EP2027979B1 - Method for manufacturing conductive wood material boards and same - Google Patents

Method for manufacturing conductive wood material boards and same Download PDF

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Publication number
EP2027979B1
EP2027979B1 EP08014789A EP08014789A EP2027979B1 EP 2027979 B1 EP2027979 B1 EP 2027979B1 EP 08014789 A EP08014789 A EP 08014789A EP 08014789 A EP08014789 A EP 08014789A EP 2027979 B1 EP2027979 B1 EP 2027979B1
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Prior art keywords
adhesive
wood
use according
based material
protein
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German (de)
French (fr)
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EP2027979A1 (en
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Norbert Dr. Kalwa
Dirk Dr. Grunwald
Joachim Prof. Dr. Hasch
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Kronotec AG
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Kronotec AG
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer

Definitions

  • the present invention relates to a process for the production of coated wood-based panels. More particularly, the present invention relates to a process for the preparation of coated wood-based panels made with an adhesive of a phenol-formaldehyde adhesive component and a low molecular weight proteinaceous, preferably natural, component followed by coating these wood-based panels. In a further aspect, the present invention relates to coated wood-based panels which are obtainable by the method according to the invention.
  • the powder coating of wood-based materials is highly topical due to the discussion of solvent emissions in classical painting and their contribution to the greenhouse effect.
  • the powder coating is considered as a welcome alternative to traditional painting, this is first an electrostatically charged paint powder as evenly distributed on the surface to be painted using an electric field and then melted on this surface and connected to a homogeneous, firmly adhering to the surface paint layer.
  • wood-based panels such as MDF panels, are not powder-coatable without appropriate measures in the production of these panels, since the surface resistance of the panels is up to about 10 13-14 ohms.
  • the process of powder coating requires surface resistances of the carrier plates, such as the wood-based panels, of preferably about 10 9-10 ohms. This surface resistance is necessary to achieve a homogeneous powder coating ensure, as well as a sufficient thermal stability of the wood-based panels, to allow the subsequent heating to melt the powder coating.
  • the plate is added to an alkali and / or alkaline earth metal salt for improving the electrical conductivity, for. B. in the form of a saline solution.
  • phenolic adhesive as an adhesive, it already contains, as a condensation aid, larger amounts of alkali salts (up to 20%) which, when used, lead to a sheet having a surface resistance in a desired range.
  • alkali metal salts or ammonium salts are disadvantage with the use of larger amounts of alkali metal salts or ammonium salts.
  • ammonium salts are not thermally stable, so that they are partially destroyed in the hot pressing to the wood-based panel be so that the higher the amount of salt must be added to the plates.
  • alternative salts which are not hygroscopic themselves, but still achieve a reduction in the surface resistance.
  • alkali and / or alkaline earth salts having a neutral pH are used, such as lithium nitrate and sodium nitrate. This process described herein has the disadvantage that the salt in the required amount leads to a significant increase in the cost of the product.
  • the adhesives themselves must be sufficiently thermally stable for a powder coating, otherwise cracks may occur, as with pure UF glue.
  • the invention has for its object under the use of a suitable adhesive coated wood-based panels, such as MDF panels provide that overcome the above-mentioned disadvantages.
  • a suitable adhesive coated wood-based panels such as MDF panels provide that overcome the above-mentioned disadvantages.
  • Important here is that both the economic aspects and the ecological aspects are taken into account, ie that the procedures do not lead to a significant increase in the price of the product, but also do not cause undue stress on the environment and do not seriously alter the previous process control for the production of the wood-based panels.
  • the object of the invention is achieved by a method according to claim 1. Preferred embodiments of this method are described in the subclaims 2 to 9. Furthermore, the invention provides coated wood-based panels preparable according to the inventive method. Preferred embodiments of these coated wood-based panels are set forth in the subclaims 10 to 14.
  • a preform having a major portion of lignocellulosic fibers, shavings or strands is hot-pressed with an adhesive which contributes to increasing the conductivity of the wood-based panel to the wood-based panel and then coated with this panel, using as adhesive a glue is used, which consists of a phenol-formaldehyde adhesive component and a low molecular weight protein-containing, preferably natural component. From these two components, a copolymer is first prepared, which is then used as an adhesive.
  • the adhesive is phenol-formaldehyde adhesive components in which a corresponding low molecular weight, preferably natural, proteinaceous component is added or condensed during adhesive preparation.
  • the amount of proteinaceous components added is in the range of 1 to 40% by mass, based on the phenol-formaldehyde component, such as 4 to 33% by mass, e.g. 10 to 20% by mass.
  • Suitable adhesives are e.g. the additives EXP109 or EXP110 from Dynea Erkner GmbH, Erkner, Germany.
  • the modified adhesive the adhesive of a phenol-formaldehyde adhesive component and a low molecular weight protein-containing natural component (hereinafter referred to as pPF adhesive) alone or in combination with known adhesives used for the production of wood materials
  • pPF adhesive a low molecular weight protein-containing natural component
  • combinations of the pPF adhesive with another adhesive selected from the group consisting of urea-formaldehyde (UF) adhesive, melamine-urea-formaldehyde (MUF) adhesive, a melamine-urea-phenol-formaldehyde Adhesive (MUPF adhesive), a tannin-formaldehyde adhesive, a phenol-formaldehyde adhesive, an isocyanate-based adhesive or a mixture thereof.
  • the adhesive must have a PF adhesive component since the other adhesives alone can not be modified with the proteinaceous component.
  • the pPF adhesive is admixed as a copolymer to the further adhesive and then applied to the fibers, chips or strands.
  • the individual adhesives can also be applied separately. It is also possible that the individual components of the pPF adhesive are added separately to the other adhesive
  • the total amount of adhesive is in the range, as is commonly used in wood materials, for example, the adhesive is present in a proportion of 5 wt .-% to 20 wt .-% of atro fibers, chips or strands.
  • the wood-based materials further contain small amounts of alkali metal, alkaline earth metal or ammonium salts in order to increase the conductivity of the wood-based panel, so that, if required, a surface resistance tailored to the process can be set.
  • the amount of added salt is in a range of 0.1 to 1 wt .-% atro fibers, chips or strands, preferably 0.2 to 0.5 wt .-% atro fibers, chips or strands.
  • Such small amounts lead neither to the dimensional changes described above nor to a significant change in the process control. That the method according to the invention can be designed in accordance with customary process sequences for the production of wood-based panels.
  • the method comprises spraying the fibers, chips or strands with the adhesive and optionally with a solution of the alkali, alkaline earth or ammonium salts and then drying and then heating and compacting the mass to cure the plate ,
  • the coating of the wood-based panel is in one embodiment to a painting of the wood-based panel, in particular, it is according to the invention is a powder coating.
  • This powder coating is carried out according to known methods by electrostatic application.
  • the adhesive and, if necessary, the saline solution can be added as usual via the blowline to the fibers. After scattering of the fibers on the forming belt and precompression, the compression takes place e.g. in a Contipresse.
  • the coated wood-based panels are fiberboards, in particular fiberboards of average density of 750 to 850 kg / m 3 (MDF boards).
  • the wood-based panels are chipboard.
  • Another embodiment relates to wood-based panels which are OSB panels.
  • the coating of the wood-based panels is at least in the range of one of the edges of the wood-based panels. This allows e.g. To obtain a necessary deep-fringe quality for MDF boards.
  • the present invention relates to the obtainable by the process according to the invention coated wood-based panels, which are characterized by a reduced surface resistance and thereby make it possible to paint these wood-based panels using the powder coating to obtain corresponding coated wood-based panels.
  • the invention is powder-coated MDF boards, which are often used in painted form in wet areas or kitchens.
  • the wood-based panel coated according to the invention may also be a fiberboard of a different density, an OSB panel or a chipboard.
  • the coated wood-base panel prior to coating, has a surface resistance in a range of 10 8 to 11 ohms, preferably 10 8 to 10, such as 10 9 to 10 ohms. Due to the small proportion of alkali, alkaline earth or ammonium salts find no significantly larger dimensional changes in the use of plates in the area with increased humidity, eg as a front in the kitchen, or the occurrence of cracks in the coatings instead.
  • a wood-based panel is made as in Example 1, except that the portion of pPF adhesive has been replaced by the urea-formaldehyde adhesive.
  • Table 1 shows the surface resistances of the wood-based panels obtained in Examples 1 to 3.
  • Table 1 Plattenttyp Surface Resistance * Unmated in Mega Ohms Surface resistance * Air-conditioned (20 ° C, 50% relative humidity) in mega ohms Comparative Example 1 87,000 35,000 Plate Example 1 3300 1000 Plate example 2 173 95 Plate Example 3 130 75 *: Measurement according to DIN EN 61340-4-1
  • the surface resistances were determined in unclimatised and conditioned condition (50% relative humidity, 20 ° C).
  • the usual technological values, such as transverse tensile strength, covering layer strength and swelling, are in the upper range of the standard applicable to MDF for furniture application (DIN EN 622 TI.3).
  • Example 2 the obtained MDF boards, see Table 1 above, which were prepared alone with a pPF adhesive (Example 2) or in combination with other adhesives (Example 1), exhibited sufficient conductivity so that powder coating could be carried out without problems , In the subsequent powder coating according to known methods of the wood materials produced in Example 1 to 3 showed homogeneous coating properties without blistering or excessive dimensional change of the wood materials.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Description

Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung von beschichteten Holzwerkstoffplatten. Genauer betrifft die vorliegende Erfindung ein Verfahren zur Herstellung von beschichteten Holzwerkstoffplatten, die mit einem Klebstoff aus einer Phenolformaldehyd-Klebstoff-Komponente und einer niedermolekularen proteinhaltigen, bevorzugt natürlichen Komponente hergestellt sind und anschließendem Beschichten dieser Holzwerkstoffplatten. In einem weiteren Aspekt betrifft die vorliegende Erfindung beschichtete Holzwerkstoffplatten, die mit dem erfindungsgemäßen Verfahren erhältlich sind.The present invention relates to a process for the production of coated wood-based panels. More particularly, the present invention relates to a process for the preparation of coated wood-based panels made with an adhesive of a phenol-formaldehyde adhesive component and a low molecular weight proteinaceous, preferably natural, component followed by coating these wood-based panels. In a further aspect, the present invention relates to coated wood-based panels which are obtainable by the method according to the invention.

Stand der TechnikState of the art

Die Pulverbeschichtung von Holzwerkstoffen, insbesondere von mitteldichten Faserplatten (MDF-Platten) ist wegen der Diskussion über Lösungsmittelemissionen beim klassischen Lackieren und deren Beitrag zum Treibhauseffekt hoch aktuell. Die Pulverbeschichtung wird als willkommene Alternative zum klassischen Lackieren angesehen, hierbei wird zunächst ein elektrostatisch aufgeladenes Lackpulver unter Anwendung eines elektrischen Feldes möglichst gleichmäßig auf der zu lackierenden Oberfläche verteilt und anschließend auf dieser Oberfläche aufgeschmolzen und zu einer homogen, fest an der Oberfläche anhaftenden Lackschicht verbunden. Allerdings sind Holzwerkstoffplatten, wie MDF-Platten, ohne entsprechende Maßnahmen bei der Herstellung dieser Platten nicht pulverlackierbar, da der Oberflächenwiderstand der Platten bei bis zu ca. 1013-14 Ohm liegt. Um die Holzwerkstoffplatten elektrostatisch lackierbar zu machen, muss daher entweder durch entsprechende Präparation der Teile vor der Beschichtung eine ausreichende Oberflächenleitfähigkeit hergestellt werden oder durch andere Maßnahmen erreicht werden, dass zumindest während der Beschichtung im elektrischen Feld und die Coulombkräfte wirken, sowie die Ladungen abgeleitet werden können.The powder coating of wood-based materials, in particular of medium-density fiberboard (MDF boards) is highly topical due to the discussion of solvent emissions in classical painting and their contribution to the greenhouse effect. The powder coating is considered as a welcome alternative to traditional painting, this is first an electrostatically charged paint powder as evenly distributed on the surface to be painted using an electric field and then melted on this surface and connected to a homogeneous, firmly adhering to the surface paint layer. However, wood-based panels, such as MDF panels, are not powder-coatable without appropriate measures in the production of these panels, since the surface resistance of the panels is up to about 10 13-14 ohms. In order to make the wood-based panels electrostatically paintable, therefore, must be prepared by appropriate preparation of the parts prior to the coating sufficient surface conductivity or be achieved by other measures that at least during the coating in the electric field and the Coulomb forces act, and the charges can be derived ,

Der Prozess der Pulverlackierung benötigt Oberflächenwiderstände der Trägerplatten, wie den Holzwerkstoffplatten, von bevorzugt ca. 109-10 Ohm. Dieser Oberflächenwiderstand ist notwendig, um eine homogene Pulverlackierung zu gewährleisten, genauso wie eine ausreichend thermische Stabilität der Holzwerkstoffplatten, um die anschließende Erwärmung zum Aufschmelzen der Pulverlackierung zu ermöglichen.The process of powder coating requires surface resistances of the carrier plates, such as the wood-based panels, of preferably about 10 9-10 ohms. This surface resistance is necessary to achieve a homogeneous powder coating ensure, as well as a sufficient thermal stability of the wood-based panels, to allow the subsequent heating to melt the powder coating.

Um die notwendige Oberflächenleitfähigkeit zu erreichen, d.h. den Oberflächenwiderstand der Holzwerkstoffplatte zu erniedrigen, stehen im Stand der Technik verschiedene Methoden zur Verfügung. Dabei ist zu berücksichtigen, dass diese Maßnahmen generell zusätzlich und kostenintensive Arbeitsschritte darstellen, die zusätzlich einen negativen Einfluss auf die Bauteilqualität haben können, wie bei der Vorstellung der einzelnen Verfahren erläutert wird.To achieve the necessary surface conductivity, i. To reduce the surface resistance of the wood-based panel, various methods are available in the prior art. It should be noted that these measures generally represent additional and cost-intensive work steps, which can additionally have a negative influence on the component quality, as explained in the presentation of the individual methods.

1. Aufbringen eines leitfähigen Primers1. Applying a conductive primer

Das Aufbringen eines leitfähigen Primers, der üblicherweise auf Wasserbasis beruht, führt zwar zur Erhöhung der Leitfähigkeit der Holzwerkstoffplatte, allerdings treten hierdurch neue Probleme auf. Einerseits muss das durch Verwendung als Lösungsmittel eingebrachte Wasser wieder von der Platte verdunsten, da dieses sonst die Weiterverarbeitung stört. Zum anderen richten sich während des Behandelns der Platte mit dem Primer z.B. Holzfasern auf, die in einem weiteren Arbeitsschritt abgeschliffen werden müssen. Dies führt zu einer Verteuerung und Verkomplizierung der Fertigung.Although the application of a conductive primer, which is usually based on water, leads to an increase in the conductivity of the wood-based panel, but this presents new problems. On the one hand, the water introduced by use as a solvent must again evaporate from the plate, as this otherwise disturbs the further processing. On the other hand, during the treatment of the plate with the primer, e.g. Wood fibers, which must be ground in a further step. This leads to an increase in price and complication of production.

2. Erhöhung der Feuchte der Holzwerkstoffplatten2. Increasing the moisture content of the wood-based panels

Mit Erhöhung der Plattenfeuchte durch Erhöhung der Feuchte des Werkstoffes wird im Allgemeinen die Leitfähigkeit verbessert. Eine Erhöhung der Feuchtigkeit der Platten wäre daher vorstellbar, um die notwendige elektrische Leitfähigkeit zu erreichen. Eine solche Erhöhung der Plattenfeuchte ist zwar möglich, bedarf aber längerer Klimatisierungszeiträume, zudem ist eine erhöhte Restfeuchtigkeit einer Faserplatte nicht stabil und kann nur in aufwendigen Verfahren konstant gehalten werden. Eine verbleibende erhöhte Restfeuchtigkeit ist des Weiteren bei den sich anschließenden Schritte der Pulverbeschichtung, z.B. Erhitzen der Faserplatte zum Aufschmelzen des Lackpulvers, problematisch, weil hier eine Ausgasung von Wasserdampf erfolgen kann, die ein schlechtes Lackierergebnis zur Folge hat.Increasing the plate moisture by increasing the moisture content of the material generally improves the conductivity. An increase in the humidity of the plates would therefore be conceivable in order to achieve the necessary electrical conductivity. Although such an increase in plate moisture is possible, but requires longer air conditioning periods, also an increased residual moisture of a fiberboard is not stable and can be kept constant only in complex procedures. A remaining increased residual moisture is further problematic in the subsequent steps of the powder coating, such as heating the fiberboard to melt the coating powder, because here a degassing of water vapor can occur, which has a poor Lackierergebnis result.

Für Phenolharz gebundene Holzwerkstoffplatten ist bekannt, dass aufgrund der Ausgleichsfeuchte, die deutlich über der Standardfeuchte liegt, Probleme bei der Pulverbeschichtung auftreten, wie Bläschenbildung im Lack an den Schmalflächen. Des Weiteren können Verzüge auftreten, die nachteilig bei der weiteren Verarbeitung im Innenausbau oder bei Möbeln sind. Es kann weiterhin ein Reißen der Beschichtung oder der Faserplatte selbst in den Bereichen auftreten, in denen ihrer Oberfläche nicht durch ihre verdichtete Deckschicht ausgebildet wird, also insbesondere in den Bereichen der Kanten oder eingefrästen Profile.For phenolic resin bonded wood-based panels is known that due to the compensation moisture, which is well above the standard moisture, problems occur in the powder coating, such as blistering in the paint on the narrow surfaces. Furthermore, distortions may occur which are disadvantageous in the further processing in the interior or furniture. In addition, tearing of the coating or of the fiber board itself can occur in the areas in which its surface is not formed by its compacted cover layer, that is to say in particular in the areas of the edges or milled profiles.

3. Zugabe von leitfähigen Salzen bei der Plattenherstellung3. Addition of conductive salts in plate making

Die Zugabe von leitfähigen Salzen wurde in ihrer einfachsten Form bei der Herstellung von Phenol-Klebstoff gebundenen Platten angewendet. Ein Beispiel hierfür ist in der DE 102 32 874 beschrieben. Demnach wird der Platte ein Alkali-und/oder Erdalkalisalz zur Verbesserung der elektrischen Leitfähigkeit zugefügt, z. B. in Form einer Salzlösung. Allerdings enthält bei Verwendung von Phenol-Klebstoff als Klebstoff dieser bereits als Kondensationshilfsmittel größere Mengen an Alkalisalzen (bis zu 20 %), die bei Verwendung zu einer Platten mit einem Oberflächenwiderstand in einem angestrebten Bereich führt. Der Nachteil bei der Verwendung von größeren Mengen an Alkalisalzen oder Ammoniumsalzen liegt darin, dass die Platte durch die Salze und deren Hygroskopizität sehr stark Feuchtigkeit aufnimmt. Dies führt zu erheblich größeren Dimensionsänderungen als bei Platten mit Klebstoffen auf anderer Basis und diese Dimensionsänderung kann insbesondere beim Einsatz der Platten im Bereich mit hoher Luftfeuchte, wie z. B. als Front in der Küche oder in Feuchträumen, das Auftreten von Rissen in den Lacken hervorrufen. Der Quelldruck der Platte ist in diesem Fall höher als die Reißfestigkeit des Lackes. In den in der Holzwerkstoffindustrie standardmäßig eingesetzten Klebstoffen, wie Harnstoff-Formaldehyd-Klebstoff, ist die hohe Zugabe von Alkali oder Ammoniumsalzen ebenfalls nicht möglich, da diese die Aushärtung des Klebstoffs stören, wie z.B. Vorreaktionen der Salze mit Bestandteilen der nicht ausgehärteten Klebstoffe. Weiterhin sind z.B. Ammoniumsalze thermisch nicht stabil, so dass sie bei dem Heißverpressen zu der Holzwerkstoffplatte teilweise zerstört werden, so dass umso höhere Mengen an Salz den Platten zugegeben werden müssen.
Um die genannten Nachteile zu vermeiden, wurden in der DE 102 32 874 alternative Salze verwendet, die selbst nicht hygroskopisch sind, aber trotzdem eine Erniedrigung des Oberflächenwiderstandes erreichen. Hier werden z.B. Alkali-und/oder Erdalkalisalze mit einem neutralen pH-Wert verwendet, wie Lithiumnitrat und Natriumnitrat. Dieses hierin beschriebene Verfahren hat den Nachteil, dass das Salz in der benötigten Menge zu einer nicht unerheblichen Verteuerung des Produktes führt. Zusätzlich kann bei der Herstellung der Platte nicht mit einem Standard-Klebstoff (Harnstoff-Formaldehyd-Klebstoff) gearbeitet werden, da dieser nicht die nötige thermische Stabilität besitzt. Es muss ein sogenannter verstärkter Klebstoff (mit Melamin) eingesetzt werden, das ebenfalls zu einer Verteuerung führt.The addition of conductive salts has been used in its simplest form in the manufacture of phenolic adhesive bonded sheets. An example of this is in the DE 102 32 874 described. Accordingly, the plate is added to an alkali and / or alkaline earth metal salt for improving the electrical conductivity, for. B. in the form of a saline solution. However, when using phenolic adhesive as an adhesive, it already contains, as a condensation aid, larger amounts of alkali salts (up to 20%) which, when used, lead to a sheet having a surface resistance in a desired range. The disadvantage with the use of larger amounts of alkali metal salts or ammonium salts is that the plate very strongly absorbs moisture through the salts and their hygroscopicity. This leads to significantly larger dimensional changes than plates with adhesives on other bases and this dimensional change can be particularly when using the plates in the high humidity area, such. As a front in the kitchen or in wet rooms, causing the occurrence of cracks in the paints. The swelling pressure of the plate is in this case higher than the tear strength of the paint. In the standard wood-based adhesives used, such as urea-formaldehyde adhesive, the high addition of alkali or ammonium salts is also not possible because they interfere with the curing of the adhesive, such as pre-reactions of the salts with components of uncured adhesives. Furthermore, for example, ammonium salts are not thermally stable, so that they are partially destroyed in the hot pressing to the wood-based panel be so that the higher the amount of salt must be added to the plates.
To avoid the mentioned disadvantages, were in the DE 102 32 874 used alternative salts, which are not hygroscopic themselves, but still achieve a reduction in the surface resistance. Here, for example, alkali and / or alkaline earth salts having a neutral pH are used, such as lithium nitrate and sodium nitrate. This process described herein has the disadvantage that the salt in the required amount leads to a significant increase in the cost of the product. In addition, it is not possible to work with a standard adhesive (urea-formaldehyde adhesive) when manufacturing the board, since it does not have the necessary thermal stability. It must be a so-called reinforced adhesive (with melamine) are used, which also leads to an increase in price.

Weiterhin wurde versucht, Alkalisalze unter Verwendung von PMDI-Klebstoff zu verwenden, so beschreibt die EP 1 659 146 die Verwendung von PMDI-Klebstoff in Kombination mit Natrium- und/oder Kaliumhydroxid. Dies führt zu den gewünschten Oberflächenwiderständen, besitzt aber deutliche Kostennachteile und ist von Prozessführung nicht unproblematisch. Das Alkalisalz wirkt auf das PMDI sowohl als Katalysator als auch als Spaltreagenz.Furthermore, attempts were made to use alkali salts using PMDI adhesive, as described EP 1 659 146 the use of PMDI adhesive in combination with sodium and / or potassium hydroxide. This leads to the desired surface resistances, but has significant cost disadvantages and is not unproblematic in terms of process control. The alkali salt acts on the PMDI both as a catalyst and as a cleavage reagent.

Aus der DE 103 44 926 sind Holzwerkstoffkörper bekannt, die als Bindemittel duroplastische Systeme aufweisen, die durch natürliche Klebstoffe modifiziert sind. Eine Beschichtung dieser Platte oder Beschichtungseigenschaften sind nicht beschrieben.From the DE 103 44 926 are known wood material body having as a binder thermoset systems that are modified by natural adhesives. A coating of this plate or coating properties are not described.

Die Klebstoffe selbst müssen für eine Pulverbeschichtung ausreichend thermostabil sein, da ansonsten Risse auftreten können, wie bei reinem UF-Leim.The adhesives themselves must be sufficiently thermally stable for a powder coating, otherwise cracks may occur, as with pure UF glue.

Der Erfindung liegt die Aufgabe zugrunde unter Nutzung eines geeigneten Klebstoffs beschichtete Holzwerkstoffplatten, wie MDF-Platten bereitzustellen, die die oben genannten Nachteile überwinden. Wichtig hierbei ist, dass sowohl die ökonomischen Aspekte als auch die ökologischen Aspekte berücksichtigt werden, d.h. dass die Verfahren nicht zu einer deutlichen Verteuerung des Produkts führen, aber auch keine übermäßige Belastung der Umwelt hervorrufen, sowie die bisherige Prozessführung zur Herstellung der Holzwerkstoffplatten nicht gravierend verändern.The invention has for its object under the use of a suitable adhesive coated wood-based panels, such as MDF panels provide that overcome the above-mentioned disadvantages. Important here is that both the economic aspects and the ecological aspects are taken into account, ie that the procedures do not lead to a significant increase in the price of the product, but also do not cause undue stress on the environment and do not seriously alter the previous process control for the production of the wood-based panels.

Die Aufgabe der Erfindung wird mit einem Verfahren gemäß dem Patentanspruch 1 gelöst. Bevorzugte Ausführungsformen dieses Verfahrens sind in den Unteransprüchen 2 bis 9 beschrieben. Des Weiteren stellt die Erfindung beschichtete Holzwerkstoffplatten herstellbar gemäß den erfindungsgemäßen Verfahren bereit. Bevorzugte Ausführungsformen dieser beschichteten Holzwerkstoffplatten sind in den Unteransprüchen 10 bis 14 dargelegt.The object of the invention is achieved by a method according to claim 1. Preferred embodiments of this method are described in the subclaims 2 to 9. Furthermore, the invention provides coated wood-based panels preparable according to the inventive method. Preferred embodiments of these coated wood-based panels are set forth in the subclaims 10 to 14.

Ausführliche Beschreibung der ErfindungDetailed description of the invention

Gemäß dem erfindungsgemäßen Verfahren zur Herstellung von beschichteten Holzwerkstoffplatten wird eine Vorform mit einem Hauptteil aus Lignocellulose enthaltenden Fasern, Späne oder Strands mit einem Klebstoff, das zur Erhöhung der Leitfähigkeit der Holzwerkstoffplatte beiträgt, zu der Holzwerkstoffplatte heiß verpresst und diese Holzwerkstoffplatte anschließend beschichtet, wobei als Klebstoff ein Leim verwendet wird, das aus einer Phenol-Formaldehyd-Klebstoff-Komponente und einer niedermolekularen proteinhaltigen, bevorzugt natürlichen Komponente besteht. Aus diesen beiden Komponenten wird zunächst ein Copolymerisat hergestellt, das dann als Klebstoff eingesetzt wird.According to the inventive method for producing coated wood-based panels, a preform having a major portion of lignocellulosic fibers, shavings or strands is hot-pressed with an adhesive which contributes to increasing the conductivity of the wood-based panel to the wood-based panel and then coated with this panel, using as adhesive a glue is used, which consists of a phenol-formaldehyde adhesive component and a low molecular weight protein-containing, preferably natural component. From these two components, a copolymer is first prepared, which is then used as an adhesive.

Alternativ ist aber auch ein getrenntes Aufbringen der beiden Komponenten auf die Fasern, Späne oder Strands möglich.Alternatively, however, a separate application of the two components to the fibers, chips or strands is possible.

Die erfindungsgemäß verwendbaren Klebstoffe sind z.B. in der DE 102 53 455 beschrieben, auf die Bezug genommen wird.The adhesives which can be used according to the invention are described, for example, in US Pat DE 102 53 455 to which reference is made.

Diese Kombination von Phenol-Formalaldehyd-Klebstoff-Komponenten, wie sie im Stand der Technik bekannt sind mit niedermolekularen proteinhaltigen natürlichen Komponenten, insbesondere niedermolekularen Weizen-, Soja- und/oder Maisproteinhaltigen natürlichen Komponenten führen zu hochwertigen Klebstoffen, die eine Herstellung von Holzwerkstoffen, wie Spanplatten, MDF-Platten oder OSB-Platten ermöglichen, einsetzbar in Bereichen hoher Luftfeuchtigkeit, wie Feuchtbereichen, aufgrund ihrer guten Beständigkeit gegenüber hoher Luftfeuchtigkeit. Es wurde hier überraschend festgestellt, dass die Verwendung dieses Klebstoffs auch zu einer Erniedrigung des Oberflächenwiderstandes also zu einer Erhöhung der Oberflächenleitfähigkeit beiträgt.This combination of phenol-formaldehyde adhesive components, as known in the art with low molecular weight protein-containing natural components, especially low molecular weight wheat, soybean and / or corn protein-containing natural components lead to high-quality adhesives, the production of wood-based materials, such as Particle boards, MDF boards or OSB boards allow use in areas of high humidity, such as Wet areas, due to their good resistance to high humidity. It has surprisingly been found here that the use of this adhesive also contributes to a lowering of the surface resistance, ie to an increase in the surface conductivity.

Bei dem Klebstoff handelt es sich um Phenol-Formaldehyd-Klebstoff-Komponenten, bei denen während der Klebstoffherstellung eine entsprechende niedermolekulare proteinhaltige bevorzugt natürliche Komponente zugesetzt oder einkondensiert wird. Die Menge an zugefügten proteinhaltigen Komponenten liegt dabei im Bereich von 1 bis 40 Masse-% bezogen auf die Phenol-Formaldehyd-Komponente, wie 4 bis 33 Masse-%, z.B. 10 bis 20 Masse-%. Geeignete Klebstoffe sind z.B. die Additive EXP109 oder EXP110 der Dynea Erkner GmbH, Erkner, Deutschland.The adhesive is phenol-formaldehyde adhesive components in which a corresponding low molecular weight, preferably natural, proteinaceous component is added or condensed during adhesive preparation. The amount of proteinaceous components added is in the range of 1 to 40% by mass, based on the phenol-formaldehyde component, such as 4 to 33% by mass, e.g. 10 to 20% by mass. Suitable adhesives are e.g. the additives EXP109 or EXP110 from Dynea Erkner GmbH, Erkner, Germany.

In einer bevorzugten Ausführungsform wird der modifizierte Klebstoff, der Klebstoff aus einer Phenol-Formaldehyd-Klebstoff-Komponente und einer niedermolekularen proteinhaltigen natürlichen Komponente (im Folgenden als pPF-Klebstoff bezeichnet) alleine oder in Kombination mit bekannten Klebstoffen, die für die Herstellung von Holzwerkstoffen zum Einsatz kommen, insbesondere UF-Klebstoff und MUF-Klebstoff, verwendet. D.h. als Klebstoff können Kombinationen des pPF-Klebstoffs mit einem weiteren Klebstoff ausgewählt aus der Gruppe bestehend aus Harnstoff-Formaldehyd-Klebstoff (UF-Klebstoff), Melamin-Harnstoff-Formaldehyd-Klebstoff (MUF-Klebstoff), einem Melamin-Harnstoff-Phenol-Formaldehyd-Klebstoff (MUPF-Klebstoff), einem Tannin-Formaldehyd-Klebstoff, einem Phenol-Formaldehyd-Klebstoff, einem Klebstoff auf Basis von Isocyanaten oder einem Gemisch hiervon, eingesetzt werden. Allerdings muss der Klebstoff eine PF-Klebstoff Komponente aufweisen, da die anderen Klebstoffe alleine sich nicht mit der proteinhaltigen Komponente modifizieren lassen.In a preferred embodiment, the modified adhesive, the adhesive of a phenol-formaldehyde adhesive component and a low molecular weight protein-containing natural component (hereinafter referred to as pPF adhesive) alone or in combination with known adhesives used for the production of wood materials Use, in particular UF adhesive and MUF adhesive used. That as an adhesive, combinations of the pPF adhesive with another adhesive selected from the group consisting of urea-formaldehyde (UF) adhesive, melamine-urea-formaldehyde (MUF) adhesive, a melamine-urea-phenol-formaldehyde Adhesive (MUPF adhesive), a tannin-formaldehyde adhesive, a phenol-formaldehyde adhesive, an isocyanate-based adhesive or a mixture thereof. However, the adhesive must have a PF adhesive component since the other adhesives alone can not be modified with the proteinaceous component.

In einer bevorzugten Ausführungsform wird der pPF-Klebstoff als Copolymerisat zu dem weiteren Klebstoff zugemischt und dann auf die Fasern, Späne oder Strands aufgebracht. Alternativ können die einzelnen Klebstoffe auch getrennt aufgebracht werden. Möglich ist auch, dass die einzelnen Komponenten des pPF-Klebstoffs dem weiteren Klebstoff getrennt zugefügt werdenIn a preferred embodiment, the pPF adhesive is admixed as a copolymer to the further adhesive and then applied to the fibers, chips or strands. Alternatively, the individual adhesives can also be applied separately. It is also possible that the individual components of the pPF adhesive are added separately to the other adhesive

Die Gesamtmenge an Klebstoff liegt dabei in dem Bereich, wie er üblicherweise bei Holzwerkstoffen verwendet wird, z.B. ist das Klebstoff in einem Anteil von 5 Gew.-% bis 20 Gew.-% atro Fasern, Späne oder Strands vorhanden.The total amount of adhesive is in the range, as is commonly used in wood materials, for example, the adhesive is present in a proportion of 5 wt .-% to 20 wt .-% of atro fibers, chips or strands.

In einer weiteren bevorzugten Ausführungsform enthalten die Holzwerkstoffe weiterhin geringe Mengen an Alkali-, Erdalkali- oder Ammoniumsalzen, um die Leitfähigkeit der Holzwerkstoffplatte zu erhöhen, so dass bei Bedarf ein für den Prozess maßgeschneiderter Oberflächenwiderstand eingestellt werden kann. Die Menge an zugesetztem Salz liegt dabei in einem Bereich von 0,1 bis 1 Gew.-% atro Fasern, Späne oder Strands, bevorzugt 0,2 bis 0,5 Gew.-% atro Fasern, Späne oder Strands. Solche geringe Mengen führen weder zu den oben beschriebenen Dimensionsänderungen noch zu einer wesentlichen Veränderung der Prozessführung. D.h. das erfindungsgemäße Verfahren kann gemäß üblichen Prozessabläufen zur Herstellung von Holzwerkstoffplatten ausgebildet sein.In a further preferred embodiment, the wood-based materials further contain small amounts of alkali metal, alkaline earth metal or ammonium salts in order to increase the conductivity of the wood-based panel, so that, if required, a surface resistance tailored to the process can be set. The amount of added salt is in a range of 0.1 to 1 wt .-% atro fibers, chips or strands, preferably 0.2 to 0.5 wt .-% atro fibers, chips or strands. Such small amounts lead neither to the dimensional changes described above nor to a significant change in the process control. That the method according to the invention can be designed in accordance with customary process sequences for the production of wood-based panels.

In einer Ausführungsform umfasst das Verfahren, dass die Fasern, Späne oder Strands mit dem Klebstoff und gegebenenfalls mit einer Lösung der Alkali-, Erdalkali-oder Ammoniumsalze besprüht und dann getrocknet werden und anschließend die Masse erwärmt und verpresst wird, wobei eine Aushärtung der Platte erfolgt.In one embodiment, the method comprises spraying the fibers, chips or strands with the adhesive and optionally with a solution of the alkali, alkaline earth or ammonium salts and then drying and then heating and compacting the mass to cure the plate ,

Bei der Beschichtung der Holzwerkstoffplatte handelt es sich in einer Ausführungsform um eine Lackierung der Holzwerkstoffplatte, insbesondere handelt es sich erfindungsgemäß um eine Pulverbeschichtung. Diese Pulverbeschichtung erfolgt gemäß bekannten Verfahren durch elektrostatisches Aufbringen.In the coating of the wood-based panel is in one embodiment to a painting of the wood-based panel, in particular, it is according to the invention is a powder coating. This powder coating is carried out according to known methods by electrostatic application.

Das Klebstoff und falls nötig die Salzlösung kann wie üblich über die Blowline den Fasern zugegeben werden. Nach Streuung der Fasern auf dem Formband und Vorverdichtung erfolgt die Verpressung z.B. in einer Contipresse.The adhesive and, if necessary, the saline solution can be added as usual via the blowline to the fibers. After scattering of the fibers on the forming belt and precompression, the compression takes place e.g. in a Contipresse.

In einer bevorzugten Ausführungsform handelt es sich bei den beschichten Holzwerkstoffplatten um Faserplatten, insbesondere Faserplatten mittlerer Rohdichte von 750 bis 850 kg/m3 (MDF-Platten). In einer anderen Ausführungsform handelt es sich bei den Holzwerkstoffplatten um Spanplatten. Eine weitere Ausführungsform betrifft Holzwerkstoffplatten, bei denen es sich um OSB-Platten handelt.In a preferred embodiment, the coated wood-based panels are fiberboards, in particular fiberboards of average density of 750 to 850 kg / m 3 (MDF boards). In another embodiment, the wood-based panels are chipboard. Another embodiment relates to wood-based panels which are OSB panels.

Die Beschichtung der Holzwerkstoffplatten liegt mindestens im Bereich einer der Kanten der Holzwerkstoffplatten vor. Dies erlaubt z.B. bei MDF-Platten eine notwendige Tieffräßqualität zu erhalten.The coating of the wood-based panels is at least in the range of one of the edges of the wood-based panels. This allows e.g. To obtain a necessary deep-fringe quality for MDF boards.

In einem weiteren Aspekt betrifft die vorliegende Erfindung die mit Hilfe des erfindungsgemäßen Verfahrens erhältlichen beschichteten Holzwerkstoffplatten, die sich durch einen erniedrigten Oberflächenwiderstand auszeichnen und dadurch es ermöglichen, diese Holzwerkstoffplatten mit Hilfe der Pulverbeschichtung zu lackieren, um entsprechende beschichtete Holzwerkstoffplatten zu erhalten. Bevorzugt handelt es sich erfindungsgemäß um pulverbeschichtete MDF-Platten, die häufig in lackierter Form in Feuchtbereichen oder Küchen zum Einsatz kommen. Die erfindungsgemäß beschichtete Holzwerkstoffplatte kann aber auch eine Faserplatte anderer Dichte, eine OSB-Platte oder eine Spanplatte sein.In a further aspect, the present invention relates to the obtainable by the process according to the invention coated wood-based panels, which are characterized by a reduced surface resistance and thereby make it possible to paint these wood-based panels using the powder coating to obtain corresponding coated wood-based panels. Preferably, the invention is powder-coated MDF boards, which are often used in painted form in wet areas or kitchens. However, the wood-based panel coated according to the invention may also be a fiberboard of a different density, an OSB panel or a chipboard.

Die beschichtete Holzwerkstoffplatte weist vor Beschichtung einen Oberflächenwiderstand in einem Bereich von 108-11 Ohm auf, bevorzugt 108-10, wie 109-10 Ohm. Aufgrund des geringen Anteils an Alkali-, Erdalkali- oder Ammoniumsalzen finden keine erheblich größeren Dimensionsänderungen beim Einsatz der Platten im Bereich mit erhöhter Luftfeuchte, z.B. als Front in der Küche, oder das Auftreten von Rissen in den Lacken statt.The coated wood-base panel, prior to coating, has a surface resistance in a range of 10 8 to 11 ohms, preferably 10 8 to 10, such as 10 9 to 10 ohms. Due to the small proportion of alkali, alkaline earth or ammonium salts find no significantly larger dimensional changes in the use of plates in the area with increased humidity, eg as a front in the kitchen, or the occurrence of cracks in the coatings instead.

Im Folgenden wird die Erfindung mit Hilfe von Beispielen weiter illustriert, ohne auf diese Beispiele beschränkt zu sein.In the following, the invention will be further illustrated by means of examples, without being limited to these examples.

Beispiel 1example 1

100 kg Holzfaser, 8 kg Harnstoff-Formaldehyd-Klebstoff (Feststoffgehalt: ca. 65 %), 0,25 kg Ammoniumsulfatlösung (Feststoffgehalt: 30 %) und 9,9 kg pPF-Klebstoff (Feststoffgehalt 50,5 %), EXP109 Dynea Erkner GmbH, Deutschland, wurden in einem Mischer miteinander vermischt, vorverdichtet und anschließend heißverpresst.100 kg wood fiber, 8 kg urea-formaldehyde adhesive (solids content: approx. 65%), 0.25 kg ammonium sulfate solution (solids content: 30%) and 9.9 kg pPF adhesive (solids content 50.5%), EXP109 Dynea Erkner GmbH, Germany, were mixed together in a mixer, pre-compressed and then hot-pressed.

Beispiel 2Example 2

100 kg Holzfaser und 23,8 kg pPF-Klebstoff (Feststoffgehalt: 50,5 %), EXP109 Dynea Erkner GmbH, Deutschland, wurden, wie in Beispiel 1 beschrieben, heißverpresst, um eine Holzwerkstoffplatte für die Beschichtung zu erhalten.100 kg of wood fiber and 23.8 kg of pPF adhesive (solids content: 50.5%), EXP109 Dynea Erkner GmbH, Germany, were hot-pressed as described in Example 1 to obtain a wood-based panel for the coating.

Beispiel 3Example 3

100 kg Holzfaser, 23,8 kg pPF-Klebstoff (Feststoffgehalt: 50,5 %), EXP109 Dynea Erkner GmbH, Deutschland, und 0,6 kg Natriumhydroxid (Feststoffgehalt: 50 %) wurden, wie in Beispiel 1 beschrieben, vorverdichtet und heißverpresst, um eine Holzwerkstoffplatte zur Beschichtung zu erhalten.100 kg of wood fiber, 23.8 kg of pPF adhesive (solids content: 50.5%), EXP109 Dynea Erkner GmbH, Germany, and 0.6 kg of sodium hydroxide (solids content: 50%) were pre-compressed and hot-pressed as described in Example 1 to obtain a wood-based panel for coating.

Vergleichsbeispiel 1Comparative Example 1

Es wird eine Holzwerkstoffplatte wie in Beispiel 1 hergestellt, mit Ausnahme, dass der Anteil an pPF-Klebstoff durch den Harnstoff-Formaldehyd-Klebstoff ersetzt wurde.A wood-based panel is made as in Example 1, except that the portion of pPF adhesive has been replaced by the urea-formaldehyde adhesive.

In der Tabelle 1 sind die Oberflächenwiderstände der in den Beispielen 1 bis 3 erhaltenen Holzwerkstoffplatten dargestellt. Tabelle 1 Plattenttyp Oberflächenwiderstand* Unklimatisiert in Mega Ohm Oberflächenwiderstand* Klimatisiert (20°C, 50% rel. Luftfeuchte) in Mega Ohm Vergleichsbeispiel 1 87 000 35 000 Platte Beispiel 1 3300 1000 Platte Beispiel 2 173 95 Platte Beispiel 3 130 75 *: Messung erfolgte nach DIN EN 61340-4-1 Table 1 shows the surface resistances of the wood-based panels obtained in Examples 1 to 3. Table 1 Plattenttyp Surface Resistance * Unmated in Mega Ohms Surface resistance * Air-conditioned (20 ° C, 50% relative humidity) in mega ohms Comparative Example 1 87,000 35,000 Plate Example 1 3300 1000 Plate example 2 173 95 Plate Example 3 130 75 *: Measurement according to DIN EN 61340-4-1

Die Oberflächenwiderstände wurden in unklimatisiertem und klimatisiertem Zustand (50 % relative Luftfeuchtigkeit, 20 °C) bestimmt. Die üblichen technologischen Werte, wie Querzugsfestigkeit, Deckschichtabhebefestigkeit und Quellung, bewegen sich im oberen Bereich der für MDF für Möbelanwendung geltenden Norm (DIN EN 622 TI.3).The surface resistances were determined in unclimatised and conditioned condition (50% relative humidity, 20 ° C). The usual technological values, such as transverse tensile strength, covering layer strength and swelling, are in the upper range of the standard applicable to MDF for furniture application (DIN EN 622 TI.3).

Überraschenderweise zeigten die erhaltenen MDF-Platten, siehe Tabelle 1, oben, die alleine mit einem pPF-Klebstoff (Beispiel 2) oder in Kombination mit anderen Klebstoffen hergestellt wurden (Beispiel 1), eine ausreichende Leitfähigkeit, so dass eine Pulverlackierung problemlos durchgeführt werden konnte. Bei der sich anschließenden Pulverlackierung gemäß bekannten Verfahren der im Beispiel 1 bis 3 hergestellten Holzwerkstoffe zeigten sich homogene Lackierungseigenschaften ohne Blasenbildung oder überhöhter Dimensionsänderung der Holzwerkstoffe.Surprisingly, the obtained MDF boards, see Table 1 above, which were prepared alone with a pPF adhesive (Example 2) or in combination with other adhesives (Example 1), exhibited sufficient conductivity so that powder coating could be carried out without problems , In the subsequent powder coating according to known methods of the wood materials produced in Example 1 to 3 showed homogeneous coating properties without blistering or excessive dimensional change of the wood materials.

Claims (13)

  1. Use of an adhesive which consists of a phenol-formaldehyde adhesive component and a low molecular mass, protein-containing component for increasing the electrical conductivity of wood-based material boards for coating, for producing a coated wood-based material board, this wood-based material board being produced by:
    - providing a preform having a major fraction of lignocellulosic fibers, chips and strands mixed with the adhesive,
    - hot-pressing the wood-based material board and
    - coating the hot-pressed wood-based material board,
    characterized in that the wood-based material board before coating has a surface resistance in a range from 108 to 1011 ohm.
  2. Use according to Claim 1, wherein the low molecular mass, protein-containing component is a natural low molecular mass, protein-containing component.
  3. Use according to Claim 1 or 2, characterized in that the low molecular mass, protein-containing component is a wheat, soya and/or maize protein-containing component.
  4. Use according to any of the preceding claims, characterized in that wood-based material boards are fibre boards.
  5. Use according to Claim 4, wherein the fibre boards are fibre boards of medium bulk density from 750 to 850 kg/m3.
  6. Use according to any of the preceding claims, wherein the coating is a painting operation of the wood-based material board.
  7. Use according to any of the preceding claims, wherein the coating is a powder coating operation.
  8. Use according to any of the preceding claims, characterized in that the fibres, chips or strands are sprayed with the adhesive and then dried, and subsequently the composition is heated and compressed.
  9. Use according to any of the preceding claims, characterized in that the adhesive is used in a proportion of 5 weight% to 20 weight% of absolutely dry fibres, chips or strands.
  10. Use according to any of the preceding claims, characterized in that use is made as adhesive of a combination of an adhesive comprising i) a phenol-formaldehyde adhesive component and ii) a low molecular mass, protein-containing natural component and a further adhesive selected from the group consisting of a urea-formaldehyde adhesive, a melamine-urea-formaldehyde adhesive, a melamine-urea-phenol-formaldehyde adhesive, a tannin-formaldehyde adhesive, a phenol-formaldehyde adhesive, an adhesive based on isocyanates or a mixture thereof.
  11. Use according to any of the preceding claims, characterized in that the adhesive comprising i) a phenol-formaldehyde adhesive component and ii) a low molecular mass, protein-containing component is used as copolymer.
  12. Use according to any of the preceding claims, characterized in that additionally an alkali metal salt, alkaline earth metal salt or ammonium salt is used in an amount of 0.1 to 1 weight% of absolutely dry fibres, chips or strands.
  13. Use according to Claim 12, wherein an alkali metal salt, alkaline earth metal salt or ammonium salt is used in an amount of 0.2 to 0.5 weight% of absolutely dry fibres, chips or strands.
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