EP2096195A2

EP2096195A2 - Plating jig and plating method for electronic component by using the same

Info

Publication number: EP2096195A2
Application number: EP20090153477
Authority: EP
Inventors: Junichiro Shinko Electric Industries Co. Ltd. Aoki
Original assignee: Shinko Electric Industries Co Ltd
Current assignee: Shinko Electric Industries Co Ltd
Priority date: 2008-02-22
Filing date: 2009-02-23
Publication date: 2009-09-02
Also published as: CN101514476A; JP2009197283A; SG155138A1

Abstract

The resilient member 30 and the polyhedral member 40 are accommodated in a mutually adjacent manner in the recessed hole 22 formed at least in one on the surface of the electrode pad 20, the cover body 50 for preventing the resilient member 30 and the polyhedral member 40 from departing from the recessed hole 22 is disposed in such an arrangement as to cover the surface of the electrode pad 20, the opening port 52 for advancement of the lead wire 64 is formed at a position corresponding to the recessed hole 22 on the cover body 50, and the lead wire 64 of an electronic component is allowed to advance between the inner wall face of the recessed hole and the wall face of the polyhedral member 40 from the opening port 52 against the resilient force of the resilient member 30 and the lead wire 64 is held between the wall face of the polyhedral member 40 and the inner wall face of the recessed hole 22, thereby retaining the electronic component.

Description

The present disclosure relates to a plating jig and a plating method for an electronic component by using the jig. More particularly, it relates to a plating jig preferably usable in plating an electronic component having a lead wire such as an LD stem and also to plating methods for an electronic component using a plating jig.
Electronic components having a lead wire represented by an LD stem are subjected to plating on the surface for rust prevention. Conventionally, a barrel plating method has been widely adopted in plating these electronic components having a lead wire.
However, there is found such a problem that when the barrel plating method is adopted, lead wires of the electronic components are entangled with each other after the plating, and much time and labor are needed in individually separating the electronic components.
Under these circumstances, in recent years, in plating these electronic components having a lead wire, there has been proposed a plating method in which a magnet-embedded electrode is formed and a lead wire of the electronic component is retained in a state that the lead wire is in contact with the electrode by magnetic force resulting from the magnet, thereby plating the electronic component. As the above-described plating method, there is known, for example, plating methods disclosed in Patent Documents 1 and 2 (Patent Document 1: Japanese ApplicationNo. 2006-183109 ; Patent Document 2: Japanese Patent No. 3620531 ).
Where the plating methods disclosed in Patent Documents 1 and 2 are used to plate electronic components having a lead wire, the electronic components remain even after the plating at a position of the electrode which has been initially retained. Thus, there is no chance that the lead wires of the electronic components are entangled with each other. More specifically, work of individually separating the electronic components after plating can be conducted quite smoothly, which is also favorable.
However, in the methods disclosed in Patent Documents 1 and 2, since a magnet is used in a mechanism by which an electrode is retained in a state that it is allowed to be in contact with an electronic component, there is a case that the electronic component is magnetized and magnetic substance particles mixed in a plating solution may be adhered on the surface of the electronic component. There has now been found such a problem that when the magnetic substance particles are adhered on the surface of the electronic component as described above, plating metal is coated on the magnetic substance particles in a raised manner, thereby giving a poor appearance to a product after plating to reduce the yield.
Further, where plating is given to an electronic component having up to three lead wires, all the lead wires are allowed to be in contact with an electrode. However, in an electronic component having four or more lead wires, there will be found a lead wire not in contact with the electrode if any one of the lead wires is only slightly different in length.
There has also been found a problem that a lead wire not in contact with the electrode will be poorly plated if plating is given to an electronic component having lead wires which are not electrically conductive, as described above.
At least some of the problems in the art are overcome by the plating jig according to claim 1 and the plating methods for an electronic component according to claims 7, 8 and 9. Further aspects, details and advantages are evident from the dependent claims, the description and the accompanying drawings.
Therefore, an object of the invention of the present application is to provide a plating jig in which a lead wire of an electronic component is retained in a state that the lead wire is allowed to be in contact with an electrode without using a magnet, thus making it possible to plate the surface of the electronic component in such a manner that no magnetic substance particles are adhered thereon, and also, where a plurality of lead wires are disposed in an electronic component, all the lead wires can be retained in a state that they are allowed to be in contact with the electrode even if there is a difference in length of each of the lead wires.
According to a first aspect of the invention, there is provided a plating jig which is used in plating an electronic component having a lead wire, including:

a resilient member and a polyhedral member which are accommodated in a mutually adjacent manner into a recessed hole formed at least in one on the surface of an electrode pad, and
a cover body for preventing the resilient member and the polyhedral member from departing from the recessed hole, which is disposed so as to cover the surface of the electrode pad, the cover body being provided with an opening port for advancement of a lead wire at a position corresponding to the recessed hole thereon, wherein
the lead wire of the electronic component is advanced between an inner wall face of the recessed hole and a wall face of the polyhedral member from the opening port against the resilient force of the resilient member, and
the lead wire is held between the wall face of the polyhedral member and the inner wall face of the recessed hole to retain the electronic component.

a resilient member and a polyhedral member which are accommodated in a mutually adjacent manner in a recessed hole formed at least in a surface of an electrode pad, and
a cover body for preventing the resilient member and the polyhedral member from departing from the recessed hole, which is disposed so as to cover the surface of the electrode pad, the cover body being provided with an opening port for advancement of a lead wire at a position corresponding to the recessed hole thereon, wherein
an inner wall face of the recessed hole and a wall face of the polyhedral member enable advancing the lead wire of the electronic component therebetween from the opening port against a resilient force of the resilient member, and
the wall face of the polyhedral member and the inner wall face of the recessed hole are adapted for holding the lead wire therebetween in order to retain the electronic component.

According to aspects of the present disclosure, there is provided a plating jig for plating an electronic component having a lead wire, the plating jig comprising: a resilient member and a polyhedral member which are accommodated in a mutually adjacent manner into a recessed hole formed at least in one of the surfaces of an electrode pad, and a cover body for preventing the resilient member and the polyhedral member from departing from the recessed hole, the cover body being disposed covering the surface of the electrode pad, the cover body being provided with an opening port at a position corresponding to the recessed hole thereon. Preferably, an inner wall face of the recessed hole and a wall face of the polyhedral member enable advancing the lead wire of the electronic component therebetween from the opening port against a resilient force of the resilient member. Also preferably, the wall face of the polyhedral member and the inner wall face of the recessed hole are adapted for holding the lead wire therebetween in order to retain the electronic component.
According to a second aspect of the invention, there is provided the plating jig as set forth in the first aspect, wherein a plurality of recessed holes are provided for one electronic component so as to correspond to a state of arrayed lead wires.
Accordingly, it is possible to supply electricity reliably to variously arrayed lead wires.
According to a further aspect, there is provided a plating jig comprising a plurality of recessed holes spatially arranged to correspondto an array of leadwires of an electronic component.
According to a third aspect of the invention, there is provided the plating jig as set forth in the first or second aspect, wherein as a guide face for advance the lead wire from the opening port, at least one of the wall face of the polyhedral member and the inner wall face of the recessed hole which hold the lead wire therebetween is formed on and/or as an inclined face.
Accordingly, the lead wire is allowed to advance smoothly between the recessed hole and the polyhedral member.
According to yet a further aspect, there is provided a plating jig wherein at least one of the wall face of the polyhedral member and the inner wall face of the recessed hole is adapted for holding the lead wire therebetween is formed on an inclined face. Thereby, this wall face may be used as a guide face for advance of the lead wire from the opening port.
According to a forth aspect of the invention, there is provided the plating jig as set forth in any one of the first to third aspects, wherein the polyhedral member, of which a part holding the lead wire on the inner wall face of the recessed hole is formed in a tapered shape, is in point contact with the lead wire.
Accordingly, the part at which the lead wire is held can be made smaller in area, and an area to which no plating metal is adhered can be made as small as possible.
According to another aspect, there is provided a plating grid wherein the polyhedral member is for being in point contact with the lead wire. Preferably, a part of the polyhedral member for holding the lead wire on the inner wall face of the recessed hole is formed in a tapered shape.
In particular, there is provided a plating grid wherein the polyhedral member, of which a part is adapted for holding the lead wire on the inner wall face of the recessed hole, is formed in a tapered shape, is adapted for being in point contact with the lead wire.
According to a fifth aspect of the invention, there is provided the plating jig as set forth in any one of the first to forth aspects, wherein a through hole penetrating through the electrode pad is formed on the bottom face of the recessed hole.
Typically, there is provided a through hole formed on the bottom face of the recessed hole. Preferably, the through hole penetrates through the electrode pad.
Typically, the diameter dimension of the through hole is greater than that of the lead wire. Preferably, the through hole is adapted for allowing the lead wire to penetrate therethrough.
According to a sixth aspect of the invention, there is provided the plating jig as set forth in the fifth aspect, wherein the diameter dimension of the through hole is greater than that of the lead wire to allow the lead wire to penetrate through.
Accordingly, after plating is conducted for a predetermined period of time, the lead wire is further inserted into a jig, by which the lead wire is held at a different position, making it possible to plate a part to which no plating metal is adhered initially, which is also favorable. Further, since the through hole is provided, a plating solution is well circulated in a plating solution tank, thus making it possible to provide high-quality plating.
According to a seventh aspect of the invention, there is provided a plating method for an electronic component, including the steps of:

preparing the plating jig as set forth in any one of the first to sixth aspects,
advancing a lead wire of the electronic component between the inner wall face of the recessed hole and the wall face of the polyhedral member from the opening port against the resilient force of the resilient member,
holding the lead wire between the wall face of the polyhedral member and the inner wall face of the recessed hole to retain the electronic component on the plating jig,
attaching the plating jig which retains the electronic component to a plating solution tank, and
supplying electricity to the electrode pad to form a metal film on the surface of the electronic component.

According to an eighth aspect of the invention, there is provided a plating method for an electronic component, including the steps of:

preparing the plating jig as set forth in claim 6,
advancing a lead wire of the electronic component between the inner wall face of the recessed hole and the wall face of the polyhedral member from the opening port against the resilient force of the resilient member,
holding the lead wire between the wall face of the polyhedral member and the inner wall face of the recessed hole to retain the electronic component on the plating jig,
attaching the plating jig by which the electronic component is retained to a plating solution tank,
supplying electricity to the electrode pad to form a metal film on the surface of the electronic component, and
pressing the electronic component to the electrode pad side to press the lead wire into a direction of the through hole, and
conducting plating again after contact sites of the lead wire with the inner wall face of the recessed hole and with the polyhedral member are deviated.

A constitution of the plating jig of the present invention and a plating method using the jig are adopted, by which in plating an electronic component, a lead wire can be brought into contact with an electrode and retained without using magnetic force. Accordingly, even if magnetic substance particles are mixed in a plating solution, they are not adhered on the surface of the electronic component, thus making it possible to prevent the occurrence of defective plating.
Further, even where in an electronic component having a plurality (in particular, four or more) of lead wires, there is a difference in length of each of the lead wires, all the lead wires are made electrically conductive to the electrode, thus making it possible to give uniform plating to the electronic component in its entirety.
According to a further aspect, there is provided a plating method for an electronic component using a plating jig, the plating jig having a resilient member, a polyhedral member, a recessed hole formed at least in a surface of an electrode pad, and a cover body provided with an opening port, the method comprising:

advancing a lead wire of the electronic component between an inner wall face of the recessed hole and a wall face of the polyhedral member from the opening port against a resilient force of the resilient member; and
holding the lead wire between the wall face of the polyhedral member and the inner wall face of the recessed hole to retain the electronic component on the plating jig.

Fig. 1 shows a front elevational view and a plan view of an electrode pad of the plating jig of the first embodiment;
Fig. 2 shows an enlarged view of the A part given in Fig. 1 and a cross sectional view of this part taken along line a-a;
Fig. 3 shows a front elevational view and a plan view of a cover body used by being attached to the electrode pad given in Fig. 1;
Fig. 4 shows an enlarged view of the B part given in Fig. 3 and a cross sectional view of this part taken along line b-b;
Fig. 5 is a cross sectional view showing a state that a resilient body and a polyhedral member are accommodated in the electrode pad and then the cover body is attached to the electrode pad;
Fig. 6 is a cross sectional view showing a state which is immediately before attachment of an LD stem to the plating jig of the first embodiment;
Fig. 7 is a cross sectional view showing a state that the LD stem is attached to the plating jig;
Fig. 8 is a cross sectional view of a unit recessed hole portion of the plating jig in the second embodiment;
Fig. 9 is a drawing showing a state that a lead wire is projected from the back face of the electrode pad;
Fig. 10 is a cross sectional view of a unit recessed hole portion of the plating jig in the third embodiment;
Fig. 11 is a cross sectional view showing an exemplified variation in the third embodiment; and
Fig. 12 is a front elevational view showing one example of the projected portion in another embodiment.

Hereinafter, a description will be given of embodiments of the plating jig of the present invention by referring to drawings. In the present embodiment, an LD stem is exemplified as an electronic component having a lead wire.
(First embodiment)
Fig. 1 shows a front elevational view and a plan view of an electrode pad of the plating jig of a first embodiment. Fig. 2 shows an enlarged view of the A part given in Fig. 1 and a cross sectional view of the A part taken along line a-a. Fig. 3 shows a front elevational view and a plan view of a cover body used by being attached to the electrode pad given in Fig. 1. Fig. 4 shows an enlarged view of the B part given in Fig. 3 and a cross sectional view of the B part taken along line b-b inside the enlarged view.
The plating jig 10 of the present embodiment is provided with an electrode pad 20, a resilient body 30 and a polyhedral member 40 disposed in a recessed hole 22 formed on the electrode pad 20, and a cover body 50 superimposed on and attached to the electrode pad 20 (refer to Fig. 5).
As shown in Fig. 1, the electrode pad 20 is formed in a rectangular plate shape when viewed in the front. A plurality of recessed holes 22 is disposed on the front face of the electrode pad 20. In the present embodiment, two recessed holes 22, 22 are arranged laterally to give a unit recessed hole 24. As shown in Fig. 2, a projected portion 26 is provided between the recessed holes 22, 22.
As shown in Fig. 2, the cross sectional shape of the electrode pad 20 taken along line a-a at a part of the unit recessed hole 24 is formed approximately in a pattern of three raised portions, the center of which is highest. The upper end portion of the projected portion 26 is formed in a tapered shape. Each of the recessed holes 22, 22 is formed so as to give a two-stage bottom having a shallow bottom portion 22A adjacent to the projected portion 26 and a deep bottom portion 22B continuing to the shallow bottom portion 22A. A stainless steel plate is used in the electrode pad 20 of the present embodiment, and shaving can be used to form the unit recessed hole 24 and the projected portion 26.
Threaded holes 28A for attaching a cover body 50 are disposed all over the front face of the electrode pad 20. Four guide pins 28B are used in attaching the cover body 50 to the front face of the electrode pad 20. Further, threaded holes 58A and guide pin insertion holes 58B are disposed at sites positioned to the threaded holes 28A and the guide pins 28B provided on the electrode pad 20.
An ear portion 29 formed on the side edge of the electrode pad 20 is used as an attachment portion to an electrically conductive portion and/or a rack inside a plating solution tank (not illustrated).
As shown in Fig. 3, a plurality of opening ports 52 penetrating from the front face to the back face (in the plate thickness direction) are formed on the cover body 50 in an array so as to be aligned with respect to the unit recessed hole 24. More specifically, the opening ports 52 are disposed in such a state that the leading end of the projected portion 26 is aligned with respect to the center of the opening port 52. As shown in Fig. 4, the opening port 52 is formed in a reverse conical shape which is gradually reduced in diameter from the front face of the cover body 50 to the back face thereof. Therefore, the opening portion 52 is provided with an inclined wall 52a.
An opening dimension W of the opening port 52 on the back face of the cover body 50 is formed so as to be equal to or greater than a sum (W3+2d) of a width dimension (W3) of the projected portion 26 and a diameter dimension (d) of two lead wires 64 of the LD stem 60 (refer to Fig. 2 and Fig. 4).
Fig. 5 is a cross sectional view showing a state that the resilient body and the polyhedral member are accommodated in an electrode pad and the cover body is then attached to the electrode pad. Fig. 5 shows a cross sectional view at the same position as the cross section positions given in Fig. 3 and Fig. 4. As shown in Fig. 5, a resilient body 30 and a polyhedral member 40 are disposed in a mutually adjacent manner in the respective recessed holes 22A, 2B on the electrode pad. The polyhedral member 40 is disposed at the shallow bottom portion 22A, with a perpendicular side wall 40a being in contact with a perpendicular side wall 26a of the projected portion 26, and the resilient member 30 is disposed at the deep bottom portion 22B adjacent to the polyhedral member 40. In the present embodiment, the width dimension W1 of the resilient body 30 is formed so as to be substantially equal to the width dimension W2 of the polyhedral member 40 (refer to Fig. 6).
The resilient body 30 is formed in a cylindrical shape. Further, the polyhedral member 40 is formed in a square pole shape, and a wall face opposing an inclined wall 2 6b on the tapered upper end of the projected portion 26 is formed on an inclined wall 40b so as to be notched to form a V-shaped groove 45 together with the inclined wall 26b.
Since the resilient member 30 and the polyhedral member 40 are exposed to a plating solution, a material excellent in chemical resistance and heat resistance is used in both of them.
A cover body 50 is disposed on the electrode pad 20 so that the resilient member 30 and the polyhedral member 40 disposed in the recessed hole 22 do not depart. The cover body 50 can be attached in a superimposed manner in a state positioned with respect to the electrode pad 20 by inserting a guide pin 28B provided on the electrode pad 20 into a guide pin insertion hole 58B. The electrode pad 20 is assembled to the cover body 50 in such an arrangement that a face of forming the recessed hole 22 of the electrode pad 20 and a diameter-reducing side of an opening port 52 of the cover body 50 are in contact with each other. After the electrode pad 20 is superimposed on the cover body 50, the threaded hole 28A and the threaded hole 58A are tightened with screws (not illustrated) and attached integrally to assemble a plating jig 10.
Next, a description will be given of a plating method for an LD stem 60 in which the plating jig 10 of the present embodiment is used. Fig. 6 is a cross sectional view showing a state which is immediately before attachment of the LD stem to the plating jig of the first embodiment. For convenience of description, the LD stem 60 is indicated not in a cross sectional view but in a front elevational view.
In the LD stem 60 of the present embodiment, four lead wires 64 are drawn from an eyelet 62. Since Fig. 6 is a front elevational view, only two lead wires 64 are shown in accordance with two recessed holes 22, but two additional lead wires 64 are actually provided in the perpendicular direction on the space. More specifically, two lead wires 64 are provided for one recessed hole 22.
The eyelet 62 is in advance attached to a jig for array (not illustrated) before being plated, by which the LD stem 60 is arrayed and retained, with the LD stem 60 disposed in the same direction. The unit recessed hole 24 on the plating jig 10 is arrayed so as to be in accordance with a state of the LD stem 60 arrayed by the jig for array. Therefore, a lead wire 64 projected from the jig for array is opposed to the plating jig 10 and the lead wire 64 is only inserted into an opening port 52 of the plating jig 10, by which each of the LD stems 60 can move (transfer) to the plating jig 10, while keeping the arrayed state.
When the lead wire 64 of the LD stem 60 is allowed to advance into the opening port 52 of the plating jig 10, the lead wire 64 advances into the V-shaped groove 45 between the projected portion 26 and the polyhedral member 40. Then, the lead wire 64 is in contact with the inclined wall 40b of the polyhedral member 40, pressing the polyhedral member 40 by applying pressure against the resilient force of the resilient member 30. The polyhedral member 40 slides in the direction of the arrow Z, and the leading end of the lead wire 64 advances between the perpendicular side wall 40a of the polyhedral member 40 and the perpendicular side wall 26a of the projected portion 26 and is retained between these perpendicular side walls. The cylindrical resilient member 30 accommodated in the rectangular-solid deep bottom portion 22B is sufficiently secured for a space for elastic deformation due to a clearance between the cover body 50 and itself and a space between the deep bottom portion 22B and itself.
As described so far, the LD stem 60, which is to be plated, is attached to the plating jig 10. Fig. 7 is a cross sectional view showing a state that the LD stem 60 is attached to the plating jig 10. In a state given in Fig. 7, the plating jig 10 is attached to a plating solution tank (not illustrated) and electricity is supplied thereto, by which the LD stem 60 can be plated.
According to the present embodiment, no magnetic force is used in retaining the LD stem 60 on the electrode pad 20, thereby eliminating any fear of magnetization of the LD stem 60. Accordingly, even when magnetic substance particles are mixed in a plating solution, no magnetic substance particles are adhered on the surface of the LD stem 60, and no irregularities are formed on the plating surface, thus making it possible to improve a plating yield. Further, the leading end of each lead wire 64 is allowed to advance between the polyhedral member 40 and the projected portion 26 to be made electrically conductive, by which electricity can be reliably supplied to all the lead wires 64 even where the lead wires 64 are plural (four or more).
(Second embodiment) Fig. 8 is a cross sectional view of a unit recessed hole portion of a plating jig in a second embodiment. More specifically, this is a drawing corresponding to Fig. 7 in the first embodiment. In the present embodiment, the same numerals and letters are given to the same constitutions as those of the first embodiment, thus omitting a detailed description.
In the first embodiment, a part at which the lead wire 64 is held between the projected portion 26 and the polyhedral member 40 (an area indicated by the arrow H in Fig. 8) is in line contact with a holding portion. Thus, there is a fear that no proper plating may be conducted and the leading end of the lead wire 64 must be cut.
On the other hand, the plating jig of the present embodiment is characterized in that a through hole 70 is formed which penetrates from a contact position of the lead wire 64 at the bottom of the recessed hole 22 (22A) to the back face of the electrode pad 20. Since a plating solution is allowed to be circulated from the back face of the electrode pad 20 through a through hole 70, the plating solution is thoroughly circulated and also able to plate the holding portion (an area indicated by the arrow H) as well.
If the holding portion is not yet plated, the plating jig 10 is once taken out from a plating solution tank after plating is conducted for a predetermined period of time in a holding state given in Fig. 8. Then, the lead wire 64 is further pressed into the plating jig 10, and the holding portion of the lead wire 64 (the leading end) is kept exposed from the back face of the electrode pad 20. Fig. 9 is a drawing showing a state that the lead wire 64 is projected from the back face of the electrode pad 20.
After in a state given in Fig. 9, the plating jig 10 is again attached to the plating solution tank to conduct plating, thus making it possible to reliably plate all over the surface of the LD stem 60.
The constituted plating jig 10 is adopted, thereby eliminating the necessity for cutting the leading end of the lead wire 64 after plating, thus making it possible to reduce the number of man-hours and also eliminate non-plated portions at a cut cross section. Further, high-quality plating may be given to the LD stem 60 at a reduced cost, which is also favorable.
(Third embodiment)
Fig. 10 is a cross sectional view of a unit recessed hole portion of a plating jig in a third embodiment. More specifically, it corresponds to Fig. 7 in the first embodiment and Fig. 8 in the second embodiment. The present embodiment is characterized by the shape of the polyhedral members 40 for holding the lead wire 64.
In order for the polyhedral member 40 of the present embodiment to be in point contact with a contact portion with the lead wire 64, a portion at which the polyhedral member 40 is in contact with the lead wire 64 (on the side of the projected portion 26) is formed so as to be tapered in a cross sectional shape. The plating jig 10 using the thus constituted polyhedral member 40 is adopted, by which an area of the portions in which the lead wire 64 is held can be decreased as much as possible to result in a decrease in a non-plated portion, which is favorable.
As a matter of course, also in the present embodiment, as shown in Fig. 11, a through hole 70 which is formed so as to give such a dimension that the lead wire 64 passes through may be provided on an extended axial line of the lead wire 64 on the inner bottom face of the recessed hole 22 (22A).
Further, there may be adopted an aspect of the projected portion 26 shown in Fig. 12 as another method for making narrow an area at which the lead wire 64 is held.
Fig. 12 is a front elevational view of the projected portion 26 when viewed from the polyhedral member 40. Recessed grooves 72, 74 are disposed vertically and laterally on the projected portion 26, which is advantageous in that an area in contact with the lead wire 64 can be decreased and a plating solution can also be discharged easily and effectively from the opening port 52 to the through hole 70 during plating.
Where a shape which is a combination of the shape of the polyhedral member given in Fig. 10 with that of the polyhedral member 40 given in Fig. 12 is adopted, it possible to further decrease a contact portion of the projected portion 26 with the polyhedral member 40, which is also favorable.
A description has been so far given of the present invention by referring to the embodiments. The present invention shall not be, however, limited to these embodiments so far described and, as a matter of course, other embodiments may be included in the technical scope of the invention of the present application.
For example, in the embodiments so far described, the recessed holes 22A, 22B different in depth are used to give one recessed hole 22. However, there may be provided an aspect in which the depth inside the recessed hole 22 is made equal. Further, a description has been given of an aspect in which two recessed holes 22, 22 are made into one set to constitute a unit recessed hole 24 and the unit recessed hole 24 is disposed on the electrode pad 20 at predetermined intervals. As a matter of course, there may be adopted an aspect in which recessed holes 22A, 22B different in depth are used to give a recessed hole 22 as one unit or an aspect in which a simple recessed hole 22 is given as one unit and a plurality of them are disposed inside the electrode pad 20. In this instance, the lead wire 64 is held between the polyhedral member 40 and the inner wall face of the recessed hole 22.
Further, in these embodiments, a description has been given of an aspect in which two recessed holes 22 allowed to correspond to an array of lead wires of one electronic component (LD stem 60) are made into one unit to give a unit recessed hole 24 and plural sets of unit recessed holes 24 are disposed on the plating jig 10. As a matter of course, such an aspect is also acceptable in which one recessed hole 22 is allowed to correspond to one electronic component or in which three or more recessed holes 22 are allowed to correspond to one electronic component according to a state of the arrayed lead wires 64, and a plurality of electronic components are arrayed and retained at the same time on the plating jig 10.
Further, the resilient body 30 and the polyhedral member 40 disposed in the recessed hole 22 are adopted as those which are formed respectively in an approximately equal width dimension. As long as there can be obtained the resilient force resulting from the deformation of the resilient body 30 sufficiently great in holding a lead wire on insertion of the lead wire of the electronic component into the recessed hole 22, it is not necessary to make equal the width dimension W1 of the resilient body 30 and the width dimension W2 of the polyhedral member 40. As a matter of course, there may be provided no clearance between the resilient member 30 and the cover body 50, if a space in which the resilient member 30 is deformed is sufficiently secured inside the recessed hole 22B.
Further, in the embodiments so far described, the inclined faces 26b, 40b are formed respectively at the projected portion 26 and the polyhedral member 40 to constitute a V-shaped groove 45 for guiding the advancement of the lead wire 64. It is also acceptable that the inclined face (26b or 40b) is formed at only one of the projected portion 26 and the polyhedral member 40 to constitute the V-shaped groove 45.
Still further, in the embodiments so far described, a description has been given of an aspect in which electricity is supplied to the electrode pad 20 through an ear portion 29 of the electrode pad 20. Such an aspect may also be adopted that electricity is supplied through a guide pin 28B in place of the ear portion 29. In this instance, the guide pin 28B is preferably made with a material equal to or better in conductivity than the electrode pad 20.
In addition, in the embodiments so far described, there is exemplified as an electronic component the LD stem 60 having four lead wires 64. The plating jig 10 of the present invention is applicable irrespective of whether the leadwire 64 is singular or plural. In this instance, the recessed hole 22 (the unit recessed hole 24 and the projected portion 26), the resilient body 30 and the polyhedral member 40 are disposed at the electrode pad 20, while the opening port 52 is disposed at the cover body 50 in accordance with a state of the arrayed lead wire 64 with respect to the LD stem 60, thus making it possible to give a flexible response to any state of the arrayed lead wire 64.
What is more, as a matter of course, an electronic component used in the plating jig of the present invention shall not be limited to the LD stem 60. The present invention is also applicable, for example, when plating is given to terminal components, sensor components, optical communication components, connectors and the like as other electronic components having a lead wire.

Claims

A plating jig (10) which is usable in plating an electronic component (60) having a lead wire (64), comprising:
a resilient member (30) and a polyhedral member (40) which are accommodated in a mutually adjacent manner in a recessed hole (22) formed at least in a surface of an electrode pad (20), and

a cover body (50) for preventing the resilient member (30) and the polyhedral member (40) from departing from the recessed hole (22), which is disposed so as to cover the surface of the electrode pad (20), the cover body (50) being provided with an opening port (52) for advancement of a lead wire (64) at a position corresponding to the recessed hole (22) thereon, wherein

an inner wall face of the recessed hole (22) and a wall face of the polyhedral member (40) enable advancing the lead wire of the electronic component (60) therebetween from the opening port (52) against a resilient force of the resilient member (30), and

the wall face of the polyhedral member (40) and the inner wall face of the recessed hole (22) are adapted for holding the lead wire (64) therebetween in order to retain the electronic component.
The plating jig as set forth in claim 1, wherein a plurality of recessed holes are provided for one electronic component so as to correspond to a state of arrayed lead wires.
The plating jig as set forth in any of claims 1 or 2, wherein as a guide face for advance the lead wire from the opening port, at least one of the wall face of the polyhedral member and the inner wall face of the recessed hole which hold the lead wire therebetween is formed on and/or as an inclined face.
The plating jig as set forth in any of claims 1 to 3, wherein the polyhedral member, of which a part for holding the lead wire on the inner wall face of the recessed hole is formed in a tapered shape, is adapted for being in point contact with the lead wire.
The plating jig as set forth in any of claims 1 to 4, wherein a through hole penetrating through the electrode pad is formed on the bottom face of the recessed hole.
The plating jig as set forth in claim 5, wherein the diameter dimension of the through hole is greater than that of the lead wire to allow the lead wire to penetrate through.
A plating method for an electronic component (60), comprising the steps of:
preparing the plating jig (10) as set forth in claim 1 to 6,

advancing a lead wire (64) of the electronic component (60) between the inner wall face of the recessed hole (22) and the wall face of the polyhedral member (40) from the opening port (52) against the resilient force of the resilient member (30),

holding the lead wire (64) between the wall face of the polyhedral member (40) and the inner wall face of the recessed hole (22) to retain the electronic component (60) on the plating jig (10),

attaching the plating jig (10) which retains the electronic component (60) to a plating solution tank, and

supplying electricity to the electrode pad (20) to form a metal film on the surface of the electronic component (60).
A plating method for an electronic component (60), comprising the steps of:
preparing the plating jig (10) as set forth in claim 1 to 6,

advancing a lead wire (64) of the electronic component (60) between the inner wall face of the recessed hole (22) and the wall face of the polyhedral member (40) from the opening port (52) against the resilient force of the resilient member (30),

holding the lead wire (64) between the wall face of the polyhedral member (40) and the inner wall face of the recessed hole (22) to retain the electronic component (60) on the plating jig (10),

attaching the plating jig (10) by which the electronic component (60) is retained to a plating solution tank,

supplying electricity to the electrode pad (20) to form a metal film on the surface of the electronic component (60), and

pressing the electronic component (60) to the electrode pad (20) side to press the lead wire (64) into a direction of the through hole (70), and

conducting plating again after contact sites of the lead wire (64) with the inner wall face of the recessed hole (22) and with the polyhedral member (40) are deviated.
A plating method for an electronic component (60) using a plating jig (10), the plating jig (10) having a resilient member (30), a polyhedral member (40), a recessed hole (22) formed at least in a surface of an electrode pad (20), and a cover body (50) provided with an opening port (52), the method comprising:
advancing a lead wire (64) of the electronic component (60) between an inner wall face of the recessed hole (22) and a wall face of the polyhedral member (40) from the opening port (52) against a resilient force of the resilient member (30); and

holding the lead wire (64) between the wall face of the polyhedral member (40) and the inner wall face of the recessed hole (22) to retain the electronic component (60) on the plating jig (10);
The plating method for an electronic component (60) according to claim 9, further comprising:
attaching the plating jig (10) which retains the electronic component (60) to a plating solution tank;
The plating method for an electronic component (60) according to any of claims 9 or 10, further comprising:
supplying electricity to the electrode pad (20) to form a metal film on the surface of the electronic component (60).
The plating method for an electronic component (60) according to any of claims 9 to 11, further comprising:
forming or having provided a through hole (70) penetrating through the electrode pad (20) on the bottom face of the recessed hole (22).
The plating method for an electronic component (60) according to claim 12 wherein:
the diameter dimension of the through hole (70) is greater than that of the lead wire (64).
The plating method for an electronic component (60) according to any of claims 12 or 13, further comprising:
pressing the electronic component (60) to the electrode pad side to press the lead wire (64) into a direction of the through hole (70).
The plating method for an electronic component (60) according to any of claims 9 to 14, further comprising:
conducting plating again after contact sites of the lead wire (64) with the inner wall face of the recessed hole (22) and with the polyhedral member (40) are deviated.