EP2022050A1 - Memory data writable and readable by micropoints, box structures and the manufacturing method - Google Patents
Memory data writable and readable by micropoints, box structures and the manufacturing methodInfo
- Publication number
- EP2022050A1 EP2022050A1 EP07729586A EP07729586A EP2022050A1 EP 2022050 A1 EP2022050 A1 EP 2022050A1 EP 07729586 A EP07729586 A EP 07729586A EP 07729586 A EP07729586 A EP 07729586A EP 2022050 A1 EP2022050 A1 EP 2022050A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- islands
- microtip
- zone
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1463—Record carriers for recording or reproduction involving the use of microscopic probe means
- G11B9/149—Record carriers for recording or reproduction involving the use of microscopic probe means characterised by the memorising material or structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/04—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using record carriers having variable electric resistance; Record carriers therefor
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B9/00—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor
- G11B9/12—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor
- G11B9/14—Recording or reproducing using a method not covered by one of the main groups G11B3/00 - G11B7/00; Record carriers therefor using near-field interactions; Record carriers therefor using microscopic probe means, i.e. recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium; Record carriers or media specially adapted for such transducing of information
- G11B9/1463—Record carriers for recording or reproduction involving the use of microscopic probe means
- G11B9/1472—Record carriers for recording or reproduction involving the use of microscopic probe means characterised by the form
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
Definitions
- the invention relates to data memories writable or readable via microtips.
- microtip mass storage memories In the quest for ever-increasing information storage densities, so-called microtip mass storage memories have been devised in which the data entry and the reading of the stored data are done by applying an apex-sized microtip. extremely small (a few nanometers) against the surface or near the surface of a substrate that carries a sensitive layer that will also be called media.
- the application of a writing micropoint on the sensitive layer makes it possible to locally change the physical state of the layer without modifying the state thereof around the zone concerned.
- the state change may be a change in electrical state such as a resistivity value change, or a larger physical state change (for example, from an amorphous state to a crystalline state) that induces a change in state. elsewhere, most often also a modification of electrical, thermal or even chemical properties.
- microtip for the storage of data is inspired by the work that has been conducted in the field of atomic force microscopy (AFM for "Atomic Force Microscope”); this work has shown that one can explore a surface using a microtip with an extremely high geometric resolution (nanoscale).
- the microtip For an atomic force microscope, the microtip is moved over the surface of an object to explore its relief by measuring microtip displacements; for a data memory, the microtip is moved over the surface of the substrate to write data, with a very high density, and reread them.
- the density is related to the size of the microtip and the position determination accuracy of the microtip on its displacements, as well as to the specific resolution of the media which depends on the grain size of the sensitive layer.
- a thermal effect is also used: the electrical resistance presented by the tip is sensitive to heat, and the temperature that the tip takes depends on whether the tip is in a hole created during registration and increases the heat transfer; it is therefore possible, by placing the tip in an electrical measuring circuit, to detect the presence of holes, in relation to the position of the tip.
- the sensitive layer is an insulating layer in which the microtip applies an electrical breakdown voltage locally creating an electrically conductive area in the middle of the insulating environment. Replay is electrical, by measuring the current flowing through the microtip. It may be noted that this solution does not allow erasure because the breakdown is irreversible, and the memory is not rewritable, which is a drawback.
- Phase change materials typically from the chalcogenide family such as Ge 2 Sb 2 Te 5 , or AgInSbTe, have also been tested: by thermal action of the microtip on a localized area, the material can be passed locally. an amorphous state to a state crystallized. The state is reversible and one can theoretically erase a registered zone by putting it again in the amorphous state, always using a heating but under different conditions (generally with a soak, that is to say say rapid cooling).
- ironing (erasing) a crystalline zone in the amorphous state may leave or create an unwanted crystalline ring around the amorphous area.
- the residual conductivity of this crown device may prevent detection of the amorphous nature of the area that was desired to be erased.
- the invention particularly aims to facilitate the recording, reading, erasure, writable data memory and readable by microtips.
- the invention proposes a data storage memory, writable and readable by means of at least one writing or reading microtip that comes in proximity (in contact with or in the immediate vicinity) of a zone to write or read on the surface of a substrate, either to change the physical state of this zone, in writing or erasure, or to determine the physical state of the zone, the data stored in the zone being defined by the physical state of the zone, in reading, characterized in that the surface of the substrate is subdivided into a set of individual islands of a layer of a first sensitive material liable to change state under the action of the micropoint writing, each island being surrounded by a box formed by a second material little or not sensitive to the action of the writing microtip, this second material completely separating the individual islands from each other.
- a layer previously structured by a network of boxes ie a mesh network of walls connected to each other is used, which isolates the individual islets from each other; an individual island delimited by the inner periphery of a box constitutes an individual area corresponding to at least one elementary data stored in memory.
- the sensitive layer is preferably constituted by a material capable of changing the crystalline phase by controlled thermal action, in particular a chalcogenide, and in particular a GeSbTe compound of germanium, antimony and tellurium or an AgInSbTe compound of silver, of indium, of antimony and tellurium, able to pass from an amorphous state to a crystalline state in a reversible manner under the effect of controlled heating.
- the crystallization properties depend in particular on the proportion of silver, the silver lowering the crystallization temperature and thus facilitating it.
- Other materials are conceivable, such as compounds based on germanium and tellurium GeTe or germanium and selenium GeSe.
- the invention is however applicable to other types of materials, for example polymers capable of changing state and electrical conduction during a temperature cycle including for example a thermal quenching (very fast cooling).
- the material of the boxes surrounding the sensitive layer is preferably an electrically insulating material; it preferably has a low thermal conductivity. This may be in particular a ZnS zinc sulphide compound and SiO 2 silica, rather rich in ZnS (70 to 80% by weight for example).
- the second material that of the boxes
- less sensitive to phase changes than the first material that of the islands
- differentiation impurities are contained in one and / or the other of the two materials.
- the impurities are chosen in such a way that they facilitate the change of amorphous / crystalline state for the first material (that of the individual islands), and / or that they make it more difficult to change the state for the second material (that of the the caisson network that surrounds the islets).
- the impurity implanted in the islands will preferably be made of silver which tends to lower the crystallization temperature and thus to facilitate the crystallization of the material.
- the impurity implanted in the boxes will rather increase the crystallization temperature; the impurity may be hafnium or more generally an atom of great atomic number to better tend to hinder any process of crystallization.
- impurities implanted in the boxes may also be advantageous for the impurities implanted in the boxes, that these impurities are impurities tending to reduce the electrical conduction (oxygen, nitrogen, hydrogen, argon, gallium); indeed, the decrease of the conductivity will make it more difficult a phase change (crystallization in particular) in the caissons while this change of phase will remain possible in the islets which will not have received this impurity.
- the substrate is covered with a thermal barrier layer of low heat conducting material and a continuous electrode which covers the barrier layer; the continuous electrode is covered with islands of the layer of sensitive material surrounded by boxes formed by the second material; all the islands and caissons are covered by a friction reduction layer of the microtip; this layer acts as a protective layer against microtip and media wear.
- the substrate may be silicon, glass, or organic material.
- the barrier layer may be silica, silicon nitride, or preferably ZnS zinc sulphide compound and silica SiO 2 , the latter compound having a low thermal conduction (about 200 times less than silicon).
- the thickness of the barrier layer can be from about 10 nanometers to 100 nanometers.
- the electrode may be of titanium nitride or carbon; it is preferably made of a material having both an electrical resistivity intermediate between the resistivities of the two crystalline and amorphous states of the medium and a low thermal conductivity. If the electrode is carbon, we can add metal elements such as silver, chromium, nickel, gold, to adjust the electrical conductivity.
- the thickness of the electrode may be of the order of 2 to 10 nanometers for example.
- the wear protection layer of the microtips may be carbon.
- the substrate is covered with a thermal barrier layer of low heat-conducting material covered with islands of the sensitive layer; the islands are surrounded by caissons consisting of the superposition of the second layer, an electrode, and a third insulating layer electrically and thermally insulating; all the islands and caissons are covered by a friction reduction layer of the microtip; this layer acts as a protective layer against microtip and media wear.
- the electrode (electrically continuous due to the continuity of the boxes which are connected to each other) is somehow pierced with an opening at the location of each island, and the electrical connection between an island and the electrode is made by the edge of the electrode around the periphery of the island.
- etching masks obtained by photolithography it is possible to use so-called "self-organization” methods: in these In the processes, a layer of material is deposited under conditions such that the material automatically agglomerates into small islands separated from each other. This self-organization can produce, on very thin layers, a network of islands with a higher resolution than photolithography allows.
- the material thus deposited can be used directly as an active material in the final product, or it can constitute a mask for defining a pattern in another layer, this other layer possibly possibly itself constituting a layer of the media, or serving itself. same mask to define a pattern in a third layer.
- the invention proposes a novel method for manufacturing a writable and readable memory via at least one writing or reading microtip that comes into contact with an elementary zone to be written on or read on the surface of a substrate, characterized in that the elementary zones are individual islands of a first material, surrounded by caissons of different material, and in that the islands are defined using a self-organizing step at least one substance which, when deposited on a surface of a substrate, is able to self-organize into a pattern of individual islands separated from each other.
- the self-organizing substance may be an impurity intended to be diffused in an underlying layer to define individual islands. It can also be a substance serving as a mask for the treatment of an underlying layer.
- the substance which self-organizes may in particular be a polymer, this polymer being deposited at the same time as a second polymer having affinities with the first, the bonding forces between the two polymers generating a self-organization in which the first polymer agglomerates into individual islands surrounded by a matrix of the second polymer.
- FIG. 1 represents the principle of a microtip memory
- FIG. 3 represents the principle of a microtip memory, structured according to the invention
- FIGS. 4 to 9 represent the steps of a method of manufacturing a memory according to the invention in a first exemplary embodiment
- FIG. 10 to 15 show the steps of manufacturing a memory in another embodiment.
- phase change is meant above all the transition from an amorphous phase to a crystalline phase.
- controllable phase change material is meant a material whose crystallization temperatures are sufficiently low and the conditions for crystallization or return to the amorphous state are sufficiently known for selectively and voluntarily under the effect of an electric control by a microtip, to produce the passage of a state towards the other.
- the transition speeds between phases will be less than 10 microseconds.
- a substrate 10 is covered by a continuous thermal barrier layer preventing excessive heat dissipation to the substrate during writing or erasure (too much heat dissipation would tend to prevent heat concentration and therefore crystallization).
- the barrier layer 20 is covered with a continuous electrode 30 that can be brought to a desired potential (a ground potential for example, to simplify the understanding).
- the continuous electrode 30 is covered with a continuous layer 40 of a material such as a chalcogenide, especially Ge 2 Sb 2 Te 5 .
- This material has the property of being able to change reversibly phase, between an amorphous phase and a crystalline phase, by thermal action at relatively easy to reach temperatures and under known conditions with respect to the rates of warming and necessary cooling for these phase changes.
- the layer 40 is the sensitive layer of the memory, it is she who stores the information; the binary information corresponding to a small area of the layer is the amorphous or crystalline state of this zone.
- the sensitive layer 40 is preferably covered with a layer 50 called the tribological layer.
- This layer serves to facilitate the sliding of the reading or writing microtip on the surface of the substrate for access to the different individual zones of the sensitive layer. This is a layer of protection against wear of the microtip.
- the writing can be done for example by applying an electrical voltage pulse between the microtip and the electrode (Joule direct heating). Erasing is done by applying a voltage pulse of different characteristics (shorter). The reading is done by applying a lower voltage on the microtip and measuring the current flowing through the tip.
- FIG. 1 there is shown a single read or write tip 60, but a multiplicity of individually controlled network peaks can be used to simultaneously access a large number of individual zones and thus to increase the speed of transmission.
- writing or reading the media are extremely thin points (of the order of a few nanometers in area at their end) carried by the end of a lever arm cantilever.
- Figure 2 shows schematically what happens when erasing a memory area, showing the risk of a bad erasure. It is assumed that the erased initial state of the memory is a state in which the entire sensitive layer is in an amorphous state (Fig. 2a). In this amorphous state, the vertical conductivity of the sensitive layer from the microtip to the electrode 30 is low. Information is created by rendering an individual area 70 (Fig. 2b) below the microtip; this is done by applying direct or indirect heating by microtip 60, at a temperature allowing crystallization. Heating at about 200 ° C. for a hundred nanoseconds allows this to be done; this heating can be generated directly (Joule effect) by the passage of a current between the microtip 60 and the electrode 30.
- the electrical conductivity (vertically) is higher between the microtip and the electrode 30.
- the erasure can be done by applying a higher heating, of the order of 600 ° C to 700 ° C and soaking, that is to say, very fast cooling (of the order of 10 nanoseconds).
- This remelting followed by quenching makes it possible to reconstitute an amorphous zone in place of the crystalline zone 70.
- this amorphous zone is not perfect and in practice it risks being in the form of an amorphous central portion. surrounded by a peripheral zone 74 which is partly crystalline (FIG. 2c). This results from temperature conditions and cooling rates which are different in the central zone and at the periphery. If this is the case, the memory point is badly erased because the residual conductivity of the peripheral zone can make believe, when reading, the presence of a crystalline zone and not an amorphous zone.
- FIG. 3 represents a schematic example of structured memory according to the invention.
- the memory comprises individual sensitive zones 75 of a controllable phase change material (compound based on tellurium Te or antimony Sb or germanium Ge, such as GeTe or GeSb or SbTe or a chalcogenide such as GeSbTe, for example Ge 2 Sb 2 Te 5 , or AgInSbTe) in the form of individual islands surrounded by boxes 80 of a material different from the material of the zones 75 (preferably a silica and zinc sulphide compound, or possibly a low-conductive carbon such as hydrogenated carbon).
- the material of the caissons 80 is of a nature such that it is less easy to crystallize than the material of the islands 75.
- the caissons form a continuous mesh network, or a sort of regular grid, and the sensitive zones 75 are presented as punctual islands in the openings of this network.
- the caissons like the sensitive zones, are formed above a continuous electrode 30 (for example made of titanium nitride or of carbon made conductive by metal adjuvants such as Ag, Cr, Ni, Au etc.).
- the electrode 30 is itself formed above a layer 20 (preferably a silica and zinc sulphide compound) forming a thermal barrier between the electrode 30 and the substrate 10 (silicon or glass substrate or organic matter).
- a tribological protection layer 50 (preferably sprayed carbon) is preferably formed above the sensitive areas 75 and the caissons 80. the location of the sensitive areas 75, the superposition of layers can be similar to that of Figure 1.
- the material of the boxes is chosen of a nature little or not sensitive to the action of a current applied by the microtip: it does not change crystalline state as easily as the material of the islets; it is also insensitive to the heat generated in sensitive islands 75 during their writing or erasure; in other words, this material does not easily change state from the point of view of its electrical conductivity, whether under the direct action of the writing microtip or under the indirect action of the writing of a neighboring island.
- the material of the caissons is therefore advantageously an electrical insulating material (that is to say more insulating than the material of the sensitive zones, both when the latter is in a crystalline state and when it is in an amorphous state) so that the currents applied between the microtip 60 and the electrode 30 pass into the sensitive zone above which the tip is placed without being deflected in the material of the boxes.
- the casing material is preferably a poor thermal conductor to help locate heat in the islands.
- the writing is done by application, between the microtip (placed on the media above an island 75) and the electrode 30, of sufficient voltage (of the order of 3 to 5 volts), account- Given the high resistivity of the region of the sensitive layer in the amorphous state, to heat the island and bring it to the crystallization temperature for the time necessary for this crystallization.
- the heating current remains localized in the island and allows the crystallization of the layer preferably over the entire height of the island.
- the writing is typically by voltage pulses with a duration of the order of 100 to 1000 nanoseconds.
- Erasing is done by applying a high voltage to a crystal island through the microtip to melt the island material.
- the voltage pulse that produces the direct heating current required for this reflow is very short and the falling edge of the pulse is particularly short (less than 10 nanoseconds) to induce a very short cooling time; this produces a kind of soaking, allowing the material to remain in the amorphous state after melting.
- the small size of the island and the fact that the heating current is well concentrated in the island the whole of the zone becomes amorphous, without any risk of peripheral crystalline traces around the amorphous zone.
- the fact that the material of the box is relatively thermally insulating facilitates this quality of erasure, and from this point of view the choice of the ZnS-SiO 2 compound for the boxes is favorable.
- Erase pulses can typically last 40 nanoseconds.
- the surface layer 50 must have both a sufficiently high conductivity in the vertical direction so that the current applied by the microtip passes well in the vertical direction towards the island 75 and conductivity sufficiently low in the horizontal direction so that the current is not directed to the other islets (among which there may be islands that have passed into the more conductive crystalline state).
- the tribological layer 50 is very thin, which reduces its horizontal conductivity.
- the electrode 30 preferably has a conductivity which is neither too low nor too high, for example a conductivity intermediate between that of the material of the islands 75 in the crystalline state and that of this material in the amorphous state.
- the order of magnitude is 1 ohm-cm and the carbon, optionally doped with adjuvants increasing or reducing its conductivity, is adapted to the realization of the electrode.
- the reading is done by applying a lower voltage (1 to 2 volts) between the microtip and the electrode 30.
- the current that is measured is measured and the amorphous or crystalline nature of the island under a microtip is deduced therefrom. .
- the current remains well confined in an island below the microtip, especially when the island is again amorphous, due to the lack of electrical conductivity of the boxes surrounding the island.
- the non-registered state is amorphous or crystalline
- the non-registered state is the state in which the material to phase change is the most insulating possible (in practice the amorphous state).
- FIG. 4 shows by way of example the manufacturing steps of such a memory in a first embodiment.
- the buried electrode is continuous as in FIG. 3 and the phase-change material is deposited on the electrode.
- a substrate 10 silicon or glass or plastic
- a layer 20 forming a thermal barrier preferably 10 to 100 nanometers of silica or silicon nitride
- a ZnS-SiO 2 compound known for its low thermal conduction preferably 10 to 100 nanometers of silica or silicon nitride
- a layer 30 constituting the common continuous electrode is then deposited, for example a layer less than 5 nanometers of titanium or carbon nitride whose resistivity can be adjusted by incorporation of metallic elements (Ag, Cr, Ni, Au for example ).
- metallic elements Al, Cr, Ni, Au for example.
- the proportion of sp3 and sp2 orbital bond hybridization carbon atoms can also be adjusted from the pressure and deposition temperature conditions to better control the resistivity.
- a layer 40 of controllable phase change material is deposited on the electrode, preferably a chalcogenide such as Ge 2 Sb 2 Te 5 (the exact proportions of the constituents may vary, for example it may be Ge22.2Sb22.2Te 55 , 6 ) or AgInSbTe.
- the thickness of this layer can be a hundred nanometers.
- the material is generally deposited in amorphous form.
- a patterning mask of the layer 40 is formed to delimit individual islands 75 of phase change material layer which constitute the elementary points of the memory.
- the mask may be a resin mask or a mineral mask obtained by image transfer of a resin mask.
- a layer of a material which is electrically insulating and preferably poor conductor of heat is deposited ( Figure 6), on the substrate thus covered with islands 75, a layer of a material which is electrically insulating and preferably poor conductor of heat.
- This material fills the gaps between the individual islands 75 forming a network of boxes 80 in which each box surrounds a respective island.
- the material may be a compound of silicon oxide and zinc sulfide. Its thickness is greater than the height of the islets 75.
- the excess layer height 80 (and the mask 77 if it has not been removed before) is then removed (FIG. 7) by any known method (plasma, chemical mechanical polishing CMP).
- a layer 90 of encapsulating material is deposited (FIG. 8) which protects the phase-change layer.
- This material may be titanium nitride or carbon made conductive by the presence of metal impurities.
- the thickness of the layer 90 may be about 5 to 20 nanometers.
- the substrate is planarized for example by mechanical and chemical polishing and is deposited (Figure 9) a thin layer called "tribological layer" 50 which facilitates the sliding of the microtip and protects it from excessive wear.
- This layer may be of the same nature as the layer 90, in particular of carbon; it is very thin (less than 10 nanometers), it must be sufficiently vertically conductive to allow the passage of a current through the phase change layer, but it must be conductor horizontally so that there is no diverting current to another island 75 when the microtip is applied over an island.
- the material of the encapsulation layer 90 and the material of the tribology layer can also be deposited in a single step.
- phase-change material consist of the superposition of a first insulating layer (electrically and thermally), an electrode and a second insulating layer.
- the phase change layer is not deposited above the electrode but passes through holes in the electrode. These holes physically correspond to the position of the islets.
- a substrate 10 silicon or glass or plastic
- a layer 20 forming a thermal barrier preferably 10 to 100 nanometers of silica or silicon nitride
- a thermal barrier preferably 10 to 100 nanometers of silica or silicon nitride
- a first layer 82 of a thermally and electrically insulating material which will constitute in part the material of the boxes surrounding the islands of phase change material.
- a layer 30 constituting the common continuous electrode is then deposited, for example a layer less than 10 nanometers of titanium or carbon nitride whose resistivity can be adjusted by incorporation of metallic elements (Ag, Cr, Ni, Au for example ).
- the proportion of sp3 and sp2 orbital bond hybridization carbon atoms can also be adjusted from the pressure and deposition temperature conditions to adjust the resistivity. And there is deposited a second layer 84, similar to the layer 82.
- the boxes will be constituted by the superposition of the layers 82, 30 and 84.
- the steps of defining the box patterns are then carried out.
- the simplest is to use a photolithography operation by depositing and engraving a mask 77 whose pattern is that of the boxes to be made ( Figure 1 1). Note that the mask is complementary to that used in the previous example ( Figure 5).
- the etching mask may be made from an insolated photosensitive resin or a layer of deformed material by any molding or stamping process. It can also be realized from self-organization processes which will be discussed later.
- the mask thus obtained makes it possible to transfer the masking pattern into the underlying layers 84, 30, 82. This is done by reactive ion etching or ion beam etching. Holes are thus formed in this stack of layers and only the box pattern remains; the etching is stopped on the bottom of the layer 20; the mask 77 is then removed by chemical or mechanical action (FIG. 12).
- a layer 40 of controllable phase change material is then deposited which at least partially fills the openings formed in the boxes. This material forms islands separated from each other and these islets constitute the individual memory areas ( Figure 13).
- the phase change material is preferably sprayed over the entire surface and it is preferable to heat the substrate so that the material migrates to the bottom of the cavities. It is also possible to facilitate the migration of the phase change material at the bottom of the cavities by increasing the wettability of the surface and this is possible by first spraying a very fine layer of carbon or material having wettability properties on the surface having the cavities (eg chromium, nickel).
- phase change material If there is an excess of phase change material, it is removed by etching so that this material does not completely fill the holes formed in the boxes.
- an encapsulation material 90 for example titanium nitride or carbon (FIG. 14), is deposited.
- the surface of the substrate is planarized by a mechanical and chemical polishing process and the process is terminated by depositing a thin layer of tribology 50 (FIG. 15), in the same manner as explained with reference to FIG. layer may be carbon atomized with metal adjuvants to adjust its resistivity.
- the encapsulation material and the tribology layer may possibly be subject to a single deposit.
- the material of the individual islands is very different from the material of the caissons (second material) since it is respectively a chalcogenide and a ZnS-SiO 2 compound.
- the islands and caissons materials which are very close to one another but differentiated from the point of view of the crystallization properties.
- a structured memory is then used in which there is a layer of material which, for the most part, is a material capable of changing phase in a controlled manner during a thermal process, and the composition of the material is different in the islands. and the caissons that surround them so that the phase change is easier in the islands than in the caissons.
- the areas of memory consist generally of the same material as the boxes that surround them, but the compositions are slightly different in the islands and caissons.
- the composition of a uniform layer deposited on the substrate is locally modified; this modification is made either in the islets or on the contrary in the caissons which surround them.
- the composition modification can be made by implantation, diffusion, doping with species that chemically or structurally combine with the controllable phase change material.
- the method is based either on a mask for delimiting the implantation, doping or diffusion zones, or on a self-organization of the material to be diffused before proceeding to a step of actual migration of the dopant in the controllable phase change layer.
- a basic stack is carried out as previously described (FIG.
- phase-change material chalcogenide, GeSbTe or InSbTe
- an open mask is made according to the pattern of the boxes to be made, by photolithography or stamping or self-organization; then gaseous species such as oxygen or nitrogen are diffused through the openings of the mask, which will reduce the conductivity of the phase-change material and thus make it very difficult to change the phase by application of write current in the scattered areas, that is to say in the boxes.
- This diffusion process is controlled by the conditions of pressure, temperature, and the duration of the bringing into contact with the species to be diffused.
- the presence of the tribology layer contributes to stopping the diffusion of oxygen or nitrogen in the material.
- oxygen and nitrogen one could use hydrogen, or a heavy dopant such as hafnium or gallium or argon. These heavy atoms tend to increase the crystallization temperature of the phase change material, thus making the phase change more difficult.
- the structure then comprises individual islands of controllable phase change material, surrounded by wells whose conductivity has become much lower than that of the islet material (in their amorphous or crystalline state) so that the writing microtip can not not to pass in the caissons a current which would be likely to change the structure or the electrical conductivity.
- the base material used is a compound of indium In, antimony Sb and tellurium Te (possibly containing gallium which tends to increase the crystallization temperature), and is added locally in the islets but not in the caissons impurities of a chemical species (silver in particular) which tends to facilitate the control of the crystallization (for example because the incorporation of this species lowers the crystallization temperature).
- a mask is formed on a layer of InSbTe or InSbTeGa material, the masking pattern being open at the locations corresponding to the individual islands to be formed; silver impurities are deposited on this mask and diffuse into the InSbTe layer where the mask is open.
- the mask can be formed from photolithography steps or by using a self-organizing method.
- An extremely thin layer of continuous silver is deposited, of thickness of the order of a few nanometers; by self-organization assisted thermally (at a temperature of about 400 0 C) the silver agglomerates into individual islands separated from each other in a fairly regular pattern. By increasing the temperature the silver migrates into the phase-change material at the point where it has agglomerated, and it modifies by lowering the crystallization temperature at these places which become the individual islands of the memory.
- the mask is opened at the place of the caissons and not the islets, one starts from a layer of material easily crystallizable (for example a compound AgInSbTe) and deposited on the mask, for the purpose of diffusion of species where the mask is open, an impurity such as hafnium (more generally atoms of great atomic number) which tends to impede any process of crystallization.
- the material of the starting layer remains a controllable phase change material outside the boxes defined by the mask, and it becomes a material without possibility of phase control in the masked islands.
- phase change materials capable of reversing from an amorphous state to a crystalline state. It is applicable more generally to other materials which, without having properly speaking an amorphous phase and a crystalline phase, can have two states whose electrical conductivities, or even other properties, can be detected by a micropoint in phase. reading, the material can pass from one state to another under the effect of an action of the microtip in write phase.
- the self-organization step will be a step of forming a mask from which it will be possible to perform a selective operation in the non-masked areas of at least one layer of material located under the mask.
- the self-organized mask may be a positive mask protecting areas corresponding to individual islands defining the elementary points of the memory, or on the contrary a negative temporary mask defining these islands but serving to define a complementary positive mask protecting the surrounding boxes. individual islands. In the latter case, the mask defined by self-organization will be eliminated before proceeding to steps of processing a layer under the complementary positive mask.
- a self-organized mask is constituted in the following manner: a layer of a few tens of nanometers consisting of a mixture of two different polymers, which are polystyrene and polymethylmethacrylate, respectively, is deposited on the surface to be masked. a solvent such as toluene which allows sufficient mobility of the polymers.
- the two polymers organize themselves spontaneously by separating in a regular way: the polymethacrylate is formed in hexagonal cylindrical blocks embedded in a regular matrix of polystyrene. The diameter of the blocks and the periodicity of the network depend in particular on the molecular weights of the compounds.
- a long-term heat treatment (several tens of hours at a temperature of the order of 150 ° C.) stabilizes this organization.
- one of the polymers can be selectively removed by a chemical which dissolves it without attacking the other polymer.
- a chemical which dissolves it without attacking the other polymer.
- ultraviolet exposure degrades polymethacrylate by paralleling the polymerization of polystyrene, and it is only necessary to remove the polymethacrylate residues with acetic acid aided by ultrasonic agitation.
- This mask can be used for example to define by etching or diffusion patterns in the underlying layer, these patterns corresponding to the holes and to individual islands.
- holes can be made in the oxide layer corresponding to the holes of the mask by etching with CHF3 in reactive ion etching in the presence of argon; CH F3 does not attack the polystyrene but attacks the oxide.
- the silicon oxide layer thus etched with the self-organized pattern can itself serve as a mask.
- the mask thus produced can be used to define a complementary mask by a lift-off operation, that is to say an operation in which a material is deposited both on the mask and in the holes of the mask and then eliminates both the mask and the product that covers it leaving the product where it has been deposited in the holes of the mask.
- a lift-off operation that is to say an operation in which a material is deposited both on the mask and in the holes of the mask and then eliminates both the mask and the product that covers it leaving the product where it has been deposited in the holes of the mask.
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Abstract
Description
Claims
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Application Number | Priority Date | Filing Date | Title |
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FR0604809A FR2901909B1 (en) | 2006-05-30 | 2006-05-30 | INSCRIPTIBLE AND MICROPOINT-READABLE DATA MEMORY, BUILD-IN STRUCTURE, AND METHOD OF MANUFACTURE |
PCT/EP2007/055163 WO2007138035A1 (en) | 2006-05-30 | 2007-05-29 | Memory data writable and readable by micropoints, box structures and the manufacturing method |
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US (1) | US20090173929A1 (en) |
EP (1) | EP2022050A1 (en) |
JP (1) | JP2009539198A (en) |
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FR2910686B1 (en) | 2006-12-20 | 2009-04-03 | Commissariat Energie Atomique | MEMORIZATION DEVICE WITH MULTI-LEVEL STRUCTURE |
KR20100099581A (en) * | 2009-03-03 | 2010-09-13 | 삼성전자주식회사 | Method of forming phase change material layer |
US8017433B2 (en) * | 2010-02-09 | 2011-09-13 | International Business Machines Corporation | Post deposition method for regrowth of crystalline phase change material |
FR2960700B1 (en) * | 2010-06-01 | 2012-05-18 | Commissariat Energie Atomique | LITHOGRAPHY METHOD FOR REALIZING VIAS-CONNECTED CONDUCTOR NETWORKS |
EP3547026B1 (en) * | 2018-03-28 | 2023-11-29 | CSEM Centre Suisse d'Electronique et de Microtechnique SA | Method for producing a metal stamp for embossing a nano- and/or microstructure on a metal device as well as uses thereof and devices made therewith |
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JP2001155392A (en) * | 1999-11-25 | 2001-06-08 | Ricoh Co Ltd | Phase transition type recording medium and recording/ reproducing device |
JP4099953B2 (en) * | 2001-03-23 | 2008-06-11 | ソニー株式会社 | Rewritable multilayer optical disc |
US6542400B2 (en) * | 2001-03-27 | 2003-04-01 | Hewlett-Packard Development Company Lp | Molecular memory systems and methods |
JP3886802B2 (en) * | 2001-03-30 | 2007-02-28 | 株式会社東芝 | Magnetic patterning method, magnetic recording medium, magnetic random access memory |
FR2832845A1 (en) * | 2001-11-27 | 2003-05-30 | Commissariat Energie Atomique | High density data recording system for, e.g., data storage and image or video recording comprises support with phase change layer, recording element having writing stylus, and resistive elements for local dispersion of writing current |
US7149155B2 (en) * | 2002-09-20 | 2006-12-12 | Hewlett-Packard Development Company, L.P. | Channeled dielectric re-recordable data storage medium |
KR20040042387A (en) * | 2002-11-14 | 2004-05-20 | 엘지전자 주식회사 | Method of manufacturing writing media for use in probe type data storage device |
US6961299B2 (en) * | 2002-12-05 | 2005-11-01 | Hewlett-Packard Development Company, L.P. | Storage device |
KR100585462B1 (en) * | 2003-12-26 | 2006-06-07 | 한국전자통신연구원 | Data storing and reading apparatus |
EP1756808A2 (en) * | 2004-04-16 | 2007-02-28 | Nanochip, Inc. | Methods for writing and reading highly resolved domains for high density data storage |
FR2870978B1 (en) * | 2004-05-28 | 2007-02-02 | Commissariat Energie Atomique | POROUS THERMAL BARRIER RECORDING DEVICE |
WO2006045332A1 (en) * | 2004-10-27 | 2006-05-04 | Singulus Mastering B.V. | Mastering process with phase-change materials |
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- 2007-05-29 JP JP2009512567A patent/JP2009539198A/en active Pending
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- 2007-05-29 WO PCT/EP2007/055163 patent/WO2007138035A1/en active Application Filing
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FR2901909A1 (en) | 2007-12-07 |
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