EP2185859A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage

Info

Publication number
EP2185859A1
EP2185859A1 EP08801324A EP08801324A EP2185859A1 EP 2185859 A1 EP2185859 A1 EP 2185859A1 EP 08801324 A EP08801324 A EP 08801324A EP 08801324 A EP08801324 A EP 08801324A EP 2185859 A1 EP2185859 A1 EP 2185859A1
Authority
EP
European Patent Office
Prior art keywords
module
carrier
light
component carrier
luminous device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08801324A
Other languages
German (de)
English (en)
Inventor
Ralph Peter Bertram
Horst Varga
David Dussault
Matthias Fiegler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2185859A1 publication Critical patent/EP2185859A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • a luminous device has at least one luminous module.
  • the LED multiple module is known, which is suitable for installation in luminaire housing, in particular for motor vehicles.
  • the LED multiple module has a plurality of LEDs mounted on rigid circuit boards.
  • An object to be solved in the present case is to specify a luminous device with improved optical properties. This object is achieved by a luminous device according to claim 1.
  • the luminous device comprises at least one luminous module and a flat module carrier for fixing the luminous module, wherein the luminous module has a plurality of semiconductor radiation emitting
  • a flat surface is illuminated by means of the radiation generated by the light module, which extends parallel to the module carrier and thus obliquely to the mounting surface of the component carrier.
  • Radiation generated by such an oblique arrangement preferably includes an angle greater than 0 ° and less than 90 ° with the surface normal of the flat surface to be illuminated.
  • the illuminated area In comparison with a conventional flat array with perpendicular radiation incidence, in which the area illuminated by a semiconductor device is circular, in the present case the illuminated area has an elliptical shape and is therefore larger.
  • the illuminated areas of adjacent semiconductor components thereby overlap more strongly, as a result of which a better mixing of the radiation of adjacent semiconductor components is achieved.
  • the component carrier has at least one first and one second mounting surface, which run obliquely to one another.
  • the component carrier runs preferably pointedly on a side facing away from the module carrier.
  • the first mounting surface and the second mounting surface may include the same angle with the module carrier.
  • the mounting surfaces may also include different angles with the module carrier.
  • a surface can also be homogeneously illuminated in an edge region if the luminous device has a luminous module in the edge region, in which the mounting surfaces enclose different angles with the module carrier.
  • a luminous module arranged in the interior area preferably has mounting surfaces which enclose the same angle with the module carrier.
  • the component carrier serves on the one hand for fastening the components.
  • the component carrier for interconnecting the components conductor tracks structures and electrical connections, which are connected to a power supply, have.
  • the component carrier has at least one printed circuit board, wherein the mounting surface is the surface of the printed circuit board.
  • the component support may consist solely of a printed circuit board which is bent in such a way that at least two surfaces of the printed circuit board are inclined relative to one another.
  • the component carrier may have a holder with at least two mutually inclined surfaces, wherein on at least one surface, a circuit board is attached.
  • the holder preferably contains a metal and is particularly preferably made of aluminum or copper.
  • a circuit board for example, a metal core board is suitable, which ensures a comparatively good cooling of the light module.
  • the circuit board for the purpose of heat conduction have vias.
  • the component carrier has the shape of a polyhedron.
  • the shape of the component carrier results in a closed polyhedron shape.
  • the form of a polyhedron may be indicated by the component carrier.
  • Preferred polyhedra are, for example, prism, tetrahedron or pyramid.
  • the at least one mounting surface of the component carrier is arranged parallel to a boundary surface of the polyhedron.
  • the component carrier is a slide-in frame which is provided for guiding a cooling fluid flow or for inserting a cooling element.
  • fluid is to be understood as meaning a liquid or a gas.
  • the fluid flow may be an airflow that is caused by convection or by a fan.
  • the heat produced during operation of the light module can advantageously be dissipated to the environment.
  • a cooling element an active or passive element, such as a metal block or a cooling fin is suitable.
  • Such a cooling element can dissipate the heat, for example, to a heat sink or a cooling system.
  • the cooling element is arranged, in particular, in a cavity between the component carrier designed as a slide-in frame and the module carrier. If the cavity between the trained as a slide-in frame
  • the entirety of the semiconductor components of the lighting module can produce the same color of light.
  • each semiconductor device can generate white light.
  • at least two semiconductor components radiation produce different color.
  • mixed-colored light in particular white light
  • any color locations can be set.
  • the light module may comprise a first red light-emitting device, a second green light-emitting device, and a third blue light-emitting device.
  • the light-emitting module can have a further green light-emitting component.
  • a combination of different colored components a comparatively good color rendering index can be achieved.
  • the white point can be displaced by means of a different mixture of red, green and blue light.
  • the semiconductor components can be arranged regularly, in particular in rows, on the component carrier.
  • the semiconductor devices may line up at even intervals.
  • the semiconductor components like islands, so that the distance between semiconductor components within a group is smaller than the distance between semiconductor components of two adjacent groups.
  • the groups can in turn be lined up at regular intervals.
  • differently colored semiconductor components preferably three or four differently colored semiconductor components (red-green, blue) are combined to form a group.
  • semiconductor devices are suitable, which are surface mountable. Such semiconductor devices allow easy installation of the same and thus contribute to reduce the manufacturing cost of the light module.
  • each semiconductor device has a housing body in which a radiation-emitting semiconductor body is arranged.
  • the semiconductor body is a light emitting diode.
  • the module carrier on which the light module or the light modules are arranged, preferably contains a material with relatively good thermal conductivity.
  • materials are in particular metals, for example aluminum or copper, metal compounds or
  • the module carrier may be in the form of a planar metal frame, on which the light module or the light modules are placed and fastened.
  • the light module can be fastened to the module carrier by fastening means such as screws, rivets or adhesion promoter.
  • the fastening means connect the component carrier to the module carrier.
  • the light module provides a component carrier, which is a flexible printed circuit board having.
  • the printed circuit board is preferably arranged on a holder.
  • the holder has in particular at least two mutually inclined surfaces, wherein on at least one surface, the circuit board is attached.
  • the holder preferably contains a metal and is particularly preferably made of aluminum or copper.
  • the flexible circuit board can be curved in various ways, that is, the surface normal of the flexible circuit board can take different directions. In the present case, this has the advantage that the mounting surfaces of the component carrier, which preferably run obliquely relative to one another, can be designed to be continuous.
  • the flexible printed circuit board extends from the holder to the module carrier.
  • the free area that is available in addition to the light module on the module carrier can be used.
  • a radiation-emitting semiconductor component may be mounted on the flexible printed circuit board arranged on the free surface.
  • the lighting device has at least two lighting modules arranged next to one another, which are electrically connected to one another by means of the flexible printed circuit board.
  • a radiation-emitting semiconductor component arranged between the two light modules can be connected in series with one semiconductor component each of the adjacent light-emitting modules.
  • the luminous device comprises a plurality of luminous modules, these are preferably arranged at equal intervals on the module carrier.
  • the light modules of a first Row must not be at the same height with the light modules of a second row, but can be arranged offset to these.
  • the luminous device described here is particularly suitable as a backlight device.
  • the lighting device preferably has a backlighting element, wherein the backlighting element is arranged on a side facing away from the module carrier side of the lighting module.
  • Backlight element may be, for example, an LCD (Liquid Crystal Display), in particular a billboard.
  • the mounting surface of the component carrier with the backlighting element encloses an angle that is greater than 0 ° and less than 90 °.
  • the mounting surface extends obliquely to a main surface of the backlighting element.
  • the backlighting element is preferably flat.
  • the module carrier is also formed flat and arranged parallel to the backlighting element.
  • the semiconductor components are preferably arranged such that the main surface illuminated by means of the luminous module is assigned a uniform color locus. Furthermore, the semiconductor components are arranged such that the main surface is illuminated by the light module with a uniform light intensity.
  • the lighting device is the mounting surface of the component-carrier reflective trained.
  • the mounting surfaces of adjacent light modules which preferably run obliquely to one another, can thus form a reflector.
  • the luminance density can be increased in a main emission direction.
  • a diffusely reflecting foil can be applied to the component carrier.
  • FIG. 1A shows a schematic cross-sectional view and FIG. 1B shows a schematic perspective view of a first exemplary embodiment of a lighting device according to the invention
  • FIG. 2 shows a schematic perspective view of a second exemplary embodiment of a luminous device according to the invention
  • FIG. 3 shows a schematic perspective view of a third exemplary embodiment of a lighting device according to the invention
  • FIG. 4 shows a schematic perspective view of a fourth exemplary embodiment of a lighting device according to the invention
  • FIG. 5 shows a schematic perspective view of a fifth exemplary embodiment of a luminous device according to the invention
  • FIG. 6 shows a schematic cross-sectional view of a sixth exemplary embodiment of a lighting device according to the invention
  • FIG. 7 shows a schematic cross-sectional view of a seventh exemplary embodiment of a luminous device according to the invention
  • FIG. 8 is a schematic perspective view of an eighth embodiment of a luminous device according to the invention, FIG.
  • FIG. 9 shows a schematic perspective view of a ninth embodiment of a lighting device according to the invention.
  • Figure 10 is a schematic perspective view of a tenth embodiment of a lighting device according to the invention.
  • FIG. 1A shows a luminous device 1 which comprises a module carrier 2 and a luminous module 5 which is arranged on the module carrier 2.
  • the light module 5 has a component carrier 3 and a plurality of semiconductor components 4 (seen in the cross-sectional view of only one of the plurality of semiconductor components), wherein the semiconductor
  • Components 4 are arranged on a mounting surface 6a of the component carrier 3.
  • the mounting surface ⁇ a runs obliquely to the plane formed module carrier 2 and includes with this an angle 0 ° ⁇ ⁇ 90 °.
  • the mounting surface 6a also extends obliquely to a side surface 6b of the component carrier 3 and encloses with this an angle 0 ° ⁇ ⁇ 180 °.
  • the component carrier 3 is angled in the illustrated embodiment, so that between the component carrier 3 and the module carrier 2, a cavity 7 is present, in which, for example, a cooling element can be inserted.
  • the component carrier 3 may be formed in one piece or in several parts.
  • 3 printed circuit boards are joined together to produce a multi-part component carrier, so that the printed circuit boards enclose the angle ⁇ .
  • the circuit boards are then arranged on a holder (not shown).
  • the respective surfaces of the printed circuit boards then form the side surface 6b and the mounting surface 6a of the component carrier 3.
  • An anchoring of the light module 5 on the module carrier 2 can be carried out in particular by fastening means (not shown) which connect the component carrier 3 to the module carrier 2 connect.
  • the circuit boards are in particular metal core boards, which ensure good cooling of the light module 1. A good cooling of the light-emitting module 1 is also possible if the printed circuit boards have plated-through holes.
  • the mounting surface 6a is tilted both with respect to the module carrier 2 and with respect to a flat surface F to be illuminated.
  • the mounting surface 6a encloses with the flat surface F to be illuminated an angle 0 ° ⁇ ⁇ 90 °. Radiation emitted by the semiconductor devices 4 thus impinges obliquely on the surface F.
  • the illuminated area In comparison with a conventional non-tilted, flat array with perpendicular radiation incidence, in which the area illuminated by a semiconductor device is circular, the illuminated area here has an elliptical shape and is thus larger.
  • the side surface 6b is tilted with respect to the surface F as well as the mounting surface 6a.
  • the side surface 6b encloses with the surface F an angle 0 ° ⁇ ß ⁇ 90 °.
  • the side surface 6b extends obliquely to the module carrier 2.
  • the side surface 6b closes with the module carrier 2 an angle ⁇ ⁇ 0 °.
  • the angle o ⁇ and the angle ß can be different or equal.
  • the angle ⁇ and the angle ⁇ may be different or equal.
  • FIG. 1B shows a perspective view of the embodiment shown in cross section in FIG. 1A. From this comes hevor, as the semiconductor devices 4 on the
  • the semiconductor components 4 are arranged in rows along the longitudinal side of the mounting surface 6a.
  • the semiconductor Components 4 evenly spaced from each other.
  • the semiconductor devices 4 may be different colors. For a good mixing of the radiation, it is advantageous to arrange the semiconductor components 4 in periodic color order.
  • the luminous device 1 illustrated in FIG. 2 comprises a luminous module 5 with a component carrier 3, on which the semiconductor components 4 are arranged in a row in accordance with the exemplary embodiment shown in FIG.
  • the side surface 6b is used as a further mounting surface.
  • FIG. 3 shows a luminous device 1 with a luminous module 5, in which the semiconductor components 4 are grouped like islands on the mounting surface 6a of the component carrier 3.
  • the distances between the semiconductor devices 4 within a group are smaller than the distances between the semiconductor devices 4 of adjacent groups.
  • the semiconductor components 4 can be different colors.
  • the differently colored light of the semiconductor components 4 of a group mixes to white light.
  • FIGS. 1 to 3 have in common that the component carrier 3 has the shape of a prism.
  • component carrier 3 has the shape of a prism.
  • component carrier 3 are shown with other polyhedron shapes.
  • FIG. 4 shows a luminous device 1 with a luminous module 5, which has a tetrahedral component carrier 3 having.
  • the component carrier 3 has three side walls with triangular mounting surfaces 6a, 6b, 6c.
  • the respective mounting surfaces 6a, 6b, 6c extend obliquely to the module carrier 2.
  • the mounting surfaces 6a, 6b, 6c also run obliquely to one another.
  • a semiconductor device 4 is mounted in each case.
  • the semiconductor components 4 can be a red, a blue and a green light-emitting diode, so that the light-emitting module 5 radiates white light as a whole.
  • the arrangement is advantageously space-saving and also ensures a good mixing of the different colored light.
  • the component carrier 3 is not formed as a closed tetrahedron, but has on a module carrier 2 side facing a cavity in which, for example, a cooling element can be inserted.
  • the component carrier 3 of the luminous module 5 has the shape of a pyramid.
  • the component support 3 lacks the bottom surface, so that only the mounting surfaces 6a, 6b, 6c, 6d are present.
  • the component carrier 3 is not formed as a closed pyramid.
  • the component carrier 3 encloses a cavity in which, for example, a cooling element can be arranged.
  • FIG. 6 shows a luminous device 1 with a plurality of luminous modules 5, which are arranged on a common module carrier 2.
  • the lighting modules 5 are constructed, for example, according to the embodiment shown in Figure 2. Due to the oblique beam path, which is brought about by means of the inclined mounting surfaces 6a, 6b, the light of the semiconductor components 4 of adjacent light-emitting modules 5 can be better be superimposed as in perpendicular radiation, whereby the homogeneity of the radiation can be improved.
  • the component carrier 3 define together with the module carrier 2 a cavity 7.
  • a cooling element can be inserted.
  • a fluid flow, in particular an air flow to pass through the cavity 7.
  • FIG. 7 shows a luminous device 1 in which a cooling element 8 is arranged in each case between the component carriers 3 of the luminous modules 5 and the module carrier 2.
  • the cooling element 8 is inserted into the cavity 7 between the respective lighting module 5 and the module carrier 2.
  • the cooling element 8 is in direct contact with the respective component carrier 3, so that the heat generated during operation can be dissipated directly.
  • the cooling element 8 may be a cooling fin or a metal block, which in particular contains copper.
  • the light-emitting device 1 shown in Figure 8 is used to illustrate a possible arrangement of the light-emitting modules 5 on the module carrier 2.
  • the light-emitting modules 5 are arranged offset from one another and thus are not at the same height.
  • the lighting modules 5 are spaced from each other. It would also be possible to additionally align the lighting modules 5 differently.
  • the lighting modules 5 can be strung together in a closed line.
  • the component carrier 3 of the luminous module 5 has a holder 11 and a part of a flexible printed circuit board 9 which is arranged on the holder 11.
  • the flexible circuit board 9 extends further from the holder 11 to the
  • the flexible printed circuit board 9 can be bent / so that the flexible printed circuit board 9 continuously changes from the holder 11 of the component carrier 3 to the module carrier 2. In this arrangement, the existing on the module carrier 2 free
  • a radiation-emitting semiconductor component 4 is arranged on the free surface, which contributes to increasing the luminance of the luminous device 1. It is understood that, depending on the size of the free area, a multiplicity of radiation-emitting semiconductor components can be provided.
  • FIG. 10 shows a luminous device 1 which, in addition to the components already known from FIGS. 1 to 9, such as the module carrier 2 and the luminous modules 5, has a further component, the backlit element 10.
  • the backlight element 10 can be, for example, an LCD, in particular a billboard.
  • the backlight element 10 is arranged on a side facing away from the module carrier 2 side of the light modules 5.
  • the radiation generated by the semiconductor components 4 falls directly on the backlight element 10 and illuminates a main surface H of the backlight element 10.
  • the main surface H extends obliquely to the mounting surfaces 6a, 6b of the light modules 5.
  • an area A illuminated by the respective semiconductor devices 4 has an elliptical shape, which is due to the oblique irradiation. In normal incidence, the surface A would be circular and thus smaller. Due to the elliptical shape, the adjacent areas A overlap more strongly, as a result of which overall better radiation homogeneity can be achieved. Furthermore, a better superimposition of radiation cones of the semiconductor components 4 of adjacent light modules 5 is brought about by the illustrated arrangement.
  • the light modules 5 need not have the structure shown. Rather, the lighting modules 5 may also be formed according to one of the embodiments shown in the preceding figures.
  • the invention is not limited by the description with reference to the embodiments. Rather, the invention encompasses any novel feature as well as any combination of features, including in particular any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the patent claims or exemplary embodiments.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Dispositif d'éclairage (1) comprenant au moins un module d'éclairage (5) et un support (2) plant destiné à la fixation du module d'éclairage (5). Ledit module d'éclairage (5) présente plusieurs composants semi-conducteurs (4) émetteurs de rayonnements et un porte-composant (3) doté d'au moins une surface de montage (6a) sur laquelle est montée au moins une partie des composants semi-conducteurs (4) émetteurs de rayonnements. Ladite au moins une surface de montage (6a) est inclinée vers le support de module (2) plat.
EP08801324A 2007-09-14 2008-09-12 Dispositif d'éclairage Withdrawn EP2185859A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007043904A DE102007043904A1 (de) 2007-09-14 2007-09-14 Leucht-Vorrichtung
PCT/DE2008/001532 WO2009033477A1 (fr) 2007-09-14 2008-09-12 Dispositif d'éclairage

Publications (1)

Publication Number Publication Date
EP2185859A1 true EP2185859A1 (fr) 2010-05-19

Family

ID=40029059

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08801324A Withdrawn EP2185859A1 (fr) 2007-09-14 2008-09-12 Dispositif d'éclairage

Country Status (5)

Country Link
US (1) US20100284169A1 (fr)
EP (1) EP2185859A1 (fr)
CN (1) CN101802487A (fr)
DE (1) DE102007043904A1 (fr)
WO (1) WO2009033477A1 (fr)

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US20100284169A1 (en) 2010-11-11
WO2009033477A1 (fr) 2009-03-19
DE102007043904A1 (de) 2009-03-19
CN101802487A (zh) 2010-08-11

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