EP1963030A2 - Transducteur ultrasonore dote d'une couche d'adaptation autoportante et procede de fabrication associe - Google Patents

Transducteur ultrasonore dote d'une couche d'adaptation autoportante et procede de fabrication associe

Info

Publication number
EP1963030A2
EP1963030A2 EP06828702A EP06828702A EP1963030A2 EP 1963030 A2 EP1963030 A2 EP 1963030A2 EP 06828702 A EP06828702 A EP 06828702A EP 06828702 A EP06828702 A EP 06828702A EP 1963030 A2 EP1963030 A2 EP 1963030A2
Authority
EP
European Patent Office
Prior art keywords
layer
ultrasonic transducer
substrate
transducer
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06828702A
Other languages
German (de)
English (en)
Inventor
Robert Lemor
Steffen Tretbar
Eike Christian Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP1963030A2 publication Critical patent/EP1963030A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/445—Details of catheter construction

Definitions

  • the present invention relates to an ultrasonic transducer which has at least one piezoactive converter layer which is formed as a non-self-supporting layer, contacting layers for electrical contacting of the converter layer and a front-side matching layer for acoustic impedance matching to a coupling medium.
  • Such an ultrasonic transducer is suitable for both the industrial and the medical technology field.
  • these ultrasound transducers as miniaturized, high-frequency ultrasonic sensors find use in medical catheter systems, ultrasound microscopy systems and high-frequency inspection systems of technical components, for example in chip production.
  • Known ultrasonic transducers consist essentially of a piezoactive converter layer, Kontak- ttechniks slaughteren for electrical contacting of the transducer layer, a backside damping layer and a front-side matching layer (matching layer).
  • the matching layer serves to acoustically match the impedance to a coupling medium into which the ultrasonic waves are coupled in or out of the ultrasound wave. Sound waves should be received.
  • This layer system known ultrasound transducer is usually built on the self-supporting piezoactive layer and then possibly installed in a housing.
  • the object of the present invention is to specify an ultrasound transducer with a microsystem-technical design for high-frequency ultrasound applications and a method for its production, which has an increased transmission power and reception sensitivity.
  • the proposed ultrasonic transducer has at least one piezoactive converter layer which is formed as a non-self-supporting layer, contacting layers for electrically contacting the converter layer and a front-side matching layer for acoustic impedance matching to a coupling medium.
  • the ultrasonic transducer is characterized in that the matching layer is designed as a supporting element for the converter layer and the contacting layers.
  • the matching layer is formed as a supporting layer for the layer system.
  • the matching layer fulfills a dual function, on the one hand as a supporting element for the converter layer and the contacting layers and on the other hand for acoustic impedance matching to the coupling medium.
  • the matching layer must have sufficient thickness to fulfill the supporting function.
  • Thickness of the matching layer represents the impedance matching in relation to the wavelength X of the used sound frequency in the matching layer and is usually a multiple of ⁇ / 2 or ⁇ / 4.
  • the shape of the matching layer can be chosen arbitrarily. It can be flat or curved or also formed, for example, wedge, triangular or pyramidal.
  • the piezoactive transducer layer can be made thin enough in the present transducer to provide a microsystem design and high frequency ultrasonic or high frequency ultrasound reception.
  • a cushioning layer is preferably not used in the present transducer. Rather, the attenuation at the rear transducer side can be realized solely by acoustic mismatch, for example by the acoustic impedance transition from the piezoactive material to air.
  • the present ultrasonic transducer offers the advantage that the acoustic energy emitted by the piezoactive transducer layer is for the most part emitted into the matching layer and thus into the desired transmission direction. As a result, an increased power output in the transmission case as well as an improved sensitivity in the reception case compared to the known structure with an additional carrier substrate is achieved. In the absence of a damping layer, artefacts caused by double reflections in the damping layer are also excluded.
  • the present ultrasonic transducer can be implemented both as a high-frequency ultrasonic single-transducer and together with further ultrasound transducers constructed in the same way as a multi-element transducer. The construction technique described also allows the use of an acoustic lens of different materials on the front of the matching layer.
  • the present ultrasonic transducer in combination with an ASIC Implement (Application Specific Integrated Circuit) in a common structure.
  • ASIC Application Specific Integrated Circuit
  • the matching layer lies in an edge region of its front-side surface on the edge of a passage opening in a substrate.
  • the substrate is preferably used to receive an integrated circuit in addition to the ultrasonic transducer, for example, for controlling the ultrasonic transducer and / or for
  • Processing and / or amplification of received signals of the ultrasonic transducer is connected thereto.
  • FIG. 4 shows an example of an ultrasonic transducer connected to an ASIC in a common structure.
  • Fig. 1 shows an example of the present method for manufacturing the ultrasonic transducer, in which the later layer structure is supported by the matching layer, which in the present example rests on an annular substrate.
  • the substrate may also be rectangular or similarly shaped or cut out in such a construction.
  • the matching layer does not have to rest on all sides of the substrate.
  • the substrate 11 is provided, for example a silicon substrate, to which an adaptation layer 12, for example of silicon nitride, is applied.
  • the matching layer 12 may be made of a material or a multi-material layer system. Furthermore, this matching layer 12 may have any shape, for example, be flat or have a curvature, which may be generated for example by pre-structuring of the substrate 11.
  • the matching layer 12 is applied with sufficient thickness so that it can later form the supporting element for the further layers.
  • the contacting layer may be made of one material or of a layer system of different ones Materials consist, for example, of a layer system of Cr and Au, where Cr serves as a bonding agent to the matching layer 12.
  • the piezoactive transducer layer 14 is applied.
  • the piezoactive transducer layer 14 may be made of a material, such as zinc oxide, or a layer system of different materials.
  • a second contacting layer 15 is applied, which may also be made of gold, for example. All these
  • Layers can be photolithographically or otherwise masked and patterned.
  • the substrate 11 is masked and completely removed below the central area of the matching layer 12, so that a front through opening 16 for the sound radiation is formed. This can be done for example via a suitable etching process.
  • Ultrasound signals are shown schematically by the double arrow 17 in FIG.
  • both the piezoactive transducer layer 14 and the front and back contacting layer 13, 15 can be patterned for better contacting and for defining the sound radiating aperture.
  • FIG. 2 Different examples of a structuring of these layers are shown in FIG. 2, in which the structured rear-side contacting layer 22, the structured piezo-active converter layer 21 and the structured front-side contacting layer 23 can be seen. The structuring can again take place in a known manner via photolithographic masking methods, etching methods as well as by mechanical processing.
  • FIG. 3 shows an example of an ultrasonic transducer which is additionally provided with an acoustic lens 31.
  • an additional layer of material was applied in the passage opening to the front of the matching layer and structured in the central region for forming the acoustic lens.
  • This additional layer may consist of the material of the matching layer, the material of the substrate or another material.
  • FIG. 4 shows an example of a common construction of the ultrasound transducer with an ASIC 42.
  • the substrate 41 is used, in which the passage opening for the sound radiation was generated in the region of the ultrasound transducer.
  • the substrate 41 is chosen to be large enough to accommodate the ASIC 42 in addition to the layers of the ultrasonic transducer.
  • Ultrasonic transducer is preferably built up on the substrate after the production of the ASIC, so that an intervention in the conventional production method of ASICS, for example by the CMOS process, is not necessary.
  • electrically conductive connections 43 are made between the ASIC and the ultrasonic transducer. This can be done for example by means of a bonding method or by depositing and patterning of electrically conductive layers.
  • the ASIC can be used, for example, for generating the electrical excitation, for switching over individual elements (multiplexers), for electrical amplification and for signal processing of the ultrasonic signals to be transmitted and received.
  • the combination of the ASIC and the ultrasonic transducer may be accomplished with an ultrasonic transducer with or without an acoustic lens 44, as shown in FIG.

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

L'invention concerne un transducteur ultrasonore et un procédé de fabrication associé. Ce transducteur ultrasonore comporte au moins une couche de conversion (14) piézoélectriquement active, qui n'est pas autoportante, des couches de contact (13, 15) pour la mise en contact électrique de la couche de conversion (14), et une couche d'adaptation (12) avant pour adapter l'impédance acoustique au milieu de couplage. La couche d'adaptation (12) dudit transducteur ultrasonore est un élément porteur pour la couche de conversion (14) et les couches de contact (13, 15). Il est ainsi possible de réaliser un transducteur ultrasonore à microsystème qui présente une plus grande puissance d'émission et une sensibilité de réception accrue.
EP06828702A 2005-12-21 2006-12-18 Transducteur ultrasonore dote d'une couche d'adaptation autoportante et procede de fabrication associe Withdrawn EP1963030A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510061343 DE102005061343B4 (de) 2005-12-21 2005-12-21 Ultraschallwandler mit selbsttragender Anpassschicht sowie Verfahren zur Herstellung
PCT/DE2006/002272 WO2007076820A2 (fr) 2005-12-21 2006-12-18 Transducteur ultrasonore dote d'une couche d'adaptation autoportante et procede de fabrication associe

Publications (1)

Publication Number Publication Date
EP1963030A2 true EP1963030A2 (fr) 2008-09-03

Family

ID=38135530

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06828702A Withdrawn EP1963030A2 (fr) 2005-12-21 2006-12-18 Transducteur ultrasonore dote d'une couche d'adaptation autoportante et procede de fabrication associe

Country Status (3)

Country Link
EP (1) EP1963030A2 (fr)
DE (1) DE102005061343B4 (fr)
WO (1) WO2007076820A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012003495B4 (de) * 2012-02-24 2015-04-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ultraschallwandler zur Anregung und/oder zur Detektion von Ultraschall unterschiedlicher Frequenzen
DE102014207681A1 (de) 2014-04-24 2015-10-29 Robert Bosch Gmbh Membran für einen Ultraschallwandler und Ultraschallwandler

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2473242A1 (fr) * 1980-01-08 1981-07-10 Thomson Csf Transducteur electroacoustique a dome actif
FR2503517A1 (fr) * 1981-04-06 1982-10-08 Thomson Csf Transducteur piezo-electrique
FR2531298B1 (fr) * 1982-07-30 1986-06-27 Thomson Csf Transducteur du type demi-onde a element actif en polymere piezoelectrique
DE3809447A1 (de) * 1988-03-21 1989-10-12 Siemens Ag Verfahren zur herstellung einer anpassschicht bei ultraschallwandlern
JP2730756B2 (ja) * 1988-04-13 1998-03-25 日立建機株式会社 超音波探触子及びその製造方法
US5159228A (en) * 1990-08-24 1992-10-27 Siemens Aktiengesellschaft Pressure wave sensor
US5381386A (en) * 1993-05-19 1995-01-10 Hewlett-Packard Company Membrane hydrophone
US6831394B2 (en) * 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2007076820A2 *

Also Published As

Publication number Publication date
WO2007076820A3 (fr) 2008-03-20
WO2007076820A2 (fr) 2007-07-12
DE102005061343B4 (de) 2010-11-25
DE102005061343A1 (de) 2007-07-05

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