EP2341275A1 - LED-Lampe mit höherer Effizienz - Google Patents

LED-Lampe mit höherer Effizienz Download PDF

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Publication number
EP2341275A1
EP2341275A1 EP09016067A EP09016067A EP2341275A1 EP 2341275 A1 EP2341275 A1 EP 2341275A1 EP 09016067 A EP09016067 A EP 09016067A EP 09016067 A EP09016067 A EP 09016067A EP 2341275 A1 EP2341275 A1 EP 2341275A1
Authority
EP
European Patent Office
Prior art keywords
alternating current
heatsink
led module
housing
heatsink housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09016067A
Other languages
English (en)
French (fr)
Inventor
Wen-Lung Chin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to EP09016067A priority Critical patent/EP2341275A1/de
Publication of EP2341275A1 publication Critical patent/EP2341275A1/de
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a lamp and, more particularly, to an LED (light emitting diode) lamp to provide a lighting function.
  • a conventional LED (light emitting diode) lamp comprises an LED to emit light outwardly so as to provide a lighting function.
  • the LED is a heat source and easily produces a high temperature during operation, so that it is necessary to provide a heat sink to carry away the heat produced by the LED to prevent the LED from being inoperative due to an overheat.
  • a conventional heat sink generally comprises a heatsink element, such as a metallic heatsink fin, a heat conductive tube, a chill enabling chip, a heat dissipation board, a cooling fan and the like, so as to provide a heat dissipation effect to the LED.
  • the conventional heat sink cannot dissipate the heat from the heat source exactly and quickly, thereby greatly decreasing the heat dissipation efficiency.
  • the conventional heat sink has a very complicated construction, thereby increasing the costs of fabrication. Further, the conventional heat sink does not have an electrically insulating feature, thereby causing danger during operation. Further, the conventional heat sink is not a standardized product so that it cannot be mounted on a traditional lamp.
  • an LED (light emitting diode) lamp comprising a heatsink housing and an alternating current LED module mounted in the heatsink housing.
  • the alternating current LED module includes a heat conducting portion and two electrical connections.
  • the heat conducting portion of the alternating current LED module is combined with the heatsink housing.
  • the electrical connections of the alternating current LED module are electrically connected with an external power supply.
  • the heatsink housing forms a nonmetallic porous structure with a great heat dissipation feature.
  • the heatsink housing is formed to have the profile of a common lamp housing.
  • the heatsink housing has a hollow inside provided with a receiving chamber to receive the alternating current LED module.
  • an LED (light emitting diode) lamp comprising a heatsink housing, at least one alternating current LED module mounted in the heatsink housing, and a heat conducting member mounted on the heatsink housing.
  • the alternating current LED module includes a heat conducting portion and two electrical connections. The heat conducting portion of the alternating current LED module is combined with the heat conducting member. The electrical connections of the alternating current LED module are electrically connected with an external power supply.
  • the heatsink housing forms a nonmetallic porous structure with a great heat dissipation feature.
  • the heatsink housing is formed to have the profile of a common lamp housing.
  • the primary objective of the present invention is to provide an LED lamp having a higher efficiency.
  • Another objective of the present invention is to provide an LED lamp having a greater heatsink effect.
  • a further objective of the present invention is to provide an LED lamp, wherein the heatsink housing forms a porous structure with a great heat dissipation feature and a high specific surface area to provide a greater heatsink effect and to quickly carry away the heat produced by the alternating current LED module so as to enhance the heat dissipation efficiency of the alternating current LED module.
  • a further objective of the present invention is to provide an LED lamp, wherein the heatsink housing is directly formed to have the profile of a common lamp housing and is provided with a metallic screw base, an insulating gasket and a power contact plate so that the heatsink housing can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • an LED (light emitting diode) lamp in accordance with the preferred embodiment of the present invention comprises a heatsink housing 2, an alternating current LED module 1 mounted in the heatsink housing 2, and a shade 24 mounted on the heatsink housing 2 to encompass the alternating current LED module 1.
  • the alternating current LED module 1 is a modularized product.
  • the alternating current LED module 1 includes a heat conducting portion 10 and two electrical connections 11.
  • the heat conducting portion 10 of the alternating current LED module 1 is combined with the heatsink housing 2.
  • the electrical connections 11 of the alternating current LED module 1 are electrically connected with an external power supply (not shown) to electrically connect the alternating current LED module 1 to the external power supply.
  • the heatsink housing 2 forms a porous structure with a great heat dissipation feature and a high specific surface area.
  • the porous structure formed by the heatsink housing 2 is made of a nonmetallic powder (formed by an injection molding process) having a great heat conductivity, such as Al 2 O 3 , Zr 2 O, AIN, SiN, BN, WC, C, SiC, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • the nonmetallic powder making the porous structure is AIN and SiC.
  • the heatsink housing 2 has a hollow inside provided with a receiving chamber 20 to receive the alternating current LED module 1.
  • the heat conducting portion 10 of the alternating current LED module 1 is received in the receiving chamber 20 of the heatsink housing 2.
  • the heatsink housing 2 is formed to have the profile of a common lamp housing (or socket).
  • the heatsink housing 2 has a substantially semi-spherical profile.
  • the heatsink housing 2 has an end portion provided with a threaded stud 28 for mounting a metallic screw base 21, an insulating gasket 22 and a power contact plate 23.
  • each of the metallic screw base 21, the insulating gasket 22 and the power contact plate 23 has an international specification of E-27, E-14 and the like.
  • the metallic screw base 21 and the power contact plate 23 are electrically connected to the electrical connections 11 of the alternating current LED module 1.
  • the heatsink housing 2 has a surface provided with a plurality of heatsink grooves 27 to increase a heatsink surface area of the heatsink housing 2 so as to enhance the heat dissipation efficiency of the heatsink housing 2.
  • the heatsink housing 2 has an electrically insulating feature.
  • the heat produced by the alternating current LED module 1 is transferred by the heat conduction of the heatsink housing 2, so that the heat produced by the alternating current LED module 1 is carried away exactly and quickly so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the heatsink housing 2 forms a porous structure with a great heat dissipation feature and a high specific surface area to provide a greater heatsink effect and to quickly carry away the heat produced by the alternating current LED module 1 so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the heatsink housing 2 is directly formed to have the profile of a common lamp housing and is provided with a metallic screw base 21, an insulating gasket 22 and a power contact plate 23 so that the heatsink housing 2 can be mounted on a traditional receptacle to replace the conventional electric bulb.
  • the LED lamp further comprises a heat conducting plate 3 mounted between the heat conducting portion 10 of the alternating current LED module 1 and the heatsink housing 2 to carry away the heat produced by the alternating current LED module 1 so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the heat conducting plate 3 is made of a metal having a great heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like.
  • the heat produced by the alternating current LED module 1 is transferred by the heat conduction and the heat convection between the heat conducting plate 3 and the heatsink housing 2, so that the heat produced by the alternating current LED module 1 is carried away exactly and quickly so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the heatsink housing 2 co-operates with the heat conducting plate 3 to provide a greater heatsink effect and to quickly carry away the heat produced by the alternating current LED module 1 so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the LED lamp further comprises a conduction board 30 mounted between the heat conducting plate 3 and the heatsink housing 2 to carry away the heat produced by the alternating current LED module 1 so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the conduction board 30 is made of a metal having a great heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like.
  • the heat of the heat conducting plate 3 is transmitted through the conduction board 30 to the heatsink housing 2 quickly so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the LED lamp further comprises two connecting pins 25 (with an international specification of MR16 and the like) electrically connected with the electrical connections 11 of the alternating current LED module 1 and protruding outwardly from the heatsink housing 2 to electrically connect the alternating current LED module 1 to an external power supply (not shown).
  • the LED lamp further comprises a reflective shade 26 mounted on the heatsink housing 2 to encompass the alternating current LED module 1.
  • the LED lamp functions as a projection lamp to replace the traditional projection lamp.
  • an LED (light emitting diode) lamp in accordance with another preferred embodiment of the present invention comprises a heatsink housing 5, at least one alternating current LED module 1 mounted in the heatsink housing 5, a heat conducting member 4 mounted on the heatsink housing 5 and a shade 54 mounted on the heatsink housing 5 to encompass the alternating current LED module 1 and the heat conducting member 4.
  • the alternating current LED module 1 includes a heat conducting portion 10 and two electrical connections 11.
  • the heat conducting portion 10 of the alternating current LED module 1 is combined with the heat conducting member 4.
  • the electrical connections 11 of the alternating current LED module 1 are electrically connected with an external power supply (not shown) to electrically connect the alternating current LED module 1 to the external power supply.
  • the heatsink housing 5 forms a porous structure with a great heat dissipation feature and a high specific surface area.
  • the porous structure formed by the heatsink housing 5 is made of a nonmetallic powder (formed by an injection molding process) having a great heat conductivity, such as Al 2 O 3 , Zr 2 O, AIN, SiN, BN, WC, C, SiC, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • the nonmetallic powder making the porous structure is AIN and SiC.
  • the heatsink housing 5 is formed to have the profile of a common lamp housing (or socket).
  • the heatsink housing 5 has a substantially semi-spherical profile.
  • the heatsink housing 5 has an end portion provided with a threaded stud 58 for mounting a metallic screw base 51, an insulating gasket 52 and a power contact plate 53.
  • a metallic screw base 51, the insulating gasket 52 and the power contact plate 53 has an international specification of E-27, E-14 and the like.
  • the metallic screw base 51 and the power contact plate 53 are electrically connected to the electrical connections 11 of the alternating current LED module 1.
  • the heat conducting member 4 is preferably made of a metal having a great heat conductivity, such as gold, silver, copper, iron, aluminum, cobalt, nickel, zinc, titanium, manganese and the like.
  • the heat conducting member 4 is preferably made of a nonmetallic material having a great heat conductivity, such as A1 2 O 3; Zr 2 O, AIN, SiN, BN, WC, C, SiC, crystalline SiC, Recrystalline SiC (ReSiC) and the like.
  • the nonmetallic powder making the porous structure is AIN and SiC.
  • the heat produced by the alternating current LED module 1 is transferred by the heat conduction and the heat convection between the heat conducting member 4 and the heatsink housing 5, so that the heat produced by the alternating current LED module 1 is carried away exactly and quickly so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the alternating current LED module 1 is combined with the heat conducting member 4 after assembly.
  • the heat conducting member 4 is directly integrally formed with the alternating current LED module 1.
  • the heat conducting member 4 is directly integrally formed on the heatsink housing 5 to form a metallic heat conducting layer 40 on the heatsink housing 5.
  • the heatsink housing 5 has a hollow inside provided with a receiving chamber 50 to receive the alternating current LED module 1 and the heat conducting member 4.
  • the LED lamp further comprises two connecting pins 55 (with an international specification of MR16 and the like) electrically connected with the electrical connections 11 of the alternating current LED module 1 and protruding outwardly from the heatsink housing 5 to electrically connect the alternating current LED module 1 to an external power supply (not shown).
  • the LED lamp further comprises a mounting board 58 mounted on the heatsink housing 5, and at least one reflective shade 56 mounted on the mounting board 58 to encompass the at least one alternating current LED module 1.
  • the LED lamp functions as a projection lamp to replace the traditional projection lamp.
  • the mounting board 58 has a plurality of ventilating holes 59 connected to the receiving chamber 50 the heatsink housing 5 to provide a heat convection effect so as to enhance the heat dissipation efficiency of the alternating current LED module 1.
  • the heatsink housing 5 has a surface provided with a plurality of heatsink grooves 57 to increase a heatsink surface area of the heatsink housing 5 so as to enhance the heat dissipation efficiency of the heatsink housing 5.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP09016067A 2009-12-29 2009-12-29 LED-Lampe mit höherer Effizienz Withdrawn EP2341275A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09016067A EP2341275A1 (de) 2009-12-29 2009-12-29 LED-Lampe mit höherer Effizienz

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09016067A EP2341275A1 (de) 2009-12-29 2009-12-29 LED-Lampe mit höherer Effizienz

Publications (1)

Publication Number Publication Date
EP2341275A1 true EP2341275A1 (de) 2011-07-06

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EP09016067A Withdrawn EP2341275A1 (de) 2009-12-29 2009-12-29 LED-Lampe mit höherer Effizienz

Country Status (1)

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EP (1) EP2341275A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2584246A1 (de) * 2011-10-20 2013-04-24 Chih-Shen Chou Hochleistungsleuchtdiodenlampe
CN106969297A (zh) * 2017-03-24 2017-07-21 成都佰思汇信科技有限责任公司 一种led天花灯

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses
DE202007009655U1 (de) 2007-07-11 2007-09-06 Aeon Lighting Technology Inc., Chung-Ho City Wärmeableitvorrichtung für LED-Licht emittierendes Modul
US20070230188A1 (en) 2006-03-30 2007-10-04 Yi Min Lin Light-emitting diode light
WO2008108574A1 (en) * 2007-03-06 2008-09-12 Gwang Sung Lighting Industry Co., Ltd. Lamp with light emitting diodes using alternating current
EP2105659A1 (de) 2008-03-27 2009-09-30 Wen-Long Chyn LED-Lampe mit höherer Effizienz

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses
US20070230188A1 (en) 2006-03-30 2007-10-04 Yi Min Lin Light-emitting diode light
WO2008108574A1 (en) * 2007-03-06 2008-09-12 Gwang Sung Lighting Industry Co., Ltd. Lamp with light emitting diodes using alternating current
DE202007009655U1 (de) 2007-07-11 2007-09-06 Aeon Lighting Technology Inc., Chung-Ho City Wärmeableitvorrichtung für LED-Licht emittierendes Modul
EP2105659A1 (de) 2008-03-27 2009-09-30 Wen-Long Chyn LED-Lampe mit höherer Effizienz

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2584246A1 (de) * 2011-10-20 2013-04-24 Chih-Shen Chou Hochleistungsleuchtdiodenlampe
CN106969297A (zh) * 2017-03-24 2017-07-21 成都佰思汇信科技有限责任公司 一种led天花灯

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