EP2201312A1 - Système et procédé de refroidissement mettant en oeuvre deux réfrigérants séparés - Google Patents

Système et procédé de refroidissement mettant en oeuvre deux réfrigérants séparés

Info

Publication number
EP2201312A1
EP2201312A1 EP08843105A EP08843105A EP2201312A1 EP 2201312 A1 EP2201312 A1 EP 2201312A1 EP 08843105 A EP08843105 A EP 08843105A EP 08843105 A EP08843105 A EP 08843105A EP 2201312 A1 EP2201312 A1 EP 2201312A1
Authority
EP
European Patent Office
Prior art keywords
fluid coolant
heat
flow rate
mass flow
heat exchanger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08843105A
Other languages
German (de)
English (en)
Inventor
Richard M. Weber
William G. Wyatt
Kerrin A. Rummel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of EP2201312A1 publication Critical patent/EP2201312A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F25B25/005—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00 using primary and secondary systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281—Thermal management, e.g. liquid flow control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This disclosure relates generally to the field of cooling systems and, more particularly, to a system and method for cooling using two separate coolants.
  • a variety of different types of structures can generate heat or thermal energy in operation.
  • a variety of different types of cooling systems may be utilized to dissipate the thermal energy.
  • the type of coolant provided to these cooling systems may, however, be restricted, forcing the cooling system to dissipate thermal energy using a coolant with properties unsuited for efficient thermal energy dissipation.
  • a cooling system for a heat- generating structure includes a first cooling loop that directs a flow of a first fluid coolant from a heat-generating structure to a first heat exchanger.
  • the system also includes a second cooling loop that directs a flow of a second fluid coolant from the first heat exchanger to a second heat exchanger.
  • the first heat exchanger receives thermal energy from the first fluid coolant and transfers at least a portion of the thermal energy to the second fluid coolant.
  • the first fluid coolant has a specific heat and a mass flow rate
  • the second fluid coolant has a specific heat and a mass flow rate.
  • a product of the specific heat and the mass flow rate of the first fluid coolant is greater than a product of the specific heat and the mass flow rate of the second fluid coolant.
  • Certain embodiments of the disclosure may provide numerous technical advantages. For example, a technical advantage of one embodiment may include the capability to efficiently cool a structure even though the cooling system is provided with an undesirable fluid coolant or a fluid coolant flowing at an undesirable mass flow rate. For instance, one embodiment of the disclosure may allow for efficient cooling of a phased array antenna located on a mast of a ship. Other technical advantages of other embodiments may include the ability to retrofit a current cooling system in order to more efficiently cool a structure. Still yet other technical advantages of other embodiments may include the capability to prevent an accumulation of air in a fluid coolant used to cool a structure.
  • FIGURE 1 is a block diagram of an embodiment of a cooling system that may be utilized in conjunction with embodiments of the present disclosure.
  • FIGURE 2 is a block diagram of a cooling system for cooling a heat- generating structure, according to an embodiments of the disclosure.
  • FIGURE 1 is a block diagram of an embodiment of a cooling system that may be utilized in conjunction with embodiments of the present disclosure. Although the details of one cooling system will be described below, it should be expressly understood that other cooling systems may be used in conjunction with embodiments of the disclosure.
  • the cooling system 10 of FIGURE 1 is shown cooling a structure 12 that is exposed to or generates thermal energy.
  • the structure 12 may be any of a variety of structures, including, but not limited to, electronic components, circuits, computers, servers, and phased array antennas. Because the structure 12 can vary greatly, the details of structure 12 are not illustrated and described.
  • the cooling system 10 of FIGURE 1 is shown cooling a structure 12 that is exposed to or generates thermal energy.
  • the structure 12 may be any of a variety of structures, including, but not limited to, electronic components, circuits, computers, servers, and phased array antennas. Because the structure 12 can vary greatly, the details of structure 12 are not illustrated and described.
  • FIGURE 1 includes a heat exchanger inlet line 61, a structure inlet line 71, structure heat exchangers 23 and 24, a loop pump 46, inlet orifices 47 and 48, a heat exchanger 41, a reservoir 42, and a pressure controller 51.
  • the structure 12 may be arranged and designed to conduct heat or thermal energy to the structure heat exchangers 23, 24.
  • the structure heat exchangers 23, 24 may be disposed on an edge of the structure 12 (e.g., as a thermosyphon, heat pipe, or other device) or may extend through portions of the structure 12, for example, through a thermal plane of the structure 12.
  • the structure heat exchangers 23, 24 may extend up to the components of the structure 12, directly receiving thermal energy from the components.
  • two structure heat exchangers 23, 24 are shown in the cooling system 10 of FIGURE 1, one structure heat exchanger or more than two structure heat exchangers may be used to cool the structure 12 in other cooling systems.
  • a fluid coolant flows through each of the structure heat exchangers 23, 24.
  • the fluid coolant absorbs heat from the structure 12.
  • the structure heat exchangers 23, 24 may be lined with pin fins or other similar devices which, among other things, increase surface contact between the fluid coolant and walls of the structure heat exchangers 23, 24.
  • the fluid coolant may be forced or sprayed into the structure heat exchangers 23, 24 to ensure fluid contact between the fluid coolant and the walls of the structure heat exchangers 23, 24.
  • the fluid coolant may remain in a liquid phase after absorption of heat from the structure 12.
  • the absorption of heat from the structure 12 may cause at least a portion of the fluid coolant to vaporize.
  • the fluid coolant departs the exit conduits 27 and flows through the heat exchanger inlet line 61, the heat exchanger 41, the reservoir 42, a loop pump 46, the structure inlet line 71, and a respective one of two orifices 47 and 48, in order to again reach the inlet conduits 25 of the structure heat exchangers 23, 24.
  • the loop pump 46 may cause the fluid coolant to circulate around the loop shown in FIGURE 1.
  • the loop pump 46 may use magnetic drives so there are no shaft seals that can wear or leak with time.
  • the loop pump 46 may control the mass flow rate of the fluid coolant in the loop.
  • the loop pump 46 may control the mass flow rate of the fluid coolant in the loop.
  • 46 may increase, decrease, or keep the mass flow rate of the fluid coolant constant.
  • the orifices 47 and 48 may facilitate proper partitioning of the fluid coolant among the respective structure heat exchangers 23, 24, and may also help to create a large pressure drop between the output of the loop pump 46 and the heat exchangers 23, 24.
  • the orifices 47 and 48 may have the same size, or may have different sizes in order to partition the coolant in a proportional manner which facilitates a desired cooling profile.
  • a flow 56 of fluid may be forced to flow through the heat exchanger 41, for example by a fan (not shown) or other suitable device.
  • the flow 56 of fluid may be ambient fluid.
  • the heat exchanger 41 transfers heat from the fluid coolant to the flow 56 of ambient fluid, thereby reducing the temperature of the fluid coolant.
  • the fluid coolant may be in a liquid phase prior to entering the heat exchanger 41.
  • the transfer of heat to the flow 56 may not cause the fluid coolant to change phases, hi another embodiment, at least a portion of the fluid coolant may be in a vapor phase prior to entering the heat exchanger 41. hi such an embodiment, the transfer of heat from the vapor fluid coolant to the flow 56 may further cause the fluid coolant to condense into a liquid phase.
  • the fluid coolant exiting the heat exchanger 41 may be supplied to the reservoir 42.
  • the reservoir 42 may store the fluid coolant when the cooling system 10 is not in operation, hi a further embodiment, the reservoir 42 may be an expansion reservoir. Since fluids typically take up more volume in their vapor phase than in their liquid phase, the expansion reservoir may be provided in order to take up the volume of liquid fluid coolant that is displaced when some or all of the coolant in the system changes from its liquid phase to its vapor phase.
  • the fluid coolant used in the embodiment of FIGURE 1 may include, but is not limited to, mixtures of antifreeze and water or water, alone.
  • the antifreeze may be ethanol, methanol, or other suitable antifreeze.
  • the fluid coolant may include polyalphaolefin (PAO), a mixture of water and propylene glycol (PGW), a mixture of water and ethylene glycol (EGW), HFC- 134a, Coolanol, ammonia, brine, or any other suitable fluid coolant.
  • the pressure controller 51 maintains the fluid coolant at a substantially constant pressure along the portion of the loop which extends from the orifices 47 and 48 to the loop pump 46, in particular through the structure heat exchangers 23 and 24, the heat exchanger 41, and the reservoir 42.
  • metal bellows may be used in the reservoir 42, connected to the loop using brazed joints.
  • the pressure controller 51 may control loop pressure by using a motor driven linear actuator that is part of the metal bellows of the reservoir 42, or by using a small gear pump to evacuate the loop to the desired pressure level.
  • the fluid coolant removed may be stored in the metal bellows whose fluid connects are brazed.
  • the pressure controller 51 may utilize other suitable devices capable of controlling pressure.
  • the ability to cool the structure 12 may depend, at least in part, on the fluid coolant used in cooling system 10.
  • the ability to cool the structure 12 may depend on the heat transfer coefficient of the fluid coolant.
  • a fluid coolant with a high heat transfer coefficient may, in one embodiment, cool the structure 12 more efficiently than a fluid coolant with a low heat transfer coefficient.
  • the heat transfer coefficient of a fluid coolant may be a function of the specific heat (C p ) of the fluid coolant and the viscosity of the fluid coolant.
  • C p specific heat
  • a fluid coolant with high specific heat may have a higher heat transfer coefficient than a fluid coolant with a low specific heat.
  • a fluid coolant with low viscosity may have a higher heat transfer coefficient than a fluid coolant with high viscosity.
  • the heat transfer coefficient may also be a function of the mass flow rate (rh) of the fluid coolant.
  • rh mass flow rate
  • a fluid coolant flowing at a high mass flow rate may have a higher heat transfer coefficient than a fluid coolant flowing at a low mass flow rate.
  • a fluid coolant with a high specific heat and low viscosity, and which is flowing at a high mass flow rate may be more desirable for use in the cooling system 10 because the higher heat transfer coefficient of the fluid coolant may provide more efficient cooling of the structure 12.
  • the ability to cool the structure 12 in the cooling system 10 may depend on the structure temperature gradient.
  • the structure temperature gradient in one embodiment, refers to the difference in the temperature of the fluid coolant entering the structure 12 and the temperature of the fluid coolant exiting the structure 12.
  • a high structure temperature gradient refers to a large temperature difference between the fluid coolant entering the structure 12 and the fluid coolant exiting the structure 12.
  • the high structure temperature gradient may cause elements of the structure 12 to be cooled to different temperatures. For example, elements near the fluid coolant inlet of the structure 12 may be cooled to a lower temperature than the elements near the fluid coolant outlet of the structure 12. As a result, a temperature difference between the elements of the structure 12 may occur.
  • the structure temperature gradient of structure 12 may be reduced by the use of a fluid coolant with a high specific heat.
  • a fluid coolant with a high specific heat may absorb more heat for every degree of temperature increase in the fluid coolant than would a fluid coolant with a low specific heat.
  • the structure temperature gradient may further be a function of the mass flow rate of the fluid coolant.
  • the structure temperature gradient may further be reduced by increasing the mass flow rate of the fluid coolant.
  • a fluid coolant with a high specific heat, and which is flowing at a high mass flow rate may be more desirable for use in the cooling system 10 because the reduced structure temperature gradient may provide more efficient cooling of the structure 12.
  • the ability to cool the structure 12 in the cooling system 10 may depend, at least in part, on the specific heat and viscosity of a fluid coolant.
  • a fluid coolant with a high specific heat and low viscosity may have a higher heat transfer coefficient than a fluid coolant with a low specific heat and high viscosity.
  • a fluid coolant with a high specific heat may also reduce the structure temperature gradient.
  • a fluid coolant with a high specific heat and low viscosity may allow for more efficient cooling of the structure 12. Therefore, although many different types of fluid coolants may be used in the cooling system 10, as discussed above, particular fluid coolants may be more desirable in certain embodiments of the cooling system 10.
  • fluid coolants such as PGW, EGW, HFC- 134a, ammonia, pure water, a mixture of water and methanol, a mixture of water and ethanol, and brine have a high specific heat and low viscosity, and therefore, may be more desirable as fluid coolants in the cooling system 10.
  • certain types of fluid coolants may be undesirable in the cooling system 10.
  • fluid coolants such as PAO and Coolanol both have a low specific heat and high viscosity, and therefore, are less desirable as fluid coolants in cooling system 10.
  • the structure needing to be cooled may be located in a system where only an undesirable, or less desirable, fluid coolant is available.
  • the structure needing to be cooled such as a phased array antenna, may be located on the mast of a ship capable of providing only a fluid coolant such as PAO or
  • Coolanol in order to cool the structure.
  • the structure to be cooled may be located in an aircraft, such as a plane, where only an undesirable fluid coolant is available. Therefore, the cooling system may be forced to use the undesirable fluid coolant. As a result, the ability to cool the structure may be reduced.
  • the ability to cool the structure 12 in the cooling system 10 may further depend, at least in part, on the mass flow rate of a fluid coolant. For example, a fluid coolant flowing at a high mass flow rate may have a high heat transfer coefficient and may also have a low structure temperature gradient. As a result, in certain embodiments, it may be desirable to provide a system with a fluid coolant flowing at a high mass flow rate.
  • a cooling system may not be provided with a fluid coolant flowing at a desirable mass flow rate.
  • the structure to be cooled may be located in a system that can only provide a fluid coolant flowing at an undesirable flow rate.
  • the structure such as a phased array antenna, may be located on the mast of a ship where the mass flow rate of the fluid coolant may be undesirably reduced by the need to pump the fluid coolant up the mast.
  • the structure may be located in a system where the mass flow rate of the fluid coolant must be restricted in order to be used in the system. As a result, in certain embodiments, the ability to cool a structure may be reduced.
  • FIGURE 2 is a block diagram of an embodiment of a cooling system 110 for cooling a heat generating structure, according to an embodiment of the disclosure, hi the embodiment of FIGURE 2, the cooling system 110 includes two separate cooling loops: a structure loop 120 for cooling a structure 112 using a first fluid coolant, and a chiller loop 124 for cooling the first fluid coolant using a second fluid coolant.
  • the cooling system 110 further includes a heat exchanger 141 for transferring heat from the first fluid coolant of the structure loop 120 to the second fluid coolant of the chiller loop 124. In one embodiment, this may prevent the cooling system 110 from having to use an undesirable fluid coolant with an undesirable mass flow rate in order to cool the structure 112.
  • an undesirable fluid coolant with an undesirable mass flow rate is merely used to cool a desirable fluid coolant with a desirable mass flow rate.
  • the structure loop 120 of the cooling system 110 of FIGURE 2 may be similar to the cooling system 10 of FIGURE 1 except that the structure loop 120 dispenser thermal energy to a chiller loop 124, which has a chiller 138.
  • the structure loop 120 of FIGURE 2 is depicted as being less detailed than cooling system 10 of FIGURE 1.
  • the cooling system 110 (the structure loop 120 ) of FIGURE 2 may contain each of the elements of cooling system 10, less elements than cooling system 10, or more elements than cooling system 10.
  • the structure loop 120 direct a first fluid coolant through the structure 112, a heat exchanger inlet line 161, the heat exchanger 141, a reservoir 142, a pump 146, and a structure inlet line 171, in order to again reach the structure 112.
  • the structure loop 120 is further operable to keep the first fluid coolant of the structure loop 120 separate from the second fluid coolant of the chiller loop 124.
  • the chiller loop 124 directs the second fluid coolant from the heat exchanger 141 through line 158, chiller 138, and line 159 in order to again reach the heat exchanger 141.
  • the chiller loop 124 (and lines 158, 159) may extend a large distance.
  • the chiller loop 124 may extend from a heat exchanger on a mast of a ship to a chiller located at any other position on the ship.
  • the chiller loop 120 may be a new chiller loop added to the system where the structure 112 is located.
  • the chiller loop 120 may be added to the system when the structure 112, the heat exchanger 141, and the structure loop 120 are added to the system.
  • the chiller loop 124 may be a pre-existing chiller loop that is already used in the system where the structure is located.
  • the chiller loop 124 may be a pre-existing chiller loop used to absorb heat from other components of a ship or aircraft. In such an embodiment, the chiller loop 124 may be retrofitted in order to work in conjunction with the heat exchanger 141 and the structure loop 120.
  • the chiller loop 124 may include a pump (not shown) operable to cause the second fluid coolant to flow throughout the chiller loop 124.
  • the pump in one embodiment, may be incapable of preventing air from accumulating in the chiller loop 124 while the chiller loop 124 is not in use.
  • the pump may be a component of a pre-existing and out-dated chiller loop system.
  • the air accumulation may not have an adverse effect on the cooling of the structure 112 because the chiller loop 124 may be further operable to keep the second fluid coolant (which may include the accumulated air) of the chiller loop 124 separate from the first fluid coolant of the structure loop 120.
  • the first fluid coolant of the structure loop 120 may include any fluid coolant with a high specific heat and low viscosity.
  • the first fluid coolant may include PGW, EGW, HFC- 134a, ammonia, pure water, a mixture of water and methanol, a mixture of ethanol and water, brine, or any other suitable fluid coolant with a high specific heat and low viscosity.
  • the first fluid coolant may include a fluid coolant with either a high specific heat or low viscosity, but not both.
  • the first fluid coolant may flow at a high mass flow rate.
  • the pump 146 may cause the first fluid coolant to flow at a higher mass flow rate than would be capable without the two separate loops.
  • the higher mass flow rate may increase the ability to cool the structure 112 without using a desirable fluid coolant.
  • the first fluid coolant may be the same type of fluid coolant as the second fluid coolant of the chiller loop 124.
  • the first fluid coolant may further include any fluid coolant that has a higher specific heat than that of the second fluid coolant, or that is flowing at a higher mass flow rate than that of the second fluid coolant.
  • the first fluid coolant may include any fluid coolant that satisfies the following inequality:
  • Ih 1 mass flow rate of the first fluid coolant
  • Cp 1 specific heat of the first fluid coolant rh
  • Cp 2 specific heat of the second fluid coolant
  • a first fluid coolant that satisfies the above inequality may provide more efficient cooling of the structure 112 than the second fluid coolant.
  • the viscosity of both the first fluid coolant and the second fluid coolant may also be a factor of the above inequality.
  • the inverse of the viscosity of the first fluid coolant and the inverse of the viscosity of the second fluid coolant may be factors of the above inequality.
  • the first fluid coolant may include a fluid coolant that is merely less viscous than the second fluid coolant.
  • the second fluid coolant of the chiller loop 124 may include any fluid coolant with either a low specific heat or high viscosity, or both.
  • the second fluid coolant may include PAO or Coolanol.
  • the second fluid coolant may flow at a low mass flow rate.
  • the second fluid coolant may include a fluid coolant with a high specific heat or low viscosity, or both.
  • the second fluid coolant may include
  • the second fluid coolant may further include any fluid coolant that satisfies the inequality discussed above.
  • the chiller 138 may include any system operable to cool the second fluid coolant of the chiller loop 124.
  • the chiller 138 may include a refrigeration system or a heat exchanger.
  • the chiller 138 may be operable to cool a fluid coolant used to cool more than the first fluid coolant of the structure loop 120.
  • the second fluid coolant cooled by chiller 138 may further be used to cool other systems, such as other components of a ship or an aircraft.
  • the cooling of the structure 112 is substantially similar to the cooling of the structure 12 described in FIGURE 1.
  • the first fluid coolant of the structure loop 120 flows through each of the structure heat exchangers 123, 124 (not shown), absorbing heat from the structure 112.
  • the first fluid coolant departs the exit conduits 127 (not shown) and flows through the heat exchanger inlet line 161 and the heat exchanger 141.
  • a flow 156 may be forced to flow through the heat exchanger 141 in order to absorb heat from the first fluid coolant.
  • the flow 156 is similar to the flow 56 of FIGURE 1 except that it includes the second fluid coolant of the chiller loop 124.
  • the heat exchanger 141 transfers heat from the first fluid coolant to the second fluid coolant, thereby reducing the temperature of the first fluid coolant.
  • the first fluid coolant departs the heat exchanger 141 and flows through the reservoir 142, the loop pump 146, the structure inlet line 171, and a respective one of two orifices 147 and 148 (not shown), in order to again reach the structure heat exchangers 123,
  • the loop pump 146 may cause the fluid coolant to circulate around the structure loop 120.
  • the loop pump 146 may control the mass flow rate of the first fluid coolant in the structure loop 120.
  • the loop pump 146 may increase, decrease, or keep the mass flow rate of the first fluid coolant constant.
  • the loop pump 146 may allow the first fluid coolant of the structure loop 120 to flow at a higher mass flow rate than the second fluid coolant of the chiller loop 124.
  • the loop pump 146 may be operable to prevent air from accumulating in the structure loop 120 while the structure loop 120 and/or the structure 112 are not in operation. Li one embodiment, this may prevent the structure loop 120 from having to undergo air purging routines upon start-up.
  • the second fluid coolant As for the chilling loop 124, after the second fluid coolant absorbs heat from the first fluid coolant, the second fluid coolant departs the heat exchanger 141 and flows to the chiller 138. After the chiller 138 removes heat from the second fluid coolant, the second fluid coolant is then directed back to the heat exchanger 141 by the chiller loop 124.
  • the second fluid coolant which is less desirable for cooling than the first fluid coolant, absorbs heat from the first fluid coolant. This allows, in one embodiment, the first fluid coolant, which is more desirable for cooling than the second fluid coolant, to absorb heat from the structure 112.
  • a structure such as a phased array antenna located on a mast of a ship, may be efficiently cooled even when the cooling system is provided with an undesirable fluid coolant.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Selon un premier mode de réalisation de l'invention, un système de refroidissement destiné à une structure thermogène comprend une première boucle de refroidissement qui dirige un flux d'un premier réfrigérant d'une structure thermogène à un premier échangeur de chaleur. Le système comprend également une seconde boucle de refroidissement qui dirige un flux d'un second réfrigérant du premier échangeur de chaleur à un second échangeur de chaleur. Le premier échangeur de chaleur transfère au moins une partie de l'énergie thermique reçue du premier réfrigérant au second réfrigérant. Chacun des premier et second réfrigérants présente une chaleur spécifique et un débit massique. Le produit de la chaleur spécifique et du débit massique du premier réfrigérant est supérieur au produit de la chaleur spécifique et du débit massique du second réfrigérant.
EP08843105A 2007-10-22 2008-08-28 Système et procédé de refroidissement mettant en oeuvre deux réfrigérants séparés Withdrawn EP2201312A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/876,301 US20090101311A1 (en) 2007-10-22 2007-10-22 System and Method for Cooling Using Two Separate Coolants
PCT/US2008/074539 WO2009055141A1 (fr) 2007-10-22 2008-08-28 Système et procédé de refroidissement mettant en oeuvre deux réfrigérants séparés

Publications (1)

Publication Number Publication Date
EP2201312A1 true EP2201312A1 (fr) 2010-06-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP08843105A Withdrawn EP2201312A1 (fr) 2007-10-22 2008-08-28 Système et procédé de refroidissement mettant en oeuvre deux réfrigérants séparés

Country Status (3)

Country Link
US (1) US20090101311A1 (fr)
EP (1) EP2201312A1 (fr)
WO (1) WO2009055141A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8549824B2 (en) 2008-06-20 2013-10-08 Nestec S.A. Capsule treatment apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144619A1 (en) * 2005-01-06 2006-07-06 Halliburton Energy Services, Inc. Thermal management apparatus, systems, and methods
US7953530B1 (en) * 2006-06-08 2011-05-31 Pederson Neal R Vehicle diagnostic tool
CN217509346U (zh) * 2022-03-16 2022-09-27 广运机械工程股份有限公司 热交换系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3776305A (en) * 1972-02-22 1973-12-04 United Aircraft Prod Heat transfer system
US4239638A (en) * 1977-11-22 1980-12-16 Uniroyal, Inc. Use of synthetic hydrocarbon oils as heat transfer fluids
GB2258298B (en) * 1991-07-31 1995-05-17 Star Refrigeration Cooling method and apparatus
FR2751473B1 (fr) * 1993-02-23 1998-12-18 Thomson Csf Structure d'antenne a modules actifs
US5819549A (en) * 1996-10-16 1998-10-13 Minnesota Mining And Manufacturing Company Secondary loop refrigeration system
US20020033470A1 (en) * 2000-07-19 2002-03-21 Evans John W. Non-aqueous heat transfer fluid and use thereof
JP2002228321A (ja) * 2001-02-02 2002-08-14 Toshiba Corp 空中線装置
US6937471B1 (en) * 2002-07-11 2005-08-30 Raytheon Company Method and apparatus for removing heat from a circuit
US7000691B1 (en) * 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US7222058B2 (en) * 2002-10-28 2007-05-22 Fisher-Rosemount Systems, Inc. Method of modeling and sizing a heat exchanger
US6952345B2 (en) * 2003-10-31 2005-10-04 Raytheon Company Method and apparatus for cooling heat-generating structure
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US7365973B2 (en) * 2006-01-19 2008-04-29 American Power Conversion Corporation Cooling system and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2009055141A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8549824B2 (en) 2008-06-20 2013-10-08 Nestec S.A. Capsule treatment apparatus

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US20090101311A1 (en) 2009-04-23

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