EP1938377A1 - Monolithically integrable circuit arrangement - Google Patents

Monolithically integrable circuit arrangement

Info

Publication number
EP1938377A1
EP1938377A1 EP06806279A EP06806279A EP1938377A1 EP 1938377 A1 EP1938377 A1 EP 1938377A1 EP 06806279 A EP06806279 A EP 06806279A EP 06806279 A EP06806279 A EP 06806279A EP 1938377 A1 EP1938377 A1 EP 1938377A1
Authority
EP
European Patent Office
Prior art keywords
coil
circuit
circuit arrangement
components
circuit component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06806279A
Other languages
German (de)
French (fr)
Inventor
Samir El Rai
Ralf Tempel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microchip Technology Munich GmbH
Original Assignee
Atmel Duisburg GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Duisburg GmbH filed Critical Atmel Duisburg GmbH
Publication of EP1938377A1 publication Critical patent/EP1938377A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5225—Shielding layers formed together with wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a monolithically integrable circuit arrangement having a first circuit component embodied as a differentially fed coil, which has at least one conductor loop enclosing an inner region, and having at least one further circuit component.
  • Such circuits are known and are used, for example, to build tank circuits for voltage controlled oscillators (VCO, voltage controlled oscillator) and other circuits that require inductive components.
  • VCO voltage controlled oscillators
  • VCO voltage controlled oscillator
  • a particular disadvantage of such circuit arrangements is the poor integration of coils in monolithic integrated circuits, in particular due to the relatively large space requirement of the coil itself and the minimum distances to be adhered to adjacent circuit components, in particular in order to keep electromagnetic interactions low and thus to avoid interference.
  • Corresponding supply lines or connecting lines between the coil and the further circuit component arranged in the inner region can furthermore be designed to be particularly short, so that parasitic effects normally caused by supply lines, such as ohmic losses or capacitive effects, are reduced.
  • the further circuit component has one or more passive components, in particular capacitive components.
  • the inventive arrangement of capacitive components in the interior of the coil advantageously allows the construction of monolithically integrated LC combinations, as they are often required in resonant circuits, filters and other circuits.
  • the total space requirement of the LC combinations according to the invention is clear less than the conventional circuit arrangements in which the capacitive components are not arranged in the inner region of the coil but outside the coil.
  • further advantages such as improved quality due to lower ohmic losses and increased accuracy with regard to a resonant frequency due to lower parasitic capacitances in the supply lines result.
  • the capacitive components are particularly advantageously designed as a configurable capacitor matrix (CDAC) in which a plurality of individual capacitors can be connected to one another in different ways and thus enable the setting of different resulting replacement capacitances.
  • CDAC configurable capacitor matrix
  • An embodiment of the capacitive components as a capacitance diode is also possible.
  • the further circuit component according to the invention may also have a combination of one or more capacitors and a capacitance diode.
  • resistive components such as ohmic resistors in the interior of the coil.
  • active components in particular transistors, can be very advantageously provided in the further circuit component, which according to the invention is arranged in the inner region of the coil.
  • different conductor sections of the coil are arranged in different metallization planes of a substrate receiving the circuit arrangement.
  • the use of different metallization levels is very expedient, because in this way the area requirement of the coil can be kept low.
  • a shielding device in the inner region of the conductor loop, a shielding device is arranged, which at least partially between at least one conductor loop of Coil and the other circuit component extends.
  • the shielding device serves to further reduce the electrical or magnetic field strength in the inner region of the coil and can be connected, for example, to a ground potential of the circuit arrangement according to the invention.
  • the coil has at least one pair of mutually symmetrical legs.
  • Such a symmetrical construction of the coil, in conjunction with the differential supply of the coil, ensures particularly low magnetic field strengths in the interior region of the coil.
  • the further circuit components and / or the further circuit components are assigned to control lines in the region of an axis of symmetry of the coil running between the legs.
  • the arrangement of the above-mentioned components in the region of the axis of symmetry ensures a minimum electromagnetic interaction between the magnetic field of the coil and the components arranged in its inner region.
  • a monolithic integrated circuit is provided with at least one circuit arrangement according to the invention.
  • a particularly advantageous embodiment of the circuit according to the invention is characterized by at least two Metalltechnischesebenen.
  • Figure 1 shows a first embodiment of the circuit arrangement according to the invention in
  • FIG. 2 shows a second embodiment of the circuit arrangement according to the invention
  • FIG. 3 shows a third embodiment of the circuit arrangement according to the invention
  • Figure 5 shows an embodiment of the circuit arrangement according to the invention with a two turns coil
  • Figure 6 shows another embodiment of the circuit arrangement according to the invention with a coil having two turns.
  • FIG. 1 shows a first embodiment of the monolithically integrable circuit arrangement 100 according to the invention, which has a first circuit component designed as a differentially fed coil.
  • the coil is essentially formed by a conductor loop HOa, which is subdivided into limbs HOa ', HOa "which are symmetrical to each other, and the coil also has connections li la', li la", at which it is supplied with a differential signal.
  • the differential supply of the coil takes place in the present example by an active components having further circuit component 121, which is connected to the terminals purple ', l ila "of the coil in each case via unspecified connection lines.
  • the circuit arrangement 100 according to the invention has yet another
  • Circuit component 120 which preferably passive components, in particular capacitive components, has, and which is connected via corresponding leads 112a ', 1 12a "also to the terminals l la', l la la" of the coil.
  • the circuit depicted in FIG. 1 may be, for example, a voltage-controlled oscillator (VCO), in which the coil according to the invention together with the capacitive components of the further circuit component 120 form a tank circuit which is energized by the active components of the further circuit component 121 is supplied.
  • VCO voltage-controlled oscillator
  • the active components of the further circuit component 121 are accordingly applied to the control line 121a by a control circuit, not shown, with control signals.
  • Conductor loop HOa of the coil according to the invention enables the construction of the circuit arrangement 100 with a minimum area requirement.
  • the further circuit component 120 and a control line 120a assigned to it are preferably arranged along an axis of symmetry (not shown) extending between the two legs HOa ', 110a "of the coil, because in an operation of the circuit arrangement 100 depicted in FIG
  • the control line 120a extends in the present example directly on the axis of symmetry.
  • the capacitive components of the further circuit component 120 according to FIG. 1 are embodied, for example, as a configurable capacitor matrix which can be interconnected in various ways as a function of a control signal supplied by the control line 120a and thus enable tuning of the resonant frequency of the tank circuit formed by the coil and the capacitive components ,
  • the inventive arrangement of the further circuit component 120 in the Inner portion 115 of the coil results furthermore very advantageous particularly low length for lines 112a 1, 112a ", which the coil or their connections li la 1, purple” connect to the capacitors of the additional circuit component 120, which in comparison to conventional circuitry relatively low resistive losses occur in the leads 112a ', 112a ".
  • circuit 100 as a whole has a lower noise level than conventional longer lead circuits.
  • the inventively reduced area consumption and the concomitant smaller cross-sectional area of the circuit arrangement 100 furthermore result in a very advantageous increased interference immunity of the circuit arrangement 100.
  • FIG. 2 A further advantageous embodiment of the present invention is shown in FIG.
  • the coil of the embodiment depicted in FIG. 2 has a circular conductor loop HOa instead of an octagonal conductor loop.
  • the coil of the circuit arrangement 100 according to the invention can also Have conductor loops with any other shapes, with a symmetrical design of the coil is preferred, however, to obtain in the inner region 115 as low as possible magnetic field strength.
  • FIG. 3 shows the arrangement according to the invention of a plurality of capacitive elements designed as capacitors 130 and the arrangement of the active components designed as transistors 140 in the region of the supply lines 112a ', 112a "or in the region of the terminals of the coil.
  • capacitors 130 with different sized capacitances it is particularly advantageous to arrange those capacitors with the largest capacitance in the vicinity of the active components 140, and those capacitors with smaller ones
  • the inner region 115 of the coil in addition from a screen device Ab 150 arranged, which ensures a high field freedom of the area surrounded by 115 of the interior.
  • the shielding device 150 may, for example, be connected to a ground potential of the circuit arrangement 100.
  • FIGS. 5 and 6 each show a circuit arrangement 100 with a coil having two windings, capacitive elements 130 or one or more control lines 120a being provided in turn in an inner region 115 of the two conductor loops 110a, HOb.
  • the configurable capacitor matrix consisting of capacitors 130 is connected to the inner conductor loop HOb of the coil, while the transistors 140 are still arranged in a terminal region of the coil.
  • Such an arrangement of the capacitors 130 allows complex influencing of the electrical properties of the coil, in particular for balancing the coil inductance when using the circuit 100 according to the invention in an LC resonant circuit or the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

Abstract

The invention relates to a monolithically integrable circuit arrangement (100) comprising a first circuit component formed as a differentially fed coil and having at least one conductor loop (110a, 110b) reaching around an inner region (115) and comprising at least one further circuit component (120, 121). According to the invention, the further circuit component (120, 121) of the circuit arrangement (100) is arranged in the inner region (115).

Description

00
55
υυ
Titel: Monolithisch integrierbare Schaltungsanordnung 5Title: Monolithically Integrated Circuit 5
Beschreibungdescription
Die vorliegende Erfindung betrifft eine monolithisch integrierbare Schaltungsanordnung mit einer als differentiell gespeiste Spule ausgebildeten ersten Schaltungskomponente, die mindestens eine einen Innenbereich umgreifende Leiterschleife aufweist, und mit mindestens einer weiteren Schaltungskomponente.The present invention relates to a monolithically integrable circuit arrangement having a first circuit component embodied as a differentially fed coil, which has at least one conductor loop enclosing an inner region, and having at least one further circuit component.
Derartige Schaltungsanordnungen sind bekannt und werden beispielsweise zum Aufbau von Tankkreisen für spannungsgesteuerte Oszillatoren (VCO, voltage controlled oscillator) und sonstigen Schaltungen, die induktive Bauelemente erfordern, eingesetzt.Such circuits are known and are used, for example, to build tank circuits for voltage controlled oscillators (VCO, voltage controlled oscillator) and other circuits that require inductive components.
Ein besonderer Nachteil solcher Schaltungsanordnungen besteht in der schlechten Integrierbarkeit von Spulen in monolithisch integrierte Schaltungen, insbesondere aufgrund des verhältnismäßig großen Flächenbedarfs der Spule selbst sowie der zu benachbarten Schaltungskomponenten einzuhaltenden Mindestabstände, insbesondere um elektromagnetische Wechselwirkungen gering zu halten und damit Störungen zu vermeiden.A particular disadvantage of such circuit arrangements is the poor integration of coils in monolithic integrated circuits, in particular due to the relatively large space requirement of the coil itself and the minimum distances to be adhered to adjacent circuit components, in particular in order to keep electromagnetic interactions low and thus to avoid interference.
Demgemäß ist es Aufgabe der vorliegenden Erfindung, eine Schaltungsanordnung der eingangs genannten Art hinsichtlich ihres Flächenbedarfs zu verbessern.Accordingly, it is an object of the present invention to improve a circuit arrangement of the type mentioned in terms of their space requirements.
Diese Aufgabe wird bei der eingangs beschriebenen Schaltungsanordnung erfindungsgemäß dadurch gelöst, dass die weitere Schaltungskomponente der Schaltungsanordnung in dem Innenbereich angeordnet ist.This object is achieved according to the invention in the circuit arrangement described above in that the further circuit component of the circuit arrangement is arranged in the inner region.
Durch die erfϊndungsgemäße Anordnung mindestens einer weiteren Schaltungskomponente der erfindungsgemäßen Schaltungsanordnung in dem Innenbereich der Spule wird vorteilhaft ein Flächenbedarf der gesamten Schaltungsanordnung reduziert. Entsprechende Zuleitungen bzw. Verbindungsleitungen zwischen der Spule und der in dem Innenbereich angeordneten weiteren Schaltungskomponente können ferner besonders kurz ausgelegt werden, so dass durch Zuleitungen üblicherweise bedingte parasitäre Effekte wie ohmsche Verluste bzw. kapazitive Effekte reduziert werden.By means of the arrangement according to the invention of at least one further circuit component of the circuit arrangement according to the invention in the inner region of the coil, an area requirement of the entire circuit arrangement is advantageously reduced. Corresponding supply lines or connecting lines between the coil and the further circuit component arranged in the inner region can furthermore be designed to be particularly short, so that parasitic effects normally caused by supply lines, such as ohmic losses or capacitive effects, are reduced.
Untersuchungen der Anmelderin haben ergeben, dass sich bei einer differentiellen Speisung der Spule das resultierende Magnetfeld im Inneren der Spule hauptsächlich um einen die Leiterschleife bildenden Leiter konzentriert und zu dem Inneren der Spule hin stark abnimmt, so dass dieser Innenbereich zur Anordnung von weiteren Schaltungskomponenten verwendet werden kann, ohne einen Betrieb der Spule zu stören bzw. ohne von dem Magnetfeld der Spule beeinträchtigt zu werden.Investigations by the Applicant have shown that in a differential feeding of the coil, the resulting magnetic field inside the coil mainly concentrates around a conductor loop forming conductor and greatly decreases toward the interior of the coil, so that this inner area are used for the arrangement of other circuit components can without disturbing an operation of the coil or without being affected by the magnetic field of the coil.
Bei einer besonders vorteilhaften Ausführungsform der vorliegenden Erfindung weist die weitere Schaltungskomponente ein oder mehrere passive Bauelemente, insbesondere kapazitive Bauelemente auf. Die erfindungsgemäße Anordnung kapazitiver Bauelemente im Innenbereich der Spule ermöglicht vorteilhaft den Aufbau von monolithisch integrierten LC- Kombinationen, wie sie häufig in Schwingkreisen, Filtern und weiteren Schaltungen benötigt werden. Der gesamte Flächenbedarf der erfindungsgemäßen LC-Kombinationen ist deutlich geringer als der herkömmlicher Schaltungsanordnungen, bei denen die kapazitiven Bauelemente nicht in dem Innenbereich der Spule angeordnet sind sondern außerhalb der Spule. Gleichzeitig ergeben sich aufgrund der erfindungsgemäß verringerten Zuleitungslänge weitere Vorteile wie z.B. eine verbesserte Güte aufgrund geringerer ohmscher Verluste und eine erhöhte Genauigkeit hinsichtlich einer Resonanzfrequenz aufgrund geringerer parasitärer Kapazitäten bei den Zuleitungen.In a particularly advantageous embodiment of the present invention, the further circuit component has one or more passive components, in particular capacitive components. The inventive arrangement of capacitive components in the interior of the coil advantageously allows the construction of monolithically integrated LC combinations, as they are often required in resonant circuits, filters and other circuits. The total space requirement of the LC combinations according to the invention is clear less than the conventional circuit arrangements in which the capacitive components are not arranged in the inner region of the coil but outside the coil. At the same time, due to the supply line length reduced according to the invention, further advantages such as improved quality due to lower ohmic losses and increased accuracy with regard to a resonant frequency due to lower parasitic capacitances in the supply lines result.
Besonders vorteilhaft sind die kapazitiven Bauelemente bei einer weiteren Ausführungsform der vorliegenden Erfindung als konfigurierbare Kondensatormatrix (CDAC) ausgebildet, bei der mehrere einzelne Kondensatoren in unterschiedlicher Weise miteinander verschaltbar sind und somit die Einstellung verschiedener resultierender Ersatzkapazitäten ermöglichen. Eine Ausbildung der kapazitiven Bauelemente als Kapazitätsdiode ist ebenfalls möglich. Ferner kann die weitere Schaltungskomponente erfindungsgemäß auch eine Kombination eines oder mehrerer Kondensatoren und einer Kapazitätsdiode aufweisen.In a further embodiment of the present invention, the capacitive components are particularly advantageously designed as a configurable capacitor matrix (CDAC) in which a plurality of individual capacitors can be connected to one another in different ways and thus enable the setting of different resulting replacement capacitances. An embodiment of the capacitive components as a capacitance diode is also possible. Furthermore, the further circuit component according to the invention may also have a combination of one or more capacitors and a capacitance diode.
Darüberhinaus ist es bei der erfindungsgemäßen Schaltungsanordnung auch denkbar, resistive Bauelemente wie z.B. Ohmwiderstände in dem Innenbereich der Spule anzuordnen.Moreover, it is also conceivable in the circuit arrangement according to the invention, resistive components such. To arrange ohmic resistors in the interior of the coil.
Sehr vorteilhaft können gemäß einer weiteren Ausführungsform der vorliegenden Erfindung auch aktive Bauelemente, insbesondere Transistoren, in der weiteren Schaltungskomponente vorgesehen sein, die erfindungsgemäß in dem Innenbereich der Spule angeordnet ist.According to a further embodiment of the present invention, active components, in particular transistors, can be very advantageously provided in the further circuit component, which according to the invention is arranged in the inner region of the coil.
Bei einer weiteren sehr vorteilhaften Ausführungsform der vorliegenden Erfindung sind verschiedene Leiterabschnitte der Spule, insbesondere verschiedene Leiterschleifen der Spule, in unterschiedlichen Metallisierungsebenen eines die Schaltungsanordnung aufnehmenden Substrats angeordnet. Insbesondere bei einer Ausbildung der Spule als Mehrwindungsspule ist die Verwendung unterschiedlicher Metallisierungsebenen sehr zweckmäßig, weil auf diese Weise der Flächenbedarf der Spule gering gehalten werden kann.In a further very advantageous embodiment of the present invention, different conductor sections of the coil, in particular different conductor loops of the coil, are arranged in different metallization planes of a substrate receiving the circuit arrangement. Particularly when the coil is designed as a multi-turn coil, the use of different metallization levels is very expedient, because in this way the area requirement of the coil can be kept low.
Eine andere vorteilhafte Ausführungsform der vorliegenden Erfindung ist dadurch gekennzeichnet, dass in dem Innenbereich der Leiterschleife eine Abschirmvorrichtung angeordnet ist, die sich zumindest teilweise zwischen mindestens einer Leiterschleife der Spule und der weiteren Schaltungskomponente erstreckt. Die Abschirmvorrichtung dient zur weiteren Reduzierung der elektrischen bzw. magnetischen Feldstärke in dem Innenbereich der Spule und kann beispielsweise mit einem Massepotential der erfindungsgemäßen Schaltungsanordnung verbunden werden.Another advantageous embodiment of the present invention is characterized in that in the inner region of the conductor loop, a shielding device is arranged, which at least partially between at least one conductor loop of Coil and the other circuit component extends. The shielding device serves to further reduce the electrical or magnetic field strength in the inner region of the coil and can be connected, for example, to a ground potential of the circuit arrangement according to the invention.
Eine andere sehr vorteilhafte Ausführungsform der vorliegenden Erfindung ist dadurch gekennzeichnet, dass die Spule mindestens ein Paar jeweils zueinander symmetrischer Schenkel aufweist. Ein derartiger symmetrischer Aufbau der Spule gewährleistet in Verbindung mit der differentiellen Speisung der Spule besonders geringe magnetische Feldstärken in dem Innenbereich der Spule.Another very advantageous embodiment of the present invention is characterized in that the coil has at least one pair of mutually symmetrical legs. Such a symmetrical construction of the coil, in conjunction with the differential supply of the coil, ensures particularly low magnetic field strengths in the interior region of the coil.
Besonders vorteilhaft ist bei einer weiteren erfindungsgemäßen Ausführungsform vorgesehen, dass die weitere Schaltungskomponente und/oder der weiteren Schaltungskomponente zugeordnete Steuerleitungen im Bereich einer zwischen den Schenkeln verlaufenden Symmetrieachse der Spule angeordnet sind. Die Anordnung der vorstehend genannten Komponenten im Bereich der Symmetrieachse gewährleistet eine minimale elektromagnetische Wechselwirkung zwischen dem Magnetfeld der Spule und den in deren Innenbereich angeordneten Komponenten.In a further embodiment according to the invention, it is particularly advantageous for the further circuit components and / or the further circuit components to be assigned to control lines in the region of an axis of symmetry of the coil running between the legs. The arrangement of the above-mentioned components in the region of the axis of symmetry ensures a minimum electromagnetic interaction between the magnetic field of the coil and the components arranged in its inner region.
Auch sich außerhalb der Spule entlang der Symmetrieachse erstreckende Bereiche weisen eine besonders geringe magnetische Feldstärke auf, so dass auch in diesen Bereichen Schaltungskomponenten, Steuerleitungen und dergleichen vorteilhaft angeordnet werden können.Also, outside the coil along the axis of symmetry extending areas have a particularly low magnetic field strength, so that even in these areas circuit components, control lines and the like can be arranged advantageously.
Als eine weitere Lösung der Aufgabe der vorliegenden Erfindung ist eine monolithisch integrierte Schaltung mit mindestens einer erfindungsgemäßen Schaltungsanordnung angegeben.As a further solution of the object of the present invention, a monolithic integrated circuit is provided with at least one circuit arrangement according to the invention.
Eine besonders vorteilhafte Ausführungsform der erfindungsgemäßen Schaltung ist durch mindestens zwei Metallisierungsebenen gekennzeichnet.A particularly advantageous embodiment of the circuit according to the invention is characterized by at least two Metallisierungsebenen.
Weitere Vorteile, Merkmale und Einzelheiten ergeben sich aus der nachfolgenden Beschreibung, in der unter Bezugnahme auf die Zeichnung verschiedene Ausführungsbeispiele der Erfindung dargestellt sind. Dabei können die in den Ansprüchen und in der Beschreibung erwähnten Merkmale jeweils einzeln für sich oder in beliebiger Kombination erfindungswesentlich sein.Further advantages, features and details emerge from the following Description in which, with reference to the drawing, various embodiments of the invention are shown. The features mentioned in the claims and in the description may each be essential to the invention individually or in any desired combination.
In der Zeichnung zeigt:In the drawing shows:
Figur 1 eine erste Ausführungsform der erfindungsgemäßen Schaltungsanordnung inFigure 1 shows a first embodiment of the circuit arrangement according to the invention in
Draufsicht,Top view,
Figur 2 eine zweite Ausführungsform der erfindungsgemäßen Schaltungsanordnung,FIG. 2 shows a second embodiment of the circuit arrangement according to the invention,
Figur 3 eine dritte Ausführungsform der erfindungsgemäßen Schaltungsanordnung,FIG. 3 shows a third embodiment of the circuit arrangement according to the invention,
Figur 4 eine vierte Ausführungsform der erfmdungsgemäßen Schaltungsanordnung,4 shows a fourth embodiment of the inventive circuit arrangement,
Figur 5 eine Ausführungsform der erfindungsgemäßen Schaltungsanordnung mit einer zwei Windungen aufweisenden Spule, undFigure 5 shows an embodiment of the circuit arrangement according to the invention with a two turns coil, and
Figur 6 eine weitere Ausführungsform der erfindungsgemäßen Schaltungsanordnung mit einer zwei Windungen aufweisenden Spule.Figure 6 shows another embodiment of the circuit arrangement according to the invention with a coil having two turns.
Figur 1 zeigt eine erste Ausfuhrungsform der erfindungsgemäßen monolithisch integrierbaren Schaltungsanordnung 100, die eine als differentiell gespeiste Spule ausgebildete erste Schaltungskomponente aufweist. Die Spule ist im wesentlichen durch eine Leiterschleife HOa gebildet, die in zueinander symmetrische Schenkel HOa', HOa" unterteilt ist. Ferner weist die Spule Anschlüsse li la', li la" auf, an denen sie mit einem differentiellen Signal gespeist wird.FIG. 1 shows a first embodiment of the monolithically integrable circuit arrangement 100 according to the invention, which has a first circuit component designed as a differentially fed coil. The coil is essentially formed by a conductor loop HOa, which is subdivided into limbs HOa ', HOa "which are symmetrical to each other, and the coil also has connections li la', li la", at which it is supplied with a differential signal.
Die differentielle Speisung der Spule erfolgt in dem vorliegenden Beispiel durch eine aktive Bauelemente aufweisende weitere Schaltungskomponente 121, die mit den Anschlüssen lila', l ila" der Spule jeweils über nicht näher bezeichnete Verbindungsleitungen verbunden ist. Darüberhinaus weist die erfindungsgemäße Schaltungsanordnung 100 noch eine weitereThe differential supply of the coil takes place in the present example by an active components having further circuit component 121, which is connected to the terminals purple ', l ila "of the coil in each case via unspecified connection lines. In addition, the circuit arrangement 100 according to the invention has yet another
Schaltungskomponente 120 auf, die vorzugsweise passive Bauelemente, insbesondere kapazitive Bauelemente, aufweist, und die über entsprechende Zuleitungen 112a', 1 12a" ebenfalls mit den Anschlüssen l i la', l i la" der Spule verbunden ist.Circuit component 120, which preferably passive components, in particular capacitive components, has, and which is connected via corresponding leads 112a ', 1 12a "also to the terminals l la', l la la" of the coil.
Bei der in Figur 1 abgebildeten Schaltung kann es sich bspw. um einen spannungsgesteuerten Oszillator (VCO) handeln, bei dem die erfindungsgemäße Spule zusammen mit den kapazitiven Bauelementen der weiteren Schaltungskomponente 120 einen Tankkreis ausbildet, der durch die aktiven Bauelemente der weiteren Schaltungskomponente 121 mit Energie versorgt wird. Die aktiven Bauelemente der weiteren Schaltungskomponente 121 werden dementsprechend über die Steuerleitung 121a von einer nicht abgebildeten Ansteuerschaltung mit Steuersignalen beaufschlagt.The circuit depicted in FIG. 1 may be, for example, a voltage-controlled oscillator (VCO), in which the coil according to the invention together with the capacitive components of the further circuit component 120 form a tank circuit which is energized by the active components of the further circuit component 121 is supplied. The active components of the further circuit component 121 are accordingly applied to the control line 121a by a control circuit, not shown, with control signals.
Die erfindungsgemäße Anordnung der weiteren Komponenten 120, 121 in einem bei herkömmlichen Schaltungsanordnungen unbenutzten Innenbereich 115 innerhalb derThe arrangement according to the invention of the further components 120, 121 in an interior region 115, which is unused in conventional circuit arrangements, within the
Leiterschleife HOa der erfindungsgemäßen Spule ermöglicht den Aufbau der Schaltungsanordnung 100 mit einem minimalen Flächenbedarf.Conductor loop HOa of the coil according to the invention enables the construction of the circuit arrangement 100 with a minimum area requirement.
Bevorzugt wird die weitere Schaltungskomponente 120 sowie eine ihr zugeordnete Steuerleitung 120a entlang einer zwischen den beiden Schenkeln HOa', 110a" der Spule verlaufenden Symmetrieachse (nicht gezeigt) angeordnet, weil sich bei einem Betrieb der in Figur 1 abgebildeten Schaltungsanordnung 100 in diesem Bereich besonders geringe magnetische Feldstärken ergeben. Die Steuerleitung 120a erstreckt sich in dem vorliegenden Beispiel direkt auf der Symmetrieachse.The further circuit component 120 and a control line 120a assigned to it are preferably arranged along an axis of symmetry (not shown) extending between the two legs HOa ', 110a "of the coil, because in an operation of the circuit arrangement 100 depicted in FIG The control line 120a extends in the present example directly on the axis of symmetry.
Die kapazitiven Bauelemente der weiteren Schaltungskomponente 120 gemäß Figur 1 sind beispielsweise als konfigurierbare Kondensatormatrix ausgebildet, die in Abhängigkeit eines mittels der Steuerleitung 120a zugeführten Steuersignals in verschiedener Weise miteinander verschaltbar sind und damit eine Abstimmung der Resonanzfrequenz des durch die Spule und die kapazitiven Bauelemente gebildeten Tankkreises ermöglichen.The capacitive components of the further circuit component 120 according to FIG. 1 are embodied, for example, as a configurable capacitor matrix which can be interconnected in various ways as a function of a control signal supplied by the control line 120a and thus enable tuning of the resonant frequency of the tank circuit formed by the coil and the capacitive components ,
Durch die erfindungsgemäße Anordnung der weiteren Schaltungskomponente 120 in dem Innenbereich 115 der Spule ergibt sich femer sehr vorteilhaft eine besonders geringe Länge für die Zuleitungen 112a1, 112a", die die Spule beziehungsweise deren Anschlüsse l i la1, lila" mit den kapazitiven Bauelementen der weiteren Schaltungskomponente 120 verbinden, wodurch im Vergleich zu herkömmlichen Schaltungsanordnungen verhältnismäßig geringe ohmsche Verluste in den Zuleitungen 112a', 112a" auftreten.The inventive arrangement of the further circuit component 120 in the Inner portion 115 of the coil results furthermore very advantageous particularly low length for lines 112a 1, 112a ", which the coil or their connections li la 1, purple" connect to the capacitors of the additional circuit component 120, which in comparison to conventional circuitry relatively low resistive losses occur in the leads 112a ', 112a ".
Eine derartige Reduktion der ohmschen Verluste in den Zuleitungen 112a', 112a" ist insbesondere bei der Ausbildung der Schaltungsanordnung als LC-Schwingkreis sehr zweckmäßig, da im Resonanzfall besonders große Ströme durch die betreffenden Bauelemente und die sie verbindenden Zuleitungen 112a', 112a" fließen. Bei herkömmlichen Schaltungsanordnungen mit außerhalb der Spule angeordneten Kapazitäten ergeben sich aufgrund der größeren Länge entsprechender Zuleitungen verhältnismäßig große ohmsche Verluste und damit eine geringe Schwingkreisgüte.Such a reduction of the ohmic losses in the supply lines 112a ', 112a "is particularly useful in the design of the circuit arrangement as an LC resonant circuit, since in the case of resonance particularly large currents flow through the relevant components and the supply lines 112a', 112a" connecting them. In conventional circuit arrangements with capacitors arranged outside the coil, relatively large ohmic losses and thus a low resonant circuit quality result due to the greater length of corresponding leads.
Dementsprechend ergibt sich bei der erfmdungsgemäßen Schaltungsanordnung 100 bzw. bei einem hierdurch realisierten LC-Schwingkreis aufgrund der geringe Länge für die Zuleitungen 112a', 112a" eine besonders hohe Schwingkreisgüte.Accordingly, in the case of the circuit arrangement 100 according to the invention or in the case of an LC resonant circuit realized thereby, a particularly high resonant circuit quality results for the supply lines 112a ', 112a "due to the short length.
Ein weiterer vorteilhafter Effekt, der sich durch die verringerte Zuleitungslänge ergibt, besteht darin, dass die Schaltungsanordnung 100 insgesamt ein niedrigeres Rauschniveau aufweist als herkömmliche Schaltungsanordnungen mit längeren Zuleitungen.Another beneficial effect resulting from the reduced lead length is that the circuit 100 as a whole has a lower noise level than conventional longer lead circuits.
Durch den erfindungsgemäß verringerten Flächenverbrauch und die damit einhergehende geringere Querschnittsfläche der Schaltungsanordnung 100 ergibt sich ferner sehr vorteilhaft eine gesteigerte Störsicherheit der Schaltungsanordnung 100.The inventively reduced area consumption and the concomitant smaller cross-sectional area of the circuit arrangement 100 furthermore result in a very advantageous increased interference immunity of the circuit arrangement 100.
Eine weitere vorteilhafte Ausführungsform der vorliegenden Erfindung ist in Figur 2 abgebildet. Im Unterschied zu der Ausführungsform gemäß Figur 1 weist die Spule der in Figur 2 abgebildeten Ausführungsform eine kreisförmig ausgebildete Leiterschleife HOa anstelle einer achteckigen Leiterschleife auf.A further advantageous embodiment of the present invention is shown in FIG. In contrast to the embodiment according to FIG. 1, the coil of the embodiment depicted in FIG. 2 has a circular conductor loop HOa instead of an octagonal conductor loop.
Prinzipiell kann die Spule der erfindungsgemäßen Schaltungsanordnung 100 auch Leiterschleifen mit beliebigen anderen Formen aufweisen, wobei eine symmetrische Ausbildung der Spule jedoch bevorzugt ist, um in dem Innenbereich 115 eine möglichst geringe magnetische Feldstärke zu erhalten.In principle, the coil of the circuit arrangement 100 according to the invention can also Have conductor loops with any other shapes, with a symmetrical design of the coil is preferred, however, to obtain in the inner region 115 as low as possible magnetic field strength.
Noch eine weitere vorteilhafte Ausführungsform der vorliegenden Erfindung ist in Figur 3 abgebildet. Die Schaltungsanordnung 100 gemäß Figur 3 zeigt die erfindungsgemäße Anordnung einer Mehrzahl von als Kondensatoren 130 ausgebildeten kapazitiven Elementen sowie die Anordnung der als Transistoren 140 ausgebildeten aktiven Bauelemente im Bereich der Zuleitungen 112a' , 112a' ' bzw. im Bereich der Anschlüsse der Spule.Yet another advantageous embodiment of the present invention is shown in FIG. The circuit arrangement 100 according to FIG. 3 shows the arrangement according to the invention of a plurality of capacitive elements designed as capacitors 130 and the arrangement of the active components designed as transistors 140 in the region of the supply lines 112a ', 112a "or in the region of the terminals of the coil.
Bei der Verwendung von Kondensatoren 130 mit unterschiedlich großen Kapazitäten ist es besonders vorteilhaft, diejenigen Kondensatoren mit der größten Kapazität in der Nähe der aktiven Bauelemente 140 anzuordnen, und diejenigen Kondensatoren mit geringererWhen using capacitors 130 with different sized capacitances, it is particularly advantageous to arrange those capacitors with the largest capacitance in the vicinity of the active components 140, and those capacitors with smaller ones
Kapazität an dem von den aktiven Bauelementen 140 abgewandten Ende der ZuleitungenCapacity at the end remote from the active components 140 of the supply lines
112a', 112a" anzuordnen. Dadurch wird vermieden, dass auch die in Figur 3 oben liegenden112a ', 112a ", thereby avoiding that also in FIG
Enden der Zuleitungen 112a', 112a" unnötig von insbesondere in einem Resonanzbetrieb großen Strömen durchflössen werden und somit entsprechende ohmsche Verluste entstehen.Ends of the leads 112a ', 112a "are unnecessarily flowed through by large currents, in particular in a resonance mode, and thus corresponding ohmic losses occur.
Bei einer anderen sehr vorteilhaften Ausführungsform der vorliegenden Erfindung, die schematisch in Figur 4 abgebildet ist, ist in dem Innenbereich 115 der Spule zusätzlich eine Ab schirm Vorrichtung 150 angeordnet, die eine weitgehende Feldfreiheit des von ihr umgebenen Bereichs des Inneren 115 gewährleistet. Die Abschirm Vorrichtung 150 kann beispielsweise mit einem Massepotential der Schaltungsanordnung 100 verbunden sein.In another very advantageous embodiment of the present invention, which is shown schematically in Figure 4, in the inner region 115 of the coil in addition from a screen device Ab 150 arranged, which ensures a high field freedom of the area surrounded by 115 of the interior. The shielding device 150 may, for example, be connected to a ground potential of the circuit arrangement 100.
In den Figuren 5 und 6 ist jeweils eine Schaltungsanordnung 100 mit einer zwei Windungen aufweisenden Spule abgebildet, wobei in einem Innenbereich 115 der beiden Leiterschleifen 110a, HOb wiederum kapazitive Elemente 130 bzw. eine oder mehrere Steuerleitungen 120a vorgesehen sind.FIGS. 5 and 6 each show a circuit arrangement 100 with a coil having two windings, capacitive elements 130 or one or more control lines 120a being provided in turn in an inner region 115 of the two conductor loops 110a, HOb.
Im Unterschied zu der in Figur 5 abgebildeten Konfiguration ist bei der in Figur 6 abgebildeten Schaltungsanordnung 100 die aus Kondensatoren 130 bestehende konfigurierbare Kondensatormatrix mit der inneren Leiterschleife HOb der Spule verbunden, während die Transistoren 140 nach wie vor in einem Anschlussbereich der Spule angeordnet sind.In contrast to the configuration depicted in FIG. 5, in the case of the circuit arrangement 100 shown in FIG. 6, the configurable capacitor matrix consisting of capacitors 130 is connected to the inner conductor loop HOb of the coil, while the transistors 140 are still arranged in a terminal region of the coil.
Eine derartige Anordnung der Kondensatoren 130 ermöglicht eine komplexe Beeinflussung der elektrischen Eigenschaften der Spule, insbesondere zu einem Abgleich der Spuleninduktivität bei einer Verwendung der erfindungsgemäßen Schaltung 100 in einem LC-Schwingkreis oder dergleichen.Such an arrangement of the capacitors 130 allows complex influencing of the electrical properties of the coil, in particular for balancing the coil inductance when using the circuit 100 according to the invention in an LC resonant circuit or the like.
Ebenso ist es möglich, die Transistoren 140 mit der inneren Leiterschleife HOb der Spule zu verbinden und die Kondensatoren 130 in dem Anschlussbereich der Spule, d. h. bei den Anschlüssen der äußeren Leiterschleife 110a vorzusehen.It is also possible to connect the transistors 140 to the inner conductor loop HOb of the coil and to connect the capacitors 130 in the terminal region of the coil, i. H. to provide at the terminals of the outer conductor loop 110a.
Weitere Ausführungsformen der vorliegenden Erfindung, insbesondere mit einer mehr als zwei Windungen aufweisenden Spule, sind ebenfalls denkbar, wobei derartige Konfigurationen besonders vorteilhaft in einer monolithisch integrierten Schaltung realisiert werden, die über mehrere Metallisierungsebenen verfügt. Further embodiments of the present invention, in particular with a coil having more than two turns, are also conceivable, such configurations being realized particularly advantageously in a monolithic integrated circuit having a plurality of metallization levels.

Claims

Patentansprüche claims
1. Monolithisch integrierbare Schaltungsanordnung (100) mit einer als differentiell gespeiste Spule ausgebildeten ersten Schaltungskomponente, die mindestens eine einen Innenbereich (115) umgreifende Leiterschleife (110a, 110b) aufweist, und mit mindestens einer weiteren Schaltungskomponente (120, 121), dadurch gekennzeichnet, dass die weitere Schaltungskomponente (120, 121) der Schaltungsanordnung (100) in dem Innenbereich (115) angeordnet ist.1. Monolithically integrable circuit arrangement (100) with a first circuit component designed as a differentially fed coil, which has at least one inner region (115) encompassing conductor loop (110a, 110b), and with at least one further circuit component (120, 121), characterized in that the further circuit component (120, 121) of the circuit arrangement (100) is arranged in the inner region (115).
2. Schaltungsanordnung (100) nach Anspruch 1, dadurch gekennzeichnet, dass die weitere Schaltungskomponente (120) ein oder mehrere passive Bauelemente aufweist, insbesondere kapazitive Bauelemente (130).2. Circuit arrangement (100) according to claim 1, characterized in that the further circuit component (120) has one or more passive components, in particular capacitive components (130).
3. Schaltungsanordnung (100) nach Anspruch 2, dadurch gekennzeichnet, dass die kapazitiven Bauelemente (130) als konfigurierbare Kondensatormatrix und/oder als Kapazitätsdiode ausgebildet sind.3. Circuit arrangement (100) according to claim 2, characterized in that the capacitive components (130) are designed as a configurable capacitor matrix and / or as a capacitance diode.
4. Schaltungsanordnung (100) nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die weitere Schaltungskomponente (121) ein oder mehrere aktive Bauelemente aufweist, insbesondere Transistoren (140).4. The circuit arrangement according to claim 1, wherein the further circuit component has one or more active components, in particular transistors.
5. Schaltungsanordnung (100) nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass verschiedene Leiterabschnitte der Spule, insbesondere verschiedene Leiterschleifen (110a, 110b) der Spule, in unterschiedlichen Metallisierungsebenen eines die Schaltungsanordnung (100) aufnehmenden Substrats angeordnet sind.5. Circuit arrangement (100) according to one of the preceding claims, characterized in that different conductor sections of the coil, in particular different conductor loops (110a, 110b) of the coil, are arranged in different metallization levels of a circuit arrangement (100) receiving substrate.
6. Schaltungsanordnung (100) nach einem der vorstehenden Ansprüche, gekennzeichnet durch eine in dem Innenbereich (1 15) der Leiterschleife (110a, 110b) angeordnete6. Circuit arrangement (100) according to any one of the preceding claims, characterized by a in the inner region (1 15) of the conductor loop (110 a, 110 b) arranged
Abschirmvorrichtung (150), die sich zumindest teilweise zwischen mindestens einer Leiterschleife (110a, 110b) der Spule und der weiteren Schaltungskomponente (120, 121) erstreckt. i lShielding device (150) extending at least partially between at least one conductor loop (110a, 110b) of the coil and the further circuit component (120, 121). il
7. Schaltungsanordnung (100) nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, dass die Spule mindestens ein Paar jeweils zueinander symmetrischer Schenkel (HOaM lOa") aufweist.7. Circuit arrangement (100) according to any one of the preceding claims, characterized in that the coil has at least one pair of mutually symmetrical legs (HOaM lOa ").
8. Schaltungsanordnung (100) nach Anspruch 7, dadurch gekennzeichnet, dass die weitere Schaltungskomponente (120, 121) und/oder der weiteren8. Circuit arrangement (100) according to claim 7, characterized in that the further circuit component (120, 121) and / or the other
Schaltungskomponente (120, 121) zugeordnete Steuerleitungen (120a, 121a) im Bereich einer zwischen den Schenkeln (HOa', 110a") verlaufenden Symmetrieachse der Spule angeordnet sind.Circuit components (120, 121) associated control lines (120a, 121a) in the region of between the legs (HOa ', 110a ") extending symmetry axis of the coil are arranged.
9. Monolithisch integrierte Schaltung mit mindestens einer Schaltungsanordnung (100) nach einem der vorstehenden Ansprüche.9. Monolithically integrated circuit having at least one circuit arrangement (100) according to one of the preceding claims.
10. Schaltung nach Anspruch 9, gekennzeichnet durch mindestens zwei Metallisierungsebenen. 10. A circuit according to claim 9, characterized by at least two metallization levels.
EP06806279A 2005-10-21 2006-10-14 Monolithically integrable circuit arrangement Withdrawn EP1938377A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005050484A DE102005050484B4 (en) 2005-10-21 2005-10-21 Monolithically integrated circuit arrangement
PCT/EP2006/009937 WO2007045409A1 (en) 2005-10-21 2006-10-14 Monolithically integrable circuit arrangement

Publications (1)

Publication Number Publication Date
EP1938377A1 true EP1938377A1 (en) 2008-07-02

Family

ID=37575233

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06806279A Withdrawn EP1938377A1 (en) 2005-10-21 2006-10-14 Monolithically integrable circuit arrangement

Country Status (5)

Country Link
US (1) US20080245543A1 (en)
EP (1) EP1938377A1 (en)
CN (1) CN101317269B (en)
DE (1) DE102005050484B4 (en)
WO (1) WO2007045409A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8068003B2 (en) * 2010-03-10 2011-11-29 Altera Corporation Integrated circuits with series-connected inductors
US8643461B2 (en) * 2011-04-28 2014-02-04 Globalfoundries Singapore Pte. Ltd. Integrated transformer
DE102013010695B4 (en) 2013-02-11 2022-09-29 Sew-Eurodrive Gmbh & Co Kg Device with a winding arrangement and arrangement, in particular a charging station, for contactless energy transmission to an electric vehicle, with a winding arrangement
JP5719000B2 (en) * 2013-09-17 2015-05-13 学校法人慶應義塾 Integrated circuit device
GB2562043B (en) * 2017-04-28 2020-04-29 Drayson Tech Europe Ltd Loop RF Power Harvester
US11152150B2 (en) * 2018-05-09 2021-10-19 Realtek Semiconductor Corp. LC tank circuit having improved resonant frequency stability and fabrication method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5541442A (en) * 1994-08-31 1996-07-30 International Business Machines Corporation Integrated compact capacitor-resistor/inductor configuration
US5793272A (en) * 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
EP0862214A1 (en) * 1997-02-28 1998-09-02 TELEFONAKTIEBOLAGET L M ERICSSON (publ) An integrated circuit having a planar inductor
JPH10335590A (en) * 1997-06-04 1998-12-18 Nec Corp Passive element circuit
DE69840827D1 (en) * 1998-06-30 2009-06-25 Asulab Sa Inductive sensor
DE60014377T2 (en) * 1999-02-24 2006-03-02 Hitachi Maxell, Ltd., Ibaraki INTEGRATED CIRCUIT AND ITS MANUFACTURE, AND INTEGRATED CIRCUIT ASSEMBLED ON AN INFORMATION CARRIER
TW516213B (en) * 2000-08-04 2003-01-01 Infineon Technologies Ag Integrated electronic circuit having at least two inductors and method for producing it
FR2820875B1 (en) * 2001-02-12 2003-07-11 St Microelectronics Sa INTEGRATED INDUCTANCE STRUCTURE
US7038294B2 (en) * 2001-03-29 2006-05-02 Taiwan Semiconductor Manufacturing Company, Ltd. Planar spiral inductor structure with patterned microelectronic structure integral thereto
JP4496516B2 (en) * 2002-01-31 2010-07-07 ルネサスエレクトロニクス株式会社 High frequency wiring
JP2006511068A (en) * 2002-12-13 2006-03-30 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ Integrated circuit having planar inductive components and planar inductor components
KR100698617B1 (en) * 2005-02-15 2007-03-21 삼성전자주식회사 Integrated circuit including integrated inductors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2007045409A1 *

Also Published As

Publication number Publication date
WO2007045409A1 (en) 2007-04-26
DE102005050484A1 (en) 2007-05-03
CN101317269B (en) 2010-05-19
CN101317269A (en) 2008-12-03
US20080245543A1 (en) 2008-10-09
DE102005050484B4 (en) 2010-01-28

Similar Documents

Publication Publication Date Title
DE19655266B4 (en) Electronic component
DE102006018158A1 (en) Cylindrical magnetic resonance antenna
DE102006017189B4 (en) Integrated oscillator circuit with at least two resonant circuits
DE102006025941B4 (en) Double resonance coil arrangement for a magnetic resonance apparatus
DE69222585T2 (en) Transverse electromagnetic vibration mode resonator
DE102013101768A1 (en) Transformer and electrical circuit
DE10314215A1 (en) Magnetic resonance antenna, e.g. for medical imaging, has high frequency switching elements for frequency tuning, connected to common switching wires
EP1938377A1 (en) Monolithically integrable circuit arrangement
DE10244173B4 (en) Antenna arrangement for a magnetic resonance apparatus, magnetic resonance antenna system, magnetic resonance apparatus and method for coupling two antenna groups
DE69938626T2 (en) COAXIAL CAVITY RESONATOR
DE102011006157B4 (en) Double tuned RF resonator
DE102005052637A1 (en) Monolithic integrated circuit
DE4133352C2 (en) LC composite element
EP1786059B1 (en) Coupling element for electromagnetically coupling of at least two lines of a transmission line
DE102005013293B4 (en) Magnetic resonance system with a high-frequency source
DE3416786A1 (en) Noise filter
EP1202450B1 (en) Circuit arrangement
DE10345767B4 (en) Magnetic resonance apparatus with a cavity and with a gradient coil system arranged in the cavity
DE102006017188A1 (en) Integrated differential oscillator circuit
EP0752171B1 (en) Planar-construction high-frequency oscillator
DE10361347B4 (en) Probe for nuclear magnetic resonance measurements
DE102014220640B4 (en) Switchable frequency filter
DE60315517T2 (en) AM antenna noise reduction
EP3729645B1 (en) Lc-filter arrangement and electrical or electronical device comprising such an lc-filter arrangement
DE10213596A1 (en) Resonance signal detector has conductors for detecting resonance signal enclosed by dielectric material, external electrical circuit for preventing degeneration of resonance shapes

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20080410

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: TEMPEL, RALF

Inventor name: EL RAI, SAMIR

RBV Designated contracting states (corrected)

Designated state(s): DE FR

17Q First examination report despatched

Effective date: 20090313

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20090724