between the first signal loop pair L1 and the second signal loop pair L2 can be reduced and even canceled when signals are sent through either of the two signal loop pairs L1, L2.
  • the compensation capacitance Crlr2 is provided by the first metal conducting wire C1 and the second metal conducting wire C2, and the compensation capacitance Ctlt2 is provided by the first metal plate P1 and the second metal plate P2.
  • the totally equivalent compensation capacitance is the total sum of the compensation capacitance Crlr2 and the compensation capacitance Ctlt2 when the metal conducting wires C1, C2 of the first conducting group G1 and the metal plates P1 and P2 of the second conducting group are simultaneously used.
  • the equivalent capacitance Ctlt2 can be provided by electrically connecting the first conductor T11 to the second metal plate P2 and electrically connecting the third conductor T12 to the first metal plate P1.
  • the difference between this embodiment and the above-mentioned embodiment is only the connection relationship. Hence, the detail description is omitted here for conciseness.
  • the electrical connector with crosstalk compensation is provided to reduce and even cancel the crosstalk noise induced between the first signal loop pair L1 and the second signal loop pair L2 by using only the metal conducting wires or the metal plates and even both the metal conducting wires and the metal plates.
  • Fig. 7 is a curve chart of showing the result before and after compensation of the embodiment shown in Fig. 2A .
  • the abscissa represents the frequency (in Megaherz) and the ordinate represents the crosstalk magnitude (in dB).
  • a dashed line represents the crosstalk magnitude induced between the two signal loop pairs L1, L2 without using the metal conducting wires C1, C2 (namely before compensation).
  • a solid line represents the crosstalk magnitude induced between the two signal loop pairs L1, L2 by using the metal conducting wires C1, C2 (namely after compensation).
  • the test data are 8-mm-length, 0.254-mm-width, and 0.254-mm-pitch metal conducting wires C1, C2.
  • the reduced crosstalk magnitude is approximately 5dB between 1 to 500 MHz, and more particularly the reduced degree of the crosstalk magnitude is significant between 50 to 350 MHz.
  • the present invention has following advantages:
  • the specification, such as length, width, pitch of the metal conducting wires C1, C2 or the metal plates P1, P2 can be designed according to the measured coupled capacitance.
  • the crosstalk noise induced between the first signal loop pair L1 and the second signal loop pair L2 can be reduced and even canceled when signals are sent through either of the two signal loop pairs L1, L2.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
EP10150431A 2010-01-11 2010-01-11 Connecteur électrique avec compensation de diaphonie Withdrawn EP2363925A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10150431A EP2363925A1 (fr) 2010-01-11 2010-01-11 Connecteur électrique avec compensation de diaphonie

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10150431A EP2363925A1 (fr) 2010-01-11 2010-01-11 Connecteur électrique avec compensation de diaphonie

Publications (1)

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EP2363925A1 true EP2363925A1 (fr) 2011-09-07

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EP10150431A Withdrawn EP2363925A1 (fr) 2010-01-11 2010-01-11 Connecteur électrique avec compensation de diaphonie

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5299956A (en) 1992-03-23 1994-04-05 Superior Modular Products, Inc. Low cross talk electrical connector system
US6089923A (en) * 1999-08-20 2000-07-18 Adc Telecommunications, Inc. Jack including crosstalk compensation for printed circuit board
WO2005053324A2 (fr) * 2003-11-21 2005-06-09 Leviton Manufacturing Co., Inc. Panneau de cablage a systeme de reduction de la diaphonie et procede associe
US20050250372A1 (en) * 1998-08-24 2005-11-10 Panduit Corp. Low crosstalk modulator communication connector
EP1826879A1 (fr) * 2006-02-23 2007-08-29 Surtec Industries, Inc. Connecteur pour installation de communications ayant une disposition de contacts à broche et augmentation des performances de compensation
US20070238367A1 (en) * 2006-04-11 2007-10-11 Hammond Bernard H Jr Telecommunications jack with crosstalk multi-zone crosstalk compensation and method for designing
WO2009102851A1 (fr) * 2008-02-12 2009-08-20 Adc Gmbh Compensation de télédiaphonie améliorée

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5299956A (en) 1992-03-23 1994-04-05 Superior Modular Products, Inc. Low cross talk electrical connector system
US5299956B1 (en) 1992-03-23 1995-10-24 Superior Modular Prod Inc Low cross talk electrical connector system
US20050250372A1 (en) * 1998-08-24 2005-11-10 Panduit Corp. Low crosstalk modulator communication connector
US6089923A (en) * 1999-08-20 2000-07-18 Adc Telecommunications, Inc. Jack including crosstalk compensation for printed circuit board
WO2005053324A2 (fr) * 2003-11-21 2005-06-09 Leviton Manufacturing Co., Inc. Panneau de cablage a systeme de reduction de la diaphonie et procede associe
EP1826879A1 (fr) * 2006-02-23 2007-08-29 Surtec Industries, Inc. Connecteur pour installation de communications ayant une disposition de contacts à broche et augmentation des performances de compensation
US20070238367A1 (en) * 2006-04-11 2007-10-11 Hammond Bernard H Jr Telecommunications jack with crosstalk multi-zone crosstalk compensation and method for designing
WO2009102851A1 (fr) * 2008-02-12 2009-08-20 Adc Gmbh Compensation de télédiaphonie améliorée

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