EP2244009B1 - Wärmeableitende Anordnung eines LED-Lampenhalters - Google Patents

Wärmeableitende Anordnung eines LED-Lampenhalters Download PDF

Info

Publication number
EP2244009B1
EP2244009B1 EP09005730A EP09005730A EP2244009B1 EP 2244009 B1 EP2244009 B1 EP 2244009B1 EP 09005730 A EP09005730 A EP 09005730A EP 09005730 A EP09005730 A EP 09005730A EP 2244009 B1 EP2244009 B1 EP 2244009B1
Authority
EP
European Patent Office
Prior art keywords
heat
plate
assembly
lamp holder
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP09005730A
Other languages
English (en)
French (fr)
Other versions
EP2244009A1 (de
Inventor
Kuo-Len Lin
Chen-Hsiang Lin
Hwai-Ming Wang
Chiao-Li Huang
Ken Hsu
Chih-Hung Cheng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Golden Sun News Techniques Co Ltd
Original Assignee
CpuMate Inc
Golden Sun News Techniques Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CpuMate Inc, Golden Sun News Techniques Co Ltd filed Critical CpuMate Inc
Priority to EP09005730A priority Critical patent/EP2244009B1/de
Priority to AT09005730T priority patent/ATE520930T1/de
Publication of EP2244009A1 publication Critical patent/EP2244009A1/de
Application granted granted Critical
Publication of EP2244009B1 publication Critical patent/EP2244009B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the present invention relates to a LED lamp, and in particular to a heat-dissipating assembly of a LED lamp holder.
  • An assembly according to the preamble of claim 1 is disclosed in DE 10 2007 042 978 .
  • LED Light-emitting diodes
  • the LED since the LED is an electronic element, it has to be waterproof and dust-proof when being applied to an outdoor lamp. Further, the heat-dissipating performance of the LED has to be also taken into consideration.
  • the current heat-dissipating assembly in a LED lamp holder continues using a heat sink or heat-dissipating device in a computer host.
  • a heat-conducting plate is brought into contact with a heat source.
  • heat pipes are connected to transmit the heat to the lamp cover or heat-dissipating fins, thereby cooling the heat source.
  • the above-mentioned members have to be fixedly connected to each other with a superior heat-conducting effect, such as by means of tin paste or adhesive heat-conducting paste. Therefore, it is impossible to detach these members after being assembled together, which makes more difficult to replace the damaged components in the future. Since it is unable to replace the damaged components, the whole lamp holder should be replaced, which causes the waste in cost.
  • the present Inventor proposes a reasonable and novel structure based on his delicate researches and expert experiments.
  • the present invention is to provide an assembly of a LED lamp holder. Without affecting the contact between a heat-dissipating device and a heat source of a LED unit, a detachable assembly is provided, so that the components within the LED lamp holder can be replaced. Especially, after being detached, the contact between the heat-dissipating device and the heat source of the LED unit will not be affected.
  • the present invention is to provide an assembly of a LED lamp holder, which includes a lamp cover and a heat-dissipating device provided in the lamp cover.
  • An accommodating inlet is provided on the lamp cover.
  • a LED unit is provided below the lamp cover.
  • a cover plate covers the accommodating inlet.
  • the heat-dissipating device comprises a heat-absorbing plate, a heat-dissipating plate and a heat pipe connected between the heat-absorbing plate and the heat-dissipating plate.
  • the heat-absorbing plate is brought into contact with the LED unit, while the heat-dissipating plate is brought into contact with the cover plate.
  • the cover plate is penetrated by a plurality of screw elements. Each of the screw elements is screwed to the heat-absorbing plate. The length of each screw element exactly makes the heat-absorbing plate to abut and contact the LED unit, and the respective screw elements can keep this state.
  • the heat-dissipating device is assembled with the cover plate to form
  • Fig. 1 is an exploded perspective view of the present invention
  • Fig. 2 is an assembled view showing the internal structure of the present invention.
  • the present invention provides an assembly of a LED lamp holder, which includes a lamp cover 1 and a heat-dissipating device 2 provided in the lamp cover 1.
  • the lamp cover 1 is constituted of a base 10 and an upper cover 11.
  • a LED unit 3 is disposed below the base 10.
  • the LED unit 3 comprises a circuit board 30 and a plurality of light-emitting diodes 31 provided on the circuit board 30, so that the light emitted by each of the light-emitting diodes 31 of the LED unit 3 can project toward the underside of the lamp cover 1 ( Fig. 4 ).
  • Each of the front and rear sides of the base 10 is formed with an upright shielding plate 12.
  • the slightly-curved upper cover 11 spans between the two shielding plates 12. Air holes 120 are provided on the shielding plate 12
  • the heat-dissipating device 2 is provided in the lamp cover 1 and comprises a heat-absorbing plate 20, at least one heat pipe 21 and a heat-dissipating plate 22.
  • the heat-absorbing plate 20 is brought into contact with the back surface of the LED unit 3 to facilitate the heat dissipation of the LED unit 3.
  • a heat-conducting substrate 32 is adhered on the back surface of the LED unit 3.
  • the bottom surface of the heat-conducting substrate 32 is provided with a trough 320 for allowing the LED unit 3 to be accommodated in the trough 320.
  • the heat-absorbing plate 20 is provided with at least one groove 200 for allowing one end of the heat pipe 21 to be embedded therein.
  • the groove 200 is preferably located on the bottom surface of the heat-absorbing plate 20, so that it can be adhered to the heat source of the LED unit 3 more closely.
  • the heat-dissipating plate 22 is provided with at least one groove 220 for allowing the other end of the heat pipe 21 to be embedded therein.
  • the groove 220 is preferably located on the top surface of the heat-dissipating plate 22, so that it can be further distant from the heat source of the LED unit 3.
  • the upper cover 11 of the lamp cover 1 is provided with an accommodating inlet 110 that is positioned to correspond to the heat-dissipating device 2 for allowing the heat-dissipating device 2 to pass through.
  • a cover plate 13 covers the accommodating inlet 110.
  • the heat-dissipating plate 22 of the heat-dissipating device 2 is adhered to the underside of the cover plate 13.
  • the cover plate 13 is assembled to the upside of the heat-dissipating device 2. Then, via the accommodating inlet 2, the heat-dissipating device 2 is assembled in the lamp cover 1, so that the underside of the heat-dissipating device 2 can be brought into contact with the heat source of the LED unit 3. At this time, a plurality of screw elements 14 such as bolts are used to penetrate the cover plate 13 to be screwed on the heat-absorbing plate 20.
  • the cover plate 13 is provided with through-holes 130 for allowing the screw elements 14 to pass through. Further, the heat-absorbing plate 20 is provided with screw holes 201 for allowing the screw elements 14 to be screwed therein.
  • the cover plate 13 is provided with through-holes 131 for allowing screws 15 to pass through.
  • the through-holes 131 are positioned to correspond to the screw holes 221 on the heat-dissipating plate 22, so that the cover plate 13 and the heat-dissipating plate 22 can be brought into contact with each other via the screws.
  • screws 16 may pass through the through-holes 132 to fasten the upper cover 11 to screw holes 111 near the periphery of the accommodating inlet 110, thereby completing the assembly.
  • the length of the screw element 14 is preset to make the heat-absorbing plate 20 abut the back surface of the LED unit 3 or contact the top surface of the heat-conducting substrate 32.
  • the heat-absorbing plate 20 of the heat-dissipating device 2 can be brought into contact with the heat source of the LED unit 3 surely.
  • the present invention forms a detachable assembly, so that it is convenient to replace the components within this assembly in the future.
  • the assembly of LED lamp holder of the present invention can be achieved.
  • each of the screw elements 14 has an exact length to make the heat-absorbing plate 20 of the heat-dissipating device 2 abut and contact the LED unit 3. Further, via the respective screw elements 14, the above-mentioned state can be kept. Thus, the heat-dissipating device 2 is assembled with the cover plate 13 to form a detachable assembly. Even after detachment and re-assembly, the respective screw elements 14 can still maintain the contact between the heat-absorbing plate 20 and the LED unit 3.
  • a layer of heat-conducting medium such as heat-conducting paste (not shown) can be applied between the heat-absorbing plate 20 and the back surface of the Led unit 3 (or the top surface of the heat-conducting substrate 32).
  • the heat-dissipating device 2 is additionally provided with other heat-dissipating members 23 on the inner periphery of the lamp cover 1.
  • the present invention already achieves the desired objects and overcomes the problems of prior art.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Claims (9)

  1. Anordnung eines LED-Lampenhalters, umfassend:
    - eine Lampenabdeckung (1) mit einem Aufnahmezugang (110) an ihrer Oberseite und einer LED-Einheit an ihrer Unterseite, wobei eine Abdeckplatte (13) den Aufnahmezugang (110) bedeckt; und
    - eine wärmeableitende Vorrichtung (2), die innerhalb der Lampenabdeckung (1) bereitgestellt ist, und die eine wärmeabsorbierende Platte (20), eine wärmeableitende Platte (22) und eine Wärmeleitung (21), die zwischen die wärmeabsorbierende Platte (20) und die wärmeableitende Platte (22) angeschlossen ist, aufweist, wobei die wärmeabsorbierende Platte (20) mit der LED-Einheit (3) und die wärmeableitende Platte (22) mit der Abdeckplatte (13) in Kontakt ist;
    dadurch gekennzeichnet, dass
    die Abdeckplatte (13) von mehreren Schraubenelementen (14) durchdrungen ist, wobei die Schraubenelemente (14) an der wärmeabsorbierenden Platte (20) angeschraubt sind, und wobei eine Länge eines jeden Schraubenelements (14) genau ausgelegt ist, um die wärmeabsorbierende Platte (20) an die LED-Einheit (3) zur Anlage zu bringen und sie mit dieser in Kontakt zu bringen, sowie diesen Zustand aufrecht zu erhalten.
  2. Anordnung eines LED-Lampenhalters nach Anspruch 1, wobei die Lampenabdeckung (1) aus einer Basis (10) und einer oberen Abdeckung (11) gebildet ist, die LED-Einheit (3) unterhalb der Basis (10) angeordnet ist, und sich der Aufnahmezugang (110) an der oberen Abdeckung (11) befindet.
  3. Anordnung eines LED-Lampenhalters nach Anspruch 2, wobei jede der Vorder- und Rückseiten der Basis (10) mit einer aufrechten Abschirmplatte (12) ausgebildet ist, und die obere Abdeckung (11) gekrümmt ist und die zwei Abschirmplatten (12) der Vorder- und Rückseiten der Basis (10) umfasst.
  4. Anordnung eines LED-Lampenhalters nach Anspruch 3, wobei die beiden Abschirmplatten (12) mit Luftlöchern (120) versehen sind.
  5. Anordnung eines LED-Lampenhalters nach Anspruch 1, wobei die LED-Einheit (3) eine Leiterplatte (30) und mehrere lichtemittierende Dioden (31) auf der Leiterplatte (30) umfasst, eine Rückseite der Leiterplatte (30) mit einem wärmeleitenden Substrat (32) verklebt ist, und wobei die wärmeabsorbierende Platte (20) mit dem wärmeleitenden Substrat (32) verklebt und in Kontakt mit der LED-Einheit (3) ist.
  6. Anordnung eines LED-Lampenhalters nach Anspruch 5, wobei eine Unterseite des wärmeleitenden Substrats (32) mit einer Mulde (320) versehen ist, die zur Aufnahme der LED-Einheit (3) vorgesehen ist.
  7. Anordnung eines LED-Lampenhalters nach Anspruch 1, wobei die Abdeckplatte (13) mit Durchgangslöchern (130) versehen ist, die einen Durchgang entsprechender Schraubenelemente (14) erlauben, und die wärmeabsorbierende Platte (20) mit Schraubenlöchern (201) versehen ist, so dass die entsprechenden Schraubenelemente (14) darin eingeschraubt werden können.
  8. Anordnung eines LED-Lampenhalters nach Anspruch 7, wobei das Schraubenelement (14) ein Bolzen ist.
  9. Anordnung eines LED-Lampenhalters nach Anspruch 1, wobei das Schraubenelement (14) ein Bolzen ist.
EP09005730A 2009-04-23 2009-04-23 Wärmeableitende Anordnung eines LED-Lampenhalters Not-in-force EP2244009B1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP09005730A EP2244009B1 (de) 2009-04-23 2009-04-23 Wärmeableitende Anordnung eines LED-Lampenhalters
AT09005730T ATE520930T1 (de) 2009-04-23 2009-04-23 Wärmeableitende anordnung eines led-lampenhalters

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09005730A EP2244009B1 (de) 2009-04-23 2009-04-23 Wärmeableitende Anordnung eines LED-Lampenhalters

Publications (2)

Publication Number Publication Date
EP2244009A1 EP2244009A1 (de) 2010-10-27
EP2244009B1 true EP2244009B1 (de) 2011-08-17

Family

ID=41112994

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09005730A Not-in-force EP2244009B1 (de) 2009-04-23 2009-04-23 Wärmeableitende Anordnung eines LED-Lampenhalters

Country Status (2)

Country Link
EP (1) EP2244009B1 (de)
AT (1) ATE520930T1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6301423B1 (ja) * 2016-09-30 2018-03-28 株式会社テレビ東京 照明装置
CN109990253B (zh) * 2019-04-08 2021-03-26 广东力维电器有限公司 一种便于更换的led照明设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070081340A1 (en) * 2005-10-07 2007-04-12 Chung Huai-Ku LED light source module with high efficiency heat dissipation
WO2007143875A2 (en) * 2006-05-30 2007-12-21 Jen-Shyan Chen High-power and high heat-dissipating light emitting diode illuminating equipment
DE102007042978A1 (de) * 2007-09-10 2009-03-12 Osram Gesellschaft mit beschränkter Haftung Lampe
CN101469819A (zh) * 2007-12-27 2009-07-01 富准精密工业(深圳)有限公司 发光二极管灯具

Also Published As

Publication number Publication date
ATE520930T1 (de) 2011-09-15
EP2244009A1 (de) 2010-10-27

Similar Documents

Publication Publication Date Title
US9241401B2 (en) Solid state lighting device and method employing heat exchanger thermally coupled circuit board
US7588355B1 (en) LED lamp assembly
US7654702B1 (en) LED lamp
US8267550B2 (en) LED lamp for easy assembly and fixation
US7677768B2 (en) LED lamp having a convenient replacement structure
US7726845B2 (en) LED lamp
EP2134569B1 (de) Beleuchtungsanordnung mit einem wärmeabführgehäuse
CN101566320B (zh) 发光二极管灯具
US7648258B2 (en) LED lamp with improved heat sink
EP1785764A4 (de) Wärmeabgebende einrichtung und display
US20100246179A1 (en) Led lamp
US20090323331A1 (en) Illumination device
CA2549077A1 (en) Light emitting diode (led) light bulbs
CN101725947A (zh) 发光二极管照明装置
CN102157671A (zh) 发光二极管装置、照明设备及制造发光二极管装置的方法
US20100254140A1 (en) Lamp holder of led streetlamp with heat-conducting and heat-dissipating capability
EP2085681A2 (de) LED-Beleuchtungsvorrichtung, LED-Lichtquellenmodul und LED-Trägerelement
US20100265708A1 (en) Heat-dissipating assembly of led lamp holder
TW200719028A (en) Backlight module
US20110069500A1 (en) Heat Dissipation Module For Bulb Type LED Lamp
EP2244009B1 (de) Wärmeableitende Anordnung eines LED-Lampenhalters
US20090009996A1 (en) Lighting Device
CN202307882U (zh) 发光装置及具备该发光装置的照明器具
US20080304270A1 (en) Light emitting diode heat dissipation module
US8182107B2 (en) LED luminaire made with recycled materials

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20091215

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA RS

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: F21Y 101/02 20060101ALN20110209BHEP

Ipc: F21V 29/00 20060101ALI20110209BHEP

Ipc: F21V 17/12 20060101AFI20110209BHEP

RIN1 Information on inventor provided before grant (corrected)

Inventor name: HSU, KEN

Inventor name: LIN, CHEN-HSIANG

Inventor name: HUANG, CHIAO-LI

Inventor name: WANG, HWAI-MING

Inventor name: LIN, KUO-LEN

Inventor name: CHENG, CHIH-HUNG

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602009002127

Country of ref document: DE

Effective date: 20111117

REG Reference to a national code

Ref country code: NL

Ref legal event code: T3

LTIE Lt: invalidation of european patent or patent extension

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111219

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111117

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111217

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 520930

Country of ref document: AT

Kind code of ref document: T

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111118

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

26N No opposition filed

Effective date: 20120521

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120328

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20120426

Year of fee payment: 4

Ref country code: DE

Payment date: 20120430

Year of fee payment: 4

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20120525

Year of fee payment: 4

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602009002127

Country of ref document: DE

Effective date: 20120521

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120430

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120423

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111128

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111117

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20131101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20130423

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130430

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131101

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130430

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130423

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20131231

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602009002127

Country of ref document: DE

Effective date: 20131101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131101

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20110817

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120423

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090423