EP1967540A4 - Curable composition - Google Patents
Curable compositionInfo
- Publication number
- EP1967540A4 EP1967540A4 EP06843274A EP06843274A EP1967540A4 EP 1967540 A4 EP1967540 A4 EP 1967540A4 EP 06843274 A EP06843274 A EP 06843274A EP 06843274 A EP06843274 A EP 06843274A EP 1967540 A4 EP1967540 A4 EP 1967540A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- curable composition
- curable
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/458—Block-or graft-polymers containing polysiloxane sequences containing polyurethane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/485—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1525—Four-membered rings
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Silicon Polymers (AREA)
- Epoxy Resins (AREA)
- Polyethers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005373458 | 2005-12-26 | ||
JP2006313190 | 2006-11-20 | ||
PCT/JP2006/325890 WO2007074813A1 (en) | 2005-12-26 | 2006-12-26 | Curable composition |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1967540A1 EP1967540A1 (en) | 2008-09-10 |
EP1967540A4 true EP1967540A4 (en) | 2011-08-03 |
EP1967540B1 EP1967540B1 (en) | 2013-04-03 |
Family
ID=38218033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06843274A Active EP1967540B1 (en) | 2005-12-26 | 2006-12-26 | Curable composition |
Country Status (6)
Country | Link |
---|---|
US (1) | US8263725B2 (en) |
EP (1) | EP1967540B1 (en) |
JP (1) | JP5364267B2 (en) |
KR (1) | KR101017188B1 (en) |
CN (1) | CN101346415B (en) |
WO (1) | WO2007074813A1 (en) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5117799B2 (en) * | 2007-09-07 | 2013-01-16 | 株式会社カネカ | Curable composition |
CN101896537B (en) * | 2007-12-10 | 2012-10-24 | 株式会社钟化 | Alkali-developable curable composition, insulating thin film using the same, and thin film transistor |
JP5037385B2 (en) * | 2008-02-26 | 2012-09-26 | 新日鐵化学株式会社 | Curable resin composition containing epoxy silicone resin |
JP2009251235A (en) * | 2008-04-04 | 2009-10-29 | Panasonic Electric Works Co Ltd | Composite resin-made lens |
WO2010038767A1 (en) * | 2008-10-02 | 2010-04-08 | 株式会社カネカ | Photocurable composition and cured product |
JP4706878B2 (en) * | 2008-11-17 | 2011-06-22 | 信越化学工業株式会社 | Plate for micro contact printing |
JP5296575B2 (en) * | 2009-03-06 | 2013-09-25 | 住友化学株式会社 | Photocurable adhesive composition, polarizing plate and method for producing the same, optical member and liquid crystal display device |
TWI529186B (en) * | 2009-11-05 | 2016-04-11 | 日立化成股份有限公司 | Thermopolymerization initiator system and adhesive composition |
JP6157118B2 (en) | 2010-03-23 | 2017-07-05 | 株式会社朝日ラバー | Flexible reflective substrate, method for producing the same, and raw material composition used for the reflective substrate |
JP5838972B2 (en) * | 2010-11-25 | 2016-01-06 | 日油株式会社 | Thioether-containing alkoxysilane derivatives and uses thereof |
JP5523376B2 (en) * | 2011-03-03 | 2014-06-18 | 新日鉄住金化学株式会社 | Epoxy silicone resin and curable resin composition using the same |
EP2691810A1 (en) * | 2011-03-29 | 2014-02-05 | Dow Corning Corporation | Photo-patternable and developable silesquioxane resins for use in device fabrication |
JP5738142B2 (en) * | 2011-09-20 | 2015-06-17 | 新日鉄住金化学株式会社 | Epoxy silicone resin and curable resin composition using the same |
JP5695269B2 (en) * | 2012-03-28 | 2015-04-01 | 株式会社ダイセル | Curable epoxy resin composition |
US20140057115A1 (en) * | 2012-08-22 | 2014-02-27 | The Walman Optical Company | Coating composition and method |
KR20150052857A (en) * | 2012-08-31 | 2015-05-14 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | Epoxy silicone resin and curable resin composition employing same |
TWI570160B (en) * | 2012-09-04 | 2017-02-11 | 新日鐵住金化學股份有限公司 | Epoxy silicone resin and a hardened resin composition using the same |
KR101501684B1 (en) * | 2012-11-15 | 2015-03-18 | 롯데케미칼 주식회사 | Catalyst composition for polymerization of olefin, preparing method of the same, and process for polymerization of olefin using the same |
WO2014157552A1 (en) * | 2013-03-28 | 2014-10-02 | 日本化薬株式会社 | Optical semiconductor encapsulating epoxy resin composition, cured product thereof and optical semiconductor device |
JP5596207B2 (en) * | 2013-04-30 | 2014-09-24 | 住友化学株式会社 | Photocurable adhesive composition, polarizing plate and method for producing the same, optical member and liquid crystal display device |
US9572753B2 (en) * | 2014-03-17 | 2017-02-21 | Ada Foundation | Enzymatically and hydrolytically stable resins, resin monomers, and resin composites for use in dental preventive and restorative applications |
US20170037273A1 (en) | 2014-04-10 | 2017-02-09 | 3M Innovative Properties Company | Adhesion promoting and/or dust suppression coating |
CN105295050B (en) * | 2014-06-20 | 2017-11-21 | 北京化工大学 | A kind of triaryl sulfonium salts of chain containing silica and its applied in photo-curing epoxy resin |
JP5989063B2 (en) * | 2014-11-10 | 2016-09-07 | 株式会社朝日ラバー | Silicone resin base material |
US11198795B2 (en) | 2015-02-17 | 2021-12-14 | The Walman Optical Company | Glycidyl ether based optical coating compositions |
CN107109190B (en) * | 2015-04-17 | 2020-06-23 | 积水化学工业株式会社 | Sealing agent for electronic device and method for manufacturing electronic device |
CN110799573B (en) * | 2017-06-20 | 2022-06-03 | 株式会社德山 | Photochromic polyrotaxane compound, and curable composition comprising same |
EP3450478B1 (en) * | 2017-08-31 | 2020-11-11 | Shin-Etsu Chemical Co., Ltd. | Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process |
US10670964B2 (en) * | 2017-11-21 | 2020-06-02 | International Business Machines Corporation | Ruggedized solder mask material |
JP6984539B2 (en) | 2018-05-21 | 2021-12-22 | 信越化学工業株式会社 | Photosensitive resin composition, pattern forming method, and manufacturing method of optical semiconductor device |
US20230257513A1 (en) * | 2022-02-16 | 2023-08-17 | International Business Machines Corporation | Rehealable and reworkable polymer for electronic packaging |
WO2024010059A1 (en) * | 2022-07-07 | 2024-01-11 | 積水化学工業株式会社 | Curable resin composition and sealing agent for organic el display elements |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6194482B1 (en) * | 1996-09-20 | 2001-02-27 | Siemens Aktiengesellschaft | UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components |
US20050209400A1 (en) * | 2002-04-26 | 2005-09-22 | Manabu Tsumura | Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product |
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US3159601A (en) * | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
US3220972A (en) * | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
US3159662A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Addition reaction |
ES305034A1 (en) * | 1963-10-18 | 1965-04-01 | Ciba Geigy | Cold-curable mixtures of cycloaliphatic polyepoxides and curing agents |
US3821218A (en) * | 1967-09-20 | 1974-06-28 | Gen Electric | Nitrogen-containing organosilicon materials |
US3517001A (en) * | 1967-09-20 | 1970-06-23 | Gen Electric | Nitrogen-containing organosilicon materials |
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JPS604640B2 (en) | 1975-07-30 | 1985-02-05 | ソニー株式会社 | pseudo head |
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US4086091A (en) * | 1977-05-20 | 1978-04-25 | General Electric Company | Method of applying and curing epoxy coating compositions using dicarbonyl chelate of group IIIa-Va element and UV irradiation |
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US4139655A (en) * | 1978-05-09 | 1979-02-13 | W. R. Grace & Co. | Photocurable epoxy compositions containing thiopyrylium salts |
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US5101029A (en) | 1989-04-27 | 1992-03-31 | Siemens Aktiengesellschaft | Isocyanurate-containing organosilicon compounds |
US5652276A (en) * | 1994-11-15 | 1997-07-29 | Kanegafuchi Chemical Industry Co., Ltd. | Foaming resin composition, plastic foam formed from the composition, and method for forming the plastic foam |
JP3967495B2 (en) | 1999-07-06 | 2007-08-29 | ジャパンエポキシレジン株式会社 | Epoxy resin composition |
JP2003128921A (en) * | 2001-10-17 | 2003-05-08 | Kanegafuchi Chem Ind Co Ltd | Thermosetting resin composition, thermosetting resin film and metal foil laminate using the same |
JP4177013B2 (en) | 2002-04-03 | 2008-11-05 | ダイセル化学工業株式会社 | Method for curing thermosetting epoxy resin composition, cured product and use thereof |
JP2004002784A (en) * | 2002-04-04 | 2004-01-08 | Kanegafuchi Chem Ind Co Ltd | Composition for electronic material, electronic material and electronic product produced by using the same |
JP5000072B2 (en) * | 2002-04-04 | 2012-08-15 | 株式会社カネカ | Light emitting diode |
AU2003236347A1 (en) * | 2002-04-08 | 2003-10-20 | Kaneka Corporation | Organic polymers having at the ends epoxy- and/or oxetanyl-containing silicon groups and process for production thereof |
JP4074796B2 (en) * | 2002-09-10 | 2008-04-09 | 東レ・ダウコーニング株式会社 | Epoxy resin composition and semiconductor device |
JP4421192B2 (en) | 2003-02-10 | 2010-02-24 | スタンレー電気株式会社 | Sealing resin composition for light emitting diode and surface mount light emitting diode using the same |
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-
2006
- 2006-12-26 CN CN200680049049XA patent/CN101346415B/en active Active
- 2006-12-26 EP EP06843274A patent/EP1967540B1/en active Active
- 2006-12-26 JP JP2007551982A patent/JP5364267B2/en active Active
- 2006-12-26 US US12/159,137 patent/US8263725B2/en active Active
- 2006-12-26 KR KR1020087015835A patent/KR101017188B1/en active IP Right Grant
- 2006-12-26 WO PCT/JP2006/325890 patent/WO2007074813A1/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6194482B1 (en) * | 1996-09-20 | 2001-02-27 | Siemens Aktiengesellschaft | UV-hardenable and thermally hardenable epoxy resins for underfilling electrical and electronic components |
US20050209400A1 (en) * | 2002-04-26 | 2005-09-22 | Manabu Tsumura | Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product |
Non-Patent Citations (1)
Title |
---|
See also references of WO2007074813A1 * |
Also Published As
Publication number | Publication date |
---|---|
JPWO2007074813A1 (en) | 2009-06-04 |
US8263725B2 (en) | 2012-09-11 |
US20100222525A1 (en) | 2010-09-02 |
KR20080072758A (en) | 2008-08-06 |
EP1967540A1 (en) | 2008-09-10 |
WO2007074813A1 (en) | 2007-07-05 |
CN101346415B (en) | 2012-06-27 |
KR101017188B1 (en) | 2011-02-25 |
CN101346415A (en) | 2009-01-14 |
JP5364267B2 (en) | 2013-12-11 |
EP1967540B1 (en) | 2013-04-03 |
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