EP2216795B1 - Contact electrique, procede d'assemblage par soudure d'une pastille de contact sur un support metallique pour realiser un tel contact. - Google Patents

Contact electrique, procede d'assemblage par soudure d'une pastille de contact sur un support metallique pour realiser un tel contact. Download PDF

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Publication number
EP2216795B1
EP2216795B1 EP20100354005 EP10354005A EP2216795B1 EP 2216795 B1 EP2216795 B1 EP 2216795B1 EP 20100354005 EP20100354005 EP 20100354005 EP 10354005 A EP10354005 A EP 10354005A EP 2216795 B1 EP2216795 B1 EP 2216795B1
Authority
EP
European Patent Office
Prior art keywords
contact
weight
comprised
silver
percentage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20100354005
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2216795A1 (fr
Inventor
Guy Gastaldin
Marcel Capelli
Jean-Paul Favre-Tissot
Frank Garcia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Electric Industries SAS
Original Assignee
Schneider Electric Industries SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schneider Electric Industries SAS filed Critical Schneider Electric Industries SAS
Priority to PL10354005T priority Critical patent/PL2216795T3/pl
Publication of EP2216795A1 publication Critical patent/EP2216795A1/fr
Application granted granted Critical
Publication of EP2216795B1 publication Critical patent/EP2216795B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0231—Composite material having a noble metal as the basic material provided with a solder layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/027—Composite material containing carbon particles or fibres

Definitions

  • the invention relates to a fixed electrical contact comprising a metal support assembled to a precompressed contact pad.
  • the invention also relates to a method of assembling by direct sintering of a precompressed contact pad on a metal support to make a fixed electrical contact according to the invention.
  • Resistance joining methods are widely used for fixing metal parts used in particular in the manufacture of electrical contacts of electrical equipment as described in document FR2665026 . These resistance welding processes can be used with a supply of material such as in particular solder. The contribution of material is used to increase the quality of the connection between the metal parts to be assembled. In addition, the mechanical strength of the welds is particularly dependent on the nature of the two metals or alloys present.
  • the metal support of the electrical contact is generally made of copper.
  • Heating outside the contact pads in particular by resistance, induction or flame, makes it possible to melt the solder and to create a catch between the contact material and its support during cooling.
  • underlayer and silver brazing causes a significant inflation of the manufacturing costs of the electrical contacts.
  • the methods of assembling an electrical contact piece comprising a cuprous support and a large surface contact pad, in particular with a surface area greater than 180 mm 2, comprises a first phase where the pellet is manufactured by bonding, extrusion or sintering. a second phase, where the pellet is fixed on its support in a separate brazing operation. Generally, given the size of the pellet, the welding is performed by induction heating or flame.
  • Obtaining the pellet by bonding, bi-extrusion or sintering tends to increase the overall manufacturing time of the contact piece. Indeed, obtaining by bending, bi-extrusion or sintering of the pellet comprises several manufacturing steps, generally four.
  • the final cutting operation of the pellet in the case of coiling or bi-extrusion can cause decohesion between the layers at the cutting edge. These decohesions at the edge of the pellet are due to the thermal expansion differential during the annealing steps which generates a differential of the stresses. residuals and therefore deformation of the different layers at the time of cutting.
  • the cuprous support is coated with a stripper to deoxidize and activate the assembly surface.
  • Solder in the form of paillon or paste is deposited on the support or the pellet.
  • Said pellet is positioned on the cuprous support and then maintained using a tool in an inductor or a flame that heats the assembly. The heating is maintained until the fusion of the solder.
  • the document DE 32 12 005 A1 discloses a method of assembling by direct sintering of a contact pad according to the preamble of claim 9.
  • the invention therefore aims to overcome the disadvantages of the state of the art, so as to provide a method of assembly between a large section contact pad and a metal support.
  • the precompressed contact pad of the fixed electrical contact according to the invention is assembled on the metal support by a direct cold sintering process and comprises a contact layer comprising a conducting agent composed of silver, the mass percentage of silver being included between 92 and 99% of the total mass, nickel, the mass percentage of nickel being between 0 and 3%, and carbon, the mass percentage of carbon being between 0.5 and 5%.
  • the precompressed contact pad comprises a reactive sub-layer comprising a pseudo-alloy based on silver and copper mixed with a phosphorus-based etching agent, said underlayer having a melting point lower than that of the coating layer. contact.
  • the contact layer comprises a fraction of refractory particles, said refractory particles being chosen from particles of tungsten carbide, tungsten or titanium nitride.
  • the contact layer comprises a fraction of anti-welding elements, said anti-welding elements being selected from nickel particles or graphite.
  • the contact layer comprises a gasogenic fraction, said gas-forming elements comprising carbon fiber.
  • the pseudo-alloy of the reactive sub-layer is composed of copper, the mass percentage of copper being between 15 and 99% of the total mass, of silver, the mass percentage of silver being between 0.5 and 85%, and phosphorus, the mass percentage of phosphorus being between 0.5 and 8%.
  • the reactive underlayer has a melting temperature of between 620 and 800 ° Celsius.
  • the surface of the contact section of the contact pad of the electrical contact is greater than or equal to 180 mm 2 .
  • the metal support consists of copper.
  • the method of assembly by direct sintering of a precompressed contact pad on a metal support to make an electrical contact as defined above comprises a cold compacting of the contact layer and the reactive underlayer respectively obtained by mixing of powders, holding the metal support and the contact pad in contact between two jaws in refractory elements, heating the contact pad and the metal support at a welding temperature, applying a compressive force through the bits.
  • the heating is performed by induction heating means.
  • the conductive agent contained in the contact layer is composed of silver, the mass percentage of silver being between 92 and 99% of the total mass, of nickel, the mass percentage of nickel being between 0 and 3%, and carbon (C), the mass percentage of carbon being between 0.5 and 5%.
  • the pseudo-alloy of the reactive sub-layer is composed of copper, the mass percentage of copper being between 15 and 99% of the total mass, of silver, the mass percentage of copper. silver being between 0.5 and 85%, and phosphorus, the mass percentage of phosphorus being between 0.5 and 8%.
  • the method of assembly by direct sintering of a precompressed contact pad 2 on a metal support 1, consists in keeping the metal support 1 and the contact pad 2 in contact between two jaws 3.
  • the two clamping jaws 3 are intended to apply on the two parts to assemble a compression force FP.
  • a first clamping jaw 3 is placed in contact with the contact pad 2 and a second clamping jaw 3 is placed in contact with the metal support.
  • Said clamping jaws 3 are preferably made of elements made of refractory material.
  • direct sintering is meant a process which allows both the sintering of the precompressed contact pad and its assembly on the support.
  • the heating resulting from the assembly process simultaneously sinter the contact layer by establishing metallurgical bonds between the grains that make up the contact layer and ensure a connection between the contact pad and its support.
  • This method according to the invention is particularly intended for the assembly of the contact pad 2 having a large contact section.
  • major contact section is meant sections greater than or equal to 180 mm 2 .
  • these high-section contact pads are particularly intended for fixed switching device contacts such as low-voltage circuit breakers intended to withstand short-circuit currents of 150 kilo amperes. .
  • a contact pad 3 according to the invention is intended to withstand short-circuit peak currents of between 100 and 1000 amperes per square millimeter of pellet.
  • the metal support 1 is made of a conductive material comprising copper and / or steel.
  • the support is made of copper.
  • the contact pad 2 comprises a first layer called contact layer 8 comprising at least 30% of a conductive agent based on copper or silver.
  • the contact layer is intended to come into contact with another contact layer of another wafer in order to ensure the electrical connection.
  • the conductive agent contained in the contact layer 8 is composed of Ag silver whose mass percentage is between 82 and 99% of the total mass.
  • the conductive agent also comprises nickel Ni whose mass percentage is between 0.5 and 3%.
  • the conductive agent comprises carbon C whose mass percentage is between 0.5 and 5%. The sum of the masses of the three components forms the total mass of the contact layer 8.
  • an ideal compromise in the choice of material proportions for this type of application consists in using a conductive material of the contact layer 8 comprising 94% silver Ag, 2% nickel Ni and 4% carbon C.
  • the contact layer 8 preferably comprises a fraction of refractory particles.
  • the refractory particles are chosen from particles of tungsten carbide (CW), tungsten (W) or titanium nitride (TiN).
  • the contact layer 8 preferably comprises a fraction of anti-welding elements.
  • the anti-welding elements are chosen from nickel (Ni) particles or graphite.
  • the contact layer 8 preferably comprises a fraction of gasogenic element elements.
  • the gas generating elements comprise carbon fiber.
  • the contact pad 2 comprises a second layer called reactive sub-layer 9 comprising a pseudo-alloy based on Ag Silver and Cu Copper mixed with a phosphorus-based etching agent.
  • Said sub-layer 9 has a melting temperature lower than that of the contact layer 8.
  • the melting temperature of the reactive sub-layer 9 is between 620 and 800 ° C. Celsius.
  • the pseudo-alloy of the reactive sub-layer 9 is composed of Cu copper whose mass percentage is between 15 and 99% of the total mass.
  • the pseudoalloy also comprises silver Ag whose mass percentage is between 0.5 and 85%.
  • the pseudoalloy of the reactive sub-layer comprises phosphorus P whose mass percentage is between 0.5 and 8%.
  • an ideal compromise in the choice of the proportions of the materials for this type of application consists in using a pseudo-alloy of the reactive sub-layer 9 comprising 80% copper and 17% silver. Ag and 3% phosphorus P.
  • the pellet is obtained prior to the assembly phase by a cold compacting of the contact layer 8 and the reactive sub-layer 9.
  • the two layers are obtained respectively by mixing powders.
  • the powders used for producing the mixtures have grains ranging in size from ten to one hundred micrometers. The grain size is not changed during the cold compaction phase.
  • the interface between the 2 layers may be irregular.
  • the assembly After placing the contact pad 2 and the metal support 1 between the jaws 3, the assembly is heated.
  • the jaws 3 then apply a compression force FP.
  • the compression force FP is of the order of 1 to 5 kilograms per square centimeter (1 to 5 kg / cm 2 ). Heating means heat the contact pad 2 and the metal support 1 at a soldering temperature.
  • the heating is carried out by induction heating means.
  • the heating can be carried out by flame heating means.
  • the heating temperature at the surface to be joined must be between 620 ° C and 800 ° C and is maintained until complete melting of the reactive underlayer.
  • the invention relates to a fixed electrical contact 100 intended to be in contact with a movable contact of an electrical switchgear.
  • the fixed electrical contact according to the invention comprises a metal support 1 and a contact pad 2 assembled according to the method as defined above.
  • the metal support 1 is made of Cu copper.
  • the contact pad 2 of electrical contact 100 comprises a contact layer 8 and a reactive sub-layer 9.
  • the surface of the contact section of the contact pad of the electrical contact 100 according to the invention is greater than or equal to 180 mm 2 .
  • the contact layer 8 comprises a conducting agent composed of silver Ag whose mass percentage is between 92 and 99% of the total mass.
  • the conductive agent is composed of nickel Ni whose mass percentage is between 0.5 and 3%.
  • the conductive agent also comprises carbon C whose mass percentage is between 0.5 and 5%. The sum of the masses of the three components forms the total mass of the contact layer 8.
  • the reactive sub-layer 9 comprises a pseudo-alloy based on Ag Silver and Cu Copper mixed with a phosphorus-based etching agent.
  • the pseudo-alloy of the reactive sub-layer 9 is composed of Cu copper whose mass percentage is between 15 and 99% of the total mass.
  • the pseudoalloy comprises Ag silver whose mass percentage is between 0.5 and 85%.
  • the pseudo-alloy comprises phosphorus P whose mass percentage is between 0.5 and 8%.
  • the thickness of the reactive sub-layer 9 is between 100 and 500 ⁇ m.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Contacts (AREA)
  • Powder Metallurgy (AREA)
EP20100354005 2009-02-06 2010-01-29 Contact electrique, procede d'assemblage par soudure d'une pastille de contact sur un support metallique pour realiser un tel contact. Active EP2216795B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL10354005T PL2216795T3 (pl) 2009-02-06 2010-01-29 Styk elektryczny, sposób montażu przez spawanie styczki na metalowym podłożu w celu wykonania takiego styku

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0900517A FR2942069B1 (fr) 2009-02-06 2009-02-06 Contact electrique, procede d'assemblage par soudure d'une pastille de contact sur un support metallique pour realiser un tel contact.

Publications (2)

Publication Number Publication Date
EP2216795A1 EP2216795A1 (fr) 2010-08-11
EP2216795B1 true EP2216795B1 (fr) 2015-05-13

Family

ID=41016786

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20100354005 Active EP2216795B1 (fr) 2009-02-06 2010-01-29 Contact electrique, procede d'assemblage par soudure d'une pastille de contact sur un support metallique pour realiser un tel contact.

Country Status (4)

Country Link
EP (1) EP2216795B1 (es)
ES (1) ES2543213T3 (es)
FR (1) FR2942069B1 (es)
PL (1) PL2216795T3 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113571988B (zh) * 2021-07-09 2024-01-30 陕西斯瑞新材料股份有限公司 一种牵引变压器铜导电连接结构的焊接方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3668758A (en) * 1971-07-08 1972-06-13 Richard H Krock Bonding of metallic members with alkali metals and alkali metal containing alloys
DE3212005C2 (de) * 1982-03-31 1986-05-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen eines Zweischicht-Sinter-Kontaktstückes auf der Basis von Silber und Kupfer
FR2665026B1 (fr) 1990-07-19 1992-09-18 Merlin Gerin Procede de connexion par soudage d'un conducteur flexible a un doigt de contact, et structure de contact electrique a plusieurs lamelles.
DE19617974A1 (de) * 1996-05-06 1997-11-13 Duerrwaechter E Dr Doduco Verfahren zum Verbinden einer Lotfolie mit Kontaktplättchen für elektrische Schaltgeräte

Also Published As

Publication number Publication date
FR2942069A1 (fr) 2010-08-13
FR2942069B1 (fr) 2012-02-10
PL2216795T3 (pl) 2015-10-30
ES2543213T3 (es) 2015-08-17
EP2216795A1 (fr) 2010-08-11

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