Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
  • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/032—Materials
  • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10106—Light emitting diode [LED]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
  • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Definitions

• the present invention relates to a light panel comprising a rigid substrate and light emitting diodes (LEDs).
• the invention is directed to a light panel whose coating comprises a reflective layer.
• a lighting device comprising a transparent glass backing board coated with electrically conductive strips on which light-emitting diodes emitting their light through the transparent support (US Pat. No. 6,270,236 B1) are mounted.
• This known device does not disclose a reflective layer.
• the object of the invention is to provide a light panel which is also a mirror by its visible light reflecting properties.
• the invention relates to a light panel as defined in claim 1.
• the light panel according to the invention comprises a rigid substrate.
• rigid substrate is meant here a solid body of flat shape, that is to say of small thickness compared to its other dimensions and mechanical resistance to bending and torsional stress sufficient to not deform under the action of external stresses that are commonly encountered in the environment
• the rigid substrates used generally withstand the wind, and bad weather in general, found in the environments where these panels are used, including ice and snow.
• the substrate can be in the form of a rigid plate made of a single material or on the contrary be the result of an assembly of several sheets
• the substrate comprises at least one glass sheet.
• the rigid substrate is coated with a coating comprising a layer that reflects the visible light in the direction and direction of observation by a user.
• this coating has a haze of at most 5% in its portion located on the observation side, that is to say on the side of the LED's light emission.
• the veil of a transparent medium is measured in light transmission and is directly related to the scattering of light in directions other than incident light radiation. It has a marked impact on the diffuse reflection of this medium when it is coated with a reflective layer due to the fact that any ray incident on the panel crosses twice the transparent medium before reaching the eye of the observer.
• the diffuse reflection measurement is therefore often taken for an estimation of the haze of a transparent medium coated with a reflective layer.
• a panel having a diffuse reflection coefficient R 1 of 0.1 to 1.5% is preferred. More preferably still are panels having a diffuse reflection R vd of 0.1 to 0.6%.
• the diffuse reflection coefficient is measured with a spectrophotometer equipped with an integrating sphere.
• a spectrophotometer of Perkin-Elmer ® 900 type gave excellent results.
• the front face of the panel whose web must be measured is applied tangentially to the sphere so as to close a small opening of its surface.
• a monochromatic incident ray delivered by a monochromator device of the spectrophotometer is directed to the sample to be measured closing the aperture in the sphere, at an angle of small value by perpendicular to the surface of the sample.
• An opposite aperture in the sphere in the direction of the low symmetrical angle on the other side of the perpendicular allows the output of the light beam speculatively reflected by the reflective surface of the sample, the sphere trapping all light rays diffuse reflected in any other direction.
• a photoelectric sensor located elsewhere on the surface of the sphere measures at an angle of observation of 10 ° the total diffuse monochromatic light integrated by the sphere.
• the diffuse reflection coefficient R ⁇ is then calculated as follows, by integrating all the monochromatic diffuse lights over the entire range of wavelengths of the visible spectrum:
• ⁇ ( ⁇ ) is the total spectral diffuse light
• V ( ⁇ ) is the spectral light sensitivity of an average human eye
• D65 ( ⁇ ) is the relative spectral distribution of the normalized illuminant
• the coating comprises an electro-conductive structure transparent to visible light and situated on the side of the reflecting face reflective layer.
• electro-conductive structure is meant an electroconductive layer of the pyrolytic type or obtained by vacuum magnetron sputtering ("magnetron sputtering").
• the electroconductive layer is a pyrolytic layer deposited on the surface of the glass at temperatures ranging from 500 to 750 ° C.
• the conductive pyrolytic layer has been deposited at temperatures of 570 to 660 ° C.
• a layer of this type can be deposited directly on the hot glass ribbon, at the exit of the step in which the molten glass floats on the surface of a liquid metal tin bath, in the well-known manufacturing process of float glass. Deposition can be done by spraying (spraying) fine drops of liquid or by chemical vapor deposition.
• the pyrolytic layer is a chemically deposited layer in the vapor phase.
• this pyrolytic layer is essentially SnO 2 doped with fluorine and / or antimony.
• a pyrolytic layer consisting essentially of fluorine-doped SnO 2 gave excellent results.
• the thickness of this pyrolytic layer must be carefully adapted to provide adequate surface electrical resistance. Thicknesses of the pyrolytic layer should advantageously be from 250 to 500 nm. A thickness of about 300 nm gave excellent results.
• the surface resistance of a conductive layer adapted to the invention is from 1 to 50 ⁇ / D. Preferably, this resistance is 1 to 15 ⁇ / D. Surface resistances of 1.5 to 12 ⁇ / D gave excellent results.
• the light transmission of such a pyrolytic conductive layer is generally not less than 50% and preferably not less than 75%, the measurement being made under standard illuminant D65 by the CIE (International Commission for Lighting) and with a solid angle of 2 °. Layers providing a light transmission of 76 to 79% gave excellent results.
• the conductive layer has a total surface roughness of 20 to 40 nm and preferably 20 to 30 nm. Total surface roughness (R) is the sum of the greatest height of the protuberances (R prot ) and the greatest depth of the wells (R p J measured using an atomic force microscope). last delivers individual heights h ⁇ for each point of the surface in two perpendicular directions i and j, R 1 can be calculated as follows:
• N is the total number of measurements.
• the electroconductive layer is a layer obtained by magnetron sputtering ("magnetron sputtering").
• the layer may be a soft layer consisting of a stack of the following elementary layers:
• TiO 2 / ZnO / Ag / Ti / ZnO / SnO 2 The surface resistance of these magnetron layers is generally from 1 to 20 ⁇ / D and preferably from 1 to 10 ⁇ / D. A surface resistance value of 5 ⁇ / D gave excellent results.
• the light transmission of such a conductive layer is generally not less than
• the magnetron conductive layer may also consist of a stack which comprises an Al-doped Zn electroconductive layer or an indium-doped indium oxide (“ITO" layer) layer.
• the surface resistance of these layers is about 4 to 50 ⁇ / D and preferably about 4 to 15 ⁇ / D.
• the light transmission of such a conductive layer applied to clear glass (4 mm thick) is generally not less than 80% and, preferably 84%, the measurement being made under standard illuminant D65 by the CIE (Commission International Lighting) and with a solid angle of 2 °.
• Pyrolytic layers are generally preferred to magnetron layers because of their higher mechanical resistance to scratching.
• the reflective layer of the panel may only partially reflect the incident visible light. This is for example the case of a mirror whose silver layer is not completely opaque and passes part of the light.
• one option is to arrange the LED's in such a way that their luminous flux is directed towards the partial reflecting layer in order to be able to easily cross it. In this way, a luminous mirror is made, which at the same time illuminates the objects it reflects. Instead of partially reflecting the incident visible light, the reflective layer of the panel can also fully reflect incident light and.
• Another variant is, on the contrary, the case of a mirror reflecting layer which totally reflects the incident visible light.
• This is for example the case of a lighting panel light in which a reflective layer is cut and absent on small areas to the right of each LED's.
• This is also the case of a panel in which a reflective layer is located at the rear of the LED's with respect to the direction of emission of the luminous flux, thus improving the intensity of the flux by reference of the non-directed light. in the direction of the main flow and that would be lost in the absence of this provision.
• the conductive layer may be merged with the reflective layer.
• the electrical supply connectors of each LED it is advantageous for the electrical supply connectors of each LED to be in contact with the electro-conductive structure.
• areas serving as power supply and evacuation tracks have been isolated from the remainder of the electrically conductive structure by thin insulating strips cut therein. These insulating strips could, for example be removed by the action of a laser beam. These insulating strips can be almost invisible to the naked eye.
• the width of an insulating strip is less than 150 ⁇ m, preferably less than 100 ⁇ m. In a particularly preferred manner, these strips have a width of less than 50 ⁇ m and most preferably less than 10 ⁇ m.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• General Engineering & Computer Science (AREA)
• Optical Elements Other Than Lenses (AREA)
• Illuminated Signs And Luminous Advertising (AREA)
• Laminated Bodies (AREA)

Priority Applications (1)

Applications Claiming Priority (3)

Publications (1)

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ID=37917348

Family Applications (2)

Family Applications Before (1)

Country Status (3)

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Family Cites Families (6)

• 2006
  • 2006-12-18 EP EP06126388A patent/EP1947378A1/de not_active Withdrawn
• 2007
  • 2007-12-17 EA EA200900843A patent/EA014486B1/ru not_active IP Right Cessation
  • 2007-12-17 EP EP07857704A patent/EP2095012A1/de not_active Withdrawn
  • 2007-12-17 WO PCT/EP2007/064074 patent/WO2008074777A1/fr active Application Filing

Non-Patent Citations (1)

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