EP2085681A2 - Dispositif d'éclairage à DEL, module de source lumineuse à DEL, et élément de support à DEL - Google Patents

Dispositif d'éclairage à DEL, module de source lumineuse à DEL, et élément de support à DEL Download PDF

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Publication number
EP2085681A2
EP2085681A2 EP09151178A EP09151178A EP2085681A2 EP 2085681 A2 EP2085681 A2 EP 2085681A2 EP 09151178 A EP09151178 A EP 09151178A EP 09151178 A EP09151178 A EP 09151178A EP 2085681 A2 EP2085681 A2 EP 2085681A2
Authority
EP
European Patent Office
Prior art keywords
foam
led
metal
layer
foam metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09151178A
Other languages
German (de)
English (en)
Inventor
Xue-Yong Liu
Hong-Xian Lou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Andy Optoelectronic Co Ltd
Original Assignee
Ningbo Andy Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Andy Optoelectronic Co Ltd filed Critical Ningbo Andy Optoelectronic Co Ltd
Publication of EP2085681A2 publication Critical patent/EP2085681A2/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a light emitting diode (LED) illuminating structure, and more particularly to a LED illuminating device, a LED light source module, and a LED support member.
  • LED light emitting diode
  • LED light emitting diode
  • LED illuminating devices is a LED light source module having a plurality of LEDs installed on an aluminum (Al) substrate and arranged according to a predetermined manner, wherein the Al substrate is used to dissipate heat generated by the LEDs.
  • Al substrate is used to dissipate heat generated by the LEDs.
  • the thickness of the Al substrate must be increased.
  • the weight of the entire LED illuminating device may be inevitably increased, the operational convenience thereof may be lowered, and the manufacture cost thereof may be increased.
  • the foregoing shortcomings of high-power LED illuminating devices are apparent.
  • a high-power LED street lamp of 120 watts which is provided with a Al substrate for dissipating heat, has a weight about 9kg, wherein most of the weight is due to the thickness and height of the Al substrate increased for heat-dissipating purpose.
  • the weight of the entire street lamp is substantially increased, so that the installation and disassembly thereof is inconvenient and the material cost thereof is increased.
  • the Al substrate has too large integrated heat sinks, the demand of cast molds for the Al substrate may be increased. Meanwhile, the product yield thereof may be lowered, and the manufacture cost thereof may be substantially increased.
  • the heat-dissipation efficiency of the entire street lamp can not be enhanced to an ideal value.
  • a primary object of the present invention is to provide a LED illuminating device, which includes a housing and a LED light source module which has a plurality of LEDs and a LED support member.
  • the LEDs are installed on the LED support member which is provided with a foam metal layer and a metal support layer having at least one portion for supporting the LEDs.
  • the foam metal layer is made of foam metal having porous structures, the metal support layer is formed on a portion of a surface of the foam metal layer, and the metal support layer and the foam metal layer are connected to each other.
  • a secondary object of the present invention is to provide a LED light source module, which includes a plurality of LEDs and a LED support member.
  • the LEDs are installed on the LED support member which is provided with a foam metal layer and a metal support layer having at least one portion for supporting the LEDs.
  • the foam metal layer is made of foam metal having porous structures, the metal support layer is formed on a portion of a surface of the foam metal layer, and the metal support layer and the foam metal layer are connected to each other.
  • a third object of the present invention is to provide a LED support member, which is used to support a plurality of LEDs.
  • the LED support member includes a foam metal layer and a metal support layer having at least one portion for supporting the LEDs.
  • the foam metal layer is made of foam metal having porous structures, the metal support layer is formed on a portion of a surface of the foam metal layer, and the metal support layer and the foam metal layer are connected to each other.
  • the foam metal is foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, or foam aluminum alloy.
  • the foam metal has 10-50 micro-pores per inch.
  • the metal support layer is a solid metal layer made of the same metal material as the foam metal.
  • a cooling fan is mounted on a surface of the foam metal layer different from the surface thereof formed with the metal support layer or received in a receiving space defined by the foam metal layer.
  • remaining surfaces of the foam metal layer different from the surface thereof formed with the metal support layer has at least one covered portion.
  • the metal support layer is connected to the foam metal layer by electro-plating.
  • the LED support member of the LED illuminating device according to the present invention is improved, wherein the surface of the foam metal layer is formed with the metal support layer, and the LEDs are installed on the metal support layer through a printed circuit board.
  • the heat generated by the LEDs is speedily transmitted to the foam metal layer through the metal support layer.
  • the foam metal layer provides 3-dimensional webbed structures therein, so as to substantially increase surface area of the foam metal layer for being in contact with external air.
  • the heat-dissipation efficiency can be improved.
  • the foam metal layer made of foam metal is advantageous to save considerable metal material, so as to substantially lower the weight of the entire LED illuminating device and the manufacture cost thereof, and enhance the convenience thereof.
  • Fig. 1 is an assembled perspective view of a LED light source module in a LED illuminating device according to a first embodiment of the present invention
  • Fig. 2 is an assembled perspective view of a LED light source module in a LED illuminating device according to a second embodiment of the present invention
  • Fig. 3 is another perspective view of the LED light source module in the LED illuminating device, as shown in Fig. 2 ;
  • Fig. 4 is an assembled perspective view of a LED light source module in a LED illuminating device according to a third embodiment of the present invention.
  • Fig. 5 is an assembled perspective view of a LED light source module in a LED illuminating device according to a fourth embodiment of the present invention.
  • Fig. 6 is an assembled perspective view of a LED light source module in a LED illuminating device according to a fifth embodiment of the present invention.
  • Fig. 7 is a schematic view of the LED illuminating device according to the first embodiment of the present invention.
  • the LED illuminating device 9 comprises a housing 7 and a LED light source module 8 which has a LED light source 1 and a LED support member 2.
  • the LED light source 1 comprises a plurality of LEDs (not-shown) and a plurality of printed circuit boards 10 made of high thermal conductive material (such as aluminum) for supporting the LEDs.
  • the LEDs are arranged on each of the printed circuit boards 10 to define a plurality of LED illuminating strips (unlabeled).
  • each of the LEDs can be provided with a lens means 11 according to an actual desire.
  • the LED support member 2 comprises a foam metal layer 21 and a metal support layer 20 having at least one portion for supporting the LEDs.
  • the foam metal layer 21 is made of foam metal having porous structures, such as foam iron, foam copper, foam aluminum, foam iron alloy, foam copper alloy, foam aluminum alloy, and etc, wherein the foam metal has about 10-50 micro-pores per inch.
  • the foam metal layer 21 is made of foam copper
  • the metal support layer 20 is formed on a portion of a surface of the foam metal layer 21.
  • the metal support layer 20 is a solid metal layer made of the same metal material as the foam metal.
  • the foam metal layer 21 is made of foam copper
  • the metal support layer 20 is a solid metal layer made of copper.
  • the metal support layer 20 and the foam metal layer 21 are connected to each other.
  • the metal support layer 20 is connected to the foam metal layer 21 by electro-plating.
  • the LEDs are mounted on the LED support member 2 through the printed circuit board 10.
  • the LEDs are mounted on the metal support layer 20 through the printed circuit board 10 which is tightly in contact with the metal support layer 20 to increase the surface area therebetween.
  • a thermal conductive material (such as a thermal conductive adhesive) can be optionally disposed between the printed circuit board 10 and the metal support layer 20.
  • the foam metal layer 21 provides 3-dimensional webbed structures therein, so as to substantially increase surface area of the foam metal layer 21 for being in contact with external air.
  • the heat-dissipation efficiency can be improved.
  • the foam metal layer 21 made of foam metal is advantageous to save considerable metal material, so as to substantially lower the weight of the entire LED illuminating device 9 and the manufacture cost thereof, and enhance the convenience thereof.
  • the LED illuminating device of the second embodiment comprises a LED light source module 8' different from that of the first embodiment.
  • the LED light source module 8' has a LED support member 2 which is further provided with a cooling fan 23.
  • the cooling fan 23 is mounted on a surface of the foam metal layer 21 different from the surface thereof formed with the metal support layer 20.
  • the cooling fan 23 is mounted on a surface of the foam metal layer 21 opposite to the surface formed with the metal support layer 20.
  • the cooling fan 23 rotates, and the foam metal layer 21 made of foam metal having porous structures can provide 3-dimensional webbed structures and micro-pores therein.
  • the foam metal layer 21 made of foam metal having porous structures can provide 3-dimensional webbed structures and micro-pores therein.
  • the LED illuminating device of the third embodiment comprises a LED light source module 8" different from that of the second embodiment.
  • the LED light source module 8" is provided with a cooling fan 23.
  • the cooling fan 23 is mounted on a side surface of the foam metal layer 21 adjacent to the surface thereof formed with the metal support layer 20.
  • the operational principle of the LED illuminating device of the third embodiment is similar to that of the second embodiment, so that the description thereof will be omitted hereinafter.
  • the LED illuminating device of the fourth embodiment comprises a LED light source module 8"' different from that of the first embodiment.
  • the LED light source module 8"' has a foam metal layer 21 which has a side surface covered by a thermal insulation plate 25.
  • the thermal insulation plate 25 covers a desired side surface of the foam metal layer 21 according to an actual position of a heat source and a possible position of a cooling fan 23, so as to provide a better heat-dissipation efficiency and efficiently solve the problem of partial concentration of the heat source.
  • the covered side surface of the foam metal layer 21 is determined according to the actual position of the heat source. For example, a side surface of the foam metal layer 21 which the heat source is close to may keep open, while the remaining side surfaces thereof are covered by the thermal insulation plate 25.
  • the cooling fan 23 operates, air mainly flows through the side surface of the foam metal layer 21 where the heat source is close to, so as to efficiently solve the problem of partial concentration of the heat source.
  • the LED illuminating device of the fifth embodiment comprises a LED light source module 8"" different from that of the first embodiment.
  • the LED light source module 8"" has a cooling fan 23 received in a receiving space (unlabeled) defined by a foam metal layer 21.
  • the operational principle of the LED illuminating device of the fifth embodiment is similar to that of the second embodiment, so that the description thereof will be omitted hereinafter.
EP09151178A 2008-01-31 2009-01-23 Dispositif d'éclairage à DEL, module de source lumineuse à DEL, et élément de support à DEL Withdrawn EP2085681A2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2008100333273A CN101220934A (zh) 2008-01-31 2008-01-31 Led照明装置

Publications (1)

Publication Number Publication Date
EP2085681A2 true EP2085681A2 (fr) 2009-08-05

Family

ID=39630932

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09151178A Withdrawn EP2085681A2 (fr) 2008-01-31 2009-01-23 Dispositif d'éclairage à DEL, module de source lumineuse à DEL, et élément de support à DEL

Country Status (4)

Country Link
EP (1) EP2085681A2 (fr)
JP (1) JP2009182327A (fr)
KR (1) KR20090084689A (fr)
CN (1) CN101220934A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2400252A1 (fr) * 2010-06-24 2011-12-28 Valeo Vision Dispositif à échange de chaleur, notamment pour véhicule automobile
FR2965042A1 (fr) * 2010-09-22 2012-03-23 Valeo Vision Dispositif a echange de chaleur, notamment pour vehicule automobile
US10378750B2 (en) * 2015-01-12 2019-08-13 Xyzed Lighting module with diodes having improved cooling

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574671B2 (ja) * 2009-11-05 2014-08-20 キヤノン株式会社 Ｕｓｂホスト装置、制御方法、及びプログラム
CN102661505A (zh) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 一种设有金属散热装置的大功率led平板灯具
CN102661504A (zh) * 2012-05-02 2012-09-12 浙江全加好科技有限公司 一种设有金属散热装置的大功率led筒灯
CN104315486A (zh) * 2013-04-20 2015-01-28 大连三维传热技术有限公司 SiO2纳米液体工质的泡沫金属吸液芯热板散热器
CN103727506A (zh) * 2013-12-13 2014-04-16 青岛威力电子科技有限公司 Led光源承载体的高效散热方法
CN105177339B (zh) * 2015-10-26 2016-12-07 三峡大学 一种三维空间有序孔结构泡沫铝及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2404009B (en) * 2003-07-17 2005-06-15 Enfis Ltd Cooling method and apparatus
US9412926B2 (en) * 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2400252A1 (fr) * 2010-06-24 2011-12-28 Valeo Vision Dispositif à échange de chaleur, notamment pour véhicule automobile
FR2961894A1 (fr) * 2010-06-24 2011-12-30 Valeo Vision Dispositif a echange de chaleur, notamment pour vehicule automobile
US9103605B2 (en) 2010-06-24 2015-08-11 Valeo Vision Heat exchange device
FR2965042A1 (fr) * 2010-09-22 2012-03-23 Valeo Vision Dispositif a echange de chaleur, notamment pour vehicule automobile
EP2434246A1 (fr) * 2010-09-22 2012-03-28 Valeo Vision Dispositif à échange de chaleur, notamment pour véhicule automobile
US10378750B2 (en) * 2015-01-12 2019-08-13 Xyzed Lighting module with diodes having improved cooling

Also Published As

Publication number Publication date
JP2009182327A (ja) 2009-08-13
KR20090084689A (ko) 2009-08-05
CN101220934A (zh) 2008-07-16

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