EP1979673B1 - Vehicle headlight - Google Patents

Vehicle headlight Download PDF

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Publication number
EP1979673B1
EP1979673B1 EP07702411A EP07702411A EP1979673B1 EP 1979673 B1 EP1979673 B1 EP 1979673B1 EP 07702411 A EP07702411 A EP 07702411A EP 07702411 A EP07702411 A EP 07702411A EP 1979673 B1 EP1979673 B1 EP 1979673B1
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EP
European Patent Office
Prior art keywords
heat
motor vehicle
vehicle headlight
heat sink
illumination device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP07702411A
Other languages
German (de)
French (fr)
Other versions
EP1979673A1 (en
Inventor
Gerhard Mitic
Siegfried Ramminger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
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Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP1979673A1 publication Critical patent/EP1979673A1/en
Application granted granted Critical
Publication of EP1979673B1 publication Critical patent/EP1979673B1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/60—Heating of lighting devices, e.g. for demisting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • US2004 / 213016A1 and WO2005 / 116520A describe automotive headlights.
  • An object to be solved is to provide a motor vehicle headlamp with improved thermal management.
  • the invention relates to a motor vehicle headlight according to claim 1.
  • the motor vehicle headlight has a lighting device which comprises at least one light-emitting diode chip.
  • the illumination device comprises a multiplicity of light-emitting diode chips.
  • the illumination device forms a light source of the headlight.
  • the headlight comprises a heat pipe or a thermosiphon.
  • the heat pipe or the thermosiphon has an evaporation area. At the evaporation area, the heat pipe or the thermosiphon absorbs heat.
  • Heatpipe or the thermosiphon on a condensation area At the condensation area, the heat pipe or the thermosiphon releases part of the heat absorbed at the evaporation area to the environment.
  • the evaporation region is thermally coupled to the illumination device. That is, the heat pipe or the thermosiphon receives at least a portion of the heat generated by the lighting device during operation at the evaporation area. The absorbed waste heat is led from the heat pipe or the thermosiphon to the condensation area of the heat pipe or the thermosyphon.
  • the condensation region of the heat pipe or the thermosiphon is connected to a heat sink.
  • the heat sink is preferably mechanically fixed to the heat pipe or the thermosiphon. For example, it is soldered or jammed with the heat pipe or thermosyphone. But it is also possible that the heat sink is formed integrally with the heat pipe or the thermosiphon. That is, the heat sink may, for example, be an integral part of a pipe of the heat pipe or the thermosyphone. Heatsink and tube are then connected together without an interface and can be made together, for example, in a single operation. The heat sink releases at least part of the heat absorbed by the lighting device to the environment.
  • the motor vehicle headlight has a lighting device which comprises at least one light-emitting diode chip. Furthermore, the motor vehicle headlight on a heat pipe or a thermosiphon.
  • the heat pipe or the thermosiphon comprise an evaporation area and a condensation area.
  • the evaporation region is thermally connected to the illumination device.
  • the Condensation area is connected to a heat sink.
  • the heat sink releases heat absorbed by the illumination device to the environment.
  • the vehicle headlight described here makes u.a. to make use of the knowledge that a motor vehicle headlight has areas of very different temperatures. That is, in the automotive headlight, a large temperature gradient may occur. In the case of a large temperature gradient, the use of heat pipes or thermosiphons for heat transport proves to be particularly efficient. For example, due to the waste heat of the engine and the illumination device in the area of the illumination device, temperatures of up to 150 ° Celsius can occur. On the cover of the headlamp, through which the light generated by the illumination device leaves the headlamp, the temperature is in the range of the outside temperature. A heat transfer from the illumination device to the cover can therefore be particularly efficient.
  • the heat sink comprises at least one cooling structure.
  • the cooling structure of the heat sink can be given for example by a comb-like surface of the heat sink.
  • the heat sink it is possible for the heat sink to comprise cooling ribs or cooling slats.
  • the cooling structure is suitable to increase the surface of the heat sink. This allows a particularly efficient dissipation of heat to the environment of the heat sink.
  • the heat sink contains or consists of a good heat-conducting material such as a metal.
  • the heat sink can contain, for example, copper and / or aluminum or consist of one of these metals.
  • the evaporation region of the heat pipe or the thermosiphon is thermally connected to the underside of the illumination device facing away from the main emission direction of the light-emitting diode chip.
  • the illumination device may, for example, comprise a connection carrier on which the light-emitting diode chip is applied. The main emission direction of the LED chip is then directed away from the connection carrier.
  • the evaporation region of the heat pipe or the thermosiphon can be connected directly to the underside of the illumination device.
  • the vehicle headlight described here makes u.a. to use the knowledge that light-emitting diode chips have an operating temperature of at most 150 ° Celsius and therefore only one - compared to the example for heat transfer by heat conduction - small proportion of the heat loss is given by heat radiation to the environment. A large part of the heat is released by means of heat conduction to the connection carrier for the LED chips. Therefore, it proves to be particularly efficient to absorb the heat on the connection carrier and remove it from there.
  • the evaporation region of the heat pipe or the thermosiphon is connected to a heat conduction body.
  • the heat-conducting body may be, for example, a plate which consists of a particularly good heat-conducting material such as copper and / or aluminum or contains one of these materials.
  • the heat conduction body of a thermally conductive composite material such as AlSiC, CuSiC or Al-diamond be formed.
  • the heat-conducting body is preferably thermally connected to the lighting device and / or coupled.
  • the heat conducting body for example mechanically - for example by means of a solder connection - be connected to the underside of the lighting device.
  • the evaporation region may be in the form of a main body.
  • the main body then forms the heat-conducting body to which a pipe circuit - in the case of a loop thermosiphon - or a simple pipe - in the case of a thermosiphon - is connected. Heat-conducting body and thermosiphon are thus integrally formed.
  • the illumination device can be connected to the heat-conducting body in a thermally conductive manner, for example by means of soldering or clamping with thermal compound.
  • the heat sink emits at least part of the heat absorbed by the illuminator to a cover of the motor vehicle headlamp.
  • the cover of the vehicle headlamp is formed from a material which is transparent at least for a large part of the electromagnetic radiation generated by the LED chip.
  • the cover consists of a glass. The electromagnetic radiation generated by the lighting device during operation leaves the vehicle headlight through the cover.
  • the heat sink is in direct contact with the cover. According to an unclaimed example, it is also possible that the heat sink is arranged in the immediate vicinity of the cover of the headlight, so that there is a gap between the heat sink and cover, which is preferably filled with air.
  • the heat is removed from the heat sink by heat conduction and / or convection.
  • the heat sink is arranged on the vehicle underside facing the underside of the cover. In this way, the rising by free convection heat - ie, for example warmed air - be distributed over the entire cover.
  • the heat sink is arranged at the top of the cover. Compared to an arrangement at the bottom while this results in less favorable conditions for the free convection of heat, however, improves the heat transfer of the heat pipe or the thermosiphon, since the gravity supports the return of the condensate in the cooling circuit.
  • the heat sink extends over at least 50% of the length of the cover disk. Preferably, the heat sink extends over at least 75% of the length of the cover of the vehicle headlamp.
  • the heat emitted by the heat sink can be distributed particularly uniformly over the entire cover of the headlight. This allows, for example, a particularly fast, large-scale deicing an icy cover. At least some of the heat emitted by the lighting device during operation can be used in this way in a particularly efficient way for heating and / or defrosting the cover pane.
  • FIG. 1 shows a motor vehicle headlamp described here according to a first embodiment in a schematic frontal view.
  • the motor vehicle headlight 1 comprises a headlight housing 2.
  • the headlight housing 2 may be formed, for example, by a part of the body of a motor vehicle.
  • the motor vehicle headlamp 1 has a lighting device 3.
  • the lighting device 3 comprises at least one LED chip 20 (see also FIG. 5 ).
  • At least one optical element 4 can be arranged downstream of and / or downstream of the illumination device 3 in the main emission direction of the light-emitting diode chips 20.
  • the optical element 4 is, for example, a reflector and / or a projection lens.
  • the lighting device 3 is thermally connected to a heat pipe 5.
  • the lighting device 3 is thermally coupled with its evaporation region 6 to the heat pipe 5.
  • the heat pipe 5 performs at least a portion of the heat generated by the lighting device 3 during operation.
  • the heat absorbed by the lighting device 3 is released to the environment.
  • the heat pipe 5 is connected in the condensation region 7 with a heat sink 8.
  • the heat sink 8 is in direct contact with a cover 10 of the motor vehicle headlight. 1
  • the heat sink 8 extends over a length of at least 50%, preferably 75% of the length of the vehicle headlamp along the motor vehicle headlamp 1 in the horizontal direction.
  • the vehicle headlamp is a closed system from which the power loss of the lighting device 3 of typically about 50 watts can be dissipated only by heat conduction or heat radiation. Ventilation slots with or without fans are not desirable due to soiling and condensation.
  • the engine compartment which is usually located in the vicinity of the motor vehicle headlight 1, generates under unfavorable conditions an ambient temperature of about 90 ° Celsius for the rear of the vehicle headlamp, in which the lighting device 3 is located.
  • the power loss of the illumination device 3 is guided away from the illumination device 3 by means of the heat pipe 5. This can advantageously be dispensed with movable components such as fans. This increases the reliability of the headlamp system.
  • the heat pipe 5 extends from the lighting device 3 to the front part of the motor vehicle headlight 1, ie, up to the cover 10 of the motor vehicle headlight 1 and preferably extends along the entire cover 10 or at least along 75% of the length of the cover in the lower part of Motor vehicle headlamps 1.
  • the temperature in the area of the illumination device 3 is up to about 150 ° Celsius.
  • the temperature in the front interior of the motor vehicle headlight 1, on the cover 10 of the motor vehicle headlight is - depending on the outside temperature and running time of the engine - at most about 60 ° Celsius.
  • the temperature on the outside of the cover 10 is - depending on the outside temperature and running time of the engine - at most about 40 ° C.
  • the high temperature gradient between lighting device 3 and the air space in the front part of the headlight 1 supports the heat transfer through the heat pipe 5 optimally.
  • FIG. 2 shows the headlamp 1 according to a second embodiment in a schematic side view.
  • the heat pipe 5 is thermally conductively connected in its evaporation region 6 with a heat conducting body 9.
  • the Heatpipe 9 can be used in conjunction with the Figures 1 and 2 described embodiments of the motor vehicle headlight 1 also find a thermosiphon or a loop thermosiphon use.
  • FIG. 3 shows the heat pipe 5 and the heat-conducting body 9 in a schematic detail view.
  • the heat pipe 5 is soldered in the evaporation region 6, for example, to the heat-conducting body 9. Furthermore, it is possible that the heat pipe 5 is embedded in the evaporation region 6 in the heat-conducting body 9.
  • the heat-conducting body 9 encloses the heat pipe 5 in this area then from at least three sides.
  • the heat-conducting body 9 consists of or contains a good heat-conducting material such as copper or aluminum.
  • the heat-conducting body 9 is with its side facing away from the heat pipe 5 with the illumination device. 3 connected thermally conductive.
  • the heat pipe 5 also directly with a connection carrier 28 (see also FIG. 5 ) of the lighting device 3.
  • the heat pipe is preferably thermally coupled to a side facing away from the light emitting diode chips 20 of the lighting device 3 underside of the lighting device 3.
  • FIG. 4 shows a schematic detail view of the heat pipe 5 with heat sink 8.
  • the heat sink 8 is connected in the condensation region 7 of the heat pipe 5 with this.
  • the heat pipe 5 is embedded in the condensation region 7 in the heat sink 8 or soldered to the heat sink 8. Further, it is possible that heat pipe 5 and heat sink 8 form a unit and are integrally formed.
  • the heat sink 8 contains or consists of a good heat-conducting material such as aluminum or copper. To increase its surface, the heat sink 8 may comprise cooling structures 11, which may be, for example, comb-like or designed as cooling fins.
  • FIG. 5 shows a schematic perspective view of a lighting device as it can be used in one of the vehicle headlights described here.
  • the illumination device 3 comprises light-emitting diode chips 20, which are preferably suitable for generating white light.
  • the light-emitting diode chips 20 are mounted in a housing 22, which may for example consist of a ceramic material such as aluminum nitrite. However, the light-emitting diode chips 20 can also be mounted directly on the connection carrier 28.
  • the light-emitting diode chips 20 are followed by a beveled housing wall 21, which can be designed to be reflective, and thereby contributes to beam shaping of the electromagnetic radiation generated.
  • a beveled housing wall 21 which can be designed to be reflective, and thereby contributes to beam shaping of the electromagnetic radiation generated.
  • the light-emitting diodes 20 are electrically connected via contact points 23 to tracks 24 of the connection carrier 28.
  • the illumination device 3 can have components 25 which are suitable, for example, for protecting the light-emitting diode chips 20 from an electrostatic discharge.
  • a varistor, a diode or a resistor can be used for this purpose.
  • a power supply can be connected, which supplies by means of the contact points 27, the lighting device 3 with the power required for operation.
  • connection carrier 28 is preferably formed by a metal core board, which may contain, for example, copper, aluminum and / or a ceramic material. Heat generated by the light-emitting diode chips 20 during operation is conducted to the underside of the connection carrier 28 facing away from the light-emitting diode chips 20 and from there either directly from the heat pipe 5 or via the heat-conducting body 9 from the heat pipe 5.
  • FIG. 6 shows a schematic schematic diagram of a motor vehicle headlamp according to a third embodiment.
  • a loop thermosiphon 35 at least part of the of Lighting device 3 dissipates heat generated during operation.
  • the thermosiphon 35 comprises a heat-conducting body 9, which is designed as a body filled with a coolant 36.
  • the heat-conducting body 9 forms the evaporation region 6 of the thermosyphone 35. Steam is removed from the heat-conducting body 9 in the direction of the arrow 37 toward the cooling body 8.
  • the heat sink 8 comprises cooling structures 11, which are formed for example as cooling fins. At the heat sink 8, the steam condenses to condensate 38, which is transported in the direction of the arrow 39 to the heat-conducting body 9.
  • the heat sink 8 is preferably arranged on the underside of the cover 10 of the motor vehicle headlight.
  • thermo-conductive body 9 When in FIG. 6
  • the thermo-conductive body 9 has both an opening for the removal of the vapor and an opening for the return transport of the condensate 38.
  • a simple thermosiphon can be used in which the heat-conducting body 9 has a single opening through which steam and condensate transported in the opposite direction.
  • thermosiphon 35 In the case of a loop thermosiphon 35 or a simple thermosiphon, the tubes of the thermosiphon are integrally formed with the heat-conducting body 9.
  • the cooling body 9 extends over a length of at least 50 percent, preferably at least 75 percent of the length of the vehicle headlamp along the motor vehicle headlamp 1 in the horizontal direction.
  • the vehicle headlamp 1 described here is characterized by a particularly high reliability, since it can be dispensed with movable components such as fans for cooling. Further, the cooling device comprising the heat pipe 5 or the thermosiphon 35 and the heat sink 8 is particularly easy to install. Furthermore, the vehicle headlight described 1. is distinguished by a particularly rapid Enttauung the entire cover when icing the cover.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A motor vehicle headlight comprising an illuminating device (3) which comprises at least one light-emitting diode chip (20). The motor vehicle headlight furthermore has a heat pipe (5) or a thermosiphon (35) with an evaporation region (6) and a condensation region (7), wherein the evaporation region (6) is thermally connected to the illuminating device (3), and the condensation region (7) is connected to a heat sink (8) which outputs heat absorbed at the illuminating device (3) to the surrounding area.

Description

Es wird ein Kfz-Scheinwerfer angegeben.It is a motor vehicle headlights specified.

Diese Patentanmeldung beansprucht die Priorität der deutschen Patentanmeldung 102006004593.9 und die Priorität der deutschen Patentanmeldung 102006010977.5 , deren Offenbarungsgehalt hiermit durch Rückbezug aufgenommen wird.This patent application claims the priority of the German patent application 102006004593.9 and the priority of the German patent application 102006010977.5 , the disclosure of which is hereby incorporated by reference.

In der Druckschrift US 6,601,982 ist ein Kfz-Scheinwerfer beschrieben.In the publication US 6,601,982 is a motor vehicle headlight described.

Die Druckschriften DE 202005007501U1 , US2004/213016A1 und WO2005/116520A beschreiben Kfz-Scheinwerfer.The pamphlets DE 202005007501U1 . US2004 / 213016A1 and WO2005 / 116520A describe automotive headlights.

Eine zu lösende Aufgabe besteht darin, einen Kfz-Scheinwerfer mit einem verbesserten Wärmemanagement anzugeben.An object to be solved is to provide a motor vehicle headlamp with improved thermal management.

Die Erfindung betrifft einen Kfz-Scheinwerfer gemäß Anspruch 1.The invention relates to a motor vehicle headlight according to claim 1.

Gemäß zumindest einer Ausführungsform weist der Kfz-Scheinwerfer eine Beleuchtungseinrichtung auf, die zumindest einen Leuchtdiodenchip umfasst. Vorzugsweise umfasst die Beleuchtungseinrichtung eine Vielzahl von Leuchtdiodenchips. Die Beleuchtungseinrichtung bildet eine Lichtquelle des Scheinwerfers.In accordance with at least one embodiment, the motor vehicle headlight has a lighting device which comprises at least one light-emitting diode chip. Preferably, the illumination device comprises a multiplicity of light-emitting diode chips. The illumination device forms a light source of the headlight.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers umfasst der Scheinwerfer eine Heatpipe oder einen Thermosyphon. Die Heatpipe oder der Thermosyphon weist einen Verdampfungsbereich auf. Am Verdampfungsbereich nimmt die Heatpipe oder der Thermosyphon Wärme auf. Weiter weist dieIn accordance with at least one embodiment of the motor vehicle headlight, the headlight comprises a heat pipe or a thermosiphon. The heat pipe or the thermosiphon has an evaporation area. At the evaporation area, the heat pipe or the thermosiphon absorbs heat. Next, the

Heatpipe oder der Thermosyphon einen Kondensationsbereich auf. Am Kondensationsbereich gibt die Heatpipe oder der Thermosyphon einen Teil der am Verdampfungsbereich aufgenommenen Wärme an die Umgebung ab.Heatpipe or the thermosiphon on a condensation area. At the condensation area, the heat pipe or the thermosiphon releases part of the heat absorbed at the evaporation area to the environment.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers ist der Verdampfungsbereich thermisch an die Beleuchtungseinrichtung angekoppelt. D.h., die Heatpipe oder der Thermosyphon nimmt am Verdampfungsbereich zumindest einen Teil der von der Beleuchtungseinrichtung im Betrieb erzeugten Wärme auf. Die aufgenommene Abwärme wird von der Heatpipe oder dem Thermosyphon zum Kondensationsbereich der Heatpipe oder des Thermosyphons geführt.In accordance with at least one embodiment of the motor vehicle headlight, the evaporation region is thermally coupled to the illumination device. That is, the heat pipe or the thermosiphon receives at least a portion of the heat generated by the lighting device during operation at the evaporation area. The absorbed waste heat is led from the heat pipe or the thermosiphon to the condensation area of the heat pipe or the thermosyphon.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers ist der Kondensationsbereich der Heatpipe oder des Thermosyphons mit einem Kühlkörper verbunden. Der Kühlkörper ist vorzugsweise mechanisch fest mit der Heatpipe oder dem Thermosyphon verbunden. Beispielsweise ist er mit der Heatpipe oder dem Thermosyphon verlötet oder verklemmt. Es ist aber auch möglich, dass der Kühlkörper einstückig mit der Heatpipe oder dem Thermosyphon ausgebildet ist. Das heißt, der Kühlkörper kann zum Beispiel integraler Bestandteil eines Rohrs der Heatpipe oder des Thermosyphons sein. Kühlkörper und Rohr sind dann ohne eine Grenzfläche miteinander verbunden und können beispielsweise in einem einzigen Arbeitsgang gemeinsam gefertigt werden. Der Kühlkörper gibt zumindest einen Teil der an der Beleuchtungseinrichtung aufgenommenen Wärme an die Umgebung ab.In accordance with at least one embodiment of the motor vehicle headlight, the condensation region of the heat pipe or the thermosiphon is connected to a heat sink. The heat sink is preferably mechanically fixed to the heat pipe or the thermosiphon. For example, it is soldered or jammed with the heat pipe or thermosyphone. But it is also possible that the heat sink is formed integrally with the heat pipe or the thermosiphon. That is, the heat sink may, for example, be an integral part of a pipe of the heat pipe or the thermosyphone. Heatsink and tube are then connected together without an interface and can be made together, for example, in a single operation. The heat sink releases at least part of the heat absorbed by the lighting device to the environment.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers weist der Kfz-Scheinwerfer eine Beleuchtungseinrichtung auf, die zumindest einen Leuchtdiodenchip umfasst. Weiter weist der Kfz-Scheinwerfer eine Heatpipe oder einen Thermosyphon auf. Die Heatpipe oder der Thermosyphon umfassen einen Verdampfungsbereich und einen Kondensationsbereich. Der Verdampfungsbereich ist dabei thermisch an die Beleuchtungseinrichtung angeschlossen. Der Kondensationsbereich ist mit einem Kühlkörper verbunden. Bevorzugt gibt der Kühlkörper an der Beleuchtungseinrichtung aufgenommene Wärme an die Umgebung ab.In accordance with at least one embodiment of the motor vehicle headlight, the motor vehicle headlight has a lighting device which comprises at least one light-emitting diode chip. Furthermore, the motor vehicle headlight on a heat pipe or a thermosiphon. The heat pipe or the thermosiphon comprise an evaporation area and a condensation area. The evaporation region is thermally connected to the illumination device. Of the Condensation area is connected to a heat sink. Preferably, the heat sink releases heat absorbed by the illumination device to the environment.

Der hier beschriebene Kfz-Scheinwerfer macht sich dabei u.a. die Erkenntnis zu nutze, dass ein Kfz-Scheinwerfer Bereiche stark unterschiedlicher Temperaturen aufweist. D.h., im Kfz-Scheinwerfer kann ein großer Temperaturgradient auftreten. Im Falle eines großen Temperaturgradienten erweist sich der Einsatz von Heatpipes oder Thermosyphons zum Wärmetransport als besonders effizient. Beispielsweise können aufgrund der Abwärme des Motors und der Beleuchtungseinrichtung im Bereich der Beleuchtungseinrichtung Temperaturen bis zu 150° Celsius auftreten. An der Abdeckscheibe des Scheinwerfers, durch die das von der Beleuchtungseinrichtung erzeugte Licht den Scheinwerfer verlässt, liegt die Temperatur im Bereich der Außentemperatur. Ein Wärmetransport von der Beleuchtungseinrichtung zur Abdeckscheibe kann daher besonders effizient erfolgen.The vehicle headlight described here makes u.a. to make use of the knowledge that a motor vehicle headlight has areas of very different temperatures. That is, in the automotive headlight, a large temperature gradient may occur. In the case of a large temperature gradient, the use of heat pipes or thermosiphons for heat transport proves to be particularly efficient. For example, due to the waste heat of the engine and the illumination device in the area of the illumination device, temperatures of up to 150 ° Celsius can occur. On the cover of the headlamp, through which the light generated by the illumination device leaves the headlamp, the temperature is in the range of the outside temperature. A heat transfer from the illumination device to the cover can therefore be particularly efficient.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers umfasst der Kühlkörper zumindest eine Kühlstruktur. Die Kühlstruktur des Kühlkörpers kann beispielsweise durch eine kammartig ausgebildete Oberfläche des Kühlkörpers gegeben sein. Alternativ oder zusätzlich ist es möglich, dass der Kühlkörper Kühlrippen oder Kühllammellen umfasst. Insgesamt ist die Kühlstruktur geeignet, die Oberfläche des Kühlkörpers zu vergrößern. Dies ermöglicht eine besonders effiziente Abfuhr von Wärme an die Umgebung des Kühlkörpers. Vorzugsweise enthält oder besteht der Kühlkörper aus einem gut wärmeleitenden Material wie beispielsweise einem Metall. Der Kühlkörper kann dazu beispielsweise Kupfer und/oder Aluminium enthalten oder aus einem dieser Metalle bestehen. Gemäß zumindest einer Ausführungsform ist der Verdampfungsbereich der Heatpipe oder des Thermosyphons thermisch an die der Hauptabstrahlrichtung des Leuchtdiodenchips abgewandte Unterseite der Beleuchtungseinrichtung angeschlossen. Die Beleuchtungseinrichtung kann dazu beispielsweise einen Anschlussträger umfassen, auf dem der Leuchtdiodenchip aufgebracht ist. Die Hauptabstrahlrichtung des Leuchtdiodenchips ist dann von dem Anschlussträger weg gerichtet. Der Verdampfungsbereich der Heatpipe oder des Thermosyphons kann direkt mit der Unterseite der Beleuchtungseinrichtung verbunden sein.In accordance with at least one embodiment of the motor vehicle headlamp, the heat sink comprises at least one cooling structure. The cooling structure of the heat sink can be given for example by a comb-like surface of the heat sink. Alternatively or additionally, it is possible for the heat sink to comprise cooling ribs or cooling slats. Overall, the cooling structure is suitable to increase the surface of the heat sink. This allows a particularly efficient dissipation of heat to the environment of the heat sink. Preferably, the heat sink contains or consists of a good heat-conducting material such as a metal. The heat sink can contain, for example, copper and / or aluminum or consist of one of these metals. In accordance with at least one embodiment, the evaporation region of the heat pipe or the thermosiphon is thermally connected to the underside of the illumination device facing away from the main emission direction of the light-emitting diode chip. For this purpose, the illumination device may, for example, comprise a connection carrier on which the light-emitting diode chip is applied. The main emission direction of the LED chip is then directed away from the connection carrier. The evaporation region of the heat pipe or the thermosiphon can be connected directly to the underside of the illumination device.

Der hier beschriebene Kfz-Scheinwerfer macht sich dabei u.a. die Erkenntnis zu nutze, dass Leuchtdiodenchips eine Betriebstemperatur von maximal 150° Celsius aufweisen und daher nur ein - im Vergleich zum Beispiel zum Wärmetransport mittels Wärmeleitung - kleiner Anteil der Verlustwärme durch Wärmestrahlung an die Umgebung abgegeben wird. Ein Großteil der Wärme wird mittels Wärmeleitung an den Anschlussträger für die Leuchtdiodenchips abgegeben. Daher erweist es sich als besonders effizient, die Wärme am Anschlussträger aufzunehmen und von dort abzuführen.The vehicle headlight described here makes u.a. to use the knowledge that light-emitting diode chips have an operating temperature of at most 150 ° Celsius and therefore only one - compared to the example for heat transfer by heat conduction - small proportion of the heat loss is given by heat radiation to the environment. A large part of the heat is released by means of heat conduction to the connection carrier for the LED chips. Therefore, it proves to be particularly efficient to absorb the heat on the connection carrier and remove it from there.

Gemäß zumindest einer Ausführungsform ist der Verdampfungsbereich der Heatpipe oder des Thermosyphons mit einem Wärmeleitkörper verbunden. Bei dem Wärmeleitkörper kann es sich z.B. um eine Platte handeln, die aus einem besonders gut wärmeleitenden Material wie Kupfer und/oder Aluminium besteht oder eines dieser Materialien enthält. Ferner kann der Wärmeleitkörper aus einem wärmeleitfähigen Verbundwerkstoff wie beispielsweise AlSiC, CuSiC oder Al-Diamant gebildet sein. Der Wärmeleitkörper ist vorzugsweise thermisch an die Beleuchtungseinrichtung angeschlossen und / oder angekoppelt. Dazu kann der Wärmeleitkörper beispielsweise mechanisch - z.B. mittels einer Lotverbindung - mit der Unterseite der Beleuchtungseinrichtung verbunden sein.In accordance with at least one embodiment, the evaporation region of the heat pipe or the thermosiphon is connected to a heat conduction body. The heat-conducting body may be, for example, a plate which consists of a particularly good heat-conducting material such as copper and / or aluminum or contains one of these materials. Furthermore, the heat conduction body of a thermally conductive composite material such as AlSiC, CuSiC or Al-diamond be formed. The heat-conducting body is preferably thermally connected to the lighting device and / or coupled. For this purpose, the heat conducting body, for example mechanically - for example by means of a solder connection - be connected to the underside of the lighting device.

Beispielsweise im Falle eines Thermosyphons kann der Verdampfungsbereich in Form eines Grundkörpers gegeben sein. Der Grundkörper bildet dann den Wärmeleitkörper, an den ein Rohrkreislauf - im Falle eines Loop-Thermosyphons - oder ein einfaches Rohr - im Falle eines Thermosyphons - angebunden ist. Wärmeleitkörper und Thermosyphon sind also einstückig ausgebildet.For example, in the case of a thermosiphon, the evaporation region may be in the form of a main body. The main body then forms the heat-conducting body to which a pipe circuit - in the case of a loop thermosiphon - or a simple pipe - in the case of a thermosiphon - is connected. Heat-conducting body and thermosiphon are thus integrally formed.

Die Beleuchtungseinrichtung kann beispielsweise mittels Löten oder Klemmen mit Wärmeleitpaste thermisch leitend an den Wärmeleitkörper angeschlossen sein.The illumination device can be connected to the heat-conducting body in a thermally conductive manner, for example by means of soldering or clamping with thermal compound.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers gibt der Kühlkörper zumindest einen Teil der an der Beleuchtungseinrichtung aufgenommenen Wärme an eine Abdeckscheibe des Kfz-Scheinwerfers ab. Die Abdeckscheibe des Kfz-Scheinwerfers ist dabei aus einem Material gebildet, das zumindest für einen Großteil der vom Leuchtdiodenchip erzeugten elektromagnetischen Strahlung transparent ist. Beispielsweise besteht die Abdeckscheibe aus einem Glas. Die von der Beleuchtungseinrichtung im Betrieb erzeugte elektromagnetische Strahlung verlässt den Kfz-Scheinwerfer durch die Abdeckscheibe.In accordance with at least one embodiment of the motor vehicle headlamp, the heat sink emits at least part of the heat absorbed by the illuminator to a cover of the motor vehicle headlamp. The cover of the vehicle headlamp is formed from a material which is transparent at least for a large part of the electromagnetic radiation generated by the LED chip. For example, the cover consists of a glass. The electromagnetic radiation generated by the lighting device during operation leaves the vehicle headlight through the cover.

Der Kühlkörper befindet sich in direktem Kontakt mit der Abdeckscheibe. Gemäss einem nicht beanspruchten Beispiel ist es aber auch möglich, dass der Kühlkörper in unmittelbarer Nähe der Abdeckscheibe des Scheinwerfers angeordnet ist, sodass sich zwischen Kühlkörper und Abdeckscheibe ein Spalt befindet, der vorzugsweise mit Luft gefüllt ist. Die Wärme wird vom Kühlkörper durch Wärmeleitung und / oder Konvektion abgeführt. Vorzugsweise ist der Kühlkörper an der der Fahrzeugunterseite zugewandten Unterseite der Abdeckscheibe angeordnet. Auf diese Weise kann die durch freie Konvektion aufsteigende Wärme - d.h., beispielsweise angewärmte Luft - über die gesamte Abdeckscheibe verteilt werden.The heat sink is in direct contact with the cover. According to an unclaimed example, it is also possible that the heat sink is arranged in the immediate vicinity of the cover of the headlight, so that there is a gap between the heat sink and cover, which is preferably filled with air. The heat is removed from the heat sink by heat conduction and / or convection. Preferably, the heat sink is arranged on the vehicle underside facing the underside of the cover. In this way, the rising by free convection heat - ie, for example warmed air - be distributed over the entire cover.

Es ist aber auch möglich, dass der Kühlkörper an der Oberseite der Abdeckscheibe angeordnet ist. Gegenüber einer Anordnung an der Unterseite ergeben sich dabei zwar ungünstigere Bedingungen für die freie Konvektion der Wärme, jedoch verbessert sich der Wärmetransport der Heatpipe oder des Thermosyphons, da die Gravitation den Rücktransport des Kondensats im Kühlkreislauf unterstützt.But it is also possible that the heat sink is arranged at the top of the cover. Compared to an arrangement at the bottom while this results in less favorable conditions for the free convection of heat, however, improves the heat transfer of the heat pipe or the thermosiphon, since the gravity supports the return of the condensate in the cooling circuit.

Gemäß zumindest einer Ausführungsform des Kfz-Scheinwerfers erstreckt sich der Kühlkörper über zumindest 50 % der Länge der Abdeckscheibe. Vorzugsweise erstreckt sich der Kühlkörper über wenigstens 75 % der Länge der Abdeckscheibe des Kfz-Scheinwerfers.In accordance with at least one embodiment of the motor vehicle headlight, the heat sink extends over at least 50% of the length of the cover disk. Preferably, the heat sink extends over at least 75% of the length of the cover of the vehicle headlamp.

Dadurch ist es ermöglicht, dass die vom Kühlkörper abgegebene Wärme besonders gleichmäßig über die gesamte Abdeckscheibe des Scheinwerfers verteilt werden kann. Dies ermöglicht zum Beispiel ein besonders schnelles, großflächiges Enteisen einer vereisten Abdeckscheibe. Zumindest ein Teil der von der Beleuchtungseinrichtung im Betrieb abgegebenen Wärme kann auf diese Weise besonders effizient zum Heizen und / oder Enteisen der Abdeckscheibe Verwendung finden.This makes it possible that the heat emitted by the heat sink can be distributed particularly uniformly over the entire cover of the headlight. This allows, for example, a particularly fast, large-scale deicing an icy cover. At least some of the heat emitted by the lighting device during operation can be used in this way in a particularly efficient way for heating and / or defrosting the cover pane.

Im Folgenden wird der hier beschriebene Kfz-Scheinwerfer anhand von Ausführungsbeispielen und den dazugehörigen Figuren näher erläutert.

  • Figur 1 zeigt eine schematische Frontansicht eines Kfz-Scheinwerfers gemäß einem ersten Ausführungsbeispiels des Kfz-Scheinwerfers.
  • Figur 2 zeigt eine schematische Seitenansicht eines Kfz-Scheinwerfers gemäß einem zweiten Ausführungsbeispiels des Kfz-Scheinwerfers.
  • Figur 3 zeigt eine schematische Detail-Darstellung eines Teils einer Heatpipe gemäß einem Ausführungsbeispiel des Kfz-Scheinwerfers.
  • Figur 4 zeigt eine schematische Detail-Darstellung eines Teils einer Heatpipe mit Kühlkörper gemäß einem Ausführungsbeispiel des Kfz-Scheinwerfers.
  • Figur 5 zeigt eine schematische perspektivische Darstellung einer Beleuchtungseinrichtung gemäß einem Ausführungsbeispiels des Kfz-Scheinwerfers.
  • Figur 6 zeigt eine schematische Prinzipskizze eines Kfz-Scheinwerfers gemäß einem dritten Ausführungsbeispiel des Kfz-Scheinwerfers.
In the following, the vehicle headlamp described here will be explained in more detail by means of exemplary embodiments and the associated figures.
  • FIG. 1 shows a schematic front view of a motor vehicle headlamp according to a first embodiment of the motor vehicle headlamp.
  • FIG. 2 shows a schematic side view of a motor vehicle headlamp according to a second embodiment of the motor vehicle headlamp.
  • FIG. 3 shows a schematic detail representation of a portion of a heat pipe according to an embodiment of the motor vehicle headlamp.
  • FIG. 4 shows a schematic detail representation of a portion of a heat pipe with heat sink according to an embodiment of the motor vehicle headlamp.
  • FIG. 5 shows a schematic perspective view of a lighting device according to an embodiment of the motor vehicle headlight.
  • FIG. 6 shows a schematic diagram of a motor vehicle headlamp according to a third embodiment of the motor vehicle headlamp.

In den Ausführungsbeispielen und Figuren sind gleiche oder gleichwirkende Bestandteile jeweils mit den gleichen Bezugszeichen versehen. Die dargestellten Bestandteile sowie die Größenverhältnisse der Bestandteile untereinander sind nicht als maßstabsgerecht anzusehen. Vielmehr sind einige Details der Figuren zum besseren Verständnis übertrieben groß dargestellt.In the exemplary embodiments and figures, the same or equivalent components are each provided with the same reference numerals. The illustrated components and the size ratios of the components with each other are not to be considered as true to scale. Rather, some details of the figures are exaggerated for clarity.

Figur 1 zeigt einen hier beschriebenen Kfz-Scheinwerfer gemäß einem ersten Ausführungsbeispiel in einer schematischen Frontalansicht. Der Kfz-Scheinwerfer 1 umfasst ein Scheinwerfergehäuse 2. Das Scheinwerfergehäuse 2 kann beispielsweise durch einen Teil der Karosserie eines Kraftfahrzeuges gebildet sein. FIG. 1 shows a motor vehicle headlamp described here according to a first embodiment in a schematic frontal view. The motor vehicle headlight 1 comprises a headlight housing 2. The headlight housing 2 may be formed, for example, by a part of the body of a motor vehicle.

Der Kfz-Scheinwerfer 1 weist eine Beleuchtungseinrichtung 3 auf. Die Beleuchtungseinrichtung 3 umfasst wenigstens einen Leuchtdiodenchip 20 (siehe dazu auch Figur 5). Der Beleuchtungseinrichtung 3 kann zumindest ein optisches Element 4 vor- und / oder in Hauptabstrahlrichtung der Leuchtdiodenchips 20 nachgeordnet sein. Bei dem optischen Element 4 handelt es sich beispielsweise um einen Reflektor und / oder eine Projektionslinse. Die Beleuchtungseinrichtung 3 ist thermisch an eine Heatpipe 5 angeschlossen.The motor vehicle headlamp 1 has a lighting device 3. The lighting device 3 comprises at least one LED chip 20 (see also FIG. 5 ). At least one optical element 4 can be arranged downstream of and / or downstream of the illumination device 3 in the main emission direction of the light-emitting diode chips 20. The optical element 4 is, for example, a reflector and / or a projection lens. The lighting device 3 is thermally connected to a heat pipe 5.

Die Beleuchtungseinrichtung 3 ist mit ihrem Verdampfungsbereich 6 an die Heatpipe 5 thermisch angekoppelt.The lighting device 3 is thermally coupled with its evaporation region 6 to the heat pipe 5.

Die Heatpipe 5 führt zumindest einen Teil der von der Beleuchtungseinrichtung 3 im Betrieb erzeugten Wärme ab. Im Kondensationsbereich 7 der Heatpipe 5 wird die an der Beleuchtungseinrichtung 3 aufgenommene Wärme an die Umgebung abgegeben. Dazu ist die Heatpipe 5 im Kondensationsbereich 7 mit einem Kühlkörper 8 verbunden. Der Kühlkörper 8 befindet sich in direkten Kontakt mit einer Abdeckscheibe 10 des Kfz-Scheinwerfers 1.The heat pipe 5 performs at least a portion of the heat generated by the lighting device 3 during operation. In the condensation region 7 of the heat pipe 5, the heat absorbed by the lighting device 3 is released to the environment. For this purpose, the heat pipe 5 is connected in the condensation region 7 with a heat sink 8. The heat sink 8 is in direct contact with a cover 10 of the motor vehicle headlight. 1

Der Kühlkörper 8 erstreckt sich über eine Länge von wenigstens 50 %, bevorzugt 75 % der Länge des Kfz-Scheinwerfers entlang des Kfz-Scheinwerfers 1 in horizontaler Richtung.The heat sink 8 extends over a length of at least 50%, preferably 75% of the length of the vehicle headlamp along the motor vehicle headlamp 1 in the horizontal direction.

Der Kfz-Scheinwerfer ist ein abgeschlossenes System aus dem die Verlustleistung der Beleuchtungseinrichtung 3 von typisch ca. 50 Watt nur durch Wärmeleitung oder Wärmestrahlung abgeführt werden kann. Belüftungsschlitze mit oder ohne Ventilatoren sind aufgrund von Verschmutzungen und Kondenswasser nicht erwünscht. Der Motorraum, der sich in der Regel in Nähe des Kfz-Scheinwerfers 1 befindet, erzeugt unter ungünstigen Bedingungen eine Umgebungstemperatur von ca. 90° Celsius für den hinteren Teil des Kfz-Scheinwerfers, in dem sich auch die Beleuchtungseinrichtung 3 befindet. Die Verlustleistung der Beleuchtungseinrichtung 3 wird mittels der Heatpipe 5 von der Beleuchtungseinrichtung 3 weg geführt. Dadurch kann vorteilhaft auf bewegliche Komponenten wie Ventilatoren verzichtet werden. Dies erhöht die Zuverlässigkeit des Scheinwerfersystems.The vehicle headlamp is a closed system from which the power loss of the lighting device 3 of typically about 50 watts can be dissipated only by heat conduction or heat radiation. Ventilation slots with or without fans are not desirable due to soiling and condensation. The engine compartment, which is usually located in the vicinity of the motor vehicle headlight 1, generates under unfavorable conditions an ambient temperature of about 90 ° Celsius for the rear of the vehicle headlamp, in which the lighting device 3 is located. The power loss of the illumination device 3 is guided away from the illumination device 3 by means of the heat pipe 5. This can advantageously be dispensed with movable components such as fans. This increases the reliability of the headlamp system.

Die Heatpipe 5 reicht von der Beleuchtungseinrichtung 3 bis zum vorderen Teil des Kfz-Scheinwerfers 1, d.h., bis zur Abdeckscheibe 10 des Kfz-Scheinwerfers 1 und verläuft vorzugsweise entlang der gesamten Abdeckscheibe 10 oder zumindest entlang 75 % der Länge der Abdeckscheibe im unteren Teil des Kfz-Scheinwerfers 1. Durch den im Bereich des Kondensationsbereichs 7 der Heatpipe 5 mit der Heatpipe verbundenen Kühlkörper 8 wird die an der Beleuchtungseinrichtung 3 aufgenommene Verlustwärme auf den Luftraum unmittelbar an der Innenseite der Abdeckscheibe 10 verteilt. Von dort kann die Wärme durch freie Konvektion und Wärmeleitung über die Abdeckscheibe 10 an die Umgebung abgeführt werden. Im Betrieb der Beleuchtungseinrichtung 3, bei laufendem Motor, beträgt die Temperatur im Bereich der Beleuchtungseinrichtung 3 bis zu ca. 150° Celsius. Die Temperatur im vorderen Innenbereich des Kfz-Scheinwerfers 1, an der Abdeckscheibe 10 des Kfz-Scheinwerfers, beträgt - je nach Außentemperatur und Laufzeit des Motors - höchstens ca. 60° Celsius. Die Temperatur auf der Außenseite der Abdeckscheibe 10 beträgt - je nach Außentemperatur und Laufzeit des Motors - höchstens circa 40°C. Der hohe Temperaturgradient zwischen Beleuchtungseinrichtung 3 und dem Luftraum im vorderen Teil des Scheinwerfers 1 unterstützt den Wärmetransport durch die Heatpipe 5 dabei optimal.The heat pipe 5 extends from the lighting device 3 to the front part of the motor vehicle headlight 1, ie, up to the cover 10 of the motor vehicle headlight 1 and preferably extends along the entire cover 10 or at least along 75% of the length of the cover in the lower part of Motor vehicle headlamps 1. The heat sink 5, which is connected to the heat pipe in the region of the condensation area 7 of the heat pipe 5, distributes the heat loss absorbed by the lighting device 3 directly to the inside of the cover pane 10. From there, the heat can be dissipated by free convection and heat conduction through the cover 10 to the environment. During operation of the lighting device 3, with the engine running, the temperature in the area of the illumination device 3 is up to about 150 ° Celsius. The temperature in the front interior of the motor vehicle headlight 1, on the cover 10 of the motor vehicle headlight is - depending on the outside temperature and running time of the engine - at most about 60 ° Celsius. The temperature on the outside of the cover 10 is - depending on the outside temperature and running time of the engine - at most about 40 ° C. The high temperature gradient between lighting device 3 and the air space in the front part of the headlight 1 supports the heat transfer through the heat pipe 5 optimally.

Figur 2 zeigt den Scheinwerfer 1 gemäß einem zweiten Ausführungsbeispiel in einer schematischen Seitenansicht. In Ergänzung zum in Verbindung mit der Figur 1 beschriebenen Scheinwerfer 1 ist die Heatpipe 5 in ihrem Verdampfungsbereich 6 mit einem Wärmeleitkörper 9 thermisch leitend verbunden. Alternativ zur Heatpipe 9 kann bei den in Verbindung mit den Figuren 1 und 2 beschriebenen Ausführungsbeispielen des Kfz-Scheinwerfers 1 auch ein Thermosyphon oder ein Loop-Thermosyphon Verwendung finden. FIG. 2 shows the headlamp 1 according to a second embodiment in a schematic side view. In addition to in conjunction with the FIG. 1 described headlight 1, the heat pipe 5 is thermally conductively connected in its evaporation region 6 with a heat conducting body 9. Alternatively to the Heatpipe 9 can be used in conjunction with the Figures 1 and 2 described embodiments of the motor vehicle headlight 1 also find a thermosiphon or a loop thermosiphon use.

Figur 3 zeigt die Heatpipe 5 und den Wärmeleitkörper 9 in einer schematischen Detailansicht. Die Heatpipe 5 ist im Verdampfungsbereich 6 beispielsweise an den Wärmeleitkörper 9 gelötet. Ferner ist es möglich, dass die Heatpipe 5 im Verdampfungsbereich 6 in den Wärmeleitkörper 9 eingebettet ist. Der Wärmeleitkörper 9 umschließt die Heatpipe 5 in diesem Bereich dann von zumindest drei Seiten. FIG. 3 shows the heat pipe 5 and the heat-conducting body 9 in a schematic detail view. The heat pipe 5 is soldered in the evaporation region 6, for example, to the heat-conducting body 9. Furthermore, it is possible that the heat pipe 5 is embedded in the evaporation region 6 in the heat-conducting body 9. The heat-conducting body 9 encloses the heat pipe 5 in this area then from at least three sides.

Der Wärmeleitkörper 9 besteht aus oder enthält ein gut wärmeleitendes Material wie beispielsweise Kupfer oder Aluminium. Der Wärmeleitkörper 9 ist mit seiner der Heatpipe 5 abgewandten Seite mit der Beleuchtungseinrichtung 3 thermisch leitend verbunden. Alternativ kann die Heatpipe 5 auch direkt mit einem Anschlussträger 28 (siehe dazu auch Figur 5) der Beleuchtungseinrichtung 3 verbunden sein. In jedem Fall ist die Heatpipe vorzugsweise an eine den Leuchtdiodenchips 20 der Beleuchtungseinrichtung 3 abgewandte Unterseite der Beleuchtungseinrichtung 3 thermisch angekoppelt.The heat-conducting body 9 consists of or contains a good heat-conducting material such as copper or aluminum. The heat-conducting body 9 is with its side facing away from the heat pipe 5 with the illumination device. 3 connected thermally conductive. Alternatively, the heat pipe 5 also directly with a connection carrier 28 (see also FIG. 5 ) of the lighting device 3. In any case, the heat pipe is preferably thermally coupled to a side facing away from the light emitting diode chips 20 of the lighting device 3 underside of the lighting device 3.

Figur 4 zeigt eine schematische Detailansicht der Heatpipe 5 mit Kühlkörper 8. Der Kühlkörper 8 ist im Kondensationsbereich 7 der Heatpipe 5 mit dieser verbunden. Die Heatpipe 5 ist im Kondensationsbereich 7 in den Kühlkörper 8 eingebettet oder mit dem Kühlkörper 8 verlötet. Weiter ist es möglich, dass Heatpipe 5 und Kühlkörper 8 eine Einheit bilden und einstückig ausgebildet sind. FIG. 4 shows a schematic detail view of the heat pipe 5 with heat sink 8. The heat sink 8 is connected in the condensation region 7 of the heat pipe 5 with this. The heat pipe 5 is embedded in the condensation region 7 in the heat sink 8 or soldered to the heat sink 8. Further, it is possible that heat pipe 5 and heat sink 8 form a unit and are integrally formed.

Der Kühlkörper 8 enthält oder besteht aus einem gut wärmeleitenden Material wie beispielsweise Aluminium oder Kupfer. Zur Vergrößerung seiner Oberfläche kann der Kühlkörper 8 Kühlstrukturen 11 umfassen, die beispielsweise kammartig oder als Kühlrippen ausgebildet sein können.The heat sink 8 contains or consists of a good heat-conducting material such as aluminum or copper. To increase its surface, the heat sink 8 may comprise cooling structures 11, which may be, for example, comb-like or designed as cooling fins.

Figur 5 zeigt eine schematische Perspektivdarstellung einer Beleuchtungseinrichtung wie sie in einem der hier beschriebenen Kfz-Scheinwerfer zum Einsatz kommen kann. Die Beleuchtungseinrichtung 3 umfasst Leuchtdiodenchips 20, die vorzugsweise geeignet sind, weißes Licht zu erzeugen. Die Leuchtdiodenchips 20 sind in ein Gehäuse 22 montiert, das beispielsweise aus einem keramischen Material wie Aluminiumnitrit bestehen kann. Die Leuchtdiodenchips 20 können aber auch direkt auf den Anschlussträger 28 montiert sein. FIG. 5 shows a schematic perspective view of a lighting device as it can be used in one of the vehicle headlights described here. The illumination device 3 comprises light-emitting diode chips 20, which are preferably suitable for generating white light. The light-emitting diode chips 20 are mounted in a housing 22, which may for example consist of a ceramic material such as aluminum nitrite. However, the light-emitting diode chips 20 can also be mounted directly on the connection carrier 28.

In Abstrahlrichtung ist den Leuchtdiodenchips 20 eine angeschrägte Gehäusewand 21 nachgeordnet, die reflektierend ausgestaltet sein kann, und dadurch zur Strahlformung der erzeugten elektromagnetischen Strahlung beiträgt. Über Durchbrüche im Gehäuse 22 sind die Leuchtdioden 20 elektrisch leitend über Kontaktstellen 23 mit Leiterbahnen 24 des Anschlussträgers 28 verbunden.In the emission direction, the light-emitting diode chips 20 are followed by a beveled housing wall 21, which can be designed to be reflective, and thereby contributes to beam shaping of the electromagnetic radiation generated. About openings in the housing 22, the light-emitting diodes 20 are electrically connected via contact points 23 to tracks 24 of the connection carrier 28.

Weiter kann die Beleuchtungseinrichtung 3 Bauelemente 25 aufweisen, die beispielsweise zum Schutz der Leuchtdiodenchips 20 vor einer elektrostatischen Entladung geeignet sind. Dazu können beispielsweise ein Varistor, eine Diode oder ein Widerstand Verwendung finden. An einen Gegenstecker 26 kann eine Stromversorgung angeschlossen werden, die mittels der Kontaktstellen 27 die Beleuchtungseinrichtung 3 mit dem für den Betrieb erforderlichen Strom versorgt.Furthermore, the illumination device 3 can have components 25 which are suitable, for example, for protecting the light-emitting diode chips 20 from an electrostatic discharge. For example, a varistor, a diode or a resistor can be used for this purpose. To a mating connector 26, a power supply can be connected, which supplies by means of the contact points 27, the lighting device 3 with the power required for operation.

Der Anschlussträger 28 ist vorzugsweise durch eine Metallkernplatine gebildet, die beispielsweise Kupfer, Aluminium und/oder ein keramisches Material enthalten kann. Von den Leuchtdiodenchips 20 im Betrieb erzeugte Wärme wird auf die den Leuchtdiodenchips 20 abgewandte Unterseite des Anschlussträgers 28 geführt und von dort entweder direkt von der Heatpipe 5 oder über den Wärmeleitkörper 9 von der Heatpipe 5 aufgenommen.The connection carrier 28 is preferably formed by a metal core board, which may contain, for example, copper, aluminum and / or a ceramic material. Heat generated by the light-emitting diode chips 20 during operation is conducted to the underside of the connection carrier 28 facing away from the light-emitting diode chips 20 and from there either directly from the heat pipe 5 or via the heat-conducting body 9 from the heat pipe 5.

Figur 6 zeigt eine schematische Prinzipskizze eines Kfz-Scheinwerfers gemäß einem dritten Ausführungsbeispiel. Im Unterschied zum in Verbindung mit Figur 1 beschriebenen ersten Ausführungsbeispiel des Kfz-Scheinwerfers weist der Kfz-Scheinwerfer in diesem Ausführungsbeispiel einen Loop-Thermosyphon 35 auf, der zumindest einen Teil der von der Beleuchtungseinrichtung 3 im Betrieb erzeugten Wärme abführt. Der Thermosyphon 35 umfasst einen Wärmeleitkörper 9, der als ein mit einem Kühlmittel 36 befüllter Grundkörper ausgebildet ist. Der Wärmeleitkörper 9 bildet den Verdampfungsbereich 6 des Thermosyphons 35. Dampf wird vom Wärmeleitkörper 9 in Richtung des Pfeils 37 zum Kühlkörper 8 hin abgeführt. Der Kühlkörper 8 umfasst Kühlstrukturen 11, die beispielsweise als Kühlrippen ausgebildet sind. Am Kühlkörper 8 kondensiert der Dampf zu Kondensat 38, das in Richtung des Pfeils 39 zum Wärmeleitkörper 9 transportiert wird. Der Kühlkörper 8 ist vorzugsweise an der Unterseite der Abdeckscheibe 10 des Kfz-Scheinwerfers angeordnet. FIG. 6 shows a schematic schematic diagram of a motor vehicle headlamp according to a third embodiment. Unlike in conjunction with FIG. 1 described first embodiment of the motor vehicle headlamp, the motor vehicle headlamp in this embodiment, a loop thermosiphon 35, at least part of the of Lighting device 3 dissipates heat generated during operation. The thermosiphon 35 comprises a heat-conducting body 9, which is designed as a body filled with a coolant 36. The heat-conducting body 9 forms the evaporation region 6 of the thermosyphone 35. Steam is removed from the heat-conducting body 9 in the direction of the arrow 37 toward the cooling body 8. The heat sink 8 comprises cooling structures 11, which are formed for example as cooling fins. At the heat sink 8, the steam condenses to condensate 38, which is transported in the direction of the arrow 39 to the heat-conducting body 9. The heat sink 8 is preferably arranged on the underside of the cover 10 of the motor vehicle headlight.

Beim in Figur 6 dargestellten Loop-Thermosyphon 35 hat der Wärmeleitkörper 9 sowohl eine Öffnung für den Abtransport des Dampfes als auch eine Öffnung für den Rücktransport des Kondensats 38. Alternativ kann auch ein einfacher Thermosyphon Verwendung finden, bei dem der Wärmeleitkörper 9 eine einzige Öffnung aufweist, durch welche Dampf und Kondensat gegengerichtet transportiert werden.When in FIG. 6 The thermo-conductive body 9 has both an opening for the removal of the vapor and an opening for the return transport of the condensate 38. Alternatively, a simple thermosiphon can be used in which the heat-conducting body 9 has a single opening through which steam and condensate transported in the opposite direction.

Im Falle eines Loop-Thermosyphons 35 oder eines einfachen Thermosyphons sind die Rohre des Thermosyphons einstückig mit dem Wärmeleitkörper 9 ausgebildet.In the case of a loop thermosiphon 35 or a simple thermosiphon, the tubes of the thermosiphon are integrally formed with the heat-conducting body 9.

Auch im in Verbindung mit Figur 6 beschriebenen Ausführungsbeispiels des Kfz-Scheinwerfers 1 erstreckt sich der Kühlkörper 9 über eine Länge von wenigstens 50 Prozent, bevorzugt wenigstens 75 Prozent der Länge des Kfz-Scheinwerfers entlang des Kfz-Scheinwerfers 1 in horizontaler Richtung.Also in conjunction with FIG. 6 described embodiment of the motor vehicle headlamp 1, the cooling body 9 extends over a length of at least 50 percent, preferably at least 75 percent of the length of the vehicle headlamp along the motor vehicle headlamp 1 in the horizontal direction.

Der hier beschriebene Kfz-Scheinwerfer 1 zeichnet sich durch eine besonders hohe Zuverlässigkeit aus, da auf bewegliche Komponenten wie beispielsweise Ventilatoren zur Kühlung verzichtet werden kann. Weiter ist die Kühlvorrichtung umfassend die Heatpipe 5 oder der Thermosyphon 35 und den Kühlkörper 8 besonders einfach montierbar. Ferner zeichnet sich der beschriebene Kfz-Scheinwerfer 1.durch eine besonders schnelle Enttauung der gesamten Abdeckscheibe bei einem Vereisen der Abdeckscheibe aus.The vehicle headlamp 1 described here is characterized by a particularly high reliability, since it can be dispensed with movable components such as fans for cooling. Further, the cooling device comprising the heat pipe 5 or the thermosiphon 35 and the heat sink 8 is particularly easy to install. Furthermore, the vehicle headlight described 1. is distinguished by a particularly rapid Enttauung the entire cover when icing the cover.

Die obige Erläuterung der Erfindung anhand der Ausführungsbeispiele ist nicht als Beschränkung der Erfindung auf die Ausführungsbeispiele zu verstehen.The above explanation of the invention with reference to the embodiments is not to be understood as limiting the invention to the embodiments.

Claims (7)

  1. Motor vehicle headlight having
    - an illumination device (3) which comprises at least one light-emitting diode chip (20), and
    - a heat pipe (5) or a thermosyphon (35) with a vaporization region (6) and a condensation region (7),
    - the vaporization region (6) being thermally connected to the illumination device (3), and
    - the condensation region (7) being connected to a heat sink (8) which outputs to the environment heat accumulated on the illumination device (3), and
    - the heat sink (8) outputting the accumulated heat to a cover plate (10) of the headlight (1), characterized in that
    - the heat sink (8) extends over at least 50% of the length of the cover plate (10), and
    - the heat sink (8) is located in direct contact with the cover plate (10).
  2. Motor vehicle headlight according to the preceding claim, in which the heat sink (8) comprises a cooling structure (11).
  3. Motor vehicle headlight according to at least one of the preceding claims, in which the vaporization region (6) is thermally connected to the underside of the illumination device (3), which underside is averted from the main emission direction of the light-emitting diode chip.
  4. Motor vehicle headlight according to at least one of the preceding claims, in which the vaporization region (6) is connected to a thermally conductive element (9) which is thermally connected to the illumination device (3).
  5. Motor vehicle headlight according to at least one of the preceding claims, in which the accumulated heat is used to heat the cover plate (10).
  6. Motor vehicle headlight according to at least one of the preceding claims, in which the accumulated heat is used to de-ice the cover plate (10).
  7. Motor vehicle headlight according to Claim 1, in which the motor vehicle headlight is a closed system from which the heat loss of the illumination device (3) can be dissipated only by thermal conduction or thermal radiation.
EP07702411A 2006-02-01 2007-01-31 Vehicle headlight Active EP1979673B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006004593 2006-02-01
DE102006010977A DE102006010977A1 (en) 2006-02-01 2006-03-09 Motor vehicle headlight
PCT/DE2007/000180 WO2007087791A1 (en) 2006-02-01 2007-01-31 Vehicle headlight

Publications (2)

Publication Number Publication Date
EP1979673A1 EP1979673A1 (en) 2008-10-15
EP1979673B1 true EP1979673B1 (en) 2011-10-19

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US (1) US20090213613A1 (en)
EP (1) EP1979673B1 (en)
CN (1) CN101389901B (en)
AT (1) ATE529699T1 (en)
DE (1) DE102006010977A1 (en)
WO (1) WO2007087791A1 (en)

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Also Published As

Publication number Publication date
US20090213613A1 (en) 2009-08-27
ATE529699T1 (en) 2011-11-15
DE102006010977A1 (en) 2007-12-06
CN101389901B (en) 2010-10-20
EP1979673A1 (en) 2008-10-15
WO2007087791A1 (en) 2007-08-09
CN101389901A (en) 2009-03-18

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