EP2113350B1 - Board manufactured with two layers and material between them - Google Patents

Board manufactured with two layers and material between them Download PDF

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Publication number
EP2113350B1
EP2113350B1 EP09005897.5A EP09005897A EP2113350B1 EP 2113350 B1 EP2113350 B1 EP 2113350B1 EP 09005897 A EP09005897 A EP 09005897A EP 2113350 B1 EP2113350 B1 EP 2113350B1
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EP
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Prior art keywords
grains
binder
granulate
layer
granules
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EP09005897.5A
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German (de)
French (fr)
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EP2113350A1 (en
Inventor
Kurt Nonniner
Carsten Kowalski
Herbert Klein
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Pfleiderer Deutschland GmbH
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Pfleiderer Deutschland GmbH
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Priority to PL09005897T priority Critical patent/PL2113350T3/en
Priority to EP09005897.5A priority patent/EP2113350B1/en
Priority to ES09005897T priority patent/ES2718473T3/en
Priority to PT09005897T priority patent/PT2113350T/en
Publication of EP2113350A1 publication Critical patent/EP2113350A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/02—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N1/00—Pretreatment of moulding material

Definitions

  • the invention relates to a plate according to claim 1.
  • Modern materials must today have a variety of required properties and often equal fulfill a whole series of requirements simultaneously.
  • appropriate properties such as stability, strength, flexural rigidity, mass and density, or thermal properties may be essential.
  • additional properties are often important, such as. B. a fire and fire resistance.
  • an increasing scarcity of raw materials sets additional restrictions with regard to the usable basic and starting materials.
  • a recycling of already used materials and parts, as well as the possibility of re-use of newly produced materials and parts are increasingly desirable. So today already puffed cereal grains are common in packaging and insulation technology.
  • the invention relates to a generic plate or a molded part according to the preamble of the independent claim, which is known ( AU 2005200282 A1 ).
  • a plate having a first and second on both sides glued on a layer of material cover layers.
  • the material layer is provided with a material comprising granules of a granule formed as porous air or gas filled granules of a glass foam granule.
  • fibers of a natural material, eg wool are provided on the surface of the coated grains.
  • the material further comprises constituents, for example grains of a further granulate, wherein the coated granules of the granules are mixed with the granules of the further granules and bound together.
  • This known plate may have a minimum density of 150 g / l.
  • a suitable material for forming sheets, sheets and moldings, granules of a granule and a surface comprising granules of the granules This new material has very good swelling values, in particular for the plates produced therefrom.
  • the strength of the plates made with the material is improved when fibers are additionally provided, the binder binding a portion of the fibers to the surface of the granules of the granules.
  • This material may advantageously have an improved or desired strength.
  • the material may be light in an advantageous manner, ie lighter than comparable materials or have a lower mass density, defined by the ratio of mass to volume. Therefore, the material can provide a favorable relationship between weight or density and strength.
  • the mechanical strength of a single grain, and thus also of the material can be improved.
  • the granules of the granules for the density of the material are significantly determining.
  • the granules provide more than 50%, more than 75% or more than 90% of the volume of the material.
  • the weight fraction of the fibers and binder relative to the grains of the granules may be less than 50%, less than 25% or less than 10%.
  • a grain of the granules on a porous base material wherein the pores are filled with air or with a gas.
  • corresponding grains for this purpose are popped grains of a cereal, such as. Corn, wheat, oats, or amaranth; Popp grain; Granules of a foamed plastic, of an expanded plastic, of an extruded plastic or of a flexible material; Grains of a foam; Styrofoam, Styrodur, or Styrofoam grains; Grains of a puffed extrudate, granules of crushed carpet, or other recyclable or recycled materials such as packaging material, textiles or the like.
  • natural products or plastics can be used, such.
  • PS polystyrene
  • PVC polyvinyl chloride
  • PU polyurethane
  • the gases used are air, nitrogen, carbon dioxide, halogenated hydrocarbons and the like.
  • foamed metals such as grains of aluminum foam, can be used. Grains for the purposes of the present invention may thus be particles, chips, chips or parts of a comminuted material.
  • the basic material used according to the invention are natural substances.
  • materials already used or recycled, and possibly also otherwise not otherwise usable can be used as raw materials for a material according to an embodiment of the invention.
  • the use of renewable, environmentally friendly and environmentally compatible raw materials can be made possible in a further advantageous manner.
  • Another advantage may lie in a cost-effective production of the material.
  • an average density of the grains is below 0.1 kg / l.
  • This average density where the density is averaged over a representative plurality of grains, may correspond to the density of Styrofoam, Poppkorn, and may be lower than the average density of solid wood, e.g. Spruce, chipboard or medium density fibreboard (MDF).
  • MDF medium density fibreboard
  • a material can be obtained whose density is in a range of a density of light materials.
  • a mean diameter of a grain size of the grains according to another embodiment may be in a range of 0.5 mm to 5 mm, in a range of 1 mm to 10 mm, or even more than 10 mm.
  • a grain shape can correspond to possible or conventional forms such.
  • a mean diameter of the fibers may be in a range of 10 ⁇ m to 100 ⁇ m , in a range of 100 ⁇ m to 500 ⁇ m , or more than 500 ⁇ m .
  • an average length of the fibers may be in a range of 100 ⁇ m to 1 mm, in a range of 1 mm to 10 mm, or even over 10 mm.
  • Applicable fibers include wood fibers, staple fibers, medium density fibers, fibers of renewable resources, natural fibers, hemp, flax, straw, textile fibers, glass fibers, metal wires or metal shavings, plastic fibers, and the like.
  • the binder comprises a cured adhesive, a partially cured adhesive or a curable adhesive. Curing or partial curing of the adhesive can be carried out by evaporation or partial evaporation of a solvent, a heat treatment or a polymerization.
  • the binder may be mixed with a hardener.
  • a comprehensive curing by special storage or handling such. As a cooled storage, initially be suppressed.
  • the fibers can already be firmly or finally firmly bonded to the surface of the grains, while further processing, reshaping of the material or bonding of the grains to each other is still possible.
  • binders in this context are thermosets, urea-formaldehyde (urea-formaldehyde, UF), melamine-formaldehyde (MF), phenol-formaldehyde (PF), isocyanate, diphenylmethane diisocyanate, epoxy resin, acrylic resin, dispersion glues, glues, adhesives, starch , Proteins, polymers and the like.
  • the material comprises constituents, for example granules of a further granulate, wherein the granules of the granules with the grains of the further granules can be mixed.
  • the mixing ratio of the grains of the granules to the grains of the further granules may vary within the material or a unit made therefrom, for example in order to advantageously influence or determine the mechanical properties.
  • the mechanical, chemical or physical properties of the material can advantageously be changed or adjusted independently of the properties of the granules, of the fibers or of the binder.
  • the strength can be further increased, the weight can be further reduced, or else a fire resistance can be increased, for example by mixing in flame retardants.
  • other granules include wood chips, fibers, particles, grains of certain active chemical substances such as flame retardants or hydrophobic or hydrophilic substances, rock or metal particles, natural or synthetic grains or the like.
  • the material may once again comprise the fibers with which the grains of the starting granules are coated, ie the fibers are added to the material once again, regardless of the bond to a surface of a grain of the granules, in the sense of another granule.
  • the material comprises a further binder, wherein the further binder the coated granules of the granules and / or the grains of the further granules binds to each other.
  • the further binder may correspond to the binder which binds the fibers to the grains, so that advantageously only one binder is used.
  • the invention provides a plate according to claim 1 ready.
  • the grains of granules or granules are bound together, so that they form a solid, coherent and stable material.
  • a corresponding plate can represent an insulation board or a building board in building or equipment construction according to one embodiment.
  • a chipboard which comprises a first chipboard layer, a second chipboard layer and a material layer.
  • the material layer is arranged between the first chipboard layer and the second chipboard layer.
  • a chipboard according to the invention can advantageously increase the strength of the board, wherein at the same time the weight and / or the board thickness can be advantageously reduced in comparison to a chip board with comparable strength.
  • FIGS. 2A to 2C schematic representations of plates and layers according to embodiments of the present invention.
  • the Figure 1A shows a schematic representation of a bulk material.
  • a bulk material 100 comprises coated grains 31.
  • the grains 31 comprise grains 30 of granules which are coated on their surface, at least partially, with fibers 10 and a binder 20.
  • the individual grains 31 may vary both in shape and in size, and are not bound together according to this embodiment, so that the bulk material 100, even when touching the grains 31 with each other, is freely deformable or deformable or remains.
  • the FIG. 1B shows a schematic, general representation of a material. Accordingly, a material 110 comprises the coated grains 31, which are bonded together with another binder 21 to each other. This further binder 21 may correspond to the binder 20, as it is in connection with the Fig. 1A has been described and according to the fibers 10 binds to the surface of a grain 30.
  • the Figure 1C shows a schematic, general representation of a material according to the present invention.
  • a material 120 comprises the coated grains 31, as well as grains 32 of a further granulate and further fibers 11, which are bonded to each other with the further binder 21 to each other.
  • these Presentation shows both the grains 32 of the other granules and other fibers 11, also advantageous materials are possible in which either the grains 32 of the other granules or the other fibers 11 are missing.
  • the FIG. 2A shows a schematic representation of a plate according to an embodiment.
  • a plate 130 comprises a material with the coated grains 31 and the further binder 21.
  • the plate 130 may be in the form of a single-layer plate, so that they z. B. can be used in a cost effective manner in equipment, machinery or building application, such as insulation board or load-bearing plate.
  • FIG. 2B shows a schematic representation of an insulation board according to another embodiment.
  • an insulating board 140 comprises a material having the coated grains 31 and the further binder 21 according to the above-mentioned embodiment, and is made of this material.
  • the insulation board 140 also has knobs 141, which advantageously increase a surface of the insulation board 140 and / or absorb sound, vibrations, shocks or even heat, intercept or dam.
  • the Figure 2C further shows a schematic representation of a chipboard according to the Embodiment of the present invention.
  • a chipboard 150 comprises a first chipboard layer 151 and a second chipboard layer 152, between which is disposed a material layer 153 comprising a material according to an embodiment of the plate of the invention.
  • the material layer 153 can advantageously improve the mechanical, physical or other properties compared to a normal particle board, wherein a normal chipboard without a material layer 153 or a material inclusion would be provided.
  • By the arrangement of the material layer 153 between the chipboard layers 151, 152 can according to this embodiment also preserve an optical impression of a chip, wood or veneer plate, although although advantageous properties of the material desired, but z. B. the optical properties and / or its aesthetic impression of the material layer 153 are not desirable.
  • Example in general For the production of all chipboard, industrially processed chips were used as grains of the additional granules, as far as the middle layer is concerned. The chips were removed from the belt scale after drying and immediately before gluing. The material is composed of various raw material assortments and is subdivided into cover and middle layer fractions due to the process.
  • Example 1 Production of UF resin bound, three-layer chipboards with low bulk density and with 33% pure Maisextrudat than the Granules of the granules according to independent claim 1 in the middle layer (middle layer chips).
  • aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 with a solids content of about 68% was used.
  • a curing accelerator a 33% aqueous ammonium sulfate solution was used.
  • the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
  • the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.
  • the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
  • the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
  • Example 2 Production of UF resin bonded, three-layer chipboard with less Bulk density and 33% fiber-reinforced maize trudate as the granules of the granules according to independent claim 1 and the fibers on their surface in the middle layer (middle layer chips).
  • Middle layer chips From industrially produced spun and Maisextrudat, which is reinforced with the fibers bonded to its surface, 20 mm thick three-layer chipboard with a density of 500 kg / m 3 were prepared with an industrially standardized binder composition.
  • the middle layer chips were admixed with 33% of the fiber-reinforced extrudate. For this purpose, the extrudate was coated with 10% fiber type C120 from Rettenmeier.
  • the fixation of the fiber on the extrudate surface was carried out by the adhesive effect of starch from the corn as a binder.
  • an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 with a solids content of about 68% was used.
  • a 33% aqueous ammonium sulfate solution was used.
  • the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
  • the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.
  • the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
  • the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
  • Example 3 Preparation of low bulk density three-layer chipboard bound UF resin and 33% acrylate (as binder) reinforced maize trudate as the granules of the granule of independent claim 1 in the middle layer (middle layer chips).
  • the middle layer shavings as further granules were admixed with 33% acrylate as binder reinforced extrudate as granules.
  • the extrudate was glued with 12.5% percent of a 50 percent acrylate dispersion type BV 595 of the polymer latex polymer and dried at 60 ° C in a stream of hot air.
  • aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%.
  • a curing accelerator a 33% ammonium sulfate aqueous solution was used.
  • a water repellent came a Paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50% is used.
  • the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin based on dry chip, 2% Ammonioumsulfatates (hardener) based on dry solid resin and 1% water repellents based on atro chip.
  • the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
  • the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
  • Example 4 Production of UF resin bonded, three-layer chipboard with low bulk density and 33% with acrylate as a binder reinforced Maisextrudat grains of the granules according to independent claim 1 and fibers on the surface in the middle layer (middle layer chips).
  • the extrudate was glued with 12.5 percent of a 50% acrylate dispersion type BV 595 of the polymer latex, coated with 10% fiber type C120 Fa Rettenmeier and then at 60 ° C in Warm air stream dried.
  • aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%.
  • a curing accelerator a 33% aqueous ammonium sulfate solution was used.
  • the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
  • the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.
  • the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
  • the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
  • Example 5 Production of UF resin bonded, three-layer chipboard with low bulk density and 33% acrylate reinforced as a binder Maisextrudat grains of the granules with fibers on the surface in the middle layer (middle layer chips).
  • Spangut and Maisextrudat which is reinforced with fiber and acrylate, were 20 mm thick three-layered Particleboard with a density of 500 kg / m 3 made with an industrially standardized binder composition.
  • the middle layer chips were mixed with 33% fiber- and acrylate-reinforced extrudate.
  • the extrudate was glued with 12.5 percent of a 50 percent acrylate dispersion type DV 455 of the polymer latex polymer coated with 10% fiber type C120 Fa Rettenmeier and then dried at 60 ° C in a stream of hot air.
  • aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%.
  • a curing accelerator a 33% ammonium sulfate aqueous solution was used.
  • the hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%.
  • the glue liquor of the middle layer as a further binder consisted of 8% UF solid resin based on dry chip, 2% Ammonioumsulfatates (hardener) based on dry solid resin and 1% water repellents based on atro chip.
  • the glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip.
  • the chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .
  • Example 6 Preparation of UF resin bonded, three-layer chipboard with low density of pure industrial chips as a reference.

Description

Die Erfindung betrifft eine Platte gemäß Anspruch 1. Moderne Werkstoffe müssen heute eine Vielzahl von geforderten Eigenschaften aufweisen und oft gleich eine ganze Reihe von Anforderungen gleichzeitig erfüllen. Für viele Werkstoffe, wie sie beispielsweise in der Verpackungstechnik, im Gebäude-, Geräte- oder Maschinenbau Anwendung finden, können entsprechende Eigenschaften, wie die Stabilität, Festigkeit, Biegesteifigkeit, Masse und Dichte, oder auch thermische Eigenschaften von wesentlicher Bedeutung sein. Auch sind oft zusätzliche Eigenschaften wichtig, wie z. B. eine Brand- und Feuerfestigkeit.
Des Weiteren setzt auch eine zunehmende Rohstoff-Knappheit zusätzliche Beschränkungen hinsichtlich der einsetzbaren Grund- und Ausgangsstoffe. Eine Wiederverwertung bereits benutzter Werkstoffe und Teile, sowie die Möglichkeit der Widerverwertung neu erzeugter Werkstoffe und Teile sind immer öfter wünschenswert. So sind heute bereits aufgepuffte Getreidekörner in der Verpackungs- und Dämmtechnik üblich. Hierbei vereint man also bereits die Verwendung nachhaltig nachwachsender Rohstoffe mit einer inhärenten Umweltfreundlichkeit der aus den Rohstoffen hergestellten Werkstoffe. Die Erfindung betrifft eine gattungsgemäße Platte oder ein Formteil nach dem Oberbegriff des unabhängigen Anspruchs, was bekannt ist ( AU 2005200282 A1 ). Hierin ist eine Platte offenbart, die mit einer ersten sowie zweiten beiderseits auf eine Werkstoffschicht aufgeklebte Deckschichten aufweist. Die Werkstoffschicht ist mit einem Werkstoff versehen, der Körner eines Granulats aufweist, das als poröse mit Luft oder mit einem Gas gefüllte Körner eines Glas-Schaum-Granulats ausgebildet ist. Dabei sind zusätzlich Fasern aus einem Naturstoff, z.B. Wolle an der Oberfläche der beschichteten Körner vorgesehen. Der Werkstoff umfasst weiter Bestandteile, z.B. Körner eines weiteren Granulats, wobei die beschichteten Körner des Granulats mit den Körnern des weiteren Granulats vermischt und aneinander gebunden sind. Diese bekannte Platte kann eine Mindestdichte von 150 g/l aufweisen.The invention relates to a plate according to claim 1. Modern materials must today have a variety of required properties and often equal fulfill a whole series of requirements simultaneously. For many materials, such as those used in packaging technology, in building, equipment or mechanical engineering application, appropriate properties, such as stability, strength, flexural rigidity, mass and density, or thermal properties may be essential. Also, additional properties are often important, such as. B. a fire and fire resistance.
Furthermore, an increasing scarcity of raw materials sets additional restrictions with regard to the usable basic and starting materials. A recycling of already used materials and parts, as well as the possibility of re-use of newly produced materials and parts are increasingly desirable. So today already puffed cereal grains are common in packaging and insulation technology. Thus, the use of sustainably renewable raw materials with an inherent environmental friendliness of the materials produced from the raw materials is already combined. The invention relates to a generic plate or a molded part according to the preamble of the independent claim, which is known ( AU 2005200282 A1 ). Herein is disclosed a plate having a first and second on both sides glued on a layer of material cover layers. The material layer is provided with a material comprising granules of a granule formed as porous air or gas filled granules of a glass foam granule. In addition, fibers of a natural material, eg wool are provided on the surface of the coated grains. The material further comprises constituents, for example grains of a further granulate, wherein the coated granules of the granules are mixed with the granules of the further granules and bound together. This known plate may have a minimum density of 150 g / l.

Jedoch erzielen derartige, bekannte Werkstoffe, wie beispielsweise Holzersatzstoffe, oft nur eine unbefriedigende Festigkeit, Dichte, oder Schüttdichte, bzw. ein unbefriedigendes Verhältnis zwischen Schüttdichte und Festigkeit.
Es ist daher Aufgabe der vorliegenden Erfindung, einen verbesserten Werkstoff, einschliesslich verbessertem Schüttgut, eine verbesserte Platte bzw. Spanplatte, und ein verbessertes Formteil bereitzustellen.
Diese Aufgabe wird durch die Platte gemäß Anspruch1 gelöst. Weitere vorteilhafte Ausgestaltungen der Erfindung sind in den abhängigen Ansprüchen angegeben.However, such known materials, such as wood substitutes, often achieve only unsatisfactory strength, density, or bulk density, or an unsatisfactory relationship between bulk density and strength.
It is therefore an object of the present invention to provide an improved material, including improved bulk material, an improved plate or chipboard, and an improved molded part.
This task is done by the plate according to claim 1 solved. Further advantageous embodiments of the invention are specified in the dependent claims.

Gemäß einem Aspekt wird ein zur Bildung von Platten, Schichten und Formteilen geeigneter Werkstoff bereitgestellt, der Körner eines Granulats sowie ein an der Oberfläche der Körner des Granulats vorgesehenes Bindemittel umfasst. Dieser neue Werkstoff besitzt sehr gute Quellwerte insbesondere bei den daraus hergestellten Platten.According to one aspect, there is provided a suitable material for forming sheets, sheets and moldings, granules of a granule and a surface comprising granules of the granules. This new material has very good swelling values, in particular for the plates produced therefrom.

Nach der vorliegenden Erfindung wird die Festigkeit der mit dem Werkstoff hergestellten Platten verbessert, wenn zusätzlich Fasern vorgesehen sind, wobei das Bindemittel einen Teil der Fasern an die Oberfläche der Körner des Granulats bindet.
Dieser Werkstoff kann in vorteilhafter Weise eine verbesserte oder gewünschte Festigkeit aufweisen. Insbesondere kann der Werkstoff in vorteilhafter Weise leicht sein, d. h. gegenüber vergleichbaren Materialien leichter sein bzw. eine geringere Massendichte, definiert durch das Verhältnis von Masse zu Volumen, aufweisen. Daher kann der Werkstoff ein günstiges bzw. verbessertes Verhältnis zwischen Gewicht oder Dichte und der Festigkeit bereitstellen. Desweiteren kann durch eine Beschichtung der Körner mit den Fasern und/oder dem Bindemittel, die mechanische Festigkeit eines einzelnen Korns, und damit auch des Werkstoffes, verbessert werden. Dabei sind weiterhin die Körner des Granulats für die Dichte des Werkstoffes wesentlich bestimmend. Wesentlich in diesem Zusammenhang kann bedeuten, dass die Körner des Granulats mehr als 50 %, mehr als 75 % oder mehr als 90 % des Volumens des Werkstoffes bereitstellen. Ferner kann der Gewichtsanteil der Fasern und des Bindemittels gegenüber den Körnern des Granulats weniger als 50 %, weniger als 25 % oder weniger als 10 % betragen.According to the present invention, the strength of the plates made with the material is improved when fibers are additionally provided, the binder binding a portion of the fibers to the surface of the granules of the granules.
This material may advantageously have an improved or desired strength. In particular, the material may be light in an advantageous manner, ie lighter than comparable materials or have a lower mass density, defined by the ratio of mass to volume. Therefore, the material can provide a favorable relationship between weight or density and strength. Furthermore, by coating the grains with the fibers and / or the binder, the mechanical strength of a single grain, and thus also of the material, can be improved. In addition, the granules of the granules for the density of the material are significantly determining. Significantly in this context may mean that the granules provide more than 50%, more than 75% or more than 90% of the volume of the material. Furthermore, the weight fraction of the fibers and binder relative to the grains of the granules may be less than 50%, less than 25% or less than 10%.

Nach der Ausführungsform der vorliegenden Erfindung weist ein Korn des Granulats einen porösen Grundstoff auf, wobei die Poren mit Luft oder mit einem Gas gefüllt sind. Beispiele für entsprechende Körner sind hierfür aufgepuffte Körner eines Getreides, wie z. B. Mais, Weizen, Hafer, oder Amaranth; Poppkorn; Körner aus einem aufgeschäumten Kunststoff, aus einem expandierten Kunststoff, aus einem extrudierten Kunststoff oder aus einem flexiblen Stoff; Körner eines Schaumstoffs; Styropor-, Styrodur-, oder Styrofoam-Körner; Körner eines gepufften Extrudats, Körner bzw. Partikel eines zerkleinerten Teppichs, oder anderer, wiederverwertbarer oder recycelter Materialien, wie Verpackungsmaterial, Textilien oder dergleichen. Als Grundstoff können Naturstoffe oder Kunststoffe zum Einsatz kommen, wie z. B. Latex, Kautschuk, Gummi, organisches Material, Getreidematerial, Polystyrol (PS), Polyvinylchlorid (PVC) oder Polyurethan (PU). Als Gase kommen Luft, Stickstoff, Kohlendioxid, halogenierte Kohlenwasserstoffe und dergleichen zum Einsatz. Ferner sind auch aufgeschäumte Metalle, wie bespielsweise Körner aus Aluminiumschaum, einsetzbar. Körner im Sinne der vorliegenden Erfindung können also Partikel, Schnitzel, Späne oder Teile eines zerkleinerten Materials sein. Als Grundstoff kommen erfindungsgemäß Naturstoffe zum Einsatz.According to the embodiment of the present invention, a grain of the granules on a porous base material, wherein the pores are filled with air or with a gas. Examples of corresponding grains for this purpose are popped grains of a cereal, such as. Corn, wheat, oats, or amaranth; Popp grain; Granules of a foamed plastic, of an expanded plastic, of an extruded plastic or of a flexible material; Grains of a foam; Styrofoam, Styrodur, or Styrofoam grains; Grains of a puffed extrudate, granules of crushed carpet, or other recyclable or recycled materials such as packaging material, textiles or the like. As a raw material natural products or plastics can be used, such. Example, latex, rubber, rubber, organic material, cereal material, polystyrene (PS), polyvinyl chloride (PVC) or polyurethane (PU). The gases used are air, nitrogen, carbon dioxide, halogenated hydrocarbons and the like. Furthermore, foamed metals, such as grains of aluminum foam, can be used. Grains for the purposes of the present invention may thus be particles, chips, chips or parts of a comminuted material. The basic material used according to the invention are natural substances.

In vorteilhafter Weise können daher bereits benutzte bzw. recycelte, unter Umständen auch sonst nicht anderweitig verwertbare, Materialien als Grundstoffe für einen Werkstoff gemäß einer Ausführungsform der Erfindung zum Einsatz kommen. Ferner kann in einer weiteren vorteilhaften Weise die Verwendung nachwachsender, umweltfreundlicher und umweltverträglicher Grundstoffe ermöglicht werden. Des Weiteren können aber auch, unabhängig von den genannten Stoffen, Grundstoffe verwendet werden, deren Eigenschaften speziell für den Werkstoff ausgewählt bzw. angepasst sind. Ein weiterer Vorteil kann in einer kostengünstigen Herstellung des Werkstoffes liegen.Advantageously, therefore, materials already used or recycled, and possibly also otherwise not otherwise usable, can be used as raw materials for a material according to an embodiment of the invention. Furthermore, the use of renewable, environmentally friendly and environmentally compatible raw materials can be made possible in a further advantageous manner. Furthermore, but also, regardless of the substances whose basic properties are selected or adapted specifically for the material. Another advantage may lie in a cost-effective production of the material.

In der vorliegenden Ausführungsform liegt eine mittlere Dichte der Körner unterhalb von 0,1 kg/l. Diese mittlere Dichte, wobei die Dichte über eine repräsentative Vielzahl von Körner gemittelt wird, kann der Dichte von Styropor, Poppkorn entsprechen und niedriger sein als die mittlere Dichte von Massivholz, wie z. B. Fichtenholz, Pressspanplatten oder Platten aus mitteldichter Faser (MDF). In vorteilhafter Weise kann daher ein Werkstoff erzielt werden, dessen Dichte in einem Bereich einer Dichte von Leichtmaterialien liegt. Des Weiteren kann ein mittlerer Durchmesser einer Korngröße der Körner gemäß einer weiteren Ausführungsform in einem Bereich von 0,5 mm bis 5 mm, in einem Bereich von 1 mm bis 10 mm, oder auch über 10 mm liegen. Eine Kornform kann dabei möglichen oder üblichen Formen entsprechen, wie z. B. einer Kugelform, einer Ellipsoidform, Granulatformen, Schnitzelformen, Spanformen, Blasen- oder Tropfenformen, oder einer anderen, unter Umständen auch unregelmäßig geformten, Form.
Des Weiteren kann nach einer Ausführungsform der Erfindung ein mittlerer Durchmesser der Fasern in einem Bereich von 10 µm bis 100 µm, in einem Bereich von 100 µm bis 500 µm, oder über 500 µm liegen. Ferner kann eine mittlere Länge der Fasern gemäß einer weiteren Ausführungsform in einem Bereich von 100 µm bis 1 mm, in einem Bereich von 1 mm bis 10 mm, oder auch über 10 mm liegen. Beispiele für einsetzbare Fasern umfassen Holzfasern, Stapelfasern, mitteldichte Fasern, Fasern nachwachsender Rohstoffe, Naturfasern, Hanf, Flachs, Stroh, Textilfasern, Glasfasern, Metalldrähte oder Metallspäne, Kunststofffasern, und dergleichen.In the present embodiment, an average density of the grains is below 0.1 kg / l. This average density, where the density is averaged over a representative plurality of grains, may correspond to the density of Styrofoam, Poppkorn, and may be lower than the average density of solid wood, e.g. Spruce, chipboard or medium density fibreboard (MDF). Advantageously, therefore, a material can be obtained whose density is in a range of a density of light materials. Further, a mean diameter of a grain size of the grains according to another embodiment may be in a range of 0.5 mm to 5 mm, in a range of 1 mm to 10 mm, or even more than 10 mm. A grain shape can correspond to possible or conventional forms such. As a spherical shape, an ellipsoidal shape, granule shapes, Schnitzelformen, chip shapes, blister or teardrop shapes, or other, possibly also irregularly shaped, shape.
Furthermore, according to one embodiment of the invention, a mean diameter of the fibers may be in a range of 10 μm to 100 μm , in a range of 100 μm to 500 μm , or more than 500 μm . Furthermore, according to a further embodiment, an average length of the fibers may be in a range of 100 μm to 1 mm, in a range of 1 mm to 10 mm, or even over 10 mm. examples for Applicable fibers include wood fibers, staple fibers, medium density fibers, fibers of renewable resources, natural fibers, hemp, flax, straw, textile fibers, glass fibers, metal wires or metal shavings, plastic fibers, and the like.

Gemäß der vorliegenden Erfindung umfasst das Bindemittel einen ausgehärteten Klebstoff, einen teilweise ausgehärteten Klebstoff oder einen aushärtbaren Klebstoff. Eine Aushärtung bzw. eine teilweise Aushärtung des Klebstoffes kann dabei durch ein Verdampfen bzw. ein teilweises Verdampfen eines Lösungsmittels, eine Wärmebehandlung oder eine Polymerisierung erfolgen. Hierzu kann dem Bindemittel ein Härter beigemischt sein. Ferner kann eine umfassende Aushärtung durch spezielle Lagerung bzw. Handhabung, wie z. B. einer gekühlten Lagerung, zunächst noch unterdrückt sein. Somit können in vorteilhafter Weise die Fasern bereits fest bzw. abschließend fest an die Oberfläche der Körner gebunden sein, während eine weitere Verarbeitung, eine Umformung des Werkstoffes oder eine Bindung der Körner aneinander noch möglich ist.
Als Beispiele für Bindemittel seien in diesem Zusammenhang Duroplaste, Harnstoff-Formaldehyd (Urea-Formaldehyde, UF), Melamin-Formaldehyd (MF), Phenol-Formaldehyd (PF), Isocyanat, Diphenylmethandiisocyanat, Epoxydharz, Acrylharz, Dispersionsleime, Leime, Klebstoffe, Stärke, Proteine, Polymere und dergleichen genannt.According to the present invention, the binder comprises a cured adhesive, a partially cured adhesive or a curable adhesive. Curing or partial curing of the adhesive can be carried out by evaporation or partial evaporation of a solvent, a heat treatment or a polymerization. For this purpose, the binder may be mixed with a hardener. Furthermore, a comprehensive curing by special storage or handling such. As a cooled storage, initially be suppressed. Thus, in an advantageous manner, the fibers can already be firmly or finally firmly bonded to the surface of the grains, while further processing, reshaping of the material or bonding of the grains to each other is still possible.
Examples of binders in this context are thermosets, urea-formaldehyde (urea-formaldehyde, UF), melamine-formaldehyde (MF), phenol-formaldehyde (PF), isocyanate, diphenylmethane diisocyanate, epoxy resin, acrylic resin, dispersion glues, glues, adhesives, starch , Proteins, polymers and the like.

Gemäß der vorliegenden Erfindung umfasst der Werkstoff Bestandteile, z.B. Körner eines weiteren Granulats, wobei die Körner des Granulats mit den Körnern des weiteren Granulats vermischt sein können. Ferner kann das Mischungsverhältnis der Körner des Granulats zu den Körnern des weiteren Granulats innerhalb des Werkstoffes oder einer daraus gefertigten Einheit variieren, um beispielsweise die mechanischen Eigenschaften in vorteilhafter Weise zu beeinflussen oder zu bestimmen. Ferner können durch Zusetzung von Körnern des weiteren Granulats die mechanischen, chemischen oder physikalischen Eigenschaften des Werkstoffs in vorteilhafter Weise unabhängig von den Eigenschaften dessen Granulats, der Fasern oder des Bindemittels verändert oder angepasst werden.
Beispielsweise kann die Festigkeit weiter erhöht, das Gewicht weiter verringert oder auch eine Brandfestigkeit, zum Beispiel durch ein Zumischen von Flammhemmern, erhöht werden. Ferner ist auch eine Erhöhung des Gewichts bzw. der Dichte des Werkstoffs durch Zumischung von einem entsprechend schweren weiteren Granulat möglich, soweit erforderlich und/oder vorteilhaft. Beispiele für ein weiteres Granulat umfassen Holzspäne, -fasern, Partikel, Körner von bestimmten aktiven chemischen Substanzen, wie beispielsweise Flammhemmer oder hydrophobe oder hydrophile Stoffe, Gesteins- oder Metallpartikel, Natur- oder Kunstoffkörner oder dergleichen. Auch kann der Werkstoff noch einmal die Fasern umfassen, mit denen die Körner des Ausgangs-Granulats beschichtet sind, d. h. die Fasern sind dem Werkstoff noch einmal zusätzlich, unabhängig von der Bindung an eine Oberfläche eines Korns des Granulats, im Sinne eines weiteren Granulats beigefügt.According to the present invention, the material comprises constituents, for example granules of a further granulate, wherein the granules of the granules with the grains of the further granules can be mixed. Furthermore, the mixing ratio of the grains of the granules to the grains of the further granules may vary within the material or a unit made therefrom, for example in order to advantageously influence or determine the mechanical properties. Furthermore, by adding granules of the further granules, the mechanical, chemical or physical properties of the material can advantageously be changed or adjusted independently of the properties of the granules, of the fibers or of the binder.
For example, the strength can be further increased, the weight can be further reduced, or else a fire resistance can be increased, for example by mixing in flame retardants. Furthermore, it is also possible to increase the weight or the density of the material by adding a correspondingly heavy further granulate, if necessary and / or advantageous. Examples of other granules include wood chips, fibers, particles, grains of certain active chemical substances such as flame retardants or hydrophobic or hydrophilic substances, rock or metal particles, natural or synthetic grains or the like. Also, the material may once again comprise the fibers with which the grains of the starting granules are coated, ie the fibers are added to the material once again, regardless of the bond to a surface of a grain of the granules, in the sense of another granule.

Gemäß der vorliegenden Erfindung umfasst der Werkstoff ein weiteres Bindemittel, wobei das weitere Bindemittel die beschichteten Körner des Granulats und/oder die Körner des weiteren Granulats aneinander bindet. Das weitere Bindemittel kann dabei dem Bindemittel entsprechen, das die Fasern an die Körner bindet, sodass in vorteilhafter Weise nur ein Bindemittel zum Einsatz kommen.According to the present invention, the material comprises a further binder, wherein the further binder the coated granules of the granules and / or the grains of the further granules binds to each other. The further binder may correspond to the binder which binds the fibers to the grains, so that advantageously only one binder is used.

Die Erfindung stellt eine Platte gemäß Anspruch 1 bereit. Dabei sind die Körner des Granulats bzw. der Granulate aneinander gebunden, sodass sie einen festen, zusammenhängenden und stabilen Werkstoff bilden. Eine entsprechende Platte kann gemäß einer Ausführungsform eine Dämmplatte oder eine Bauplatte im Gebäude- oder Gerätebau darstellen.The invention provides a plate according to claim 1 ready. The grains of granules or granules are bound together, so that they form a solid, coherent and stable material. A corresponding plate can represent an insulation board or a building board in building or equipment construction according to one embodiment.

Gemäß einem weiteren Gesichtspunkt der Erfindung ist eine Spanplatte vorgesehen, die eine erste Spanplattenschicht, eine zweite Spanplattenschicht und eine Werkstoff-Schicht umfasst. Die Werkstoff-Schicht ist zwischen der ersten Spanplattenschicht und der zweiten Spanplattenschicht angeordnet. Eine dem gemäße Spanplatte kann in vorteilhafter Weise die Festigkeit der Platte erhöhen, wobei gleichzeitig das Gewicht und/oder die Plattenstärke gegenüber einer Spanplatte mit vergleichbarer Festigkeit in vorteilhafter Weise reduziert werden kann.According to a further aspect of the invention, a chipboard is provided which comprises a first chipboard layer, a second chipboard layer and a material layer. The material layer is arranged between the first chipboard layer and the second chipboard layer. A chipboard according to the invention can advantageously increase the strength of the board, wherein at the same time the weight and / or the board thickness can be advantageously reduced in comparison to a chip board with comparable strength.

Ausführungsformen der vorliegenden Erfindung werden nachfolgend anhand der beigefügten Zeichnungen näher erläutert. Es zeigen:
Die Figuren 1A und 1B zeigen schematische Darstellungen eines Werkstoffes gemäß nicht beanspruchten Ausführungsformen Figur 1C zeigt eine schematische Darstellung eines Werkstoffes der Platte gemäß der vorliegenden Erfindung, und die Figuren 2A bis 2C schematische Darstellungen von Platten und Schichten gemäß Ausführungsformen der vorliegenden Erfindung.
Die Figur 1A zeigt eine schematische Darstellung eines Schüttguts. Dem gemäß umfasst ein Schüttgut 100 beschichtete Körner 31. Die Körner 31 umfassen dabei Körner 30 eines Granulats, die auf ihrer Oberfläche, zumindest teilweise, mit Fasern 10 und einem Bindemittel 20 beschichtet sind. Die einzelnen Körner 31 können dabei sowohl in Form als auch in Größe variieren, und sind gemäß dieser Ausführungsform nicht aneinander gebunden, sodass das Schüttgut 100, auch bei Berührung der Körner 31 untereinander, frei verformbar bzw. umformbar ist bzw. verbleibt.
Die Figur 1B zeigt eine schematische, allgemeine Darstellung eines Werkstoffes. Dem gemäß umfasst ein Werkstoff 110 die beschichteten Körner 31, die untereinander mit einem weiteren Bindemittel 21 aneinander gebunden sind. Dieses weitere Bindemittel 21 kann dabei dem Bindemittel 20 entsprechen, wie es im Zusammenhang mit der Fig. 1A beschrieben wurde und dem gemäß die Fasern 10 an die Oberfläche eines Korns 30 bindet.
Die Figur 1C zeigt eine schematische, allgemeine Darstellung eines Werkstoffes gemäß der vorliegenden Erfindung. Dem gemäß umfasst ein Werkstoff 120 die beschichteten Körner 31, sowie Körner 32 eines weiteren Granulats und weitere Fasern 11, die untereinander mit dem weiteren Bindemittel 21 aneinander gebunden sind. Obwohl diese Darstellung sowohl die Körner 32 des weiteren Granulats als auch weiteren Fasern 11 zeigt, sind auch vorteilhafte Werkstoffe möglich, bei denen entweder die Körner 32 des weiteren Granulats oder die weiteren Fasern 11 fehlen.
Die Figur 2A zeigt eine schematische Darstellung einer Platte gemäß einer Ausführungsform. Dem gemäß umfasst eine Platte 130 einen Werkstoff mit den beschichteten Körnern 31 und dem weiteren Bindemittel 21. Die Platte 130 kann in Form einer Einschichtplatte vorliegen, sodass sie z. B. in kostengünstiger Weise im Geräte-, Maschinen- oder Gebäudebau Anwendung Verwendung finden kann, so etwa als Dämmplatte oder tragende Platte. Möglich sind aber auch Mehrschichtplatten oder eine beschichtete Platte 130, um weitere gewünschte oder vorteilhafte Eigenschaften bereitzustellen.
Die Figur 2B zeigt eine schematische Darstellung einer Dämmplatte gemäß einer weiteren Ausführungsform. Dem gemäß weist eine Dämmplatte 140 einem Werkstoff mit den beschichteten Körnern 31 und dem weiteren Bindemittel 21 gemäß der oben genannten Ausführungsform und ist aus diesem Werkstoff gefertigt. Die Dämmplatte 140 weist ferner Noppen 141 auf, die in vorteilhafter Weise eine Oberfläche der Dämmplatte 140 erhöhen und/oder Schall, Vibrationen, Stöße oder auch Wärme absorbieren, abfangen bzw. dämmen.
Die Figur 2C zeigt ferner eine schematische Darstellung einer Spanplatte gemäß der Ausführungsform der vorliegenden Erfindung. Dem gemäß umfasst eine Spanplatte 150 eine erste Spanplattenschicht 151 und eine zweite Spanplattenschicht 152, zwischen denen eine Werkstoff-Schicht 153 angeordnet ist, die einen Werkstoff gemäß einer Ausführungsform der Platte der Erfindung aufweist.
Die Werkstoff-Schicht 153 kann in vorteilhafter Weise die mechanischen, physikalischen oder auch sonstigen Eigenschaften gegenüber einer normalen Spanplatte verbessern, wobei eine normale Spanplatte ohne einer Werkstoff-Schicht 153 oder einem Werkstoff-Einschluss vorgesehen wäre. Durch die Anordnung der Werkstoff-Schicht 153 zwischen den Spanplattenschichten 151, 152 kann gemäß dieser Ausführungsform ferner ein optischer Eindruck einer Span-, Holz- oder Furnierplatte gewahrt bleiben, auch wenn zwar vorteilhafte Eigenschaften des Werkstoffes erwünscht, aber z. B. die optischen Eigenschaften und/oder dessen ästhetischer Eindruck der Werkstoff-Schicht 153 nicht erwünscht sind.
Beispiel allgemein: Für die Herstellung aller Spanplatten wurden industriell aufbereitete Späne als Körner des weiteren Granulats mit verwendet, soweit die mittlere Schicht betroffen ist. Die Späne wurden nach der Trocknung und unmittelbar vor der Beleimung von der Bandwaage entnommen. Das Material setzt sich aus verschiedenen Rohstoffsortimenten zusammen und ist prozessbedingt in Deck- und Mittelschichtfraktion unterteilt.
Beispiel 1: Herstellung von UF-Harz gebundenen, dreischichtigen Spanplatten mit geringer Rohdichte und mit 33% reinen Maisextrudat als die Körner des Granulats nach dem unabhängigen Anspruch 1 in der Mittelschicht (Mittelschichtspäne).Embodiments of the present invention will be explained below with reference to the accompanying drawings. Show it:
The Figures 1A and 1B show schematic representations of a material according to non-claimed embodiments Figure 1C shows a schematic representation of a material of the plate according to the present invention, and the FIGS. 2A to 2C schematic representations of plates and layers according to embodiments of the present invention.
The Figure 1A shows a schematic representation of a bulk material. Accordingly, a bulk material 100 comprises coated grains 31. The grains 31 comprise grains 30 of granules which are coated on their surface, at least partially, with fibers 10 and a binder 20. The individual grains 31 may vary both in shape and in size, and are not bound together according to this embodiment, so that the bulk material 100, even when touching the grains 31 with each other, is freely deformable or deformable or remains.
The FIG. 1B shows a schematic, general representation of a material. Accordingly, a material 110 comprises the coated grains 31, which are bonded together with another binder 21 to each other. This further binder 21 may correspond to the binder 20, as it is in connection with the Fig. 1A has been described and according to the fibers 10 binds to the surface of a grain 30.
The Figure 1C shows a schematic, general representation of a material according to the present invention. Accordingly, a material 120 comprises the coated grains 31, as well as grains 32 of a further granulate and further fibers 11, which are bonded to each other with the further binder 21 to each other. Although these Presentation shows both the grains 32 of the other granules and other fibers 11, also advantageous materials are possible in which either the grains 32 of the other granules or the other fibers 11 are missing.
The FIG. 2A shows a schematic representation of a plate according to an embodiment. Accordingly, a plate 130 comprises a material with the coated grains 31 and the further binder 21. The plate 130 may be in the form of a single-layer plate, so that they z. B. can be used in a cost effective manner in equipment, machinery or building application, such as insulation board or load-bearing plate. However, multilayer plates or a coated plate 130 are also possible in order to provide further desired or advantageous properties.
The FIG. 2B shows a schematic representation of an insulation board according to another embodiment. Accordingly, an insulating board 140 comprises a material having the coated grains 31 and the further binder 21 according to the above-mentioned embodiment, and is made of this material. The insulation board 140 also has knobs 141, which advantageously increase a surface of the insulation board 140 and / or absorb sound, vibrations, shocks or even heat, intercept or dam.
The Figure 2C further shows a schematic representation of a chipboard according to the Embodiment of the present invention. Accordingly, a chipboard 150 comprises a first chipboard layer 151 and a second chipboard layer 152, between which is disposed a material layer 153 comprising a material according to an embodiment of the plate of the invention.
The material layer 153 can advantageously improve the mechanical, physical or other properties compared to a normal particle board, wherein a normal chipboard without a material layer 153 or a material inclusion would be provided. By the arrangement of the material layer 153 between the chipboard layers 151, 152 can according to this embodiment also preserve an optical impression of a chip, wood or veneer plate, although although advantageous properties of the material desired, but z. B. the optical properties and / or its aesthetic impression of the material layer 153 are not desirable.
Example in general: For the production of all chipboard, industrially processed chips were used as grains of the additional granules, as far as the middle layer is concerned. The chips were removed from the belt scale after drying and immediately before gluing. The material is composed of various raw material assortments and is subdivided into cover and middle layer fractions due to the process.
Example 1: Production of UF resin bound, three-layer chipboards with low bulk density and with 33% pure Maisextrudat than the Granules of the granules according to independent claim 1 in the middle layer (middle layer chips).

Aus dem industriell hergestelltem Spangut und dem reinen Maisextrudat wurden 20 mm dicke dreischichtige Spanplatten mit einer Rohdichte von 500 kg/m3 mit einer industriell standardisierten Bindemittelzusammensetzung als weiteres Bindemittel hergestellt. Den Mittelschichtspänen wurden hierbei 33% reines Maisextrudat beigemischt.From the industrially produced Spangut and the pure Maisextrudat 20 mm thick three-layer chipboard with a density of 500 kg / m 3 were prepared with an industrially standardized binder composition as another binder. The middle layer shavings were admixed with 33% pure maize trudate.

Für die Deck- und Mittelschichtspäne wurde eine wässrige Lösung eines Harnstoff-Formaldehyd-Kondensationsproduktes der Marke Dynea Prefere 10F102 mit einem Feststoffgehalt von ca. 68% verwendet. Als Härtungsbeschleuniger wurde eine 33%ige wässrige Ammoniumsulfat-Lösung verwendet. Als Hydrophobierungsmittel kam eine Emulsion auf Paraffinbasis der Marke "HYDRAWAX 138" der Firma SASOL GmbH mit einem Feststoffgehalt von ca. 50% zum Einsatz. Die Leimflotte der Mittelschicht als weiteres Bindemittel bestand dabei aus 8 % UF-Festharz bezogen auf atro Span, 2 % Ammonioumsulfat-Lösung (Härter) bezogen auf atro Festharz und 1% Hydrophobierungsmittel bezogen auf atro Span.For the cover and middle layer chips an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 with a solids content of about 68% was used. As a curing accelerator, a 33% aqueous ammonium sulfate solution was used. The hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%. The glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.

Die Leimflotte der Deckschicht bestand aus 11 % UF-Festharz bezogen auf atro Span, 0,5 % Ammoniumsulfatlösung auf atro Festharz und 1 % Hydrophobierungsmittel bezogen auf atro Span. Der Spankuchen wurde bei 195°C für 6 s/mm und einem spezifischen Druck von 2,5 N/mm2 verpresst.The glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip. The chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .

Beispiel 2: Herstellung von UF-Harz gebundenen, dreischichtigen Spanplatten mit geringer Rohdichte und mit 33% faserverstärkten Maisextrudat als die Körner des Granulats nach dem unabhängigen Anspruch 1 und den Fasern an deren Oberfläche in der Mittelschicht (Mittelschichtspäne).
Aus industriell hergestelltem Spangut und Maisextrudat, welches mit den an seiner Oberfläche gebundenen Fasern verstärkt ist, wurden 20 mm dicke dreischichtige Spanplatten mit einer Rohdichte von 500 kg/m3 mit einer industriell standardisierten Bindemittelzusammensetzung hergestellt.
Den Mittelschichtspänen wurden hierbei 33% des faserverstärkten Extrudats beigemischt. Hierzu wurde das Extrudat mit 10% Faser Typ C120 der Fa Rettenmeier umhüllt. Die Fixierung der Faser an der Extrudatoberfläche erfolgte dabei durch die Klebewirkung der Stärke aus dem Mais als Bindemittel.
Für die Deck- und Mittelschichtspäne wurde eine wässrige Lösung eines Harnstoff-Formaldehyd-Kondensationsproduktes der Marke Dynea Prefere 10F102 mit einem Feststoffgehalt von ca. 68% verwendet. Als Härtungsbeschleuniger wurde eine 33%ige wässrige Ammoniumsulfat-Lösung verwendet. Als Hydrophobierungsmittel kam eine Emulsion auf Paraffinbasis der Marke "HYDRAWAX 138" der Firma SASOL GmbH mit einem Feststoffgehalt von ca. 50% zum Einsatz. Die Leimflotte der Mittelschicht als weiteres Bindemittel bestand dabei aus 8 % UF-Festharz bezogen auf atro Span, 2 % Ammonioumsulfat-Lösung (Härter) bezogen auf atro Festharz und 1% Hydrophobierungsmittel bezogen auf atro Span.Example 2: Production of UF resin bonded, three-layer chipboard with less Bulk density and 33% fiber-reinforced maize trudate as the granules of the granules according to independent claim 1 and the fibers on their surface in the middle layer (middle layer chips).
From industrially produced spun and Maisextrudat, which is reinforced with the fibers bonded to its surface, 20 mm thick three-layer chipboard with a density of 500 kg / m 3 were prepared with an industrially standardized binder composition.
The middle layer chips were admixed with 33% of the fiber-reinforced extrudate. For this purpose, the extrudate was coated with 10% fiber type C120 from Rettenmeier. The fixation of the fiber on the extrudate surface was carried out by the adhesive effect of starch from the corn as a binder.
For the cover and middle layer chips an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 with a solids content of about 68% was used. As a curing accelerator, a 33% aqueous ammonium sulfate solution was used. The hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%. The glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.

Die Leimflotte der Deckschicht bestand aus 11 % UF-Festharz bezogen auf atro Span, 0,5 % Ammoniumsulfatlösung auf atro Festharz und 1 % Hydrophobierungsmittel bezogen auf atro Span. Der Spankuchen wurde bei 195°C für 6 s/mm und einem spezifischen Druck von 2,5 N/mm2 verpresst.The glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip. The chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .

Beispiel 3: Herstellung von UF-Harz gebundenen, dreischichtigen Spanplatten mit geringer Rohdichte und mit 33% mit Acrylat (als Bindemittel) verstärktem Maisextrudat als die Körner des Granulats nach dem unabhängigen Anspruch 1 in der Mittelschicht (Mittelschichtspäne).Example 3: Preparation of low bulk density three-layer chipboard bound UF resin and 33% acrylate (as binder) reinforced maize trudate as the granules of the granule of independent claim 1 in the middle layer (middle layer chips).

Aus industriell hergestelltem Spangut und dem Maisextrudat, welches mit Acrylat als dem Bindemittel verstärkt ist, wurden 20 mm dicke dreischichtige Spanplatten mit einer Rohdichte von 500 kg/m3 mit einer industriell standardisierten Bindemittelzusammensetzung hergestellt.From industrially produced spangenut and the maize trudate reinforced with acrylate as the binder, 20 mm thick three-layer chipboards having a bulk density of 500 kg / m 3 were prepared with an industrially standardized binder composition.

Den Mittelschichtspänen als weiteres Granulat wurde 33% mit Acrylat als Bindemittel verstärktes Extrudat als Granulat eigemischt. Hierzu wurde das Extrudat mit 12,5% Prozent einer 50prozentigen Acrylatdispersion Typ BV 595 der Fa Polymer Latex beleimt und bei 60°C im Warmluftstrom getrocknet.The middle layer shavings as further granules were admixed with 33% acrylate as binder reinforced extrudate as granules. For this purpose, the extrudate was glued with 12.5% percent of a 50 percent acrylate dispersion type BV 595 of the polymer latex polymer and dried at 60 ° C in a stream of hot air.

Als Bindemittel für die Deck- und Mittelschichtspäne wurde eine wässrige Lösung eines Harnstoff-Formaldehyd-Kondensationsproduktes der Marke Dynea Prefere 10F102 mit einem Feststoffgehalt von ca. 68% verwendet. Als Härtungsbeschleuniger wurde eine 33%ige wässrige Ammoniumsulfatlösung verwendet. Als Hydrophobierungsmittel kam eine Emulsion auf Paraffinbasis der Marke "HYDRAWAX 138" der Firma SASOL GmbH mit einem Feststoffgehalt von ca. 50% zum Einsatz. Die Leimflotte der Mittelschicht als weiteres Bindemittel bestand dabei aus 8 % UF-Festharz bezogen auf atro Span, 2 % Ammonioumsulfatlösung (Härter) bezogen auf atro Festharz und 1% Hydrophobierungsmittel bezogen auf atro Span.As a binder for the top and middle layer chips an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%. As a curing accelerator, a 33% ammonium sulfate aqueous solution was used. As a water repellent came a Paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50% is used. The glue liquor of the middle layer as a further binder consisted of 8% UF solid resin based on dry chip, 2% Ammonioumsulfatlösung (hardener) based on dry solid resin and 1% water repellents based on atro chip.

Die Leimflotte der Deckschicht bestand aus 11 % UF-Festharz bezogen auf atro Span, 0,5 % Ammoniumsulfatlösung auf atro Festharz und 1 % Hydrophobierungsmittel bezogen auf atro Span. Der Spankuchen wurde bei 195°C für 6 s/mm und einem spezifischen Druck von 2,5 N/mm2 verpresst.The glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip. The chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .

Beispiel 4: Herstellung von UF-Harz gebundenen, dreischichtigen Spanplatten mit geringer Rohdichte und mit 33% mit Acrylat als Bindemittel verstärkten Maisextrudat als Körner des Granulats nach dem unabhängigen Anspruch 1 und Fasern an deren Oberfläche in der Mittelschicht (Mittelschichtspäne).Example 4: Production of UF resin bonded, three-layer chipboard with low bulk density and 33% with acrylate as a binder reinforced Maisextrudat grains of the granules according to independent claim 1 and fibers on the surface in the middle layer (middle layer chips).

Aus industriell hergestelltem Spangut und dem Maisextrudat, welches mit Faser- und Acrylat verstärkt ist, wurden 20 mm dicke dreischichtige Spanplatten mit einer Rohdichte von 500 kg/m3 mit einer industriell standardisierten Bindemittelzusammensetzung hergestellt. Den Mittelschichtspänen wurde 33% Faser- und Acrylat verstärktes Extrudat beigemischt.From industrially produced spangenut and the maize trudate, which is reinforced with fiber and acrylate, 20 mm thick three-layer chipboards were produced with a density of 500 kg / m 3 with an industrially standardized binder composition. The middle layer chips were mixed with 33% fiber- and acrylate-reinforced extrudate.

Hierzu wurde das Extrudat mit 12,5 Prozent einer 50%igen Acrylatdispersion Typ BV 595 der Fa Polymer Latex beleimt, mit 10% Faser Typ C120 der Fa Rettenmeier umhüllt und anschließend bei 60°C im Warmluftstrom getrocknet.For this purpose, the extrudate was glued with 12.5 percent of a 50% acrylate dispersion type BV 595 of the polymer latex, coated with 10% fiber type C120 Fa Rettenmeier and then at 60 ° C in Warm air stream dried.

Als Bindemittel für die Deck- und Mittelschichtspäne wurde eine wässrige Lösung eines Harnstoff-Formaldehyd-Kondensationsproduktes der Marke Dynea Prefere 10F102 mit einem Feststoffgehalt von ca. 68% verwendet. Als Härtungsbeschleuniger wurde eine 33prozentige wässrige Ammoniumsulfat-Lösung verwendet. Als Hydrophobierungsmittel kam eine Emulsion auf Paraffinbasis der Marke "HYDRAWAX 138" der Firma SASOL GmbH mit einem Feststoffgehalt von ca. 50% zum Einsatz. Die Leimflotte der Mittelschicht als weiteres Bindemittel bestand dabei aus 8 % UF-Festharz bezogen auf atro Span, 2 % Ammonioumsulfat-Lösung (Härter) bezogen auf atro Festharz und 1% Hydrophobierungsmittel bezogen auf atro Span.As a binder for the top and middle layer chips an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%. As a curing accelerator, a 33% aqueous ammonium sulfate solution was used. The hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%. The glue liquor of the middle layer as a further binder consisted of 8% UF solid resin, based on dry chip, 2% ammonium sulfate solution (hardener) based on dry solid resin and 1% water repellent based on atro chip.

Die Leimflotte der Deckschicht bestand aus 11 % UF-Festharz bezogen auf atro Span, 0,5 % Ammoniumsulfatlösung auf atro Festharz und 1 % Hydrophobierungsmittel bezogen auf atro Span. Der Spankuchen wurde bei 195°C für 6 s/mm und einem spezifischen Druck von 2,5 N/mm2 verpresst.The glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip. The chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .

Beispiel 5: Herstellung von UF-Harz gebundenen, dreischichtigen Spanplatten mit geringer Rohdichte und mit 33% Acrylat als Bindemittel verstärktes Maisextrudat als Körner des Granulats mit Fasern an deren Oberfläche in der Mittelschicht (Mittelschichtspäne).Example 5: Production of UF resin bonded, three-layer chipboard with low bulk density and 33% acrylate reinforced as a binder Maisextrudat grains of the granules with fibers on the surface in the middle layer (middle layer chips).

Aus industriell hergestelltem Spangut und Maisextrudat, welches mit Faser- und Acrylat verstärkt ist, wurden 20 mm dicke dreischichtige Spanplatten mit einer Rohdichte von 500 kg/m3 mit einer industriell standardisierten Bindemittelzusammensetzung hergestellt. Den Mittelschichtspänen wurde 33% Faser- und Acrylat verstärktes Extrudat beigemischt.From industrially produced Spangut and Maisextrudat, which is reinforced with fiber and acrylate, were 20 mm thick three-layered Particleboard with a density of 500 kg / m 3 made with an industrially standardized binder composition. The middle layer chips were mixed with 33% fiber- and acrylate-reinforced extrudate.

Hierzu wurde das Extrudat mit 12,5 Prozent einer 50prozentigen Acrylatdispersion Typ DV 455 der Fa Polymer Latex beleimt, mit 10% Faser Typ C120 der Fa Rettenmeier umhüllt und anschließend bei 60°C im Warmluftstrom getrocknet.For this purpose, the extrudate was glued with 12.5 percent of a 50 percent acrylate dispersion type DV 455 of the polymer latex polymer coated with 10% fiber type C120 Fa Rettenmeier and then dried at 60 ° C in a stream of hot air.

Als Bindemittel für die Deck- und Mittelschichtspäne wurde eine wässrige Lösung eines Harnstoff-Formaldehyd-Kondensationsproduktes der Marke Dynea Prefere 10F102 mit einem Feststoffgehalt von ca. 68% verwendet. Als Härtungsbeschleuniger wurde eine 33prozentige wässrige Ammoniumsulfatlösung verwendet. Als Hydrophobierungsmittel kam eine Emulsion auf Paraffinbasis der Marke "HYDRAWAX 138" der Firma SASOL GmbH mit einem Feststoffgehalt von ca. 50% zum Einsatz. Die Leimflotte der Mittelschicht als weiteres Bindemittel bestand dabei aus 8 % UF-Festharz bezogen auf atro Span, 2 % Ammonioumsulfatlösung (Härter) bezogen auf atro Festharz und 1% Hydrophobierungsmittel bezogen auf atro Span.As a binder for the top and middle layer chips an aqueous solution of a urea-formaldehyde condensation product of the brand Dynea Prefere 10F102 was used with a solids content of about 68%. As a curing accelerator, a 33% ammonium sulfate aqueous solution was used. The hydrophobing agent used was a paraffin-based emulsion of the brand "HYDRAWAX 138" from SASOL GmbH with a solids content of about 50%. The glue liquor of the middle layer as a further binder consisted of 8% UF solid resin based on dry chip, 2% Ammonioumsulfatlösung (hardener) based on dry solid resin and 1% water repellents based on atro chip.

Die Leimflotte der Deckschicht bestand aus 11 % UF-Festharz bezogen auf atro Span, 0,5 % Ammoniumsulfatlösung auf atro Festharz und 1 % Hydrophobierungsmittel bezogen auf atro Span. Der Spankuchen wurde bei 195°C für 6 s/mm und einem spezifischen Druck von 2,5 N/mm2 verpresst.The glue liquor of the cover layer consisted of 11% UF solid resin based on dry chip, 0.5% ammonium sulfate solution on dry solid resin and 1% water repellents based on dry chip. The chip cake was pressed at 195 ° C for 6 s / mm and a specific pressure of 2.5 N / mm 2 .

Beispiel 6: Herstellung von UF-Harz gebundenen, dreischichtigen Spanplatten mit geringer Rohdichte aus reinen Industriespänen als Referenz.Example 6: Preparation of UF resin bonded, three-layer chipboard with low density of pure industrial chips as a reference.

Aus reinem industriell hergestelltem Spangut wurden 20 mm dicke dreischichtige Spanplatten mit einer Rohdichte von 500 kg/m3 und einer industriell standardisierten Bindemittelzusammensetzung hergestellt. Die Leimflotte entsprach in ihrer Zusammensetzung und Menge der in Beispiel 1, 2, 3 und 4 beschriebenen Versuche. Alle weiteren Herstellungsparameter sind mit dem Beispiel 1, 2, 3und 4 völlig identisch. Die Werte der mechanischtechnologischen Eigenschaften der Beispiele 1, 2, 3 und 4 sowie die Daten des Referenzmusters 5 sind in der nachfolgenden Tabelle 1 dargestellt. Tabelle 1: Mechanisch technologische Eigenschaften der dreischichtigen, UF-Harz gebundenen Spanplatten, wobei bedeuten: Extr. Extrudat, Acryl. Acrylat Rohd. Rohdichte Q 02h Quellung nach 2 Stunden Q 24h Quellung nach 24 Stunden Beispiel Extr. Acryl. Faser Rohd. Querzug Q 2h [kg/m3] Q 24h [N/mm2] Beispiel Extr. Acryl. Faser Rohd. Querzug Q 2h Q 24h 1 mit ohne ohne 497 0,28 4,49 16,86 2 mit ohne mit 505 0,30 3,46 13,57 3 mit DV646 ohne 511 0,27 4,99 17,91 4 mit DV646 mit 505 0,38 8,59 18,76 5 mit DV455 mit 510 0,40 7,89 19,14 6 (Referenz) ohne ohne ohne 502 0,33 6,55 18,88 From pure industrial manufactured Spangut 20 mm thick three-layer chipboard with a density of 500 kg / m 3 and an industrially standardized binder composition were prepared. The size of the glue liquor corresponded in its composition and amount to the experiments described in Examples 1, 2, 3 and 4. All other production parameters are completely identical to Examples 1, 2, 3 and 4. The values of the mechanical properties of Examples 1, 2, 3 and 4 as well as the data of Reference Pattern 5 are shown in Table 1 below. Table 1: Mechanical technological properties of the three-layer, UF resin-bonded chipboard, wherein Extr. extrudate Acrylic. acrylate Rohd. density Q 02h Swelling after 2 hours Q 24h Swelling after 24 hours example Extr. Acrylic. fiber Rohd. lateral tension Q 2h [kg / m 3 ] Q 24h [N / mm 2 ] example Extr. Acrylic. fiber Rohd. lateral tension Q 2h Q 24h 1 With without without 497 0.28 4.49 16.86 2 With without With 505 0.30 3.46 13.57 3 With DV646 without 511 0.27 4.99 17.91 4 With DV646 With 505 0.38 8.59 18.76 5 With DV455 With 510 0.40 7.89 19.14 6 (reference) without without without 502 0.33 6.55 18.88

Claims (5)

  1. Board (150) having a first layer (151) and having a second layer (152), having a material (100, 110, 120) which is suitable for formation of boards and layers and comprises grains (30) of a granulate and a binder (20) provided at the surface of the grains (30) of the granulate, wherein the binder (20) comprises a cured adhesive, a partly cured adhesive or a curable adhesive, wherein fibres (10) are additionally provided, wherein the binder (20) binds some of the fibres (10) to the surface of the coated grains (31) of the granulate, wherein a grain (30) of the granulate includes a porous base material, wherein the pores of the base material have been filled with air or with a gas, wherein the material comprises grains (32) of a further granulate and the coated grains (31) of the granulate have been mixed with the grains (32) of the further granulate,
    characterized
    in that the material comprises a further binder (21) and the further binder (21) binds the coated grains (31) of the granulate and the grains (32) of the further granulate to one another, in that the base material of the granulate is a natural substance, in that the grains (30, 31) of the granulate take the form of puffed grains of a cereal and in that the average density of the grains is below 0.1 kg/l.
  2. Board according to Claim 1, characterized in that the first layer (151) or the second layer (152) takes the form of a particle board layer.
  3. Board according to Claim 1 or 2, characterized in that an average diameter of a grain size of the grains (30) is within a range from 0.5 mm to 50 mm.
  4. Board according to any of the preceding claims, characterized in that an average diameter of the fibres (10) is within a range from 10 µm to 1 mm.
  5. Board according to any of the preceding claims, characterized in that an average length of the fibres (10) is within a range from 100 µm to 50 mm.
EP09005897.5A 2009-04-28 2009-04-28 Board manufactured with two layers and material between them Active EP2113350B1 (en)

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PL09005897T PL2113350T3 (en) 2009-04-28 2009-04-28 Board manufactured with two layers and material between them
EP09005897.5A EP2113350B1 (en) 2009-04-28 2009-04-28 Board manufactured with two layers and material between them
ES09005897T ES2718473T3 (en) 2009-04-28 2009-04-28 Plate formed with two layers and material between them
PT09005897T PT2113350T (en) 2009-04-28 2009-04-28 Material and method for production of same and board made from same material

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GB659731A (en) * 1946-03-02 1951-10-24 Alfred Mauricio Monath Improvements in and relating to the manufacture of sheet material from wood particles
ES262289A1 (en) * 1959-11-18 1961-04-01 Fahrmi Fred Method and apparatus for coating loose particles with a sprayable bonding substance
DE2263964A1 (en) * 1972-12-29 1974-07-04 B Maier Kg 4812 Maschf Vegetable fibres treatment for chipboard prodn. - without preliminary cutting or beater mill stages, using combined radial and axial flow mill
CH628521A5 (en) * 1978-05-20 1982-03-15 Kaiser Wirz Max METHOD AND DEVICE FOR ADMINISTERING LIQUID COMPONENTS IN SCHUETTABLE GOETER.
EP1207572A1 (en) * 2000-11-15 2002-05-22 Dr. Sugnaux Consulting Mesoporous electrodes for electrochemical cells and their production method
AU2005200282B2 (en) * 2004-02-13 2011-06-16 Kluger, Gerard F A Material for Building or Other Purposes
JP2008215061A (en) * 2007-02-07 2008-09-18 Ez Bright Corp Road surface structure

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