EP2230476A2 - Réglage de la température pour un évaporateur à microstructure destiné au refroidissement de liquides - Google Patents

Réglage de la température pour un évaporateur à microstructure destiné au refroidissement de liquides Download PDF

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Publication number
EP2230476A2
EP2230476A2 EP10001550A EP10001550A EP2230476A2 EP 2230476 A2 EP2230476 A2 EP 2230476A2 EP 10001550 A EP10001550 A EP 10001550A EP 10001550 A EP10001550 A EP 10001550A EP 2230476 A2 EP2230476 A2 EP 2230476A2
Authority
EP
European Patent Office
Prior art keywords
temperature
heat exchanger
evaporator
temperature control
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10001550A
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German (de)
English (en)
Other versions
EP2230476A3 (fr
Inventor
Jürgen Dr. Brandner
Wolf Wibel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Karlsruher Institut fuer Technologie KIT
Original Assignee
Karlsruher Institut fuer Technologie KIT
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Filing date
Publication date
Application filed by Karlsruher Institut fuer Technologie KIT filed Critical Karlsruher Institut fuer Technologie KIT
Publication of EP2230476A2 publication Critical patent/EP2230476A2/fr
Publication of EP2230476A3 publication Critical patent/EP2230476A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00Fluid-circulation arrangements
    • F25B41/20Disposition of valves, e.g. of on-off valves or flow control valves
    • F25B41/24Arrangement of shut-off valves for disconnecting a part of the refrigerant cycle, e.g. an outdoor part
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • F25B49/02Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00Control issues
    • F25B2600/25Control of valves
    • F25B2600/2501Bypass valves
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21Temperatures
    • F25B2700/2117Temperatures of an evaporator
    • F25B2700/21171Temperatures of an evaporator of the fluid cooled by the evaporator

Definitions

  • the invention relates to a temperature control for a microstructure evaporator for cooling liquids according to the first claim.
  • tempering heat exchangers
  • fluids liquid, vapor, gas
  • electrically operated elements such as an electric heater or Peltier elements.
  • Evaporative cooling for example, use the energy of a phase transition for heating or cooling.
  • Air-operated control valves or valves with electric actuator which are flow-regulating and well-known in the art (see for example product lines of companies such as Endress & Hauser, Jumo or other relevant manufacturers and distributors of measurement and control technology).
  • microstructured heat transfer systems Due to their fine structures, microstructured heat transfer systems have a high specific heat transfer surface and a low thermal mass, which on the one hand considerably improves their efficiency, but on the other hand also extends their range of application [1, 2].
  • the compact design allows use in transportable applications or in the kitchen machinery sector, such as the temperature control of beverages directly by the end user.
  • the reduced thermal mass of the micro heat exchanger leads to very short reaction times with temperature changes. For the heating of liquids, this is usually not a disadvantage. When using a heating fluid this is electrically heated elsewhere, for example.
  • This heating can be controlled by means of a conventional, low-cost regulator or via simple switching on and off by means of a bimetallic switch or an NTC or PTC sensor. Direct electrical heating can use similar mechanisms.
  • Appropriate regulatory systems are known and published [3, 4]. In [3] is described how an electrically heated microstructure apparatus is operated with a conventional control mechanisms. [4] describes the use of an electrical switch for the temperature-controlled regulation of an electrical load.
  • PTC or NTC sensors are integrated in the meantime, for example, as overtemperature protection elements as well as cost-effective control mechanisms in devices for private consumers (eg hair dryer).
  • Self-regulating heating elements based on PTC resistors are described eg in [5] and distributed by various manufacturers of electrical heating means (eg: David & Baader GmbH, [6])
  • Peltier elements are attached directly to the microstructure apparatus or indirectly used for cooling a secondary fluid for cooling, simple cut-off mechanisms for the supply voltage of the Peltier elements are available for power regulation or interruptions. This is technically possible, but usually shortens the life of the Peltier elements.
  • Peltier elements operate with a low efficiency or with a low temperature lift and require relatively voluminous secondary cooling to dissipate the power loss, they are only of limited suitability for use with microstructured apparatuses. The rather high price of Peltier elements and the operation Required power supplies or high current sources reduces the potential applications in the home and consumer markets in addition.
  • a simple shutdown or interruption of operation of other cooling devices such as refrigeration compressors, as widely used in commercial refrigerators, or cooling by evaporation of a coolant, e.g. in connection with microstructured apparatuses are also technologically limited feasible.
  • a compressor basically requires a certain start-up time and thus generates dead times during switching operations.
  • evaporation processes are inert in the case of changes and generally require lead times until a steady state returns.
  • the particular advantage of a fast reaction time of microstructure devices is thus partially or completely removed.
  • the mentioned means also cause unwanted irregularities in the cooling performance with its own dynamics.
  • the object of the invention is to propose an inexpensive and reliable temperature control for a microstructure evaporator for cooling fluids, preferably liquids, which does not have the disadvantages mentioned.
  • the scheme should meet the requirements of strong power fluctuations within a short time without significant delay. This requirement results from the task of cooling hot drinks batchwise to a defined temperature at the push of a button.
  • the solution of the problem provides a temperature control for a heat exchanger, preferably microstructure evaporator for temperature control, preferably cooling of liquids, wherein the microstructure evaporator with a tempering fluid, preferably a coolant operated.
  • the temperature control is controlled by controlling the amount of heat transferred in the heat exchanger, i. realized a heat quantity control.
  • manipulation of the tempering fluid flow passing through the heat exchanger or preferred microstructure evaporator takes place, for example. by tempering, throttling, control, interruption and / or bypass diversion as well as a temperature measurement on the tempering fluid for the generation of a control signal for the control.
  • temperrierfluid Miter In the context of temperature control, the manipulation of a coolant flow takes place as Temperierfluid Mitsch, by at least one flow valve for regulating a flow resistance in the coolant flow and / or at least one shut-off valve for interrupting a coolant flow.
  • the flow valve and / or the shut-off valve open and close regulated depending on temperature.
  • the temperature is measured in the context of the invention at different locations.
  • a control of the amount of heat transferred in the heat exchanger via the inlet temperature or the outlet temperature of the coolant at the microstructure evaporator is preferably, a control of the amount of heat transferred in the heat exchanger via the inlet temperature or the outlet temperature of the coolant at the microstructure evaporator.
  • a measured temperature T correlates advantageously directly to the evaporation pressure P steam on entry into the Evaporator passage in the heat exchanger.
  • This results from the sum of the pressure drop ⁇ P over the evaporator passage of the micro heat exchanger and the pressure Pmother in the suction line of a coolant circuit after exiting the evaporator. Accordingly, the pressure loss ⁇ P is calculated to: .DELTA.P P steam - P low
  • the pressure drop .DELTA.P is considerably larger than in corresponding macroscopic evaporators due to the microscopic dimensions, preferably between 50 and 1000 .mu.m of the cross sections of the single fluid channel. If the coolant in the micro heat exchanger fed with a quantity of heat Q warm, which is greater than or equal to the cooling power Q cold (required for complete vaporization heat quantity) of the circuit, the thermal treatment is completely evaporated within the individual fluid channels in the heat exchanger.
  • the Temperierfluidl is closed via a downstream of the heat exchanger solenoid valve as soon as T a below a threshold, which is about 2K above the freezing point of the fluid to be cooled (in water about 2 ° C. .). Exceeds the T a measured value back to the threshold value, the solenoid valve opens the Temperierfluidhne again, the full cooling capacity is directly available again.
  • a regulation of the outlet temperature T from the temperature control fluid from the heat exchanger is advantageous if a control over measurement of the temperature T a at the evaporator inlet due to the higher installation effort or due to the design of the micro heat exchanger (for example, in an integration of the expansion diaphragm in the micro heat exchanger) not technically possible or uneconomical.
  • the recording of this temperature is preferably carried out directly on the tempering after leaving the evaporator passage or more cost-effective by measuring the surface temperature of the suction at the terminal micro-transformer evaporator outlet (outlet at the heat exchanger).
  • the regulation is carried out analogously to the aforementioned temperature control over the inlet temperature, with the difference that the outlet temperature is used as a controlled variable.
  • the tempering fluid evaporates completely until Exit from the individual fluid channels (evaporator passage). There is an overheating of the tempering in the gaseous region; the temperature at the Temperierfluidaustritt T off is then significantly greater than 0 ° C.
  • a refrigerant R134A was used for this, but other tempering fluids are also possible and practical, such as R744 or R600a.
  • the tempering fluid does not evaporate completely within the individual fluid passages (evaporator passage).
  • Non-evaporated tempering fluid evaporates in this case immediately after exiting the evaporator passage upon entry into the suction line and therefore directly cools the suction line and the temperature sensor T from .
  • a value of about T of ⁇ 1 ° (for aqueous fluids to be temperature) has to be chosen in order to prevent freezing.
  • the invention includes use of the temperature control for cooling preferably in microstructured heat exchangers of hot beverages, preferably freshly brewed hot drinks such as coffee or tea, or other beverages such as hot beverages. Milk drinks, which are to be cooled on request, preferably immediately after a heat treatment (cold drink on demand).
  • the invention further includes a use of the temperature control for a temperature, preferably cooling in chemical processes or processes in which, for example due to an exothermic reaction or a heating time-dependent different temperatures occur or different amounts of heat must be removed controlled to ensure a stable experimental design or Temperaurkonstanz ,
  • the invention also includes use of the temperature control for temperature control of smaller air conditioners in e.g. portable devices in the electronics and IT sector or in the automotive sector, in which strong power fluctuations and thus also large fluctuations of the waste heat occur and are exchanged with heat exchangers of small dimensions.
  • the invention also includes a method for controlling the temperature of a microstructure evaporator for cooling liquids, wherein the microstructure evaporator is operated with a tempering fluid flow (coolant flow).
  • a tempering fluid flow coolant flow
  • this tempering fluid flow through the heat exchanger is set in the manner mentioned by at least one means for manipulating the tempering fluid flow into mass flow, volume flow, pressure and / or temperature.
  • Fig.1 to 3 give embodiments with countercurrent heat exchanger 1 as a microstructured evaporator again. This is on the one hand for the temperature control of fluids with high temperature differences.
  • it has a parallel guidance of a plurality of individual fluid channels for liquid 3 to be tempered and temperature control medium 4 (two fluid channel fractions), whereby the same tempering conditions prevail in each of the fundamentally identically designed fluid channels per fluid channel fraction. Consequently, a liquid to be tempered in the main stream 2 after branching into a plurality of individual fluid channels in these in contrast to a cross-flow heat exchanger in principle also experiences an identical thermal loading.
  • a cross-flow heat exchanger represents a component which can be produced economically.
  • a use is then advantageous and therefore desirable if the tempering fluid only passes through small temperature changes when it passes through the heat exchanger. This is the case when the tempering medium undergoes an isothermal phase transition from liquid to gaseous or vice versa and the phase transition of the liquid to be tempered additionally extracts or supplies heat. This embodiment is therefore particularly suitable for evaporative coolers.
  • a first embodiment ( Fig.1 ) provides a bypass line 5 for a coolant as Temperierfluid to the microstructure evaporator (countercurrent heat exchanger 1 ) before.
  • the diversion of the coolant into the bypass line takes place with the aid of a temperature-controlled solenoid valve 6 , which is preferably inserted in the coolant line 13 between branch 7 to the bypass line 5 and microstructure evaporator, ie in the coolant stream 8 before entering the microstructure evaporator.
  • the temperature is - as described above - measured in the tempering (coolant) directly at the inlet 11 or directly at the outlet 12 of the heat exchanger, or alternatively at the liquid outlet 14 on the heat exchanger 1 in the main stream 2 and as a controlled variable of a control (control electronics), not shown for the control used the solenoid valve 6 .
  • the measured temperature is compared with an adjustable threshold value and the solenoid valve is either closed or opened in the event of overshoot or undershoot.
  • a measurement At the liquid outlet 14 has the advantage that the temperature is measured directly on or in the liquid to be tempered and thus this is particularly accurate temperature controlled.
  • the temperature of the tempering fluid at the inlet or outlet must also be monitored.
  • the branch 7 is preferably designed as a flow switch so that it passes the coolant flow with the solenoid valve 6 fully open in the heat exchanger and only when it flows the same coolant flow into the bypass line.
  • the parallel to the bypass line 5 coolant flow through the heat exchanger between junction 7 and the introduction 16 is the main coolant flow and corresponds to Fig.1 the coolant line 13.
  • a continuously adjustable valve eg slide valve
  • a continuously adjustable aperture is provided.
  • a valve or aperture with a temperature detection with regulation by a temperature-dependent control panel ie a component without additional possibly required power supply of a scheme to replace, preferably a bimetal a slide over a bimetallic flexure against a preset spring force to be closed or opened.
  • This control panel is preferably arranged directly at the inlet 11 or directly at the outlet 12 of the heat exchanger.
  • the heating or cooling potential in the coolant flow in the bypass line can be used, for example, by a further heat exchanger 9 for further uses.
  • the cooling capacity can be used indirectly via an additional secondary cooling circuit or directly for cooling the fresh water reservoir or accessory components such as cups, cups or other vessels.
  • Another possibility is the direct pre-cooling of the liquid to be cooled, for example, to reduce or prevent degradation (in the case of water: algae). This represents a decisive hygienic advantage over simple bearing components.
  • Figure 3 disclose alternative temperature controls without a bypass line.
  • the cooling capacity of the coolant flow 8 (here equivalent to the main coolant flow) is manipulated by means of a temperature-controlled orifice 10 (flow valve) or a solenoid valve 6, alternatively also the aforementioned continuously temperature-dependent control orifice, by the height of the mass flow of the tempering fluid (coolant).
  • the height of the mass flow determines the height of the introduced through the coolant through the heat exchanger 1 heat flow and thus directly to be transferred in the heat exchanger to the main stream 2 heat output.
  • a manipulation of the cooling capacity of the heat exchanger can in principle also be carried out by means for temperature control 15 of the tempering fluid before it enters the heat exchanger (cf. Figure 3 ).
  • electrical elements such as Peltier elements are suitable for a cooling or resistance heating element for heating, which are preferably preferably continuously controllable in their performance via the aforementioned regulation in their performance.
  • the fast switching times of a solenoid valve of the aforementioned type make it possible to obtain the advantages of the very short heat conduction path lengths of the tempering fluid in the coolant stream 8 to the tempering liquid in the main stream 2 and therefore very short heat transfer reaction times of micro heat transfer for very rapid cooling due to the small channel dimensions of the individual fluid channels. It is thus possible to always set the necessary cooling capacity at a very low cost with variable flow rate of the fluid to be tempered, without having to switch a cooling source (cooling compressor, Peltier element). As a result, dead times or control delays are excluded and the advantages of the micro-heat exchangers can be fully utilized. Conventional control systems are too slow for these micro heat exchangers or evaporators usual very short reaction times or technically very complicated and therefore expensive.
  • a preferred interval-like activation and interruption of the coolant flow through the valve also reduces the risk of frost for the liquid to be cooled in the individual fluid channels for the liquid 3 to be tempered.
  • Temperierfluid Ahmedlauf is interrupted via an upstream valve before entering the evaporator, it would be initially to a further cooling of the component, since Temperierfluidreste would be sucked at further decreasing evaporation pressure and thereby further decreasing evaporation temperature from the micro heat exchanger. It can be assumed that the fluid to be cooled freezes. A more complex regulation would be necessary to prevent this.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Temperature-Responsive Valves (AREA)
EP10001550.2A 2009-02-25 2010-02-16 Réglage de la température pour un évaporateur à microstructure destiné au refroidissement de liquides Withdrawn EP2230476A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009010329A DE102009010329A1 (de) 2009-02-25 2009-02-25 Temperaturregelung für einen Mikrostrukturverdampfer zur Kühlung von Flüssigkeiten

Publications (2)

Publication Number Publication Date
EP2230476A2 true EP2230476A2 (fr) 2010-09-22
EP2230476A3 EP2230476A3 (fr) 2014-04-09

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EP10001550.2A Withdrawn EP2230476A3 (fr) 2009-02-25 2010-02-16 Réglage de la température pour un évaporateur à microstructure destiné au refroidissement de liquides

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DE (1) DE102009010329A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012205200B4 (de) 2011-04-04 2020-06-18 Denso Corporation Kältemittelkreislaufvorrichtung
DE102015212550A1 (de) * 2015-07-06 2017-01-12 Bayerische Motoren Werke Aktiengesellschaft Kältekreis, Verfahren zur Klimatisierung eines Fahrzeugs und Fahrzeug
DE102016204378A1 (de) 2016-03-16 2017-09-21 Weiss Umwelttechnik Gmbh Prüfkammer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0208318A2 (fr) 1985-07-12 1987-01-14 Kabelwerke Reinshagen GmbH Circuit électrique commandé par la température

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19959249A1 (de) * 1999-12-08 2001-07-19 Inst Mikrotechnik Mainz Gmbh Modulares Mikroreaktionssystem
DE10124501C2 (de) * 2001-05-19 2003-08-14 Karlsruhe Forschzent Verfahren zur Durchführung chemischer Reaktionen unter periodisch veränderten Temperaturen
DE102005048881A1 (de) * 2005-10-12 2007-04-19 Forschungszentrum Karlsruhe Gmbh Verfahren zur Lösungskristallisation von Stoffgemischen
WO2008086838A2 (fr) * 2007-01-20 2008-07-24 Eugster/Frismag Ag Refroidisseur de liquide et procédé permettant de faire fonctionner le refroidisseur de liquide
DE102007063327A1 (de) * 2007-03-30 2008-10-02 Eugster/Frismag Ag Wärmetauscher zum Kühlen oder Erwärmen einer Flüssigkeit, Kühlkreislauf sowie Verfahren zur Kühlung oder Erwärmung eines Arbeitsfluids oder eines Wärmetauschers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0208318A2 (fr) 1985-07-12 1987-01-14 Kabelwerke Reinshagen GmbH Circuit électrique commandé par la température

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
BRANDNER ET AL., MICROSTRUCTURE HEAT EXCHANGER APPLICATIONS; LABORATORY AND INDUSTRY HEAT TRANSFER ENGINEERING, vol. 28, no. 8-9, August 2007 (2007-08-01), pages 761 - 771
BRANDNER: "Fast Temperature Cycling in Microstructure Devices", CHEMICAL ENG. J., vol. 101, no. 1-3, 2004, pages 217 - 224, XP002418557, DOI: doi:10.1016/j.cej.2003.11.020
SCHUBERT ET AL.: "Microstructure Devices for Applications; Thermal and Chemical Process Engineering", MICROSCALE THERMOPHYS. ENG., vol. 5, no. 1, pages 17 - 39, XP009072106, DOI: doi:10.1080/108939501300005358

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Publication number Publication date
EP2230476A3 (fr) 2014-04-09
DE102009010329A1 (de) 2010-08-26

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