EP2043861A2 - Multilayered body comprising an electroconductive polymer layer and method for the production thereof - Google Patents

Multilayered body comprising an electroconductive polymer layer and method for the production thereof

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Publication number
EP2043861A2
EP2043861A2 EP20070801436 EP07801436A EP2043861A2 EP 2043861 A2 EP2043861 A2 EP 2043861A2 EP 20070801436 EP20070801436 EP 20070801436 EP 07801436 A EP07801436 A EP 07801436A EP 2043861 A2 EP2043861 A2 EP 2043861A2
Authority
EP
Grant status
Application
Patent type
Prior art keywords
layer
transfer
characterized
electrically conductive
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20070801436
Other languages
German (de)
French (fr)
Inventor
Walter Lehnberger
Ulrich Schindler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurz Leonhard Stiftung and Co KG
Original Assignee
Kurz Leonhard Stiftung and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/20Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
    • B32B37/203One or more of the layers being plastic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/12Photovoltaic modules
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00Labels, badges
    • B32B2519/02RFID tags
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025Transfer laminating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1002Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y10T156/1041Subsequent to lamination
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372Particulate matter
    • Y10T428/24413Metal or metal compound
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24893Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including particulate material
    • Y10T428/24909Free metal or mineral containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31855Of addition polymer from unsaturated monomers

Abstract

The invention relates to a method for producing a multilayered body (4) comprising an electroconductive layer (421) arranged on a carrier layer (41). According to said method, a transfer film (5) comprising a transfer layer (52) consisting of an electroconductive polymer is provided. The electroconductive layer is transferred from the transfer film (5) to the multilayered body (4). The invention also relates to a transfer film and a multilayered body produced using said method.

Description

Multi-layer body with conductive polymer layer

The invention relates to a multilayer body with an electrically conductive polymer layer, a manufacturing method thereof, and a transfer foil for producing the multi-layer body.

Increasingly, conventional products and processes in the semiconductor industry to be replaced by products and processes with organic layers. Although organic semiconductors and conductors often do not meet all technical requirements, but significant progress are emerging, such as organic solar cells and polymer solar cells.

For the construction of organic solar cells, organic, inter alia,

required conductors and electrode layers whose electrical properties must be adjustable. It is known to adjust the electrical conductivity of organic layers electrochemically. However, the sets of mass production by the roll-to-roll process boundaries, a difference based on constant manufacturing conditions.

Electrically conductive polymers can frequently than dispersions with a low solids content. Exactly such dispersions not be influenced by Duck procedures or structured with quality losses muster because they usually have a water-like consistency.

The invention now has for its object to provide a multilayer body having electrically conductive organic films which are adjustable in their electrical properties without the use of chemical methods and to provide a suitable for the mass production process for forming a structured electrically conductive organic coatings.

The object of the invention is achieved by a method for producing a multilayer body having disposed on a carrier layer electrically conductive layer, it being provided that a transfer film with an electrically conductive polymer-containing transfer layer is provided, and that the electrically conductive layer by transferring the transfer layer is formed from the transfer film on the multilayer body. The object is further attained by a transfer film, preferably a stamping foil comprising a carrier layer and an electrically conductive transfer layer, it being provided that the transfer layer comprises N electron-conducting layers and N + 1 electrically conductive polymer layers wherein alternating an electrically conductive polymer layer, and an electron-conducting layer is arranged, and N> 1. The object is further achieved by a multilayer body having a patterned electrically conductive layer, it being provided that the electrically conductive layer of at least two superposed is electrically conductive polymer layers.

With the inventive method it is proposed to use a transfer film, the transfer layer is formed of an electrically conductive polymer.

Many quality problems are avoided in that the electrical properties of the electrically conductive layer are generally adjusted during the preparation of the polymer dispersion and / or the production of the transfer film. When transferring the transfer layer to the multilayer body in particular, the geometrical characteristics of the electrically conductive layer that is, the contour and the thickness of which now be determined. The contour of the electrically conductive layer can be formed by the inventive transfer layer with a high sharpness.

Further advantages arise in that a transfer foil is provided with a carrier layer and an electrically conductive transfer layer, which in addition to the electrically conductive polymer layer at least one electron-conducting layer. Through these electron-conducting layer, the electrical conductivity of the transfer layer of the transfer film can be significantly increased without having to sacrifice the advantages of easy transmission and the layered structure of conductive structures. For example, such antennas for RFID transponders can be embossed off, the antennas may have a good electrical efficiency due to the good conductivity of the transfer layer of the transfer film.

is further advantageous that, for example, the efficiency of the processes occurring in the organic semiconductor layer of an organic solar cell, photovoltaic effect may be enhanced with the aid of the electron-conducting layers, for example by reducing the work function. If, for example, in the electron-conducting layer is a thin semitransparent layer, it can be further protected in composite from oxidation, although the advantages such as light transmission and light transmission properties are present.

The multilayer body of the invention has an electrically conductive layer with a precisely controlled thickness with the thickness tolerance is substantially determined by the thickness of the transfer layer. Thus the conductivity of the electrical layer is for example set by the number of transmitted transmission layers. If n transfer layers are transferred, then, the thus formed electrically conductive layer to the n-times the conductivity of the data transmitted in every manufacturing step transfer layer. The resistance or sheet resistance can be calculated according to the equations of the parallel connection of resistors.

Transferring the transfer layer of the transfer film on the multilayer body may advantageously be provided in a roll-to-roll process. In the multi-layer body can be a film body sections are separated from the after completion of the manufacturing process, which are placed on the market.

Other advantageous features are indicated in the dependent claims. It can be provided that a non-filmed transfer layer is provided. A non filmed transfer layer does not form a related movie. The non filmed transfer layer has a powdery consistency when it is released with the thumb test from the carrier layer of the transfer film. This suggests the formation of break points in the transfer layer, resulting from the fact that the transmission layer is applied from a dispersion and then the dispersing agent is expelled at a temperature of 30 to 40 0 C rapidly. As a result, no coherent polymeric film is formed and the adhesion to the support film is so low that the transfer layer during the transfer can be easily detached. A filmed transfer layer is incomplete when transferred to the multilayer body or not detachable from the carrier film of the transfer film and / or undefined separated.

It can further be provided that the transfer layer (52) is formed as a polymer transfer layer.

It can further be provided that a transmission layer is provided in which the electrically conductive polymer is concentrated in domains, and the transfer layer along the domain boundaries is preferably separable. Electrically conductive polymers can be formed as mixtures and have structures in which the electrically conductive polymer forms domains which are embedded in a matrix of a second polymer. In the matrix, also the electrically conductive polymer may be present in low concentration. Conventional layers of the electrically conductive polymer form a cohesive film having no preferential fracture limits. In the inventive transmission layer may be an electrically conductive polymer layer in which the domain walls serve as predetermined breaking points against it, so that the transfer layer can be transferred structured. The domains can have a cigar-shaped profile with the dimensions of 500 nm x 1000 nm, for example, in the plan view. However, it may also be circular domains, wherein the thickness of the domains can be substantially determined by the thickness of the transfer layer. The domains may thus be formed patty-shaped.

It can be provided that the electrically conductive layer is formed of one or more superposed Überträyungsscmchten structured by embossing the transfer film on the multilayer body. Here, the hot stamping may be preferred. Over the surface geometry of the die, the surface geometry of the electrically conductive layer can be determined in a simple manner. Here, very high resolution and very high register accuracy can be achieved. The limits of resolution are determined essentially by the size of the domains of the transfer layer of the transfer film.

In a further advantageous refinement, it is provided that the electrically conductive layer is formed of one or more superimposed transfer layers by thermal transfer printing on the multilayer body. It can be provided that the transfer film has a

having wax release layer between the transfer layer and carrier film. As for the achievable resolution, it can be assumed that the achievable resolution is essentially determined by the design of the thermal transfer print head.

It can further be provided that are used to form the gradient of resistance along the surface normal of the electrically conductive layer transfer layers, which have a different electrical conductivity.

It can be provided that the transfer layer during the transfer from the transfer film on the multilayer body by the action of temperature and / or pressure and / or chemical reaction is solidified and bonded to the disposed under the transfer layer layer of the multilayer body. It may also be envisaged that the polymer additives are added which improve, for example, the adhesion or inter-layer adhesion.

but it can also be provided that the transfer layer is made into a film after the transfer of the transfer film on the multilayer body by the action of temperature and / or pressure and / or chemical reaction, and connected to the disposed under the transfer layer layer of the multilayer body. It may also be provided that the Überträyuπysscπichi is applied to nicnt conductive other layers which crosslink in a subsequent process and cause interlayer adhesion.

In a further advantageous embodiment, that a transfer film is used that itself is not homogeneous, and for example, has different thicknesses at different locations or even a decorative design may be provided.

It can further be provided that a transfer film is used, in which the conductive layer is embedded in other layers, or is surrounded by other layers, which in turn can have different properties.

It can further be provided that the transfer layer both in transmitting and after the transferring of the transfer film on the multilayer body by the action of temperature and / or pressure and / or chemical reaction into a film and with the arranged below the transfer layer layer of the multilayer body is connected. It may be provided, for example, then to subject the finished structured conductive layer to a heat treatment in order to improve the homogeneity and adhesion, wherein the heat treatment can be provided in a protective gas atmosphere or in vacuum.

Further advantages in this regard include applications on rough and pre-structured layers which can not be coated by a normal coating process. It can thus be provided a multi-layer body, wherein the electrically conductive layer is disposed on a layer with a rough and / or textured and / or semi-structured surface.

The parameters to be adjusted can be determined by experiments, preferably by the values ​​of a parameter can be varied on the basis of initial values ​​and the values ​​of the remaining parameters are kept constant. In general, it is sufficient to vary the four parameters: temperature, pressure, time period, and the substrate is embossed on the, e.g.

Roughness and chemical composition.

The electrically conductive layer of the invention may comprise a sandwich-like structure even after its completion, which can be seen in the sectional view or the like of a book edge structured vertical outer edges when no homogeneous film formation has occurred in the direction perpendicular to the layers.

It can be provided that the transfer layer of the transfer film of PEDOT / PSS is formed. PEDOT / PSS is a short name for a mixture of poly (3,4-ethylenedioxythiophene) and polystyrene sulfonate, that is a polymer blend of two ionomers. Both components of PEDOT / PSS contribute different carriers to form the electrical conductivity: PEDOT positive charge carriers, PSS negative charge carriers. A PEDOT / PSS layer has domains with a predominant proportion of PEDOT, which are embedded in a matrix or in a PSS-PEDOT / PSS-PEDOT matrix with a low content.

PEDOT / PSS is preferably represented as an aqueous dispersion of polymer particles. It is preferably provided, the transfer layer applied from an aqueous PEDOT / PSS dispersion in a proportion of about 1, 2% by weight.

It can be provided that PEDOT / PSS in a weight ratio of 1: 1 is used: 20 to first Preferably, PEDOT / PSS in a weight ratio of 1: 1, since it has the highest electrical conductivity.

Further that a transfer film is used whose transfer layer has a layer thickness> 500 nm can be provided. It may also be provided that a transfer film is used whose transmission layer has a layer thickness of 50 nm to 500 nm.

It can preferably be provided that a transfer film is used whose transmission layer has a layer thickness of 5 nm to 50 nm. An electrically conductive layer of 50 nm thickness can thus for example be made up of 10 and 1 transfer layer.

More preferably, it can be provided that a transfer film is used whose transmission layer has a layer thickness of 5 nm to 10 nm.

In a further advantageous embodiment, that a transfer film is used in which the areas which are dissolved, are present in domains can be provided.

It can be provided that the electrically conductive layer of the multilayer body according to the invention comprises at least two superposed is electrically conductive polymer layers. With only one transmitted polymer layer, the electrically conductive layer may have defects which can make their use proper function in question. Furthermore, the adjustability of the electrical parameters, such as the electrical conductivity is limited only in a polymer layer. Therefore more than one transferred polymer layer is preferred.

It can be provided that the at least two superimposed polymer layers are structured the same. The electrically conductive layer of such a multilayer body is thus characterized in that it is constructed of superimposed in every area of ​​the same number polymer layers.

Alternatively, the at least two superimposed polymer layers are structured differently may be provided. In this way, for example, areas of different electrical conductivity can be formed, that is, portions of the electrically conductive layer can, for example, take over the function of a resistor. It may be provided, for example, that the voltage drop occurring across this resistor is evaluated and used as an input parameter of an electronic circuit, such as a control circuit or an alarm transmitter.

It can further be provided that the superimposed electrically conductive polymer layers are formed of different material.

It can advantageously be provided that the electrically conductive polymer layer of PEDOT / PSS is.

It can further be provided that the electrically conductive polymer layer of PEDOT / PSS in a weight ratio of 1: 1 is formed: 20 to first

The electrically conductive layer may be formed as a separating layer between a semiconductor layer and an electrode layer.

It can also be provided that the electrically conductive layer is formed as a conductor track.

In a further advantageous embodiment it is provided that the electrically conductive layer comprises electron conductive particles. Such a modified layer can have an increased electrical conductivity. The electron-conducting particles can also act as electrical shielding. but you can in case of a superimposed light extraction also serve as scattering centers. The particles can vary in the form, material, size and concentration.

It can also be provided that at least one electron-conducting layer is disposed on or below the electrically conductive layer.

It is possible that the electron-conducting particles and / or the electron-conducting layer of silver, gold, copper, titanium, aluminum or a combination of these metals exist or will exist.

It is further possible that the electrically conductive layer is disposed on a layer with a rough and / or struktürierieπ and / or semi-structured surface.

It can further be provided that the electrically conductive layer and / or the electron-conducting layer providing a personalized information.

Further advantageous embodiments are directed to the transfer film. As stated above, the transfer layer of the transfer film such as a unverfilmte PEDOT / PSS-layer and at least one electron-conducting layer.

It can advantageously be provided that the electron-conducting layer comprises a metallic layer.

It can further be provided that the electron-conducting layer consists of a sequence of two or more metallic layers, each two adjacent metallic layers consist of different materials. For example, when three designated A, B and C metal

Layers are provided, then sequences may be provided such as A / B / C, C / B / A, A / C / B or A / B / A.

Hereby is achieved, inter alia, the advantage that the chemical stability can be improved to adjacent layers, but also to the environment. Furthermore, the adhesion is improved in other layers.

It is possible that the two of an electrically conductive polymer layer adjacent to the electron-conducting layers have the same sequence of the metallic layers.

It is also possible that the two of an electrically conductive polymer layer adjacent to the electron-conducting layers have a different sequence of metal layers.

The metallic layers may be made of silver, gold, copper, titanium, aluminum, or a combination of these fvleiaiieπ. The metallic layers may be deposited for example by sputtering or vapor deposition, wherein layer thicknesses in the range of 10 nm to 50 nm are preferred.

It can advantageously be provided that the electrically conductive polymer layer of PEDOT / PSS is. In the PEDOT / PSS layer is advantageously a non-filmed PEDOT / PSS layer, as described above. The PEDOT / PSS layer is made into a film only by the transmitting means of heat and / or pressure and then haftetet securely on the substrate to which it has been applied by the embossing process.

The transfer layer of the transfer film advantageously has a release layer which enables the detachment of the transfer layer from the backing layer, wherein the release layer consists of an electrically conductive polymer. Such a release layer can contribute to the power line after Abprägen the transfer layer and the filming. It thus performs a dual function in that it can be easily detached from the support layer than unverfilmte polymer layer and the filmed polymer layer forms an adherent electrically conductive layer.

It can be provided that the release layer of PEDOT / PSS is.

It can further be provided that the transfer layer comprises on the side remote from the carrier layer side of an adhesive layer for fixing the transfer layer on a target substrate and that the adhesive layer consists of an electrically conductive polymer. Here, too, the different behavior of a unverfilmten and filmed polymer layer is used. It can involve a formed of the same material as the release layer polymer layer which acts by filming the Abprägen like a glue. The adhesive layer may consist of PEDOT / PSS. Further, it is also possible to add the PEDOT / PSS additives to improve adhesion or to modify the PEDOT / PSS accordingly.

It can further be provided that the transfer layer on the

Carrier layer side facing away from a primer layer, and in that the priming layer consists of an electrically conductive polymer. The primer layer may be provided to promote adhesion and may be formed of the same material as the release layer described above, and the adhesive layer.

The primer layer may be PEDOT / PSS. Further, it is also possible to add the PEDOT / PSS additives to improve adhesion or to modify the PEDOT / PSS accordingly.

In a further advantageous embodiment it is provided that the transfer layer arranged in an electron-conducting between two layers of the intermediate layer formed of an electrically conductive polymer has. The intermediate layer may be provided in order to impart the adhesion between the two electron-conducting layers.

The intermediate layer may be formed of PEDOT / PSS. It is thus possible to obtain a transfer film with alternately stacked electrically conductive polymer layers - preferably from unverfilmten PEDOT / PSS-layers consisting - and electron-conducting layers - preferably formed as a laminate of more than one metallic layer - to provide, which is adaptable to a wide range of operating conditions.

It can further be provided that the metallic layers are formed with different thickness.

Further, it is possible that the electrically conductive polymer layers are formed with different thicknesses and / or have a different chemical composition.

The preparation of the transfer film of the invention can be carried out essentially in three consecutive steps, which are carried out in a roll-to-roll process.

In the first step, the lowermost PEDOT / PSS layer may be applied to the carrier layer, taking care that the thus coated PEDOT / PSS layer is not made into a film after drying. Thereby is achieved that the PEDOT / PSS layer easily dissolves after the embossing of the support layer. The lowest PEDOT / PSS layer can be used to reason as a release layer so that a special release layer can be omitted. The lowermost PEDOT-PSS layer may be applied for example by gravure printing, screen printing or Coating.

In the second step of the PEDOT / PSS layer, one or more electron-conducting layers can be applied, whose layer thickness can advantageously be up nm nm ... .... If it is at the electron-conducting layer is a metallic layer, it can be applied for example by vapor deposition or sputtering. When a conductive paste is provided as the electron-conducting layer, it can be applied by those mentioned for the application of the PEDOT / PSS layer above method. As already stated above, are preferred as the metals silver, gold, copper, titanium and aluminum. By the layered structure of the electron-conducting layer, combinations of metals are possible, may be in the combinations are metallic alloys.

As a third step, applying one or more primer layers, or one or more PEDOT / PSS-layers is provided. If above, only one primer layer or PEDOT / PSS layer has been described, it is included that these layers may be formed of multiple sub-layers such as the electron-conducting layers. The thickness of the PEDOT / PSS-layers can be adjusted for example by multiple layer application. It can be provided that steps 1 and 2, be repeated one or more times before the manufacturing step is carried out. 3 During the manufacturing step 1 is read along, the PEDOT / PSS layer is deposited on each upper layer of the embossing foil with repetition steps.

It is possible to construct a polymer solar cell with the inventive transfer film comprising an electrically conductive layer formed of a an electrically conductive polymer-containing transfer layer of the transfer film. It is advantageous that the dielectric layer can be "tailored" and the efficiency of the solar cell can be increased in this manner in conjunction for example with the active layer of the solar cell.

In the following the invention is illustrated by way of example with reference to several embodiments with reference to the accompanying drawings.

Show it

Figure 1 is a schematic cross section of a first embodiment of the multilayer body according to the invention.

Fig. 2 is a graph showing the dependency of the sheet resistance of the

Embossing number for the multi-layer body in Fig. 1;

Fig. 3 is a schematic plan view of a second embodiment of the multilayer body according to the invention;

Fig. 4 is a schematic sectional view taken along the section line IV-IV in Fig.

3;

FIG. 5a, 5b production steps of a third embodiment of the multilayer body according to the invention; FIGS. 6 to 11 b, embodiments of the stamping foil according to the invention.

Fig. 1 shows a multilayer body 1, which was produced by multiple embossing, consisting of an electrically insulating carrier layer 11 and a PEDOT / PSS layer 12. In the case of PEDOT / PSS (poly (3,4-ethylenedioxythiophene) and polystyrene sulfonate) is ionomers a polymer mixture of two. Both components contribute different charge carriers: PSS negative charge carriers, PEDOT positive charge carriers.

The carrier layer 11 is Plexiglas with a thickness of 1 to 2 mm. In the example shown in Fig. 1 embodiment is in the multi-layer body is a test pattern for detecting the electrical properties of the PEDOT / PSS layer 12. The material and / or the thickness of the backing layer 11 may be adapted to the intended use, for example on the use of the multilayer body 1 as a polymer solar cell. It may be in the backing layer 11 is an organic semiconductor layer of said polymer solar cell is built on other layers and a substrate, in which the PEDOT / PSS layer is applied as a layer between the semiconductor layer and an electrode layer. In Fig. 1, such additional layers are not shown.

The PEDOT / PSS-layer 12 is composed of PEDOT / PSS sublayers ^ 2 ^ 12 to 22 which are applied successively by embossing a PEDOT / PSS-stamping foil. Here, a different embossing PEDOT / PSS types is conceivable. In this context, that applications are possible on rough and pre-structured layers which can not be coated by a normal coating process or coated very inadequately was found.

The PEDOT / PSS-stamping film is formed in the process described in Fig. 1 and the other figures, exemplary embodiments by knife-coating and drying a PEDOT / PSS-dispersion to a carrier film. The dried PEDOTVPSS- layer forms a transfer layer of PEDOT / PSS-stamping foil.

The carrier film was embossed off to the support layer 11, wherein the temperature of the stamping wheel was set at 190 to 200 0 C. Some of the test multi-layer body 1 was baked after embossing both about 10 min at about 130 to 150 0 C. This step serves to further homogenisation and filming as well as to drive out remaining solvent.

In a first example Baytron FCCP Fa. HCStarck was used. Baytron FCCP has a solids content of 1, 25% and was applied with a doctor blade R 30/3 (coating weight 10 g / m 2 in solids content of 38.54%). The consistency of this dispersion is very low. The samples were then dried in an air flow of a hot air blower at about 35 to 40 0 C. The drying time was about 2 minutes. The produced with said process

PEDOT / PSS-layer could be removed at a thumb test easily from the support film, the PEDOT / PSS layer was divided powdery. This material property is caused by the fact that it is a non-filmed PEDOT / PSS layer, that is applied according to the method described above PEDOT / PSS layer does not form a coherent film.

The samples initially had an average sheet resistance of 4.078 kOhm. According to a further three-minute heat treatment at 150 0 C, the samples exhibited a mean sheet resistance of 3,856 kOhm. The samples were filmed after the said heat treatment and could no longer come off the thumb test.

In contrast, in a drying oven at 130 0 C to 150 0 C for about 5 minutes dried PEDOT / PSS layer adhered firmly on the carrier film, forming a cohesive film which was difficult to remove with the rub test (thumb test). Similarly, the procedure referred to above can (10 to 14 days) form dried PEDOT / PSS layer after prolonged storage a solid adherent film at 35 to 40 0 C and is therefore no longer suitable as a transfer layer of the PEDOT / PSS-stamping foil. It is therefore intended to process the PEDOT / PSS-stamping film shortly after fabrication or wind the PEDOT / PSS-stamping foil so that the carrier foil is at the same time a protective film for the PEDOT / PSS-transfer layer and the subsequent Verfiimen the PEDüT / PSS- transfer layer prevents or at least greatly delayed. The long-term stability also depends on the used PEDOT / PSS.

In a second example was coated Orgacon S500 PEDOT Fa. AGFA in the manner described above. Orgacon PEDOT has a solids content of 1 29% and was applied with a doctor blade R 30/3. After drying, an average sheet resistance of 0.658 kΩ was measured; after three minutes of heat treatment at 150 ° C, an average surface resistivity of 0,7o3 kΩ was measured.

In a third example, two different PEDOT layers were applied over one another, namely Orgacon S500 with a solids content of 1, 29% and Baytron FCCP with a solids content of 1 25%. The layers were also applied with the squeegee R 30/3, said doctor blade an application weight of 10 g / m 2 had after the solid fraction, which amounted to 38.54%. The samples were then dried in an air flow of a hot air blower at about 35 to 40 0 C. The drying time was about 2 minutes. The samples initially exhibited a mean sheet resistance of 0.565 kΩ and had after a further three-minute heat treatment at 150 0 C an average sheet resistance of 0.613 kΩ on. The samples were filmed after the said heat treatment and could no longer come off the thumb test.

As the latter second example has shown the value calculated from the individual values ​​of the sheet resistance overall sheet resistance is in good agreement with the measured total resistance. It was assumed that the superposed PEDOT / PSS-layers can be modeled as a parallel connection of resistors.

1 / R g it = 1 / Rßaytron FCCP + 1 / Rθrgacon = 1 / 4.078 kΩ + 1 / 0.658 kΩ = 1 / 0.5665 kΩ

Rtot = 0.5665 kΩ The measured total resistance, as mentioned above, was 0.565 kOhm.

It can also be provided, the PEDOT / PSS by spin coating (spin coating) or a die coating applied onto the backing film and then to dry in the manner described above.

Fig. 2 is now 1 shows with reference to FIG. Is a diagram showing the dependence of the surface resistance of the PEDOT / PSS layer 12 depending on the number of PEDOT / PSS sublayers 12! indicating to 12 2. 2 As can be seen in Fig. 2, there is a non-linear course of the sheet resistance, being lower in the case shown in FIG. 2 embodiment, the sheet resistance after 8 embossing steps to 9% of the initial value and after a further 14 embossing steps to about 4% of the initial value. The surface resistance was determined as in the above-mentioned three examples, in each case after the so-called 4-point method. It is an inter alia in geophysics-applied measurement method in which the resistivity of a body or a layer is determined without sampling by measurements on the surface.

Table 1. In Table 1, the measured surface resistances in dependence on the number of embossing are gegeπübcrgesteüt the calculated reciprocal values ​​of the surface resistance (conductance). The Leitweil i i a good approximation of Prageanzahl proportionally. So it is possible to generate by repeated embossing PEDOT / PSS layers with defined conductance.

Fig. 3 shows a multi-layer body 3 on a rectangular support layer 31 is a PEDOT / PSS layer 32, formed from three PEDOT / PSS sublayers 32τ having up to 32 3. The PEDOT / PSS-layer 32τ part is formed as a horizontally arranged strip-shaped area and is arranged directly on the carrier layer 31st The PEDOT / PSS sublayer 32 2 is disposed over the PEDOT / PSS sub-layer 32i, and has three separate regions, wherein the left and the middle portion are formed as vertically extending strip-shaped regions which terminate with the horizontal edges of the backing 31 and the right portion only the right edge portion of the PEDOT / PSS-layer part 32, covered. The PEDOT / PSS-layer part 31 3 is the highest PEDOT / PSS-layer part and has two separate regions. The left pane of the PEDOT / PSS sublayer 31 3 covers the left side of the PEDOT / PSS sublayer 32 2 and the right portion of the PEDOT / PSS sublayer 31 3 covers the right area of the PEDOT / PSS sublayer 32 second

In the example shown in Fig. 3 embodiment, the PEDOT / PSS layer 32 is formed of clear display due to only three PEDOT / PSS sublayers. But it can be provided, each of the three PEDOT / PSS sublayers 32τ to 32 3 for example, each of 7 sub-layers to build up so that the sheet resistance of the three PEDOT / PSS sub-layers is composed about 350 Ω, which provided in FIG. 1 described stamping foil , In the above formation of the three PEDOT / PSS sublayers partial regions are formed in which 7, 14 or 21 sub-layers are superposed, which have surface resistances of 350 Ω, 250 Ω or 150 Ω.

Fig. 4 shows the multilayer body along the section line IV in Fig. 3. Thus, it is not only possible to adjust the surface resistance of the PEDOT / PSS layer by the number of successively applied, superimposed PEDOT / PSS sub-layers, but the sheet resistance of the also to change PEDOT / PSS layer locally. In addition, a resistance gradient can be formed along the Fiächennormaien the PEDüT / PSS-layer. In this way, load resistors can be produced, for example, with each other and / or connected to other components, wherein the regions of the PEDOT / PSS layer to form conductor tracks with low sheet resistance, which link the aforementioned components together to form an electronic circuit.

FIGS. 5a and 5b now show manufacturing steps of a multilayer body 4.

Fig. 5a shows a multilayer body 4a, which forms the first stage of production of the multilayer body 4. The multilayer body 4a is composed of a carrier layer 41 and a first PEDOT / PSS sublayer A2Y formed which entire surface, the support layer covers 41st

The multilayer body 4a is in contact with an embossing foil 5, which is formed from a support layer 51 and a transfer layer 52 made of PEDOT / PSS. a section 52p of the transfer layer 52 is transferred to the multi-layer body 4a of the stamping foil 5 now by means of a stamping tool 53rd

Fig. 5b now shows a multi-layer body 4b, on which the first PEDOT / PSS sublayer 42i a second PEDOT / PSS sublayer 42 2 is applied, wherein the second PEDOT / PSS sublayer 42 2 from section 52p of the transfer layer 52 of the stamping foil 5 is formed (Fig. 5a).

In Fig. 5b, the amount deducted from the multi-layer body 4b stamping film 52r is further illustrated, which has now a residual transfer layer 52r, which no longer has the detached portion 52p.

The manufacturing steps shown in Fig. 5a and 5b can be repeated as often as necessary until the PEDOT / PSS layer to the desired layer thickness and / or structure is formed. It can be provided, different stamping tools successively 53 to be used to pattern one or more sublayers of the PEDOT / PSS layer differently, as described above in Fig. 3 and 4. but it can also be provided to transfer the PEDOT / PSS layer by means of a thermal transfer printer and to build up layer by layer, it can be provided that subsequently to film PEDOT / PSB iSchicht by a thermal press tool. In addition, it may be provided that the embossing surface rough, structured or semi-structured.

FIGS. 6a-b 11 now show embodiments of the stamping foil according to the invention in schematic sectional illustration.

The stamping foils are each formed of a carrier layer 41 and on the support layer 41 disposed further layers, said further layers forming a transfer layer which can be transferred to a substrate by an embossing process under temperature and / or pressure. The carrier layer is for example, a PET support having a layer thickness of 19-23 microns.

On the support layer 41 is a PEDOT / PSS layer, which forms a release layer 42a. This basic layer structure is provided at all in FIGS. 6 to 11 b exemplary embodiments illustrated. The PEDOT / PSS layer has a thickness of about 300 nm in the illustrated embodiment.

FIG. 6a shows an embossing film, the transfer layer is formed of three layers. On the release layer 42a, a metallic layer 43a is arranged, which is covered by a second PEDOT / PSS layer, which is formed as an adhesive layer 42k. The metallic layer may be preferably made of silver, gold, copper, titanium or aluminum.

The release layer 42a and the adhesive layer 42k may differ in their chemical composition and / or in their thickness, are selected such that optimal both PEDOT / PSS-layers fulfill the intended functions. The optimization is preferably vornehmbar by test series. The embossed sheet shown in FIG. 6a has N = 1 metallic layers and N + 1 = 2 PEDOT / PSS-layers, wherein the number of metal species is X = 1.

The Fiy. 6b shows a Prägefoiie formed in principle as the embossed sheet shown in Hg. 6a, but wherein a plurality of superimposed metallic layers are provided. In the in Figure 6b. Illustrated embodiment, there are three metal layers 43a, 43b and 43c, each consisting of a different material. It may be provided that two are formed with different thicknesses of the three metal layers at least.

The embossed sheet shown in Fig. 6b has N = 1 electron-conducting layers, consisting of X = 3 metallic layers 43a, 43b and 43c consists and N + 1 = 2 PEDOT / PSS-layers, wherein the number of types of metal Z = 3 ,

FIGS. 7a now shows an embossing film, comprising a further PEDOT / PSS layer. The more PEDOT / PSS layer forms an intermediate layer 42z, which is arranged between two metal layers 1 and 43 a 4SA. 2 The intermediate layer 42z is provided to improve, for example, the adhesion between the individual metal layers.

As provided in the embodiments in Figs. 6a and 6b, the three PEDOT / PSS-layers in their chemical composition and / or its thickness may be different from each other.

The embossed sheet shown in FIG. 7a has N = 2 electron-conducting layers, the = 1 metallic layers consist of X 43a, and N + 1 = 3 PEDOT / PSS layers, wherein the number of types of metal Z = X = 1. Fig. 7b now shows an embossing film, which is formed in principle as the embossing film described in Fig. 7a, but in which the metallic layers of a plurality of layers 43a-rπetaiiischen ι, 43a 2 are formed to 43c-i, 43c 2. The metallic layers each have the same sequence of layers, ie, the layer sequence ABC.

In Fig. 7b stamping film shown has N = 2 electron-conducting layers consisting of X = 3 metallic layers 43a-ι, 43a 2 to 43ci, 43c 2 are made and N + 1 = 3 PEDOT / PSS-layers, wherein the number the metal species Z = X = 3.

The embodiment shown in Fig. 8a shows an embossing film, the transfer layer 52 is in principle as the transfer layer 52 are formed in Fig. 7a, but the intermediate layer is now arranged 42z of different material between metallic layers 43a and 43c.

The embossed sheet shown in FIG. 8a has N = 2 electron-conducting layers from X = 1 metallic layers 43a and 43c consist, and N + 1 = 3 PEDOT / PSS layers.

The embodiment in Fig. 8b shows an embossing film, the transfer layer 52 is in principle how the transfer layer is formed in Fig. 7b 52, but have the above and below the intermediate layer 42z arranged metal layers now a different layer sequence and / or other materials. The metallic layer below the intermediate layer 42z is made of the stacked layers 43a-ι formed 43bi and 43a 2, thus has the layer sequence aba on. Which is arranged over the intermediate layer metallic layer is formed of the superposed layers 43A3, 43c and 43b2, that is, the acb layer sequence on. As noted also with the above-mentioned embodiments of the embossing foil, the metallic layers may also differ in their thickness and the PEDOT / PSS-layers in their chemical composition and / or its thickness. The embossed sheet shown in FIG. 8b has N = 2 electron-conducting layers, the = 3 metallic layers and X 2 = consist of Xi 3 metallic layers, and N + 1 = 3 PEDOT / PSS-layers, wherein the number of types of metal Z 1 = 3 and Z 2 = 2. Generally good for the system shown in Fig Ba embodiment. Number of metal species: Z 1 + Z 2 + Z 3 + ... + Z N with Z 1 <X 1, Z 2 <X 2, Z 3 <X 3,. .., Z N <XN

Figs. 9a and 9b now show embodiments in which only a PEDOT / PSS layer is provided, and that these are to the release layer 42a. The release layer 42a allows easy detachment of the

Transfer layer from the backing layer. These are, as shown above, a non-filmed PEDOT / PSS layer, which is easily detachable from the group consisting for example of PET carrier layer.

Fig. 9a shows an embodiment that differs from the one shown above in Fig. 6 embodiment in that an adhesive layer 44 is provided instead of the adhesive layer 42k made of PEDOT / PSS which is not formed from PEDOT / PSS. This layer may also be formed as a primer layer. As also provided for the other layers, the adhesive layer 44 may be formed of multiple layers. The material of the adhesive layer 44 may be a hot melt adhesive, for example. The primer layer may for example consist of an acrylate mixture. Further, it may be provided that the primer layer packing, additives, etc. are added to achieve desired properties.

The embossed sheet shown in FIG. 9a has N = 1, metallic layers, and N = 1 PEDOT / PSS-layers, the number of types of metal X = 1.

Fig. 9b shows, in an analogous manner, an embodiment which differs from that shown in Fig 6b. Exemplary embodiment shown, characterized in that the adhesive layer is not formed from PEDOT / PSS 44 is provided in place of the formed of PEDOT / PSS adhesive layer 42k. The embossed sheet shown in FIG. 9b has N = 1 electron-conducting layers, consisting of X = 3 metallic layers 43a, 43b and 43c are made, and N = 1 PEDOT / PSS-layers, wherein the number of types of metal Z = 3.

Further embodiments in which the formed of PEDOT / PSS

Adhesive layer 42k is replaced by the non-formed from PEDOT / PSS adhesive layer 44 are shown in Fig. 10a (the rest as shown in Fig. 7a), Fig. 10b (for the rest as shown in Fig. 7b), FIG. 11 (in the rest as shown in ) and Fig. b shown. 8a 11 (as in the rest of Fig. 11 b).

It can be provided that different stamping foils are superimposed molded to form a multilayer body in sequence, so that 6 to 11 b exemplified stamping foils multi-layer body can be prepared from those shown in Figs., By selection of the embossing foils and / or the combination of the stamping foils for a intended function optimally trained.

Claims

claims
1. A process for producing a multilayer body having disposed on a carrier layer electrically conductive layer, characterized in that a transfer foil (5) with an electrically conductive polymer-containing transfer layer (52) is provided, and that the electrically conductive layer by transferring the transfer layer (52) from the transfer foil (5) on the multi-layer body (4) is formed.
2. The method according to claim 1, characterized in that a non-filmed transfer layer (52) is provided.
3. The method of claim 1 or 2, characterized in that the transfer layer (52) is formed as a polymer transfer layer.
4. The method according to any one of the preceding claims, characterized in that a transfer layer (52) is provided in which the electrically conductive polymer is concentrated in domains.
5. The method according to any one of the preceding claims, characterized in that the electrically conductive layer (42) of one or more superimposed transfer layers (52) is formed by a structured embossing the transfer film (5) on the multi-layer body (4).
6. A method according to claim 5, characterized in that for the formation of gradients in the resistance along the surface normal of the electrically conductive layer (42) transfer layers (52) are used, which have a different electrical conductivity.
7. The method according to any one of the preceding claims, characterized in that the transfer layer (52) during the transfer from the transfer foil (5) on the multi-layer body (4) by the action of temperature and / or pressure and / or chemical reaction into a film and with the under
Transfer layer disposed (52) layer of the multilayer body (4) is connected.
8. The method according to any one of the preceding claims, characterized in that a transfer foil (5) is used, in which the conductive layer is embedded in other layers, or is surrounded by other layers, which in turn can have different properties.
9. A method according to any one of claims 1 to 6, characterized in that the transfer layer (52) after the transfer from the transfer foil (5) on the multi-layer body (4) made into a film by the action of temperature and / or pressure and / or chemical reaction with the under the transfer layer (52) arranged layer of the multilayer body (4) is connected.
10. The method according to any one of the preceding claims, characterized in that the transfer layer (52) the transfer foil (5) made of PEDOT / PSS is formed.
11. The method according to claim 10, characterized in that PEDOT / PSS in a weight ratio of 1: 1 is used: 20 to first
12. The method according to any one of the preceding claims, characterized in that a transfer foil (5) is used in the areas which are dissolved, are present in domains.
13. The method according to any one of the preceding claims, characterized in that a transfer foil (5) is provided, having the transfer layer (52) one or more layers (42) consisting of an electrically conductive polymer and one or more electron-conducting layers (43).
14. The method according to claim 13, characterized in that the one or more electron-conducting layers consist of an electron-conducting material, in particular of a metal or a metal alloy.
15. The method of claim 13 or 14, characterized in that for forming the electron-conducting layer (43) a layer of silver,
Gold, copper, titanium, aluminum, or a combination of these metals by
Sputtering and / or vapor deposition (52) is applied.
16. The method of claim 13 or 14, characterized in that for forming the electron-conducting layer (43) an electrically conductive paste by gravure printing and / or screen printing and / or Coating is applied to the transfer layer.
has 17 transfer film, in particular embossing film, comprising a carrier layer (41) and a elektiisuii ieilfäπigen transfer layer [52), characterized in that the transfer layer (52) N electron-conducting layers (43) and N + 1 polymer layers (42), said alternately electrically conductive polymer layer (42) and an electron-conducting layer is disposed, and N> 1.
18. Transfer film according to claim 17, characterized in that the electron-conducting layer (43) consists of a metallic layer.
19. Transfer film according to claim 17, characterized in that the electron-conducting layer (43) of a sequence of two or more metallic layers (43a to 43c), wherein each two adjacent metallic layers (43a to 43c) consist of different material.
20. Transfer foil according to claim 19, characterized in that the two an electrically conductive polymer layer adjacent to the electron-conducting layers (43) the same sequence of the metallic
comprise layers (43a to 43c).
21. Transfer foil according to claim 19, characterized in that the two an electrically conductive polymer layer adjacent to the electron-conducting layers (43) have a different sequence of metal layers (43a to 43c).
22. Transfer film according to one of claims 18 to 21, characterized in that the metallic layers of silver, gold, copper, titanium, aluminum, or a combination of these metals.
23. Transfer film according to claim 17, characterized in that the electrically conductive polymer layer (42) of PEDOT / PSS is.
24. Transfer film according to one of claims 17 to 23, characterized in that the transfer layer (52) has a release layer (42a) which permits the detachment of the transfer layer from the backing layer (41) and that the release layer (42a) of an electrically conductive polymer.
25. Transfer film according to claim 24, characterized in that the release layer (42a) of PEDOT / PSS is.
26. Transfer film according to one of claims 17 to 25, characterized in that the transfer layer (52) on the carrier layer (41) opposite side has an adhesive layer (42k) for determining the transfer layer (52) on a target substrate and that the adhesive layer ( 42k) is made of an electrically conductive polymer.
27. Transfer foil according to claim 26, characterized in that the adhesive layer (42k) of PEDOT / PSS is.
28 has transfer sheet according to any one of claims 17 to 27, characterized in that the transfer layer (52) on the carrier layer (41) side facing away from a primer layer and the primer layer made of an electrically conductive polymer.
29. Transfer film according to claim 28, characterized in that the primer layer of PEDOT / PSS is.
30. Transfer film according to one of claims 17 to 28, characterized in that the transfer layer (52) disposed an electron-conducting between two layers (43) formed of an electrically conductive polymer
having intermediate layer (42z).
31. Transfer foil according to claim 30, characterized in that the intermediate layer (42z) of PEDOT / PSS is.
32. Transfer film according to one of claims 18 to 31, characterized in that the metallic layers (43a to 43c) are formed with different thickness.
33. Transfer film according to one of claims 17 to 32, characterized in that the electrically conductive polymer layers are formed with different thicknesses and / or have a different chemical composition.
34. A multilayer body having a patterned electrically conductive layer, characterized in that the electrically conductive layer (12, 32) comprises at least two superimposed electrically conductive polymeric layers (12i to 12 22 to 32 32 i 3).
35. A multilayer body according to claim 34, characterized in that the superimposed electrically conductive polymeric layers (12i to 12 22 to 32 32 i 3) are formed of different material.
36. A multilayer body according to any one of claims 34 or 35, characterized in that the electrically conductive layer (12, 32) is designed as a separating layer between a semiconductor layer and an electrode layer.
37. A multilayer body according to any one of claims 34 to 36, characterized in that the electrically conductive layer (12, 32) is designed as a conductor track.
38. A multilayer body according to any one of claims 34 to 37, characterized in that the electrically conductive layer (12, 32) comprises electron conductive particles.
39. A multilayer body according to any one of claims 34 to 38, characterized in that at least one electron-conducting layer (43) is arranged on or below the electrically conductive layer (12, 32).
40. A multilayer body according to claim 38 or 39, characterized in that the electron-conducting particles and / or the electron-conducting layer (43) made of silver, gold, copper, titanium, aluminum, a combination of these metals or nanoparticles exist or will exist.
41. A multilayer body according to any one of claims 34 to 40, characterized in that the electrically conductive polymer layer of PEDOT / PSS is.
42. A multilayer body according to claim 41, characterized in that the electrically conductive polymer layer of PEDOT / PSS in a weight ratio of 1: 1 is formed: 20 to first
43. A multilayer body according to any one of claims 34 to 42, characterized in that the electrically conductive layer (12, 32) is disposed on a layer with a rough and / or textured and / or semi-structured surface.
44. A multilayer body according to any one of claims 34 to 43, characterized in that the electrically conductive layer (12, 32) and / or the electron-conducting layer (43) provides a personalized information.
45. Polymer Solar cell comprising an electrically conductive layer formed of a an electrically conductive polymer-containing transfer layer of a transfer film.
46. ​​Use of a transfer film according to any one of claims 17 to 33 for the manufacture of antennas.
47. Use of a transfer film according to one of claims 17 to 33, as
Precursor of a plating process, such as antennas.
EP20070801436 2006-07-21 2007-07-19 Multilayered body comprising an electroconductive polymer layer and method for the production thereof Withdrawn EP2043861A2 (en)

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