Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D15/00—Hand tools or other devices for non-rotary grinding, polishing, or stropping
  • B24D15/04—Hand tools or other devices for non-rotary grinding, polishing, or stropping resilient; with resiliently-mounted operative surface
  • B24D15/045—Glove-shaped abrasive devices

Definitions

• the present invention relates to the field of sanding. More particularly, the invention relates to a finger adhesible abrasive pad.
• abrasive pads attached to a glove allow users to sand any desired contour of a workpiece by free and relativelyacious movement of the fingers.
• Such abrasive pads are generally releasably attached to the glove by means of loop fastening material such as Velcro so that the pads may be replaced when worn or when a different grade abrasive material is desired to be used.
• Exemplary sanding gloves are disclosed in GB 2368776 and
• Sanding gloves suffer from several deficiencies. Firstly, the type of sanding operations that can be carried out with sanding gloves is limited by the thickness of a finger or by the glove fabric. Consequently, accurate abrading or polishing operations for thin and delicate workpieces such as jewelry cannot be performed with sanding gloves. Secondly, a user wearing a sanding glove cannot feel the roughness of an object that needs to be sanded. Therefore, + Mse sanding operations that require the sense of touch, such as a manicure or me repair of a punctured bicycle tire, preclude the use of sanding gloves. Another reason that sanding gloves cannot be used for manicures is that the abrasive pads attached to a sanding glove are generally used for more than one sanding operation and are liable to transmit skin diseases such as fungus from one subject to another.
• the present invention provides a finger adhesible abrasive pad, comprising an abrasive layer, a substantially planar substrate for said abrasive layer which is made of flexible material, an adhesive layer applied to the underside of said substrate, and a peelable layer applied to said adhesive layer, wherein the abrasive pad is attachable to a fingertip by means of said adhesive layer prior to the commencement of a sanding operation.
• the substrate is of sufficient size and is adhesible to the fingertip in such a way so as to prevent injury to the fingertip during a sanding operation.
• the substrate is substantially of the same size as the abrasive layer.
• the substrate is produced in strip form or in rolls.
• a plurality of abrasive pads are releasably adhered to a common
• the abrasive pad is suitable for sanding operations selected from the group of abrading or polishing operations for jewelry, manicures, the repair of a 06 000800
• the abrasive layer is preferably made from abrading particles selected from the group of aluminum oxide, garnet, ceramic, and silicon carbide having an average particle diameter ranging from approximately 60 to 1000 microns [(which can be also expressed in grit size code according to FEPA's (Federation of European Producers of Abrasives) standard].
• Fig. 1 is a side view of a finger adhesible abrasive pad, in accordance with one embodiment of the invention
• Fig. 2 is a top view of an array of abrasive pads
• Fig. 3 is a perspective view of an abrasive pad attached to a
• the present invention is an abrasive pad that is releasably adhesible to a finger.
• a finger to which such a pad is adhered is able to feel the roughness of an object to be sanded and to carry out a sanding operation in a desired area of roughness.
• Fig. 1 illustrates an abrasive pad, according to one embodim ⁇ - 4 " of the invention.
• the abrasive pad generally designated by numeral 10 comprises abrasive layer 5, e.g. sandpaper, which is produced in a manner well known to those skilled in the art and made with suitable abrading
• substrate 7 may be of the same size as abrasive layer 5. Alternatively, substrate 7 may be
• abrasive layer 5 e.g. produced in strip form, so that substrate 7 may be wrapped around a finger or applied along the length of the finger.
• Fig. 2 illustrates an exemplary commercial product that may include an array of adhesible abrasive pads 10, six of which are shown.
• the plurality of abrasive pads 10 are releasably adhered to common peelable layer 25.
• Each abrasive pad 10 is preferably detached from layer 25 prior to the application of an abrasive pad 10 onto a finger.
• Fig. 3 illustrates a typical sanding operation carried out with the abrasive pad of the invention.
• Abrasive pad 10 is adhered to the fleshy part of the fingertip 29 in such a way that the fingertip will not be injure ⁇ during a
• abrasive pad 10 is preferably adhere ⁇ to the thumb due the superior force that may be applied by the thumb with respect to the other fingers, it will be appreciated that the abrasive pad may be applied to the other fingers as well. Alternatively, abrasive pads may be applied to more than one finger, if the need of such a sanding operation arises.
• abrasive pad 10 is placed on area 37 of roughness and fingertip 29 is moved in reciprocating or rotary motion in such a way so as to smoothen area 37.
• the hand may grasp an object when the sanding operation is being performed.
• the pad is detached from fingertip 29 and is replaced by a new abrasive pad 10.
• the abrasive pad of the present invention is particularly useful for carrying out accurate abrading or polishing operations for thin and delicate workpieces such as jewelry.
• the fingertip can remove areas of roughness that are detected on the
• the abrasive pad is also useful for those sanding operations that require the sense of touch, such as a manicure whereby the abrasive pad is replaced at the completion of the manicure in order to prevent the transmission of skin diseases such as fungus, or the repair of a punctured bicycle tire whereby the puncture site is geTM ⁇ n *ally detected
• abrasive pad for the smoothening of the casing of electronic equipment. At times metallic fragments, which may cause damage to wires or may result in a short circuit, remain in the vicinity of the casing apertures, following the milling of the casing. Similarly, the abrasive pad of the invention is also suitable for metalworking and woodworking applications.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Polishing Bodies And Polishing Tools (AREA)

Applications Claiming Priority (3)

Publications (1)

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Family Applications (1)

Country Status (6)

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Family Cites Families (24)

• 2006
  • 2006-07-10 AU AU2006267853A patent/AU2006267853A1/en not_active Abandoned
  • 2006-07-10 EP EP06766126A patent/EP1910028A2/en not_active Withdrawn
  • 2006-07-10 JP JP2008521035A patent/JP2009500186A/ja active Pending
  • 2006-07-10 WO PCT/IL2006/000800 patent/WO2007007329A2/en not_active Ceased
  • 2006-07-10 CA CA002614903A patent/CA2614903A1/en not_active Abandoned
  • 2006-07-10 US US11/995,069 patent/US20110151758A1/en not_active Abandoned

Non-Patent Citations (1)

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