EP2070401A1 - Switched mode power supply - Google Patents
Switched mode power supplyInfo
- Publication number
- EP2070401A1 EP2070401A1 EP07787313A EP07787313A EP2070401A1 EP 2070401 A1 EP2070401 A1 EP 2070401A1 EP 07787313 A EP07787313 A EP 07787313A EP 07787313 A EP07787313 A EP 07787313A EP 2070401 A1 EP2070401 A1 EP 2070401A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- power supply
- switching power
- piezoelectric fan
- transformer
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004804 winding Methods 0.000 claims abstract description 23
- 230000005284 excitation Effects 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 230000007613 environmental effect Effects 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 239000002245 particle Substances 0.000 abstract description 3
- 238000011109 contamination Methods 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D33/00—Non-positive-displacement pumps with other than pure rotation, e.g. of oscillating type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
- H02M3/28—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate ac
Definitions
- the invention relates to a switching power supply with a transformer, which comprises at least one primary winding which is connectable via a switching element to a DC voltage and which comprises at least one secondary winding which is connectable via a least one diode comprehensive rectifier circuit to a load.
- Switching power supplies are known in various forms and serve to connect electrical loads to a power grid or to a power source. For example, a distinction is made between switched-mode power supplies which operate as flyback converters, as push-pull converters or as flux converters, etc. Electrical energy is transferred from a primary side to a secondary side via a transformer. In this case, the voltage applied on the primary side is clocked by means of a switching element, wherein the clock frequency is a multiple of the
- Mains frequency corresponds. Due to the high clock frequency of the transformer can be designed to be correspondingly small.
- US 2003/0107907 describes a switching power supply that uses the parasitic energy of the switching element to drive a fan.
- switching-mode power supplies usually use natural air convection for cooling.
- ventilation openings are arranged in the switching power supply housing, escape through the heated air up and fresh air can flow from below.
- the arrangement of the heat-generating components within the housing usually depends on the prevailing flow conditions.
- JP 2001 095 233 for example, the arrangement of several converter modules is described within a switching power supply unit housing. The higher power converter modules are better cooled by this arrangement than the lower power converter modules.
- heat sinks may be arranged which are thermally connected to components to be cooled and deliver heat to the environment.
- JP 2005 033 088 describes the arrangement of cooling fins that protrude from a housing, thus dissipating heat from switching power supply components to the environment.
- Other known measures for cooling of switching power supplies relate to the design of individual heat-generating components.
- US 2004/0080393 discloses a ring transformer for use in switching power supplies, in which the winding material is arranged favorably for heat dissipation.
- JP 2006041314 Al a special expression of the winding material for transformers in a switching power supply is described.
- the invention has for its object to provide a solution for cooling power generating components for switching power supplies, the design effort, the maintenance and energy consumption should be low and with no pollution due to excessive cooling air flow.
- Switching power supply comprises at least one piezoelectric fan, which causes an air flow at the transformer and / or on the switching element and / or on the diode.
- a piezo fan for use in a switched-mode power supply lies in the mode of operation;
- the generated air flow is directed to the components to be cooled, the air flow remains low overall and thus no pollution caused by dirt particles in the air.
- a piezo fan consumes only very little energy, whereby the effect on the efficiency of the switching power supply is negligible.
- the simple design of a piezo fan also allows a simple structural arrangement within a switching power supply.
- a microcontroller for driving the switching element and the at least one piezoelectric fan. This microcontroller can then be used in a simple manner to implement various control requirements.
- a further advantageous embodiment of the invention provides that the at least one piezoelectric fan is formed from a substantially strip-shaped wing, wherein one end of the wing is arranged freely oscillating and a second end of the wing is held in a holder and wherein the wing electrically conductive one
- Control unit is connected.
- piezo fans are already available in reliable quality on the market and can be mounted in a simple manner.
- the switching power supply comprises an even number of piezo fans, which are arranged in such a way that cancel the inertial forces of the free-swinging ends of the wings at the same synchronous excitation of the wings.
- the holder of the at least one piezoelectric fan is rigidly connected to the transformer.
- the heat sink serves as a counterweight for the piezo fan and is cooled directly by the generated air flow.
- the circuit elements which are in thermal contact with the heat sink are cooled.
- the at least one piezoelectric fan is set into oscillation by means of a drive signal having a predetermined excitation frequency. In this way it is ensured that the air flow generated by the piezo fan is always adaptable to the thermal conditions in the switching power supply.
- the drive signal is formed by means of microcontroller.
- Switched-mode power supplies usually have a programmable microcontroller which can be used without additional hardware expenditure for generating a suitable drive signal of the piezoelectric fan.
- a sinusoidal signal is generated as a drive signal. Due to its function as a control unit for the switched-mode power supply, with the requirement of a sinusoidal current drain, the microcontroller of a switched-mode power supply is particularly suitable for generating sinusoidal signals, e.g. using D / AWandler or as a smoothed or filtered PWM signal.
- the mechanical vibration form of the wing is essentially sinusoidal, which is why a sinusoidal
- Control signal the mechanical stress of the wing keeps low.
- Switching power supplies are therefore particularly suitable for the use of piezo fans.
- An advantageous embodiment of the method also provides that the power consumption of the at least one piezoelectric fan is detected as a function of the excitation frequency by means of microcontrollers, so that a resonance frequency is detected at maximum power consumption. Since the resonance frequency for each individual piezo fan can vary slightly, this method ensures that the resonance frequency of the piezo fan installed in the switched-mode power supply is available as a control variable.
- the ambient temperature changing resonant frequency is reset at predetermined intervals and that when commissioning the switching power supply, the last set resonant frequency is specified as the excitation frequency.
- Time intervals for adjusting the resonance frequency can be very short, so that the piezo fan is constantly operated with changing maximum environmental conditions under changing environmental conditions.
- the microcontroller for predetermined excitation frequencies and associated tolerance values those power values are programmed, which are detected at undamaged, free-swinging wing of the at least one piezoelectric fan and that during operation, the frequency of the control signal is changed at predetermined intervals, so that changed resonance frequencies are detected. This is immediately recognized in the microcontroller when the
- Resonance frequency of the piezo fan changes beyond the tolerance limits, which is usually due to a crack of the wing or due to foreign body contact. There are thus created the conditions to turn off the switching power supply in critical condition of the piezoelectric fan before components of the switching power supply damage and the event can be signaled to a maintenance or operating personnel.
- Fig. 1 arrangement of switching power supply elements with respect to a piezoelectric fan. 8
- FIG. 4 view A to the arrangement shown in Figure 3
- Fig. 5 bobbin 12 according to the arrangement shown in Figure 3 Fig. 6 first alternative arrangement of a piezoelectric fan 8 to a transformer. 1
- FIG. 7 bobbin 12a according to the arrangement shown in Figure 6
- FIG. 10 Arrangement of two piezo fans 8 on a block-shaped heat sink 18
- FIG. 11 Transformer 1 with a plurality of piezo fans 8
- FIG. 1 the spatial arrangement of the heat generating elements of a switching power supply is shown greatly simplified.
- a transformer 1 On a circuit carrier 7, a transformer 1, a primary-side switching element 4, a capacitor 3 (eg, an electrolytic capacitor) and a secondary-side diode 2 are arranged.
- the secondary-side diode 2 is thermally connected to a first heat sink 5 and the primary side
- Switching element 4 is coupled to a second heat sink 6.
- the first heat sink 5 additionally serves as a receptacle for the holder 9 of a piezoelectric fan 8.
- the vane 10 of the piezoelectric fan 8 has with its freely oscillating end in the direction of transformer 1.
- the transformer 1 is thus in the main flow direction of the air flow generated by the piezoelectric fan 8. Since the piezoelectric fan 8 generates a widely scattering air flow, the elements arranged laterally of the piezoelectric fan 8 are also ventilated and thus cooled.
- the supply voltage for the piezo fan is, for example, derived directly from the output voltage, if the potential position on the secondary side does not represent an insulation problem. Alternatively, provision should be made by means of a primary auxiliary supply.
- To generate the excitation signal is either a separate circuit, for example, provided on an integrating into the holder 9 circuit carrier or
- Excitation signal is generated by microcontroller.
- the switching power supply has a suitable microcontroller for controlling the primary-side switching element 4. It is important to ensure that the wing 10 is operated within the elastic limit to avoid material fatigue.
- the use of the microcontroller has the advantage that a sinusoidal excitation signal can be generated in a simple manner (for example by means of a D / A converter or as a smoothed PWM signal), whereby the mechanical load of the piezo-buffer 8 is reduced compared to an example trapezoidal excitation signal. Thus, the life of the piezo-blower 8 is increased. The noise is also lower with sinusoidal excitation.
- the control by microcontroller also allows the storage of the slightly varying for each piezoelectric 8 resonant frequency. This is determined for example for each device in such a way that the piezoelectric fan is operated over a predetermined frequency range and then the frequency with the highest power consumption is stored as the resonance frequency.
- the resonant frequency can then be determined at predetermined time intervals in this manner and compared with the stored value. A change in the resonant frequency over predetermined
- Tolerance limits (to account for small changes due to changed environmental conditions) indicate a disturbance, such as a crack in the wing 10 or a foreign body collision.
- the switching power supply can then be switched off automatically and the error corrected.
- a separate circuit for generating the excitation signal may be integrated in the piezo fan, but as a rule a trapezoidal signal is provided.
- Figure 2 shows a trained as an angle profile Kuhlelement 5a.
- the Kuhlelement 5a is attached to the circuit carrier, not shown.
- Thermally coupled to the second, orthogonal away from the circuit carrier angle leg is for example the diode 2 at.
- This angle leg also has a rectangular opening into which the piezo fan 8 in the Way is used, that the wing 10 largely fills the breakthrough and has the free-swinging end of the blade 10 in the direction of the diode 2.
- the diode 2 and the region of the heat sink 5 a directly in contact with it are ventilated directly by the piezo fan and thus cooled.
- an embodiment of the switching element 4 or a combined arrangement is possible.
- an optional stiffening 11 is provided on the front side.
- FIG. 3 shows the arrangement of a piezo fan 8 on a transformer 1.
- the transformer 1 consists of a bobbin 12, windings 13 - usually a primary winding and a secondary winding - and a mostly three-legged core 14.
- the bobbin 12 is for example an injection molded part made of plastic as shown in Figure 5.
- Bobbin 12 for wrapping the windings is formed of a hollow square tube with rectangular flanges on the end faces. In the cavity of the square tube, the middle leg of the core 14 is arranged, whereas the two outer legs of the core 14 rest laterally on the bobbin 12.
- FIG. 7 Another embodiment of an attachment of the piezoelectric fan 8 to the transformer 1 is shown in FIG.
- a coil body 12a designed as an injection molded part, as shown in FIG. 7, is provided.
- an angled extension is arranged, which has a rectangular opening for receiving the piezoelectric fan 8 and is angled at its end again, so that with this end a support on the circuit carrier 1 not shown here is given.
- the extension of the bobbin 12a thus essentially forms a bridge pointing away from the transformer, wherein further circuit elements to be cooled can be arranged in the free space under this bridge on the circuit carrier.
- the piezoelectric fan 8 is arranged in such a way that the wing 10 largely fills the rectangular opening of the extension, with the freely oscillating end of the wing 10 pointing in the direction of windings 13. It is important to ensure that in the assembled state, a distance between the free-swinging wing end and the windings 13 surrounding core 14 is present.
- the windings 13 and the core 14 is mitgekühlt amplified.
- the additional support of the Fortsatzes on the circuit board prevents it in conjunction with the stabilizing mass of the transformer 1 disturbing vibrations due to the piezoelectric oscillations.
- the cooling effect is not limited to the transformer 1, but also aims at other in the region of the piezoelectric fan 8 can be arranged circuit elements.
- FIG. 9 Another embodiment of an attachment of the piezoelectric fan 8 to the transformer 1 is shown in FIG.
- the arrangement corresponds essentially to that illustrated in FIG. 5 with the difference that the extension of the bobbin 12b, as shown in FIG. 9, has no fold for support on the circuit carrier 7.
- the extension of the bobbin 12b has no fold for support on the circuit carrier 7.
- the end of the extension is connected to the circuit carrier 7 by means of a support element 16. Under the extension thus again a free space is available, which is available for the arrangement of further circuit elements to be cooled.
- the support member 16 is connected for example in a simple manner by means of plastic clips 17 to the circuit carrier.
- a fastening variant of two piezo fans 8, shown in FIG. 10, is provided.
- a fastening element 18, which may also be designed as a cooling element two piezoelectric fans 8 are arranged laterally in such a way that the
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Dc-Dc Converters (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006046982 | 2006-10-04 | ||
PCT/EP2007/057038 WO2008040578A1 (en) | 2006-10-04 | 2007-07-10 | Switched mode power supply |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2070401A1 true EP2070401A1 (en) | 2009-06-17 |
Family
ID=38582022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07787313A Withdrawn EP2070401A1 (en) | 2006-10-04 | 2007-07-10 | Switched mode power supply |
Country Status (7)
Country | Link |
---|---|
US (1) | US8106567B2 (en) |
EP (1) | EP2070401A1 (en) |
JP (1) | JP4878388B2 (en) |
KR (1) | KR20090086398A (en) |
CN (1) | CN101524010B (en) |
RU (1) | RU2400951C1 (en) |
WO (1) | WO2008040578A1 (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102130081A (en) * | 2010-01-12 | 2011-07-20 | 富瑞精密组件(昆山)有限公司 | Heat-radiating device and air current generating device thereof |
DE102012200925A1 (en) * | 2012-01-23 | 2013-07-25 | Siemens Aktiengesellschaft | Electric power transmission device with a movable blade and method for moving a sheet |
US11156235B2 (en) * | 2012-07-05 | 2021-10-26 | Tai-Her Yang | Thermal transferring method and structural device utilizing thermal energy body performing vibration displacement (relative) to fluid |
EP2722975B1 (en) | 2012-10-16 | 2017-06-28 | ABB Research Ltd. | Cooled electrical assembly |
GB201220471D0 (en) * | 2012-11-14 | 2012-12-26 | Technology Partnership The | Pump |
CN103857225B (en) * | 2012-12-03 | 2017-03-01 | 联想(北京)有限公司 | A kind of electronic equipment |
US10280945B2 (en) * | 2013-02-01 | 2019-05-07 | Alcatel Lucent | Device for moving air |
TW201526770A (en) * | 2013-12-17 | 2015-07-01 | Wistron Corp | Heat dissipation device and control method thereof |
EP2960522A1 (en) * | 2014-06-27 | 2015-12-30 | Alcatel Lucent | Apparatus and method for operating an oscillation blade device and a system comprising the apparatus |
EP2960521A1 (en) * | 2014-06-27 | 2015-12-30 | Alcatel Lucent | Apparatus comprising an oscillation blade fan and method for cleaning the oscillation blade fan |
EP3010320B8 (en) * | 2014-10-13 | 2020-06-10 | Vitesco Technologies GmbH | Device for cooling an electronic control unit and control device for a motor vehicle |
EP3171038B1 (en) * | 2015-11-18 | 2019-01-02 | Alcatel Lucent | Apparatus and method for operating an oscillation blade device and a system comprising the apparatus |
TWM521322U (en) * | 2015-12-18 | 2016-05-01 | Xian-Qin Su | Heat dissipation device and swing structure thereof |
KR102397389B1 (en) | 2016-09-02 | 2022-05-12 | 젠텍스 코포레이션 | How to cool a full display mirror |
CN111918792B (en) | 2018-03-27 | 2023-09-26 | 金泰克斯公司 | Full display mirror with integrated cooling system |
TWI667871B (en) * | 2018-08-07 | 2019-08-01 | 國立交通大學 | Fan device |
DE102021119120A1 (en) * | 2020-08-12 | 2022-02-17 | Defond Components Limited | COOLING SYSTEM FOR COOLING AN ELECTRONIC COMPONENT OF AN ELECTRICAL DEVICE |
DE102023201451A1 (en) | 2023-02-20 | 2024-08-22 | Siemens Aktiengesellschaft | Electronic module and cooling system |
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DE3532360A1 (en) | 1985-09-11 | 1987-03-19 | Hoechst Ag | METHOD FOR PRODUCING TERTIA PHOSPHANOXIDES |
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SU1679958A1 (en) | 1988-04-19 | 2004-11-10 | Г.М. Робин | DEVICE FOR AIR COOLING OF RADIO ELECTRONIC BLOCKS ON AIRCRAFT |
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-
2007
- 2007-07-10 RU RU2009116654/09A patent/RU2400951C1/en not_active IP Right Cessation
- 2007-07-10 CN CN200780037090XA patent/CN101524010B/en not_active Expired - Fee Related
- 2007-07-10 EP EP07787313A patent/EP2070401A1/en not_active Withdrawn
- 2007-07-10 KR KR1020097009211A patent/KR20090086398A/en not_active Application Discontinuation
- 2007-07-10 US US12/311,147 patent/US8106567B2/en not_active Expired - Fee Related
- 2007-07-10 JP JP2009529623A patent/JP4878388B2/en not_active Expired - Fee Related
- 2007-07-10 WO PCT/EP2007/057038 patent/WO2008040578A1/en active Application Filing
Non-Patent Citations (2)
Title |
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None * |
See also references of WO2008040578A1 * |
Also Published As
Publication number | Publication date |
---|---|
US8106567B2 (en) | 2012-01-31 |
CN101524010B (en) | 2012-11-14 |
KR20090086398A (en) | 2009-08-12 |
JP2010505375A (en) | 2010-02-18 |
US20100038994A1 (en) | 2010-02-18 |
WO2008040578A1 (en) | 2008-04-10 |
JP4878388B2 (en) | 2012-02-15 |
RU2400951C1 (en) | 2010-09-27 |
CN101524010A (en) | 2009-09-02 |
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