EP2005808B1 - Method and device for placing electronic components, especially semiconductor chips, on a substrate - Google Patents

Abstract

An apparatus for the placement of a semiconductor chip on a substrate is provided. The apparatus includes: (a) a supply station adapted to include a semiconductor wafer in a substantially horizontal position, the semiconductor wafer including the semiconductor chip; (b) a placement station positioned entirely above the supply station, the placement station being adapted to support the substrate; and (c) a transport apparatus entirely above the supply station, the transport apparatus moving the semiconductor chip from the semiconductor wafer to the substrate, the transport apparatus including (1) a pivoting pick-up tool that removes the semiconductor chip from the semiconductor wafer, the pivoting pick-up tool being arranged on a rotary arm, the rotary arm rotates about a horizontal axis to raise the semiconductor chip to a transfer position entirely above the semiconductor wafer through an ascending curved movement, (2) a placement tool that moves the semiconductor chip to the placement station and bonds the semiconductor chip on the substrate at the placement station, and (3) at least one pivoting transfer tool that transfers the semiconductor chip from the pivoting pick-up tool to the placement tool, each of the at least one pivoting transfer tool being arranged on a respective rotary arm to rotate about a respective horizontal axis to raise the semiconductor chip along a respective ascending curved movement.

Description

The invention relates to a method for depositing electronic components, in particular semiconductor chips on a substrate. With such a method, for example, in the manufacture of semiconductor components in chip assembly machines (diebonders), the unhoused chip is picked by the already divided silicon wafer (wafer) and then deposited or bonded onto corresponding substrates. After the bonding process, further process steps such as e.g. Curing, wire bonding, melting solder joints, encapsulating, separating, etc.

For the placement of the chip on the substrate, there are a variety of different processes, such as gluing, soldering or laminating. The nature of the connection process also determines whether the chip must be turned before placement (flip-chip applications) or not (non-flip applications). Turning of the chip is expressly understood below not a relative movement with respect to a spatial axis or spatial plane, but a turning with respect to the original bearing side. In the case of non-flip applications, the chip is not turned over and, after being picked up by the wafer film, transported directly in one step to the substrate, whereby the pickup tool is simultaneously used as a bonding tool. The support side with which the chip was glued onto the wafer film is then also the side with which the chip is glued onto the substrate. A known device of this kind is for example in EP 1 049 140 mentioned or become known by the company magazine "Newsline 1/2002" the applicant (machine type "Easyline"). In the case of flip-chip applications, the chip is deposited with its structure side after turning on the substrate, that is, the support side, with the chip was glued to the wafer, after placing then the side facing away from the substrate. Modern Diebondersysteme are increasingly demanding in terms of manufacturing costs, throughput, accuracy and process flexibility. Nevertheless, the machines should not exceed existing equipment in terms of height, machine layout, weight, etc. This leads to an ever greater complexity of the machines in terms of mechanics, motion sequences and control. By the US 2005/0132567 For example, a device has become known in which semiconductor chips are picked up by a rotatable picking tool with three tool heads and transported from there to a higher level and taken over by a further tool which guides the chips in a linear movement over the substrate and deposits it there. Picking plane and substrate plane run parallel, but at different levels. This makes it possible for the wafer table to be driven under the substrate table, which is obviously advantageous, especially for large wafers, because this makes it possible to keep the overall base area of the machine small. However, in this case, the chip is evidently always turned over by the transfer operation, so that it is not deposited with its support side but with its structure side on the substrate (flip-chip application). In addition, the rotatable picking tool needs to overcome the height difference between the picking plane and the discharge plane has a relatively large outer diameter, which is not advantageous in terms of both the kinematics and for reasons of space.

By the WO 97/32460 a device has become known in which a chip is transported in two work cycles from a receiving plane to a delivery plane. It is sold at a stopover and there either swiveled or rotated.

It is therefore an object of the invention to provide a method of the type mentioned, in which the height difference between the level of the supply station and a higher level deployment can be overcome with less space and kinematically more advantageous and in addition also components can be placed on the substrate again with the same support page (non-flip application), with the highest possible throughput can be achieved with an improved Absetzgenauigkeit. It should also be possible to pick at room temperature, but may also be able to place hot. In addition, it should be possible with the same storage or with the same device to drive both flip-chip and non-flip applications in order to widen the range of use at low additional cost considerably. The position of the chip should be optimally detectable with the corresponding optical image recognition devices at different points. Finally, the device should also be as compact as possible and have the smallest possible machine floor plan. This object is achieved in procedural terms with a method having the features in claim 1. In terms of the device, the object is achieved with a device having the features in claim 11.

If the path of the component between the level of the supply station and the supply level is covered in at least two separate, ascending curve movements, space can obviously be saved with respect to the ground plan. The primary tool lays back a first curve movement with the component, transfers the component in a transfer position to at least one pivoting tool, which covers a second curve movement up to the delivery level. The curve radii are much smaller than when the stroke of the component must be covered by a single turning tool. In addition, much smaller masses must be accelerated or decelerated, which reduces the energy consumption and enables faster movement sequences. With correspondingly large height differences of course, several pivoting tools could be connected in series, so that the hub in more than two separate pivoting movements would be covered. Evidently, the at least one pivoting tool must be arranged in the effective range of the primary tool.

For a flip-chip application, it is particularly advantageous if the primary tool passes the component to an intermediate pivoting tool, which detects the component on the support side and, after a pivoting movement, transfers it to an end pivoting tool, which in turn captures the component on the structural side and pivots it into the deployment plane, where it is is transferred to the secondary tool, where it is finally deposited with the structure side on the substrate. Evidently, the intermediate pivoting tool assumes the function of transferring the component to the end pivoting tool in such a way that it can be detected on the structure side. Only under this condition, the component is last deposited by the secondary tool again with the structure side, if a repeated turning should be avoided.

In contrast, it is useful in non-flip applications when the primary tool passes the component directly to a Endschwenkwerkzeug which detects the component on the support side and pivots in the deployment plane, where it is passed to the secondary tool, where it last again with the same support side to the substrate is discontinued. Evidently, so already causes the transfer of the component from the primary tool to the Endschwenkwerkzeug that it can be detected by the secondary tool on the structure side and thus also discontinued again with the support side.

Particularly versatile applications arise, however, when the components in a first operating mode on the Zwischenschwenkwerkzeug and in a second operating mode directly The pivoting movement of the primary tool in the first or in the second operating mode, starting from the receptacle on the supply station preferably extends to separate movement sections, for example sectors. This allows either flip-chip applications and non-flip applications to be run. The execution of the pivoting movement of the primary tool on separate movement sections depending on the selected operating mode allows an optimal arrangement of the intermediate pivoting tool or the Endschwenkwerkzeugs or a geometrically optimal curve. Instead of partial arc movements, however, depending on the choice of gear used, other curve movements could be driven, such as a cycloid or a spiral. The opposite direction of curvature allows short distances and the most direct possible overcoming of the hub between the level of the storage station and the deployment level. The movement of the secondary tool from the acquisition of the component to over the substrate is advantageously linear. Again, however, a curved movement would be conceivable.

A particularly advantageous machine arrangement and movement guidance results when the transport of the component from the supply station to the substrate is essentially on an approximately vertical transport plane. All drive elements and auxiliary devices can be arranged as evident along this plane. As a result, the visual observation of the workflow and the maintenance of the machine is much easier. Further advantages can be achieved if the actual position (position and angle) of the component on the supply station is determined before recording with a first image recognition device, and or if the actual position of the component in the delivery plane is determined before transport to the substrate with a second image recognition device , and / or if the actual position of the substrate with a third image recognition device is determined, wherein deviations between the determined actual values and a predetermined target position of the component are preferably corrected during transport. The image recognition devices may, for example, be CCD cameras. With a total of only three such cameras, a very high degree of precision or an optimal correction possibility can be achieved. Depending on the application, it would also be conceivable, for example, to measure only the actual position of the component in the deployment plane.

With regard to the possibility of the different operating modes mentioned above, it is expedient if the determination of the actual position of the component in the deployment plane by the second image recognition device in the first operating mode from bottom to top against the component held on the secondary tool and in the second operating mode from top to bottom against the component held on the end pivoting tool takes place. This ensures that regardless of the operating mode in the deployment level, the component can always be measured on the structure side.

The determination of the actual position is advantageously carried out with one of the image recognition devices whenever the primary tool or the secondary tool or the end pivot tool releases the image field of the actual position to be determined. Transport movement and image recognition thus take place in such a way that they do not hinder each other.

Further advantages can be achieved if the first image recognition device is arranged in such a way that the acquisition of the image field assigned to it occurs in both operating modes from within the swivel range of the primary tool. Likewise, the second image recognition device for the second operating mode be arranged such that the detection of the image field associated with it takes place from within the pivoting range of the Endschwenkwerkzeugs. The first and the second image recognition device or their optical axes at the output opening can be arranged on mutually offset vertical axes. However, another arrangement would be possible, for example, if the axes of rotation of the primary tool and the Endschwenkwerkzeugs lie on a common vertical.

The third image recognition device for detecting the actual position of the substrate can be arranged on a preferably linearly displaceable carriage. This allows the camera to be moved to an observation position, regardless of the position of the secondary tool. This simplifies the construction of the substrate feed. Namely, for substrates having a matrix-like arrangement of settling positions, the substrates need only be displaced in one direction (x), while the other direction (y) can be achieved by the image recognition device movable in this spatial direction and the secondary tool also movable in this spatial direction. In addition, this evidently increases the flexibility of the processes and thus improves the throughput, since the measurement can be decoupled from the position of the secondary tool and thus processes can be parallelized. For high-precision applications, it may also be expedient to arrange the third image recognition device directly on the carriage of the secondary tool.

Further advantages can be achieved if the storage station is designed as a transport station for the preferably linear passage of a plurality of substrates. As a means of transport can be used per se known clamping devices, conveyor belts or the like.

In addition to the supply station, a wafer cassette can be arranged, which is movable for loading wafer frames on the supply station in different loading positions, in which the storage station and the wafer cassette are at least partially arranged on the same plane, wherein the wafer cassette is movable to a rest position in which the supply station for executing a loaded wafer frame is at least partially displaceable over the wafer cassette in the horizontal working plane. As can be seen, the wafer cassette can thus be arranged in a very space-saving manner without impairing its function when loading the workstation.

Further advantages can finally be achieved even if one or more intermediate storage stations are arranged in the pivoting area of the primary tool and / or the final pivoting tool, on which a component can be temporarily stored before being transferred to the secondary tool. As can be seen, individual components can be temporarily removed from the working process and stored temporarily in order to be further processed at a later time. In view of today's quality requirements in the production, it is partially necessary, for example, to differentiate chips in terms of quality. In order to obtain the highest possible yield, it may be necessary to sell only high-quality chips to high-quality substrate positions, whereby lower quality chips can be used on lower-quality substrate positions. The Zwischenablagestation allows a particularly simple way a qualitative control of the filing process.

Evidently, various embodiments of the invention are conceivable without departing from the subject matter of the scope. For example, two separate Endschwenkwerkzeuge components from a common primary tool and passed to two separate secondary tools.

Figur 1

Eine vereinfachte Darstellung eines unterteilten Wafers mit einem vergrössert dargestellten Halb- leiterchip,

Figur 2

eine perspektivische Gesamtdarstellung einer Vorrichtung,

Figur 3

eine stark vereinfachte Seitendarstellung der Vorrichtung gemäss Figur 2 mit einer Waferkasset- te in Ruhestellung,

Figur 4

die Vorrichtung gemäss Figur 3 mit der Waferkas- sette in der untersten Zufuhrstellung,

Figur 5

die Vorrichtung gemäss Figur 3 mit der Waferkas- sette in der obersten Zufuhrstellung,

Figur 6

eine perspektivische Darstellung eines Primär- werkzeugs, eines Zwischenschwenkwerkzeugs und ei- nes Endschwenkwerkzeugs sowie eines Sekundärwerk- zeugs,

Figur 7

eine schematische Darstellung des Kurvenverlaufs der Werkzeuge an der Vorrichtung gemäss Figur 6,

Figur 8

eine Seitendarstellung der ersten Bilderkennungs- einrichtung am Primärwerkzeug,

Figur 9

eine Seitendarstellung der zweiten Bilderkennungseinrichtung am Endschwenkwerkzeug,

Figur 10

eine Frontalansicht der beiden Bilderkennungseinrichtungen gemäss den Figuren 8

Figur 11a-l1e

und verschiedene Sequenzen eines Arbeitsvorgangs ohne Wenden des Bauteils, und

Figur 12a-12e

verschiedene Sequenzen eines Arbeitsvorgangs mit Wenden des Bauteils.

Further individual features and advantages of the invention will become apparent from the following description of an embodiment and from the drawings. Show it:

FIG. 1

A simplified representation of a subdivided wafer with an enlarged semiconductor chip,

FIG. 2

an overall perspective view of a device,

FIG. 3

a greatly simplified page representation of the device according to FIG. 2 with a wafer cassette at rest,

FIG. 4

the device according to FIG. 3 with the wafer cassette in the lowest feed position,

FIG. 5

the device according to FIG. 3 with the wafer cassette in the upper feed position,

FIG. 6

3 a perspective view of a primary tool, an intermediate pivoting tool and an end pivoting tool as well as a secondary tool,

FIG. 7

a schematic representation of the curve of the tools on the device according to FIG. 6 .

FIG. 8

a page representation of the first image recognition device on the primary tool,

FIG. 9

a side view of the second image recognition device on Endschwenkwerkzeug,

FIG. 10

a frontal view of the two image recognition devices according to the FIGS. 8

FIGS. 11a-1e

and various sequences of a work operation without turning the component, and

FIGS. 12a-12e

different sequences of a work process with turning of the component.

In FIG. 1 is shown in a highly simplified manner a known arrangement, in which an already divided semiconductor wafer 18 is glued to a wafer foil 19, which in turn is stretched in a wafer frame 20. The semiconductor chips 1 are already isolated by the sawing lines, which is indicated by the intersecting lines. Each chip 1 has a support side 4 with which it adheres to the wafer foil 19 before detachment. Semiconductor structure is applied on the side opposite the support side 4, which is why it is referred to below as the structure side 17. If the electronic component is not a semiconductor chip, the structure side simply corresponds to the top side of the component. The separation of the chips by sawing or the detachment process from the wafer film with the aid of needles and other auxiliaries are already sufficiently known to the person skilled in the art.

First, based on FIG. 2 describes the essential functional units of a device. On a machine frame, a storage station 5 is arranged, which in the present Case as wafer table for receiving prepared wafer frames according to FIG. 1 is trained. The supply station can be moved on a horizontal plane in two spatial axes, so that each individual chip can be moved to a detachment position. From a wafer cassette 27, which is lowered here in the rest position, if necessary, further wafer frames can be added. The storage station 3, to which the components must be transported from the storage station, is here designed as a feed system 39, on which in the direction of arrow x substrates 2 can be cyclically fed.

The individual chips are lifted by a primary tool 6 from the supply station 5 and pivoted upwards and then alternatively transferred to an intermediate pivoting tool 41 or directly to a final pivoting tool 42. The latter passes the chip to the secondary tool 8, which is displaceable along a carriage guide 21 to above the storage station 3.

Further details of the device are off FIG. 3 seen. For the transport of the individual chips 1, first of all a height difference between the level 47 of the supply station and the supply level 7 has to be overcome, which practically coincides with the level of the depositing station 3 with the substrates 2. This height difference is carried out in the manner described in more detail below at least two pivotal movements of the primary tool 6 and the Endschwenkwerkzeugs 42 and optionally still covered by an intermediate pivotal movement of the Zwischenschwenkwerkzeugs 41. The secondary tool 8 is attached to a carriage 15 which is linearly displaceable on a guide rail 21. On the secondary tool correction movements in the x and y axes and about an axis of rotation before settling of the component are possible if this is necessary due to the determination of the actual position.

The various work tools are provided with picking tools for holding a component e.g. provided by means of negative pressure. These receiving tools may preferably perform at least one further movement in its longitudinal axis and / or about its longitudinal axis.

In the pivoting range of the primary tool 6 and the Endschwenkwerkzeugs 42 each a Zwischenablagestation 40a and 40b is arranged. As mentioned above, these intermediate stations serve to temporarily place a chip in a waiting position for further transport at a later time. Similar to the work tools for the transport of the components and the intermediate storage stations are provided with recording tools.

For the monitoring and correction of different actual positions different cameras are arranged on the device. A first camera 10 determines the actual position of a chip 1 at the storage station 5 before lifting. A second lower camera 11a recognizes the position of a chip when transfer to the secondary tool 8 has already taken place. A second upper camera 11b, in contrast, detects the position of a chip on the end pivot tool 42 before transferring to the secondary tool 8. It can be seen that alternatively one of the two second cameras 11a is used or 11b, depending on whether the secondary tool detects the chip on the support side or on the structure side. Finally, a third camera 12 can detect the actual position of the substrate 2 on the storage station 3. This third camera 12 is arranged on a carriage 16, which is displaceable along a guide rail 22. Further details of these components can be found in the FIGS. 8 to 10 ,

Since the storage station 3 and the storage station 5 are at different levels, it can be seen, the storage station 5, so the wafer table with regard to its range of movement under the storage station, so push under the supply system, whereby the floor plan of the machine frame 26 can be kept very small. The storage station 5 must be horizontally displaceable in two spatial axes, since each individual chip to be removed is to be driven exactly under the lifting primary tool 6 in each case. Such controls are already known to the skilled person.

From the FIGS. 3 to 5 Further details on the displaceability of the storage station 5 in combination with the wafer cassette 27 can be seen. The wafer cassette 27 has different pockets in a known manner, wherein in each compartment a prepared wafer frame with subdivided wafer (according to FIG FIG. 1 ) is included. The wafer cassette is vertically movable and a removal mechanism, not shown here, can remove a wafer frame from each floor and transfer it to the storage station 5. According to FIG. 3 the wafer cassette 27 is lowered below the level of the storage station. In this position, the storage station 5, which can be displaced in two spatial axes, can be pushed both under the storage station 3 and over the wafer cassette 27, whereby, as can be seen, the machine floor plan can be kept very small.

According to FIG. 4 is the wafer cassette 27 in the lowest unloading position, in which from the top floor a wafer frame can be removed. As a result, each time a wafer frame is picked empty, it is pushed back to the corresponding empty floor and from the next floor a new wafer frame is removed until the last floor is reached. In this case, the wafer cassette 27 is in the uppermost removal position, what in FIG. 5 is shown. Of course, the wafer cassette 27 is returned to the rest position after each loading or unloading operation FIG. 3 lowered.

FIG. 6 shows more details of the entire transport device. The primary tool 6 is arranged at the end and on the outside of an L-shaped rotary arm 23. The rotary arm rotates about a horizontal axis 13 and is rotatably driven by a motor 25. The primary tool describes a turning circle or pitch circle 14, wherein the motor 25 allows actuation in both directions of rotation. A still described camera housing 24 with a lens exit is disposed within the turning circle 14. In a similar or similar manner, the final pivoting train 42 is pivotable about an axis 44 on a turning circle 45 on an L-shaped pivot arm 43. Again, a camera body 24 'projects into the interior of the turning circle 45, but with an upwardly directed lens output.

Finally, an intermediate pivoting tool 41 is still arranged in the effective range of the primary tool 6 or of the end pivoting tool 42. This rotates about an axis 50 and describes a turning circle 51. Since no chamber housing has to be stored within the turning circle, the arrangement on an L-shaped turning arm is not required. The provisioning level 7 practically forms a horizontal tangent to the turning circle 45. Above the provisioning level 7, the guide rail 21 extends for the carriage 15 of the secondary tool 8 FIG. 6 shown position, the secondary tool 8 has just taken over a semiconductor chip from Endschwenkwerkzeug 42 and transported it in the direction of the storage station. All tools are provided in a conventional manner with recording tools, which required for their operation pneumatic lines and control devices are not shown.

FIG. 7 shows the geometric relationship of in FIG. 6 shown tools to one another and in particular the curve of a component 1 between the level 47 of the storage station and the supply level 7. The axes of rotation 13, 44 and 50 of the working tools form a triangle to each other, wherein the revolving circuits 14, 45 and 51 touch on the legs of the triangle or approximately touching and thereby form a first transfer position 52, a second transfer position 53 and a third transfer position 54. Starting from the receiving position 55, the primary tool 6 returns a pivoting movement which, depending on the operating mode, leads via a first sector S1 to the first transfer position 52 or via a second sector S2 to the second transfer position 53. The intermediate pivoting tool 41 is either inactive or always puts a pivoting movement between the first transfer position 52 and the third transfer position 54 back. The Endschwenkwerkzeug 42 defines a pivoting path between the second transfer position 53 and the discharge position 56 or between the third transfer position 54 and the discharge position 56 depending on the operating mode. Evidently, it is possible depending on the structural conditions, the radii of different circles form differently. It would also be possible to integrate additional pivoting tools, so that the stroke between the two levels 7 and 47 is covered in several cornering movements. The intermediate deposition stations 40a, 40b arranged along the curved path could also be designed as pivoting tools which are capable of transporting a component away.

The following is based on the FIGS. 8 to 10 the operation and arrangement of the first camera 10 and the lower second camera 11a described. The cameras are each arranged in an elongated camera housing 24 or 24 ', which projects into the turning circle of the primary tool 6 or the end pivot tool 42. In the first camera 10, the exit opening 29 is directed downwards against the plane 47 of the supply station. On the other hand, in the lower second camera 11a, the exit opening 29 'is directed upwardly against the delivery plane. Depending on the working position of the primary tool 6 arranged on the rotary arm 23 or of the end pivoting tool 42 arranged on the rotary arm 43, the image area 37 is completely released in each case for the corresponding camera.

In particular from FIG. 10 It can be seen that corresponding to the axes of rotation 13 and 44, the respective optical axes in the region of the output openings of the cameras are laterally offset from each other. In certain cases, it would also be conceivable that the axes of rotation 13 and 44 and thus also the optical axis are arranged in the region of the outlet opening on a common vertical axis.

The following is based on the FIGS. 11a to 11e described the deposition process of a semiconductor chip, in which the chip is placed with the same support side on the substrate, with which he previously adhered to the wafer (non-flip application). According to FIG. 11a the rotary arm 23 is in a vertical position, in which the primary tool 6 detects a semiconductor chip from the storage station 5. At the same time the Endschwenkwerkzeug 42 passes an already preloaded chip in the deployment level 7 the secondary tool. 8

According to FIG. 11b The primary tool 6 and the end pivot tool 42 rotate clockwise toward each other while the secondary tool 8 on the carriage 15 is moved against the storage station 3. Before reaching the storage station, the actual position of the substrate 2 is determined with the third camera 12 on the carriage 16.

According to FIG. 11c the secondary tool 8 has reached its dispensing position above the substrate 2. The primary tool 6 transfers its chip to the final pivoting tool 42 and at the same time the next chip 1 to be picked up on the storage station 5 is measured with the aid of the first camera 10.

According to FIG. 11d the secondary tool 8 has deposited its chip on the substrate 2. The primary tool 6 has returned counterclockwise to its receiving position. Likewise, the Endschwenkwerkzeug 42 was pivoted back counterclockwise in its dispensing position.

Finally shows FIG. 11e the empty secondary tool 8 on its way back to receive a new chip. As shown, both the upper second camera 11b for determining the actual position of the chip on the end pivoting tool 42 and the third camera 12 for determining the actual position of the substrate 2 can be actuated in an intermediate position. As soon as the secondary tool 8 has reached its initial position, the cycle begins according to FIG. 11a again from scratch. For the sake of clarity, were in the FIGS. 11a to 11e the unnecessary lower second camera 11 a and the Zwischenschwenkwerkzeug 41 omitted.

If it is desired to deposit the chip on the substrate with its structure side (flip-chip application), the device can be operated in another operating mode. In this case, the intermediate pivoting device 41 is actuated, as from the FIGS. 12a to 12e is apparent. For reasons of better clarity, the upper second camera 11b, which is not required in this operating mode, has been omitted in these figures.

According to FIG. 12a the primary tool 6 receives a chip at the supply station 5. At the same time, a chip is deposited on the substrate 2 at the storage station 3 by the secondary tool 8. The Endschwenkwerkzeug 42 receives from Zwischenschwenkwerkzeug 41 a previously loaded chip. The different cameras are inactive.

According to FIG. 12b the primary tool 6 was pivoted with its recorded chip counterclockwise to the first transfer position. Similarly, the Zwischenschwenkwerkzeug 41 was pivoted back counterclockwise to accommodate a new chip can. The Endschwenkwerkzeug has pivoted the previously loaded chip back into the dispensing position and also the secondary tool 8 has reached its original position in which it can accommodate a new chip. With the help of the third camera 12, the actual position of the newly to be loaded substrate 2 is measured at the discharge station 3.

According to FIG. 12c the chip is transferred to the end tool 42 to the secondary tool 8. The primary tool 6 remains in the first transfer position. As per FIG. 12d the Endschwenkwerkzeug 42 pivots back again, can be determined with the lower second camera 11a, the actual position of the now fixed to the secondary tool 8 chips. At the same time, the actual position of the next chip to be picked up at the storage station 5 is determined with the first camera 10. The primary tool can transfer its previously loaded chip to the intermediate pivoting tool 41. Finally, according to FIG. 12e swing the primary tool 6 back into its receiving position. Likewise, the intermediate pivoting tool moves 41 has its previously loaded chip in the third transfer position and the secondary tool 8 has reached its dispensing position above the substrate 2. Then the cycle starts according to FIG. 12a again from scratch.

Claims (28)

1. A method for the placement of electronic components (1), in particular semiconductor chips, on a substrate (2) at a placement station (3), wherein the component bearing by a bearing side (4) at a supply station (5) is acquired by means of a primary tool (6) at a structure side (17) remote from the bearing side, is picked up and is transported by means of a rotational movement above the plane (47) of the supply station, and wherein the component is accepted by at least one secondary tool (8) in a provision plane (7) lying above the plane (47) of the supply station, is transported over the substrate and is deposited there, wherein the path of the component between the plane (47) of the supply station and the provision plane (7) is covered in at least two separate, ascending curve movements, wherein the primary tool (6) transfers the component to at least one pivoting tool (41, 42) in a transfer position.
2. The method as claimed in claim 1, characterized in that the primary tool (6) transfers the component (1) to an intermediate pivoting tool (41), which acquires the component at the bearing side (4) and, after a pivoting movement, transfers it to a final pivoting tool (42), which acquires the component at the structure side (17) again and pivots it into the provision plane (7), where it is transferred to the secondary tool (8), wherein it is finally deposited onto the substrate (2) by the structure side (17).
3. The method as claimed in claim 1, characterized in that the primary tool (6) transfers the component (1) directly to a final pivoting tool (42), which acquires the component at the bearing side (4) and pivots it into the provision plane (7), where it is transferred to the secondary tool (8), wherein it is finally deposited onto the substrate (2) once again by the same bearing side (4).
4. The method as claimed in claim 2 and claim 3, characterized in that the components are transferred to the final pivoting tool (42) via the intermediate pivoting tool (41) in a first operating mode and directly in a second operating mode, wherein the pivoting movement of the primary tool (6) in the first and in the second operating mode, respectively, proceeding from the pick-up at the supply station, preferably proceeds on separate movement sections.
5. The method as claimed in one of claims 1 to 4, characterized in that the curve movements are partial circle arc movements, of which preferably two successive movements proceed in a manner curved in opposite senses.
6. The method as claimed in one of claims 1 to 5, characterized in that the movement of the secondary tool (8) from the acceptance of the component as far as over the substrate proceeds linearly.
7. The method as claimed in one of claims 1 to 6, characterized in that the transport of the component (1) from the supply station (5) as far as onto the substrate (2) essentially proceeds on an approximately vertical transport plane.
8. The method as claimed in one of claims 1 to 7, characterized in that the actual position of the component on the supply station (5) prior to the pick-up is determined by means of a first image recognition device (10), and/or in that the actual position of the component in the provision plane (7) prior to the transport to the substrate is determined by means of a second image recognition device (11a, 11b), and/or in that the actual position of the substrate (2) is determined by means of a third image recognition device (12), wherein deviations between the actual values determined and a predetermined desired position of the component are corrected.
9. The method as claimed in claim 4 and claim 8, characterized in that the actual position of the component in the provision plane (7) is determined by the second image recognition device (11a, 11b) from below upward toward the component held at the secondary tool (8) in the first operating mode and from above downward toward the component held at the final pivoting tool (42) in the second operating mode.
10. The method as claimed in claim 8 or claim 9, characterized in that the actual position is determined by means of a respective one of the image recognition devices whenever the primary tool (6) or the secondary tool (8) or the final pivoting tool (42) clears the image field of the actual position to be determined.
11. An apparatus for the placement of electronic components (1), in particular semiconductor chips, on a substrate (2) at a placement station (3), wherein the component bearing by a bearing side (4) at a supply station (5) can be picked up by means of a primary tool (6) at a structure side (17) remote from the bearing side and by means of which the component can be transported above the plane (47) of the supply station, wherein the component can be accepted by at least one secondary tool (8) in a provision plane (7) lying above the plane (47) of the supply station, can be transported over the substrate (2) and can be deposited there, characterized in that at least one pivoting tool (41, 42) is arranged in the operative region of the primary tool (6), and a component can be transferred to said at least one pivoting tool from the primary tool (6) in a transfer position, wherein the path of the component between the plane (47) of the supply station and the provision plane (7) can be covered in at least two separate, ascending curve movements.
12. The apparatus as claimed in claim 11, characterized in that an intermediate pivoting tool (41) is arranged in the operative region of the primary tool (6) and a final pivoting tool (42) is arranged in the operative region of the intermediate pivoting tool, and in that a component which is acquired by the primary tool (6) at the structure side (17) and raised can be acquired by the intermediate pivoting tool at the bearing side (4) and can be transferred to the final pivoting tool, wherein it can be acquired by the latter once again at the structure side (17) and can be pivoted into the provision plane (7), with the result that it can be acquired by the secondary tool (8) and can finally be deposited onto the substrate (2) by the structure side (17).
13. The apparatus as claimed in claim 11, characterized in that a final pivoting tool (42) is arranged in the operative region of the primary tool (6), and in that a component (1) which is acquired by the primary tool (6) at the structure side (17) and raised can be acquired by the final pivoting tool at the bearing side (4) and can be pivoted into the provision plane (7), with the result that it can be acquired by the secondary tool (8) and can finally be deposited onto the substrate (2) once again by the same bearing side (4).
14. The apparatus as claimed in claim 12 and claim 13, characterized in that both the intermediate pivoting tool (41) and the final pivoting tool (42) are arranged in the operative region of the primary tool (6), wherein the component (1) can be transported to the provision plane (7) alternatively via the intermediate pivoting tool in a first operating mode and directly via the final pivoting tool in a second operating mode.
15. The apparatus as claimed in claim 14, characterized in that the primary tool (6) can be pivoted, in the first operating mode, in a first movement section from the pick-up position at the supply station as far as the transfer position to the intermediate pivoting tool (41) and, in the second operating mode, in an adjacent second movement section from the pick-up position at the supply station as far as the transfer position to the final pivoting tool (42).
16. The apparatus as claimed in one of claims 11 to 15, characterized in that the primary tool (6) and the at least one pivoting tool (41, 42) can be pivoted in such a way that an acquired component executes a curve movement composed of circle arc sections.
17. The apparatus as claimed in one of claims 11 to 16, characterized in that the secondary tool (8) is arranged at a linearly displaceable slide (15).
18. The apparatus as claimed in one of claims 11 to 17, characterized in that the primary tool (6), the at least one pivoting tool (41, 41) and the secondary tool (8) can be moved essentially on a common, approximately vertical transport plane.
19. The apparatus as claimed in one of claims 11 to 18, characterized in that a first image recognition device (10) is provided for determining the actual position of the component on the supply station (5) prior to the pick-up, and/or in that a second image recognition device (11a, 11b) is provided for determining the actual position of the component in the provision plane (7) prior to the transport to the substrate, and/or in that a third image recognition device (12) is provided for determining the actual position of the substrate (2), wherein deviations between the actual values determined and a predetermined desired position of the component can be corrected.
20. The apparatus as claimed in claim 14 and as claimed in claim 19, characterized in that, for determining the actual position of the component in the provision plane (7), the second image recognition device (11a, 11b) is arranged below the provision plane in a manner directed from below upward for the first operating mode and above the provision plane in a manner directed from above downward for the second operating mode.
21. The apparatus as claimed in claim 20, characterized in that a respective second image recognition device (11a, 11b) is arranged below and above the provision plane, which devices can be activated alternatively depending on the operating mode.
22. The apparatus as claimed in one of claims 19 to 21, characterized in that the image recognition devices are positioned in such a way that the image field of the actual position to be determined can be completely captured in at least one operating position of the primary tool (6), of the at least one pivoting tool (41, 42) and/or of the secondary tool (8).
23. The apparatus as claimed in one of claims 20 or 21 and claim 22, characterized in that the first image recognition device (10) is arranged in such a way that the image field assigned to it is captured from within the pivoting range of the primary tool (6), and in that the second image recognition device (11a), for the second operating mode, is arranged in such a way that the image field assigned to it is captured from within the pivoting range of the final pivoting tool (42).
24. The apparatus as claimed in one of claims 19 to 23, characterized in that the first and the second image recognition device or the optical axes thereof, in the region of the exit opening, are arranged on mutually offset vertical axes.
25. The apparatus as claimed in one of claims 19 to 24, characterized in that the third image recognition device (12) is arranged at a linearly displaceable slide (16).
26. The apparatus as claimed in one of claims 11 to 25, characterized in that the placement station (3) is embodied as a feed system for the preferably linear passage of a plurality of substrates.
27. The apparatus as claimed in one of claims 11 to 26, characterized in that a wafer cassette (27) with a plurality of wafers is arranged alongside the supply station (5) and can be moved, for the purpose of loading wafers onto the supply station, into different loading positions in which the supply station can be loaded with a wafer from the wafer cassette and can be unloaded, and in that the wafer cassette can be moved into a rest position in which the supply station, for processing a loaded wafer, can be displaced at least partly in the horizontal working plane over the wafer cassette.
28. The apparatus as claimed in one of claims 11 to 27, characterized in that one or a plurality of intermediate placement stations (40a, 40b) at which a component can be placed temporarily prior to the transfer to the secondary tool (8) are arranged in the operative region of the primary tool (6) and/or of the at least one pivoting tool (41, 42).

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