EP1940587A4 - Apertured conditioning brush for chemical mechanical planarization systems - Google Patents

Apertured conditioning brush for chemical mechanical planarization systems

Info

Publication number
EP1940587A4
EP1940587A4 EP06817260A EP06817260A EP1940587A4 EP 1940587 A4 EP1940587 A4 EP 1940587A4 EP 06817260 A EP06817260 A EP 06817260A EP 06817260 A EP06817260 A EP 06817260A EP 1940587 A4 EP1940587 A4 EP 1940587A4
Authority
EP
European Patent Office
Prior art keywords
chemical mechanical
mechanical planarization
conditioning brush
planarization systems
apertured conditioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06817260A
Other languages
German (de)
French (fr)
Other versions
EP1940587A2 (en
Inventor
Stephen J Benner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TBW Industries Inc
Original Assignee
TBW Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TBW Industries Inc filed Critical TBW Industries Inc
Publication of EP1940587A2 publication Critical patent/EP1940587A2/en
Publication of EP1940587A4 publication Critical patent/EP1940587A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/145—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface
EP06817260A 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems Withdrawn EP1940587A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US72812605P 2005-10-19 2005-10-19
US11/582,711 US20070087672A1 (en) 2005-10-19 2006-10-18 Apertured conditioning brush for chemical mechanical planarization systems
PCT/US2006/041166 WO2007047996A2 (en) 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems

Publications (2)

Publication Number Publication Date
EP1940587A2 EP1940587A2 (en) 2008-07-09
EP1940587A4 true EP1940587A4 (en) 2010-01-20

Family

ID=37948719

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06817260A Withdrawn EP1940587A4 (en) 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems

Country Status (7)

Country Link
US (1) US20070087672A1 (en)
EP (1) EP1940587A4 (en)
JP (1) JP2009512569A (en)
KR (1) KR20080075840A (en)
CA (1) CA2626564A1 (en)
IL (1) IL190944A0 (en)
WO (1) WO2007047996A2 (en)

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US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
JP4846417B2 (en) * 2006-03-30 2011-12-28 株式会社山田製作所 Deburring brush
JP5080769B2 (en) * 2006-09-15 2012-11-21 株式会社東京精密 Polishing method and polishing apparatus
US7597608B2 (en) * 2006-10-30 2009-10-06 Applied Materials, Inc. Pad conditioning device with flexible media mount
JP5002353B2 (en) * 2007-07-05 2012-08-15 シャープ株式会社 Chemical mechanical polishing equipment
US8758091B2 (en) * 2010-04-06 2014-06-24 Massachusetts Institute Of Technology Chemical-mechanical polishing pad conditioning system
CN102398212A (en) * 2010-09-17 2012-04-04 中芯国际集成电路制造(上海)有限公司 Chemical mechanical polishing equipment
CN104956467B (en) 2013-01-31 2018-02-16 应用材料公司 Method and apparatus for the base-plate cleaning after chemical-mechanical planarization
WO2014149676A1 (en) 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus
TWI662610B (en) * 2013-10-25 2019-06-11 美商應用材料股份有限公司 Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
US9452506B2 (en) * 2014-07-15 2016-09-27 Applied Materials, Inc. Vacuum cleaning systems for polishing pads, and related methods
KR101841549B1 (en) * 2015-10-29 2018-03-23 에스케이실트론 주식회사 An apparatus for dressing a polishing pad and wafer polisher including the same
JP6842859B2 (en) 2016-08-12 2021-03-17 株式会社荏原製作所 Dressing equipment, polishing equipment, holders, housings and dressing methods
US10410936B2 (en) 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
US20200043746A1 (en) * 2018-07-31 2020-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus
US11648644B2 (en) 2019-01-02 2023-05-16 Samsung Electronics Co., Ltd. Polishing pad conditioning apparatus
US20220281069A1 (en) * 2021-03-04 2022-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for removing debris during chemical mechanical planarization
CN112885753B (en) * 2021-03-04 2022-08-12 长江存储科技有限责任公司 Polishing pad dresser, chemical mechanical polishing apparatus and method of polishing wafer using the same
CN115870875B (en) * 2022-12-08 2024-04-12 西安奕斯伟材料科技股份有限公司 Grinding disc and grinding equipment for grinding silicon wafers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000059681A1 (en) * 1999-04-01 2000-10-12 Koninklijke Philips Electronics N.V. Cmp pad conditioner arrangement and method therefor
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
US20060046623A1 (en) * 2004-08-24 2006-03-02 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning

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DE4233888A1 (en) * 1992-10-10 1994-04-14 Reinhard Dipl Ing Hoersch Process and device for cleaning and / or maintaining all types of floor coverings
US6244946B1 (en) * 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US5975994A (en) * 1997-06-11 1999-11-02 Micron Technology, Inc. Method and apparatus for selectively conditioning a polished pad used in planarizng substrates
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JP3770752B2 (en) * 1998-08-11 2006-04-26 株式会社日立製作所 Semiconductor device manufacturing method and processing apparatus
US6142859A (en) * 1998-10-21 2000-11-07 Always Sunshine Limited Polishing apparatus
JP2001277095A (en) * 2000-03-31 2001-10-09 Mitsubishi Materials Corp Pad conditioning device and pad conditioning method
US6273800B1 (en) * 1999-08-31 2001-08-14 Micron Technology, Inc. Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
US6244944B1 (en) * 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6224470B1 (en) * 1999-09-29 2001-05-01 Applied Materials, Inc. Pad cleaning brush for chemical mechanical polishing apparatus and method of making the same
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
US6386963B1 (en) * 1999-10-29 2002-05-14 Applied Materials, Inc. Conditioning disk for conditioning a polishing pad
US6331136B1 (en) * 2000-01-25 2001-12-18 Koninklijke Philips Electronics N.V. (Kpenv) CMP pad conditioner arrangement and method therefor
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
JP3797861B2 (en) * 2000-09-27 2006-07-19 株式会社荏原製作所 Polishing device
JP2002273656A (en) * 2001-03-21 2002-09-25 Nippei Toyama Corp Grinding wheel dresser
JP2002307308A (en) * 2001-04-12 2002-10-23 Fujimori Gijutsu Kenkyusho:Kk Polishing dresser for polishing machine for chemical machine polisher
JP2003181756A (en) * 2001-12-19 2003-07-02 Tokyo Seimitsu Co Ltd Conditioner for wafer processing apparatus
JP2003211355A (en) * 2002-01-15 2003-07-29 Ebara Corp Polishing device and dressing method
AU2003218477A1 (en) * 2002-04-02 2003-10-20 Rodel Holdings, Inc. Composite conditioning tool
AU2003219400A1 (en) * 2002-05-07 2003-11-11 Koninklijke Philips Electronics N.V. Cleaning head
JP2003347256A (en) * 2002-05-29 2003-12-05 Tokyo Seimitsu Co Ltd Abrasive cloth cleaning plate and abrasive cloth cleaning method
US20050066996A1 (en) * 2002-09-11 2005-03-31 The Procter & Gamble Company Stain-removal brush including cleaning composition dispenser
JP2004306234A (en) * 2003-04-10 2004-11-04 Applied Materials Inc Brush for washing of polishing pad of chemical mechanical polishing equipment
US20050036004A1 (en) * 2003-08-13 2005-02-17 Barbara Horn Methods and systems for conditioning slotted substrates
JP2005271101A (en) * 2004-03-23 2005-10-06 Tokyo Seimitsu Co Ltd Dressing device of polishing pad and polishing apparatus having the dressing device of polishing pad
US7033253B2 (en) * 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000059681A1 (en) * 1999-04-01 2000-10-12 Koninklijke Philips Electronics N.V. Cmp pad conditioner arrangement and method therefor
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
US20060046623A1 (en) * 2004-08-24 2006-03-02 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning

Also Published As

Publication number Publication date
EP1940587A2 (en) 2008-07-09
US20070087672A1 (en) 2007-04-19
KR20080075840A (en) 2008-08-19
IL190944A0 (en) 2009-09-22
WO2007047996A2 (en) 2007-04-26
CA2626564A1 (en) 2007-04-26
WO2007047996A3 (en) 2007-10-04
JP2009512569A (en) 2009-03-26

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20080328

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

A4 Supplementary search report drawn up and despatched

Effective date: 20091217

RIC1 Information provided on ipc code assigned before grant

Ipc: B24B 37/04 20060101AFI20091211BHEP

Ipc: B24B 53/12 20060101ALI20091211BHEP

Ipc: B24D 13/14 20060101ALI20091211BHEP

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20100316