EP2193576B1 - Plug device, plug connector, and method for producing the plug connector - Google Patents

Plug device, plug connector, and method for producing the plug connector Download PDF

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Publication number
EP2193576B1
EP2193576B1 EP07820848A EP07820848A EP2193576B1 EP 2193576 B1 EP2193576 B1 EP 2193576B1 EP 07820848 A EP07820848 A EP 07820848A EP 07820848 A EP07820848 A EP 07820848A EP 2193576 B1 EP2193576 B1 EP 2193576B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
plug
connector
printed circuit
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP07820848A
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German (de)
French (fr)
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EP2193576A1 (en
Inventor
Ralf Hying
Peter Niedermeier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
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Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2193576A1 publication Critical patent/EP2193576A1/en
Application granted granted Critical
Publication of EP2193576B1 publication Critical patent/EP2193576B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/115—U-shaped sockets having inwardly bent legs, e.g. spade type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Definitions

  • the invention relates to a plug-in means, a connector and a method for producing the plug-in means.
  • the object of the invention is to avoid the disadvantages mentioned above and in particular to provide a plug-in means which enables an efficient high-current connection.
  • a plug-in means comprising a flexible printed circuit board and a connector, wherein the connector is soldered flat on the circuit board.
  • the connector is soldered at least partially flat on the flexible circuit board. Due to the planar connection, contact can be made with at least one printed conductor of the flexible printed circuit board, and thus a low inductance can be achieved.
  • the printed circuit board has at least one conductor track, which is contacted with the connector.
  • circuit board has two conductor tracks, which are arranged at least partially on different sides of the flexible printed circuit board.
  • the leakage inductance between lines or printed conductors can additionally be reduced.
  • the printed circuit board is a flexible printed circuit board, in particular a printed circuit board or a flexible printed circuit board.
  • the circuit board can be made bendable.
  • the circuit board may comprise a plurality of connectors, which are soldered in each case flat on the circuit board.
  • the plurality of connectors can be contacted via a plurality of printed conductors of the printed circuit board.
  • the connector has a plurality of electrically separate contacts, of which in each case a contact is contacted via at least one conductor track of the printed circuit board.
  • At least one contact can be without an electrical function and serve, for example, as an introduction aid or as an encoding.
  • the circuit board has at least two lines which are connected to at least one connector.
  • the connector is a blade receptacle.
  • the connector has a means for locking or for releasing the lock.
  • a blade receptacle can be equipped with a FASTON principle.
  • An alternative embodiment is that the connector is soldered in a reflow process on the circuit board.
  • the connector has a fixing possibility for securing the position of the connector on the circuit board.
  • Such fixation may be used to secure a position of the connector prior to the actual soldering operation such that during soldering, e.g. by means of reflow, this connector can not slip substantially.
  • a further development consists in that the fixing possibility comprises a depression or an elevation or a recess.
  • the connector is an SMD connector or in SMD design.
  • the connector is a high current stretch connector.
  • the connector is designed for currents greater than 2.5A.
  • the circuit board is soldered firmly on a second circuit board.
  • the second circuit board is a solid (non-flexible) board.
  • the second circuit board may be a multi-layer board, wherein the circuit board is soldered to a middle layer of the second circuit board.
  • the second printed circuit board is connected to the flexible printed circuit board, so that, for example, the flexible printed circuit board emerges from the second printed circuit board.
  • a plurality of connectors are combined by means of a connector.
  • the connector may be a plastic connector.
  • conductor tracks in particular conductor pairs, provided on both sides of the circuit board, so that a total of a low inductance can be achieved.
  • a connector comprising at least one surface for soldering on a printed circuit board.
  • a development consists in that the connector has at least one fixing possibility, by means of which the connector can be fixed on the circuit board.
  • the connector is designed in SMD construction.
  • the connector is an SMD connector.
  • the at least one connector is soldered in a reflow process.
  • the at least one connector is fixed by means of a fixing possibility on the board.
  • the printed circuit board is a flexible printed circuit board, in particular a flexible printed circuit board.
  • Fig. 1 shows a connector 101 which is soldered on a printed circuit board 102 in the front view. Curved portions 105 and 106 are for contacting with a correspondingly shaped counterpart (not shown). Over a surface 103, the example here is shown in cross section through the frontal view, the connector 101 is soldered on the circuit board 102.
  • the printed circuit board 102 has at least one conductor track, which is connected to the planar solder joint 103. Furthermore, the circuit board 102 is preferably implemented as a flexible circuit board, in particular as a flex circuit board, so that the connector 101 is connected to the counterpart, e.g. a tongue, can be connected via the circuit board 102.
  • the connector 101 is designed in SMD construction.
  • Fig.2 shows a perspective view comprising the connector 101 and the circuit board 102.
  • a plurality of connectors can be arranged side by side.
  • a direction 107 extends the particular flexible printed circuit board 102, so that a cable-like connection by means of the combination of connector 101 and circuit board 102 can be achieved.
  • the solution presented here is particularly suitable as a plug-in means that can be plugged onto existing tabs with a size of, for example, 6.3 mm.
  • the connector 101 can in this regard connected to the tongue or put on this.
  • the tabs may be mounted substantially horizontally or vertically and have a pitch of 10mm.
  • the connector 101 is a blade receptacle in SMD design.
  • This connector 101 is flat on the circuit board 102, such as a board or a flex circuit board soldered. Such soldering preferably takes place by means of a reflow process.
  • Figure 3 shows the underside of the connector 101 comprising locking lugs 104, which are designed for example as small elevations or depressions or recesses.
  • the locking lugs 104 serve to secure the position of the connector 101 on the circuit board 102 so that when melting the solder and floating the connector 101 whose position remains essentially unchanged.
  • the connector 101 may still be equipped with the so-called. FASTON principle to reduce the force acting on the flat solder joint 103 forces when plugging as well as when releasing the connector 101.
  • the connector 101 may also be soldered to a normal circuit board 102 (Printed Circuit Board, PCB). Furthermore, it is possible that several connectors are used side by side. In particular, a placement and / or positioning of a plurality of plug connectors or flat plug-in sleeves can be simplified by means of a plastic connector.
  • PCB printed Circuit Board
  • the plug-in device made of plug-in connector and printed circuit board as well as the connector itself are suitable for use with high electrical currents (high-current connection) for currents greater than 2.5A.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

The invention relates to a plug device comprising a circuit board and a plug connector, wherein the plug connector is soldered onto the circuit board in a flush manner. The invention further relates to a plug connector and a method for producing the plug device.

Description

Die Erfindung betrifft ein Steckmittel, einen Steckverbinder und ein Verfahren zur Herstellung des Steckmittels.The invention relates to a plug-in means, a connector and a method for producing the plug-in means.

Bekannt sind Flachsteckhülsen, an die Kabel gecrimpt werden können. Gerade bei Hochstromverbindungen haben derartige Kabel den Nachteil, dass sie eine verhältnismäßig hohe Induktivität bedingen.Are known flat receptacles to which cables can be crimped. Especially with high current connections such cables have the disadvantage that they require a relatively high inductance.

Aus der EP 0 731 524 A1 ist eine Flachsteckhülse bekannt, die auf eine flexible Folie gecrimpt werden kann. Eine solche Crimpverbindung hat jedoch den Nachteil einer unzuverlässigen Verbindung. Auch ist die Flexfolie in den Steckbereich hineingeführt, was die Zuverlässigkeit der Steckverbindung konterkariert.From the EP 0 731 524 A1 is known a flat receptacle, which can be crimped onto a flexible film. However, such a crimp connection has the disadvantage of an unreliable connection. Also, the flex foil is inserted into the mating area, which counteracts the reliability of the connector.

Aus der EP 1 473 802 A1 ist ein SMD Flachstecker bekannt, der auf eine Platine aufgelötet werden kann. Flachstecker haben jedoch den Nachteil, dass sie im ungesteckten Zustand nicht isoliert werden können, da der Steckbereich zugänglich sein muss.From the EP 1 473 802 A1 is a SMD tab known, which can be soldered onto a circuit board. However, tabs have the disadvantage that they can not be isolated in the unplugged state, since the plug-in area must be accessible.

Die Aufgabe der Erfindung besteht darin, die vorstehend genannten Nachteile zu vermeiden und insbesondere ein Steckmittel anzugeben, das eine effiziente Hochstromverbindung ermöglicht.The object of the invention is to avoid the disadvantages mentioned above and in particular to provide a plug-in means which enables an efficient high-current connection.

Diese Aufgabe wird gemäß den Merkmalen der unabhängigen Patentansprüche gelöst. Weiterbildungen der Erfindung ergeben sich auch aus den abhängigen Ansprüchen.This object is achieved according to the features of the independent claims. Further developments of the invention will become apparent from the dependent claims.

Zur Lösung der Aufgabe wird ein Steckmittel angegeben umfassend eine flexible Leiterplatte und einen Steckverbinder, wobei der Steckverbinder flächig auf der Leiterplatte aufgelötet ist.To solve the problem, a plug-in means is specified comprising a flexible printed circuit board and a connector, wherein the connector is soldered flat on the circuit board.

Hierbei wird der Steckverbinder zumindest teilweise flächig auf die flexible Leiterplatte aufgelötet. Durch die flächige Verbindung kann ein Kontakt mit mindestens einer Leiterbahn der flexiblen Leiterplatte hergestellt und somit eine niedrige Induktivität erzielt werden.Here, the connector is soldered at least partially flat on the flexible circuit board. Due to the planar connection, contact can be made with at least one printed conductor of the flexible printed circuit board, and thus a low inductance can be achieved.

Eine Weiterbildung ist es, dass die Leiterplatte mindestens eine Leiterbahn aufweist, die mit dem Steckverbinder kontaktiert ist.A development is that the printed circuit board has at least one conductor track, which is contacted with the connector.

Eine andere Weiterbildung ist es, dass die Leiterplatte zwei Leiterbahnen aufweist, die zumindest teilweise auf verschiedenen Seiten der flexiblen Leiterplatte angeordnet sind.Another development is that the circuit board has two conductor tracks, which are arranged at least partially on different sides of the flexible printed circuit board.

Insbesondere durch entsprechend breite Leiterbahnen kann zusätzlich die Streuinduktivität zwischen Leitungen bzw. Leiterbahnen reduziert werden.In particular, by correspondingly wide conductor tracks, the leakage inductance between lines or printed conductors can additionally be reduced.

Erfindungsgemäß ist die Leiterplatte eine flexible Leiterplatte, insbesondere eine Platine oder eine Flexleiterplatte.According to the invention, the printed circuit board is a flexible printed circuit board, in particular a printed circuit board or a flexible printed circuit board.

Bevorzugt kann die Leiterplatte biegbar ausgeführt sein.Preferably, the circuit board can be made bendable.

Insbesondere kann die Leiterplatte mehrere Steckverbinder umfassen, die jeweils flächig auf der Leiterplatte aufgelötet sind. Vorteilhaft können die mehreren Steckverbinder über mehrere Leiterbahnen der Leiterplatte kontaktiert sein.In particular, the circuit board may comprise a plurality of connectors, which are soldered in each case flat on the circuit board. Advantageously, the plurality of connectors can be contacted via a plurality of printed conductors of the printed circuit board.

Auch ist es möglich, dass der Steckverbinder mehrere elektrisch voneinander getrennte Kontakte aufweist, von denen jeweils ein Kontakt über mindestens eine Leiterbahn der Leiterplatte kontaktiert ist.It is also possible that the connector has a plurality of electrically separate contacts, of which in each case a contact is contacted via at least one conductor track of the printed circuit board.

Insbesondere kann mindestens ein Kontakt ohne elektrische Funktion sein und beispielsweise als eine Einführungshilfe oder als eine Codierung dienen.In particular, at least one contact can be without an electrical function and serve, for example, as an introduction aid or as an encoding.

So ist es eine Weiterbildung, dass die Leiterplatte mindestens zwei Leitungen aufweist, die mit mindestens einem Steckverbinder verbunden sind.Thus, it is a development that the circuit board has at least two lines which are connected to at least one connector.

Weiterhin ist der Steckverbinder eine Flachsteckhülse.Furthermore, the connector is a blade receptacle.

Eine Ausgestaltung besteht darin, dass der Steckverbinder ein Mittel zur Arretierung bzw. zum Lösen der Arretierung aufweist. So kann beispielsweise eine Flachsteckhülse mit einem FASTON-Prinzip ausgestattet sein.One embodiment is that the connector has a means for locking or for releasing the lock. For example, a blade receptacle can be equipped with a FASTON principle.

Eine alternative Ausführungsform ist es, dass der Steckverbinder in einem Reflowverfahren auf der Leiterplatte aufgelötet ist.An alternative embodiment is that the connector is soldered in a reflow process on the circuit board.

Eine andere Weiterbildung ist es, dass der Steckverbinder eine Fixiermöglichkeit zur Sicherung der Position des Steckverbinders auf der Leiterplatte aufweist.Another development is that the connector has a fixing possibility for securing the position of the connector on the circuit board.

Eine solche Fixiermöglichkeit kann eigesetzt werden, um eine Position des Steckverbinders vor dem eigentlichen Lötvorgang so zu sichern, dass beim Löten, z.B. mittels Reflowverahren, dieser Steckverbinder im wesentlichen nicht verrutschen kann.Such fixation may be used to secure a position of the connector prior to the actual soldering operation such that during soldering, e.g. by means of reflow, this connector can not slip substantially.

Eine Weiterbildung besteht darin, dass die Fixiermöglichkeit eine Vertiefung oder eine Erhebung oder eine Aussparung umfasst.A further development consists in that the fixing possibility comprises a depression or an elevation or a recess.

Insbesondere ist der Steckverbinder ein SMD-Steckverbinder oder in SMD-Bauweise ausgeführt.In particular, the connector is an SMD connector or in SMD design.

Eine Ausgestaltung ist es, dass der Steckverbinder ein Hochstromstreckverbinder ist. Der Steckverbinder ist für Ströme größer als 2,5A vorgesehen.An embodiment is that the connector is a high current stretch connector. The connector is designed for currents greater than 2.5A.

Eine andere Ausgestaltung ist es, dass die Leiterplatte fest auf einer zweiten Leiterplatte verlötet ist. Insbesondere ist die zweite Leiterplatte eine feste (nicht flexible) Platine. Optional kann die zweite Leiterplatte eine Platine mit mehreren Schichten sein, wobei die Leiterplatte an einer mittleren Schicht der zweiten Leiterplatte festgelötet ist.Another embodiment is that the circuit board is soldered firmly on a second circuit board. In particular, the second circuit board is a solid (non-flexible) board. Optionally, the second circuit board may be a multi-layer board, wherein the circuit board is soldered to a middle layer of the second circuit board.

Auch ist es eine Möglichkeit, dass die zweite Leiterplatte mit der flexibel ausgeführten Leiterplatte verbunden ist, so dass beispielsweise die flexible Leiterplatte aus der zweiten Leiterplatte hervorgeht.It is also a possibility that the second printed circuit board is connected to the flexible printed circuit board, so that, for example, the flexible printed circuit board emerges from the second printed circuit board.

Auch ist es eine Ausgestaltung, dass mehrere Steckverbinder mittels eines Verbindungsstücks zusammengefasst sind. Dabei kann das Verbindungsstück ein Kunststoffverbindungsstück sein.It is also an embodiment that a plurality of connectors are combined by means of a connector. In this case, the connector may be a plastic connector.

Eine zusätzliche Weiterbildung ist es, dass mehrere Steckverbinder auf zwei Seiten der Leiterplatte angeordnet sind.An additional development is that a plurality of connectors are arranged on two sides of the circuit board.

Vorteilhaft sind dann Leiterbahnen, insbesondere Leiterbahnpärchen, auf beiden Seiten der Leiterplatte vorgesehen, so dass insgesamt eine niedrige Induktivität erreicht werden kann.Advantageously, then conductor tracks, in particular conductor pairs, provided on both sides of the circuit board, so that a total of a low inductance can be achieved.

Die vorstehend genannte Aufgabe wird auch gelöst durch einen Steckverbinder umfassend mindestens eine Fläche zum Auflöten auf einer Leiterplatte.The above object is also achieved by a connector comprising at least one surface for soldering on a printed circuit board.

Eine Weiterbildung besteht darin, dass der Steckverbinder mindestens eine Fixiermöglichkeit aufweist, anhand derer der Steckverbinder auf der Leiterplatte fixierbar ist. Der Steckverbinder ist in SMD-Bauweise ausgeführt.A development consists in that the connector has at least one fixing possibility, by means of which the connector can be fixed on the circuit board. The connector is designed in SMD construction.

Auch wird die vorstehend genannte Aufgabe gelöst durch ein Verfahren zur Herstellung eines Steckmittels umfassend die Schritte:

  • mindestens ein Steckverbinder wird auf eine Leiterplatte flächig aufgelegt;
  • der mindestens eine Steckverbinder wird mit der Leiterplatte verlötet.
Also, the above-mentioned object is achieved by a method for producing a plug-in means comprising the steps:
  • at least one connector is placed flat on a circuit board;
  • the at least one connector is soldered to the circuit board.

Erfindungsgemäß ist der Steckverbinder ein SMD-Steckverbinder.According to the connector is an SMD connector.

Auch ist es eine Weiterbildung, dass der mindestens ein Steckverbinder in einem Reflowverfahren verlötet wird.It is also a development that the at least one connector is soldered in a reflow process.

Eine andere Weiterbildung ist es, dass der mindestens eine Steckverbinder anhand einer Fixiermöglichkeit auf der Platine fixiert wird.Another development is that the at least one connector is fixed by means of a fixing possibility on the board.

Eine Ausgestaltung ist es, dass die Leiterplatte eine flexible Leiterplatte, insbesondere eine Flexleiterplatte ist.One embodiment is that the printed circuit board is a flexible printed circuit board, in particular a flexible printed circuit board.

Ausführungsbeispiele der Erfindung werden nachfolgend anhand der Zeichnungen dargestellt und erläutert.Embodiments of the invention are illustrated and explained below with reference to the drawings.

Es zeigen:

Fig. 1
einen Steckverbinder mit einer Leiterplatte in der Frontalansicht;
Fig.2
den Steckverbinder mit der Leiterplatte in perspektivischer Ansicht;
Fig.3
den Steckverbinder von unten.
Show it:
Fig. 1
a connector with a printed circuit board in the front view;
Fig.2
the connector with the circuit board in perspective view;
Figure 3
the connector from below.

Fig. 1 zeigt einen Steckverbinder 101, der auf einer Leiterplatte 102 aufgelötet ist in der Frontalansicht. Gebogene Bereiche 105 und 106 dienen der Kontaktierung mit einem entsprechend geformten Gegenstück (nicht dargestellt). Über eine Fläche 103, die hier beispielhaft durch die Frontalansicht im Querschnitt gezeigt ist, ist der Steckverbinder 101 auf der Leiterplatte 102 aufgelötet. Fig. 1 shows a connector 101 which is soldered on a printed circuit board 102 in the front view. Curved portions 105 and 106 are for contacting with a correspondingly shaped counterpart (not shown). Over a surface 103, the example here is shown in cross section through the frontal view, the connector 101 is soldered on the circuit board 102.

Die Leiterplatte 102 weist zumindest eine Leiterbahn auf, die mit der flächigen Lötstelle 103 verbunden ist. Weiterhin ist die Leiterplatte 102 vorzugsweise als eine flexible Leiterplatte, insbesondere als eine Flexleiterplatte ausgeführt, so dass der Steckverbinder 101 mit dem Gegenstück, z.B. einer Steckzunge, über die Leiterplatte 102 verbunden werden kann.The printed circuit board 102 has at least one conductor track, which is connected to the planar solder joint 103. Furthermore, the circuit board 102 is preferably implemented as a flexible circuit board, in particular as a flex circuit board, so that the connector 101 is connected to the counterpart, e.g. a tongue, can be connected via the circuit board 102.

Der Steckverbinder 101 ist in SMD-Bauweise ausgeführt.The connector 101 is designed in SMD construction.

Fig.2 zeigt eine perspektivische Ansicht umfassend den Steckverbinder 101 und die Leiterplatte 102. Hierbei können insbesondere mehrere Steckverbinder nebeneinander angeordnet sein. Entlang einer Richtung 107 erstreckt sich die insbesondere flexible Leiterplatte 102, so dass eine kabelähnliche Verbindung mittels der Kombination aus Steckverbinder 101 und Leiterplatte 102 erzielt werden kann. Fig.2 shows a perspective view comprising the connector 101 and the circuit board 102. In this case, in particular a plurality of connectors can be arranged side by side. Along a direction 107 extends the particular flexible printed circuit board 102, so that a cable-like connection by means of the combination of connector 101 and circuit board 102 can be achieved.

Die hier vorgestellte Lösung eignet sich insbesondere als ein Steckmittel, das auf vorhandene Steckzungen mit einer Abmessung von beispielsweise 6,3mm aufgesteckt werden kann. Der Steckverbinder 101 kann diesbezüglich mit der Steckzunge verbunden bzw. auf diese gesteckt werden. Insbesondere können die Steckzungen im wesentlichen horizontal oder vertikal angebracht sein und einen Mittenabstand von 10mm aufweisen.The solution presented here is particularly suitable as a plug-in means that can be plugged onto existing tabs with a size of, for example, 6.3 mm. The connector 101 can in this regard connected to the tongue or put on this. In particular, the tabs may be mounted substantially horizontally or vertically and have a pitch of 10mm.

Bei dem Steckverbinder 101 handelt es sich um eine Flachsteckhülse in SMD-Ausführung. Dieser Steckverbinder 101 wird direkt auf der Leiterplatte 102, z.B. einer Platine oder einer Flexleiterplatte, flächig aufgelötet. Ein solches Auflöten findet bevorzugt mittels eines Reflowverfahrens statt.The connector 101 is a blade receptacle in SMD design. This connector 101 is flat on the circuit board 102, such as a board or a flex circuit board soldered. Such soldering preferably takes place by means of a reflow process.

Fig.3 zeigt die Unterseite des Steckverbinders 101 umfassend Rastnasen 104, die beispielsweise als kleine Erhebungen oder Absenkungen oder Aussparungen ausgeführt sind. Die Rastnasen 104 dienen der Sicherung der Position des Steckverbinders 101 auf der Leiterplatte 102, damit beim Aufschmelzen des Lotes und Aufschwimmen des Steckverbinders 101 dessen Position im wesentlichen unverändert bleibt. Figure 3 shows the underside of the connector 101 comprising locking lugs 104, which are designed for example as small elevations or depressions or recesses. The locking lugs 104 serve to secure the position of the connector 101 on the circuit board 102 so that when melting the solder and floating the connector 101 whose position remains essentially unchanged.

Optional kann der Steckverbinder 101 noch mit dem sog. FASTON-Prinzip ausgestattet sein, um die auf die flächige Lötstelle 103 wirkenden Kräfte beim Stecken als auch beim Lösen des Steckverbinders 101 zu verringern.Optionally, the connector 101 may still be equipped with the so-called. FASTON principle to reduce the force acting on the flat solder joint 103 forces when plugging as well as when releasing the connector 101.

Der Steckverbinder 101 kann auch auf einer normalen Leiterplatte 102 (Printed Circuit Board, PCB) aufgelötet werden. Weiterhin ist es möglich, dass mehrere Steckverbinder nebeneinander eingesetzt werden. Insbesondere kann eine Bestückung und/oder Positionierung mehrerer Steckverbinder oder Flachsteckhülsen mittels eines Kunststoffverbindungsstücks vereinfacht werden.The connector 101 may also be soldered to a normal circuit board 102 (Printed Circuit Board, PCB). Furthermore, it is possible that several connectors are used side by side. In particular, a placement and / or positioning of a plurality of plug connectors or flat plug-in sleeves can be simplified by means of a plastic connector.

Das vorgestellte Steckmittel aus Steckverbinder und Leiterplatte sowie der Steckverbinder selbst eignen sich zur Verwendung für hohe elektrische Ströme (Hochstromverbindung) für Ströme größer als 2,5A.The plug-in device made of plug-in connector and printed circuit board as well as the connector itself are suitable for use with high electrical currents (high-current connection) for currents greater than 2.5A.

Claims (10)

  1. Plug-type means comprising
    - a printed circuit board (102);
    - a plug-type connector (101), which has been soldered onto the printed circuit board (102);
    characterized in that the plug-type connector is a quick connect tab terminal designed using SMD technology, and the plug-type connector is soldered flat onto the printed circuit board, wherein the plug-type connector is intended for currents of greater than 2.5 A, and the printed circuit board (102) comprises a flexible printed circuit board, in particular a circuit board or a Flex PCB.
  2. Plug-type means according to Claim 1, in which the printed circuit board (102) has at least two lines, which are connected to at least one plug-type connector (101).
  3. Plug-type means according to one of the preceding claims, in which the plug-type connector (101) has been soldered onto the printed circuit board (102) using a reflow method.
  4. Plug-type means according to one of the preceding claims, in which the printed circuit board (102) has been soldered firmly onto a second printed circuit board.
  5. Plug-type means according to one of the preceding claims, in which a plurality of plug-type connectors (101) are combined by means of a connecting piece.
  6. Plug-type means according to Claim 5, in which the connecting piece is a plastic connecting piece.
  7. Plug-type means according to one of the preceding claims, in which a plurality of plug-type connectors (101) are arranged on two sides of the printed circuit board (102).
  8. Process for manufacturing a plug-type means according to Claim 1, comprising the following steps:
    - at least one plug-type connector (101) is laid flat on a flexible printed circuit board (102), in particular a Flex PCB;
    - the at least one plug-type connector (101) is soldered to the printed circuit board (102).
  9. Process according to Claim 8, in which the at least one plug-type connector (101) is soldered using a reflow method.
  10. Process according to Claim 8, in which the at least one plug-type connector (101) is fixed on the printed circuit board (102) using a fixing option.
EP07820848A 2007-10-02 2007-10-02 Plug device, plug connector, and method for producing the plug connector Not-in-force EP2193576B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/060466 WO2009046752A1 (en) 2007-10-02 2007-10-02 Plug device, plug connector, and method for producing the plug connector

Publications (2)

Publication Number Publication Date
EP2193576A1 EP2193576A1 (en) 2010-06-09
EP2193576B1 true EP2193576B1 (en) 2012-05-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP07820848A Not-in-force EP2193576B1 (en) 2007-10-02 2007-10-02 Plug device, plug connector, and method for producing the plug connector

Country Status (6)

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US (1) US20100221930A1 (en)
EP (1) EP2193576B1 (en)
JP (1) JP5649969B2 (en)
KR (1) KR101465078B1 (en)
CN (1) CN101816103B (en)
WO (1) WO2009046752A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016066839A1 (en) * 2014-10-31 2016-05-06 Hirschmann Car Communication Gmbh High-frequency smd crimp
CN105826733B (en) * 2016-05-02 2019-02-05 宁波速普电子有限公司 A kind of connecting terminal block
US9692163B1 (en) * 2016-08-30 2017-06-27 Te Connectivity Corporation Crush rib housing for postive lock receptacle
DE102016221351A1 (en) * 2016-10-28 2018-05-03 Te Connectivity Germany Gmbh Flat contact socket with extension arm

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5983370A (en) * 1982-11-05 1984-05-14 住友電気工業株式会社 Device for mutually connecting wire ring harness
US4607782A (en) * 1985-05-24 1986-08-26 Contact Systems, Inc. Method and apparatus for soldering electrical components to circuit boards
JPH01143083U (en) * 1988-03-28 1989-09-29
US5195908A (en) * 1988-06-30 1993-03-23 Sumitomo Wiring Systems, Ltd. Multicircuit cable connector
JPH0231067U (en) * 1988-08-19 1990-02-27
US5145386A (en) * 1991-11-18 1992-09-08 Molex Incorporated Low profile electrical connector
US5219292A (en) * 1992-04-03 1993-06-15 Motorola, Inc. Printed circuit board interconnection
JPH071670B2 (en) * 1992-04-20 1995-01-11 協伸工業株式会社 Fuse clip mounting method and fuse clip combination
JPH0684560A (en) * 1992-09-03 1994-03-25 Sumitomo Wiring Syst Ltd Multi-electrode connection terminal and manufactures thereof
US5320513A (en) * 1992-12-10 1994-06-14 Husky Injection Molding Systems Ltd. Printed circuit board for an injection molding apparatus
US5582933A (en) * 1993-06-07 1996-12-10 Matsushita Electric Industrial Co., Ltd. Cell with terminals and circuit substrate
EP0721682B1 (en) * 1993-07-29 2000-03-08 Beta Phase, Inc. Connector device for electrically interconnecting printed circuit board like members
DE4325980C2 (en) * 1993-08-03 2003-06-26 Bosch Gmbh Robert Device for the common electrical contacting of several electrically excitable units of internal combustion engines
US5626482A (en) * 1994-12-15 1997-05-06 Molex Incorporated Low profile surface mountable electrical connector assembly
DE69517671T2 (en) * 1995-03-09 2001-03-01 Berg Electronics Mfg Connector element for connecting a flexible film and a pin-shaped contact element and an associated connecting tool and method for producing the same
US6074220A (en) * 1996-05-14 2000-06-13 Roberts; Joseph A. Direct circuit to circuit stored energy connector
US5709574A (en) * 1996-08-30 1998-01-20 Autosplice Systems Inc. Surface-mountable socket connector
US5934933A (en) * 1997-06-20 1999-08-10 Cts Corporation Snap lock membrane connector
US6051781A (en) * 1997-09-24 2000-04-18 Autosplice, Inc. Surface mount electromagnetic frequency interference shield clip
US6226862B1 (en) * 1998-04-30 2001-05-08 Sheldahl, Inc. Method for manufacturing printed circuit board assembly
GB2357638B (en) * 1999-12-24 2004-02-04 Pilkington Plc An electrical terminal for a window
CN2432700Y (en) * 2000-07-28 2001-05-30 富士康(昆山)电脑接插件有限公司 Electric connector
JP3614768B2 (en) * 2000-10-20 2005-01-26 タイコエレクトロニクスアンプ株式会社 Battery connector
US6750396B2 (en) * 2000-12-15 2004-06-15 Di/Dt, Inc. I-channel surface-mount connector
JP2003047128A (en) * 2001-07-31 2003-02-14 Fujikura Ltd Connection terminal, joint box using same, and method of manufacture therefor
JP3761501B2 (en) * 2002-07-31 2006-03-29 本多通信工業株式会社 Coaxial connector and ground pad on which it is mounted
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
JP4274528B2 (en) * 2003-04-28 2009-06-10 協伸工業株式会社 Tab terminal
US6863547B2 (en) * 2003-05-01 2005-03-08 Averatec Asia Incorporation Method for suppressing electromagnetic interference of electronic device and electronic device with suppressed electromagnetic interference by the method
DE60310557T2 (en) * 2003-09-03 2007-10-11 Kyoshin Kogyo Co. Ltd. Fuse holder component
ATE369031T1 (en) * 2004-04-08 2007-08-15 Ebm Papst St Georgen Gmbh & Co ARRANGEMENT WITH A CONTACT ELEMENT
JP4131724B2 (en) * 2004-10-18 2008-08-13 Ｔｄｋ株式会社 Terminal mounting structure on circuit board
TWM280554U (en) * 2005-07-20 2005-11-11 Molex Taiwan Ltd Electrical connector
JP4913539B2 (en) * 2006-10-25 2012-04-11 日本圧着端子製造株式会社 Socket contact
US7581965B1 (en) * 2008-05-01 2009-09-01 Commscope, Inc. Of North Carolina Bottom entry interconnection element for connecting components to a circuit board
TWI360260B (en) * 2008-08-06 2012-03-11 Pegatron Corp Connector structure
CN101950866B (en) * 2009-07-10 2014-03-05 深圳富泰宏精密工业有限公司 Elastic sheet structure and electronic device applying same
US7955147B1 (en) * 2010-03-15 2011-06-07 Zierick Manufacturing Corporation Surface mount (SMT) crimp terminal and method of securing wire to same

Also Published As

Publication number Publication date
KR101465078B1 (en) 2014-11-25
EP2193576A1 (en) 2010-06-09
US20100221930A1 (en) 2010-09-02
KR20100080833A (en) 2010-07-12
CN101816103B (en) 2013-06-19
JP2010541173A (en) 2010-12-24
CN101816103A (en) 2010-08-25
JP5649969B2 (en) 2015-01-07
WO2009046752A1 (en) 2009-04-16

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