EP2007178A3 - Appareil électronique doté d'au moins un élément de raccordement électrique et procédé de fabrication d'un élément de raccordement - Google Patents

Appareil électronique doté d'au moins un élément de raccordement électrique et procédé de fabrication d'un élément de raccordement Download PDF

Info

Publication number
EP2007178A3
EP2007178A3 EP08104210.3A EP08104210A EP2007178A3 EP 2007178 A3 EP2007178 A3 EP 2007178A3 EP 08104210 A EP08104210 A EP 08104210A EP 2007178 A3 EP2007178 A3 EP 2007178A3
Authority
EP
European Patent Office
Prior art keywords
connected element
collar
electronic device
substrate
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08104210.3A
Other languages
German (de)
English (en)
Other versions
EP2007178A2 (fr
EP2007178B1 (fr
Inventor
Reinhold Danner
Andre Lischeck
Udo Schulz
Thomas Proepper
Heinrich Barth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2007178A2 publication Critical patent/EP2007178A2/fr
Publication of EP2007178A3 publication Critical patent/EP2007178A3/fr
Application granted granted Critical
Publication of EP2007178B1 publication Critical patent/EP2007178B1/fr
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
EP08104210.3A 2007-06-21 2008-06-02 Appareil électronique doté d'au moins un élément de raccordement électrique et procédé de fabrication d'un élément de raccordement Ceased EP2007178B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200710028511 DE102007028511A1 (de) 2007-06-21 2007-06-21 Elektronisches Gerät mit mindestens einem elektrischen Anschlusselement und Verfahren zur Herstellung eines Anschlusselements

Publications (3)

Publication Number Publication Date
EP2007178A2 EP2007178A2 (fr) 2008-12-24
EP2007178A3 true EP2007178A3 (fr) 2013-12-11
EP2007178B1 EP2007178B1 (fr) 2017-08-09

Family

ID=39916618

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08104210.3A Ceased EP2007178B1 (fr) 2007-06-21 2008-06-02 Appareil électronique doté d'au moins un élément de raccordement électrique et procédé de fabrication d'un élément de raccordement

Country Status (2)

Country Link
EP (1) EP2007178B1 (fr)
DE (1) DE102007028511A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1465852A1 (de) * 1963-07-24 1969-03-27 Licentia Gmbh Verfahren zur Herstellung von metallkaschierten Leiterplatten
US3969815A (en) * 1973-09-19 1976-07-20 Siemens Aktiengesellschaft Process for forming a through connection between a pair of circuit patterns disposed on opposite surfaces of a substrate
DE19709551A1 (de) * 1997-03-07 1998-09-10 Wuerth Elektronik Gmbh & Co Kg Leiterplatte und Verfahren zum Verbinden einer Leiterplatte
US6084296A (en) * 1998-07-09 2000-07-04 Satcon Technology Corporation Low cost high power hermetic package with electrical feed-through bushings
EP1737282A1 (fr) * 2004-03-31 2006-12-27 Mitsubishi Cable Industries, Ltd. Carte de circuit imprimé, méthode de fabrication de celui-ci et boîte de jonction utilisant cette carte de circuit imprimé

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1465852A1 (de) * 1963-07-24 1969-03-27 Licentia Gmbh Verfahren zur Herstellung von metallkaschierten Leiterplatten
US3969815A (en) * 1973-09-19 1976-07-20 Siemens Aktiengesellschaft Process for forming a through connection between a pair of circuit patterns disposed on opposite surfaces of a substrate
DE19709551A1 (de) * 1997-03-07 1998-09-10 Wuerth Elektronik Gmbh & Co Kg Leiterplatte und Verfahren zum Verbinden einer Leiterplatte
US6084296A (en) * 1998-07-09 2000-07-04 Satcon Technology Corporation Low cost high power hermetic package with electrical feed-through bushings
EP1737282A1 (fr) * 2004-03-31 2006-12-27 Mitsubishi Cable Industries, Ltd. Carte de circuit imprimé, méthode de fabrication de celui-ci et boîte de jonction utilisant cette carte de circuit imprimé

Also Published As

Publication number Publication date
DE102007028511A1 (de) 2008-12-24
EP2007178A2 (fr) 2008-12-24
EP2007178B1 (fr) 2017-08-09

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