EP2165583A4 - Automated direct emulsion process for making printed circuits and multilayer printed circuits - Google Patents

Automated direct emulsion process for making printed circuits and multilayer printed circuits

Info

Publication number
EP2165583A4
EP2165583A4 EP08771412A EP08771412A EP2165583A4 EP 2165583 A4 EP2165583 A4 EP 2165583A4 EP 08771412 A EP08771412 A EP 08771412A EP 08771412 A EP08771412 A EP 08771412A EP 2165583 A4 EP2165583 A4 EP 2165583A4
Authority
EP
European Patent Office
Prior art keywords
printed circuits
emulsion process
direct emulsion
making
automated direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08771412A
Other languages
German (de)
French (fr)
Other versions
EP2165583A1 (en
Inventor
Technologies Llc Vectraone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VectraOne Technologies LLC
Original Assignee
VectraOne Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VectraOne Technologies LLC filed Critical VectraOne Technologies LLC
Publication of EP2165583A1 publication Critical patent/EP2165583A1/en
Publication of EP2165583A4 publication Critical patent/EP2165583A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP08771412A 2007-06-18 2008-06-18 Automated direct emulsion process for making printed circuits and multilayer printed circuits Withdrawn EP2165583A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94473107P 2007-06-18 2007-06-18
PCT/US2008/067405 WO2008157642A1 (en) 2007-06-18 2008-06-18 Automated direct emulsion process for making printed circuits and multilayer printed circuits

Publications (2)

Publication Number Publication Date
EP2165583A1 EP2165583A1 (en) 2010-03-24
EP2165583A4 true EP2165583A4 (en) 2012-05-16

Family

ID=40156691

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08771412A Withdrawn EP2165583A4 (en) 2007-06-18 2008-06-18 Automated direct emulsion process for making printed circuits and multilayer printed circuits

Country Status (4)

Country Link
EP (1) EP2165583A4 (en)
JP (1) JP2010530646A (en)
CN (1) CN101785372B (en)
WO (1) WO2008157642A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201019874D0 (en) * 2010-11-23 2011-01-05 Rainbow Technology Systems Ltd Improved photoimaging
KR101862243B1 (en) * 2011-09-21 2018-07-05 해성디에스 주식회사 Method for manuracturing printed circuit board with via and fine pitch circuit and printed circuit board by the same method
PL414778A1 (en) * 2015-11-13 2017-05-22 Skorut Systemy Solarne Spółka Z Ograniczoną Odpowiedzialnością Method for modification of laminates used in manufacturing of printed circuits

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US6017613A (en) * 1994-06-06 2000-01-25 International Business Machines Corporation Method for photoselective seeding and metallization of three-dimensional materials
US20060068173A1 (en) * 2004-09-30 2006-03-30 Ebara Corporation Methods for forming and patterning of metallic films
US20070059646A1 (en) * 2005-09-13 2007-03-15 Eastman Kodak Company Method of forming conductive tracks

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
DE3434431A1 (en) * 1984-09-19 1986-03-20 Bayer Ag, 5090 Leverkusen Process for partial metallisation of substrate surfaces
US5648125A (en) * 1995-11-16 1997-07-15 Cane; Frank N. Electroless plating process for the manufacture of printed circuit boards
US6198525B1 (en) * 1999-02-19 2001-03-06 International Business Machines Corporation System for contact imaging both sides of a substrate
JP2006128599A (en) * 2004-09-30 2006-05-18 Ebara Corp Substrate provided with metallic film and method for forming metallic film

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US6017613A (en) * 1994-06-06 2000-01-25 International Business Machines Corporation Method for photoselective seeding and metallization of three-dimensional materials
US20060068173A1 (en) * 2004-09-30 2006-03-30 Ebara Corporation Methods for forming and patterning of metallic films
US20070059646A1 (en) * 2005-09-13 2007-03-15 Eastman Kodak Company Method of forming conductive tracks

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008157642A1 *

Also Published As

Publication number Publication date
EP2165583A1 (en) 2010-03-24
CN101785372A (en) 2010-07-21
JP2010530646A (en) 2010-09-09
WO2008157642A1 (en) 2008-12-24
CN101785372B (en) 2012-07-18

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20100118

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AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: VECTRAONE TECHNOLOGIES, LLC

RIN1 Information on inventor provided before grant (corrected)

Inventor name: VECTRAONE TECHNOLOGIES, LLC

A4 Supplementary search report drawn up and despatched

Effective date: 20120417

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 3/46 20060101ALN20120411BHEP

Ipc: H05K 3/18 20060101AFI20120411BHEP

17Q First examination report despatched

Effective date: 20140401

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20141012