EP2059349A4 - Nanoscopic assurance coating for lead-free solders - Google Patents
Nanoscopic assurance coating for lead-free soldersInfo
- Publication number
- EP2059349A4 EP2059349A4 EP07870739A EP07870739A EP2059349A4 EP 2059349 A4 EP2059349 A4 EP 2059349A4 EP 07870739 A EP07870739 A EP 07870739A EP 07870739 A EP07870739 A EP 07870739A EP 2059349 A4 EP2059349 A4 EP 2059349A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- nanoscopic
- lead
- free solders
- assurance coating
- assurance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82279206P | 2006-08-18 | 2006-08-18 | |
PCT/US2007/018121 WO2008073159A2 (en) | 2006-08-18 | 2007-08-15 | Nanoscopic assurance coating for lead-free solders |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2059349A2 EP2059349A2 (en) | 2009-05-20 |
EP2059349A4 true EP2059349A4 (en) | 2010-12-22 |
Family
ID=39512240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07870739A Withdrawn EP2059349A4 (en) | 2006-08-18 | 2007-08-15 | Nanoscopic assurance coating for lead-free solders |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2059349A4 (en) |
JP (1) | JP5221539B2 (en) |
KR (1) | KR20090051741A (en) |
SG (1) | SG176498A1 (en) |
TW (1) | TW200831623A (en) |
WO (1) | WO2008073159A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100012708A1 (en) * | 2008-07-16 | 2010-01-21 | Schlumberger Technology Corporation | Oilfield tools comprising modified-soldered electronic components and methods of manufacturing same |
DE102008036090B4 (en) * | 2008-08-04 | 2020-01-30 | Te Connectivity Germany Gmbh | Electrical contact pairing and method for producing and contacting such |
CN102019514A (en) * | 2010-06-01 | 2011-04-20 | 重庆大学 | Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof |
US10162393B2 (en) | 2016-01-13 | 2018-12-25 | Seagate Technology Llc | Electrical connector with force balancing |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4490496A (en) * | 1980-04-21 | 1984-12-25 | Hitachi Chemical Co., Ltd. | Moistureproof insulating coating composition for packing circuit boards |
EP1325946A2 (en) * | 2001-12-14 | 2003-07-09 | Shin-Etsu Chemical Co., Ltd. | Coating composition for the protection of packaging and interconnecting boards |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2738303B2 (en) * | 1994-07-15 | 1998-04-08 | 株式会社デンソー | Manufacturing method of electronic component mounted circuit board |
CA2143606C (en) * | 1995-02-24 | 1999-07-20 | Peter Arrowsmith | Method of making electronic housings more reliable by preventing formation of metallic whiskers on the sheets used to fabricate them |
US5753374A (en) * | 1995-11-27 | 1998-05-19 | Dow Corning Corporation | Protective electronic coating |
US6376769B1 (en) * | 1999-05-18 | 2002-04-23 | Amerasia International Technology, Inc. | High-density electronic package, and method for making same |
JP2001189109A (en) * | 2000-01-05 | 2001-07-10 | Sumitomo Bakelite Co Ltd | Resin composition for insulator, and insulator using the same |
US7101617B2 (en) * | 2003-07-10 | 2006-09-05 | Motorola, Inc. | Silicone dispensing with a conformal film |
JP2005322659A (en) * | 2004-05-06 | 2005-11-17 | Matsushita Electric Ind Co Ltd | Wiring board, its manufacturing method and semiconductor device |
US20060104855A1 (en) * | 2004-11-15 | 2006-05-18 | Metallic Resources, Inc. | Lead-free solder alloy |
TW200630447A (en) * | 2004-11-19 | 2006-09-01 | Showa Denko Kk | Resin cured film for flexible printed wiring board and production process thereof |
WO2006086789A2 (en) * | 2005-02-14 | 2006-08-17 | Hybrid Plastics, Inc. | Porosity control with polyhedral oligomeric silsesquioxanes |
-
2007
- 2007-08-15 SG SG2011085412A patent/SG176498A1/en unknown
- 2007-08-15 KR KR1020097003324A patent/KR20090051741A/en active IP Right Grant
- 2007-08-15 EP EP07870739A patent/EP2059349A4/en not_active Withdrawn
- 2007-08-15 JP JP2009525565A patent/JP5221539B2/en not_active Expired - Fee Related
- 2007-08-15 WO PCT/US2007/018121 patent/WO2008073159A2/en active Application Filing
- 2007-08-17 TW TW096130502A patent/TW200831623A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4490496A (en) * | 1980-04-21 | 1984-12-25 | Hitachi Chemical Co., Ltd. | Moistureproof insulating coating composition for packing circuit boards |
EP1325946A2 (en) * | 2001-12-14 | 2003-07-09 | Shin-Etsu Chemical Co., Ltd. | Coating composition for the protection of packaging and interconnecting boards |
Non-Patent Citations (1)
Title |
---|
See also references of WO2008073159A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2008073159A3 (en) | 2008-08-07 |
WO2008073159A2 (en) | 2008-06-19 |
KR20090051741A (en) | 2009-05-22 |
JP2010502011A (en) | 2010-01-21 |
JP5221539B2 (en) | 2013-06-26 |
TW200831623A (en) | 2008-08-01 |
EP2059349A2 (en) | 2009-05-20 |
SG176498A1 (en) | 2011-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20090317 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK RS |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: B05D 5/12 20060101AFI20090603BHEP |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20101124 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20130301 |