EP1861813A1 - Electronic module and chip card with indicator light - Google Patents

Electronic module and chip card with indicator light

Info

Publication number
EP1861813A1
EP1861813A1 EP06725120A EP06725120A EP1861813A1 EP 1861813 A1 EP1861813 A1 EP 1861813A1 EP 06725120 A EP06725120 A EP 06725120A EP 06725120 A EP06725120 A EP 06725120A EP 1861813 A1 EP1861813 A1 EP 1861813A1
Authority
EP
European Patent Office
Prior art keywords
light
emitting diode
electronic module
module
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP06725120A
Other languages
German (de)
French (fr)
Inventor
Lucile Dossetto
Thierry Laviron
Thierry Karlisch
Stéphane OTTOBON
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales DIS France SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Publication of EP1861813A1 publication Critical patent/EP1861813A1/en
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
    • G06K19/0728—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being an optical or sound-based communication interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07733—Physical layout of the record carrier the record carrier containing at least one further contact interface not conform ISO-7816
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the present invention relates to the field of devices comprising chips of semiconductor material and performing a function of light indicator.
  • the present invention relates more particularly to the manufacture of an electronic device comprising an integrated circuit chip and a light-emitting diode-type indicator. It is particularly applicable to the indication of activity in electronic devices such as smart cards with or without contact, or USB keys (Universal Serial Bus).
  • USB sticks that can report data transfer.
  • smart cards there is no reliable indicator that the card actually communicates.
  • Some solutions offer remote data transfer indicators on card readers, for example.
  • the patent application WO 02/023357 describes a method and a device for transferring data between a USB port and a smart card connected to this port via a reader.
  • the object of this invention is to generate a signal driving a light emitting diode and reflecting the USB transactional activity.
  • the light-emitting diode is attached to the card reader, the reader having a USB connector.
  • the indicator light is an integral part of the card reader and is dissociated from the chip carrying the data transfer.
  • the present invention intends to overcome the disadvantages of the prior art by providing a light indicator reliably releasing the activity of the card or other device and which is simple and the most economical to manufacture.
  • the invention consists in associating an indicator directly with an integrated circuit chip (preferably at the level of a smart card module) whose activity it is desired to control.
  • an integrated circuit chip preferably at the level of a smart card module
  • a common mechanical protection is provided for the integrated circuit chip and the indicator which also transmits the light emitted by the light-emitting diode.
  • the invention also consists in associating together a light indicator (LED) and a radiofrequency antenna (preferably at the level of a module of the type of contactless smart card module).
  • a common mechanical protection of the indicator, the electrical connections of the indicator to the antenna and, where appropriate, at least partially or totally of the antenna turns, also ensures the transmission of the light emitted by the diode. emitting.
  • the invention is economical because it can use the manufacturing technology of smart card modules.
  • a single coating is sufficient to provide mechanical protection and a waveguide function, preferably of lenticular or curved shape.
  • the invention has the advantage of satisfying specific bending / torsion strength criteria, in particular with chip card technology.
  • the LED light-emitting diode can be connected to the same dielectric film that is supplied in a film reel for manufacturing a smart card module.
  • the dielectric support film may already preferably comprise conductive tracks that can form all or part of an electrical circuit (coil and / or capacitance and / or resistance) and / or simply ohmic contact pads or connection tracks intended to receive a junction such as a solder or adhesive conductive material.
  • At the various component transfer and connection stations at least one LED can be carried over and connected, and possibly an integrated circuit chip close to the LED.
  • a light-emitting diode may be about 2 to 5 times less bulky than an integrated circuit chip even if it is in the form of a surface-mounted component (SMD).
  • SMD surface-mounted component
  • the coating station can be coated with a single operation and even translucent protection the electrical assembly selected with the LED.
  • the dielectric film can be replaced by any other insulating support such as, polymer sheet, paper, a printed circuit board; the support may have dimensions equal to or greater than a contactless or contactless smart card module ...
  • the conductive tracks can be made by any known method including etching, screen printing, conductive deposition, jet conductive material.
  • the subject of the invention is an electronic module comprising at least one bare chip of an integrated circuit connected to conductive tracks of an insulating support by first electrical connections and at least one light-emitting diode connected to the conductive tracks by seconds. electrical connections, characterized in that the assembly formed by the integrated circuit, the light-emitting diode, the first and second electrical connections, is coated with a translucent resin forming a mechanical protection element of said assembly and transmission of light emitted by said light emitting diode.
  • the invention also relates to an electronic module comprising at least one light-emitting diode connected to conductive tracks of an insulating support forming at least one electromagnetic coil by second electrical connections, characterized in that the assembly formed by at least one light-emitting diode (16), the second electrical connections and at least partially the coil, is coated with a translucent resin (32) forming a mechanical protection element of said assembly and transmission of light emitted by said light-emitting diode.
  • said light-emitting diode is a chip of semiconductor material directly from a sawed wafer.
  • said light emitting diode is connected in parallel with said integrated circuit.
  • said protection has a curved shape.
  • said curved shape has a focal point in the plane of said light emitting diode.
  • said resin is transparent and / or comprises pigments whose transmission band comprises the emission wavelength of said light-emitting diode.
  • said resin comprises dopants having remanence properties and an excitation band comprising the emission wavelength of said light-emitting diode, the dopants being able to charge energy at the emission of said light-emitting diode and to restore this energy, over a period of time, in light form at one or more specific wavelengths.
  • said module further comprises a resistor in series with said light emitting diode.
  • said integrated circuit is a contactless chip.
  • said light-emitting diode is directly powered by an induction loop included or not in said module.
  • said module comprises a magnetic field detector and a control circuit of said light-emitting diode according to the detection of said electromagnetic field.
  • Said control circuit can deliver an electrical signal to said light-emitting diode whose frequency is a function of the intensity of the detected electromagnetic field.
  • said light-emitting diode is directly connected to the supply terminals of said module.
  • the invention also relates to an electronic device comprising such an electronic module.
  • the device is of the smart card type and it comprises a plastic support having an apparent cavity in which said electronic module is encased.
  • the chip of said electronic module has a contactless communication function (radio frequency for example) and the electronic module is embedded in the body of said smart card during card lamination steps.
  • said plastic support forms a waveguide capable of transmitting the light emitted by said light-emitting diode.
  • Said device can simply consist of a USB key manufactured in whole or in part according to the smart card technology.
  • the invention also relates to a method of manufacturing an electronic module intended for an electronic device, the module comprising at least one integrated circuit chip connected to conductive tracks of a insulating support and at least one light emitting diode.
  • the method comprises a step of coating the assembly formed by at least the integrated circuit, the light-emitting diode, and their respective connections to the conductive tracks of the module by an insulating and translucent resin.
  • said resin is deposited so as to give it a radius of curvature, for example by distribution (dispensing) of the resin in the form of a drop (glob top).
  • the resin can also be overmolded locally by being centered on the assembly.
  • the resin preferably has a convex or lenticular shape centered on the electrical or electronic circuit assembly to be protected.
  • FIG. 1 represents the assembly plan a contactless smart card module in one embodiment of the invention
  • FIG. 2 illustrates the architecture of a smart card module produced according to the present invention
  • FIG. 3 illustrates a dome-shaped coating resin in one embodiment of the invention
  • FIG. 4 represents an example of a smart card embodying the present invention.
  • the non-contact smart card module 1 comprises a contactless chip 10, two connections 12 and 14, and a light emitting diode 16.
  • the diode 16 is integrated in the module 1 in the form of a chip of semiconductor material directly from a semiconductor wafer and has an operating voltage of 3 to 5 V.
  • Connections 18, for example gold wires, allow the electrical interconnection of the diode 16 and the chip 10.
  • the light-emitting diode 16 is chosen to be compatible in voltage and intensity with the energy that can be transferred in the case of a non-contact chip: a few volts and a few milliamperes are the values commonly used.
  • a resistance in series with the light emitting diode 16 may be added to limit the current flowing in the light emitting diode.
  • the chip 10 used in the module is a chip operating by electrical contact in parallel with which are connected several light-emitting diodes 16 emitting in the visible spectrum (400 to 750 nm) or the invisible, for example the ultraviolet (10 to 400 nm).
  • the light-emitting diodes 16 chosen are of different colors, which makes the information transmitted by them more legible: for example, one diode informs of the power supply of the module 1, another of the outgoing activity and one third of the incoming activity in the module.
  • the integrated circuit or chip 10 and the light-emitting diode 16 are electrically interconnected by means of an insulating substrate comprising a copper conductor circuit.
  • Conventional methods for mounting diode 16 and / or chip 10 are used to make these electrical connections: welding of gold wires 18 between the components 10 and 16 and the conductive parts 20 of the substrate, conductive bonding, flip chip
  • the respective connections of the diode or integrated circuit chip to the conductive tracks of the module substrate may comprise adhesive conductive material.
  • the light-emitting diode 16 is connected in parallel with the chip 10.
  • This substrate is an insulating support that can be a dielectric, polymer sheets, paper, a printed circuit support, etc.
  • the light-emitting diode 16 consists of an optoelectronic semiconductor 26 and, an anode 22 and a cathode 24 on either side of the semiconductor 26.
  • the prior art has other light emitting diode structures some of which integrate a mirror (aluminum layer) to increase the brightness.
  • the device also includes an induction loop type antenna 30 that converts the electromagnetic energy of the environment into electrical energy necessary for the operation of the chip and other components.
  • the antenna 30 is also used to transmit data at high frequencies (13.56 MHz or 915 MHz for example).
  • the antenna is placed directly in the body of the smart card and is electrically connected to the power supply terminals of the module 1.
  • the device comprises two antennas 30, one dedicated to low frequencies, of the order of a few hertz, for the conversion of the energy of the electromagnetic field in electrical energy and the second dedicated to high frequencies for data transfer.
  • the antenna 30 is directly integrated in the module 1, for example on the substrate.
  • the chip 10 drives the light-emitting diode 16 by regulating the voltage at the terminals and / or the intensity crossing the light-emitting diode 16. This control can be carried out according to various policies according to the information that it is desired to transmit to the By example, when the chip 10 receives or transmits data via the antenna 30, it supplies the light-emitting diode which lights up in parallel in parallel with the illumination of the light-emitting diode. Other policies are possible:
  • Transaction means any exchange of data or information both electrically and radiofrequency.
  • the light emitting diode may also be intermittently fed by the chip.
  • the flashing frequency of the light-emitting diode may be used as an indicator of the data transfer rate or the intensity of the electromagnetic field detected by the antenna (the further one is from the reader, the lower the blinking frequency).
  • the light emitting diode 16 is directly connected to the antenna 30, that is to say without being coupled to the chip.
  • the diode 16 is powered by the converted current of the electromagnetic field by the antenna and the diode is therefore lit.
  • an electrically insulating and translucent resin 32 is deposited at the same time on the chip 10, the light-emitting diode 16 and the welds 18.
  • translucent is meant the ability of the resin to pass through light, even partially.
  • the coating of these elements (10, 16, 18) by the resin can be carried out by known methods, for example the technique of filling with two resins of different viscosity (also called Dam and FiIl) by deposition.
  • this resin 32 has an additional advantage: it forms a means of diffusing the light emitted by the diode.
  • the various parameters viscosity of the resin, flow rate, polymerization to block the spreading of the resin
  • the radius of curvature is worked, which can make it possible to obtain a lens for the transmission of all or part of the light emitted by the light-emitting diode 16. It is possible to use a resin which can be activated in the laser conductive paths to make the electrical connections;
  • the resin 32 is chosen to be transparent for better transmission of light; it may be especially based on silicone, epoxy or polyurethane.
  • the resin 32 comprises dopants which ensure the dispersion of light or has pigments whose transmission band comprises the emission wavelength of the light-emitting diode.
  • the resin 32 has remanence properties, for example by the use of dopants having absorption and re-emission properties as described in more detail in EP 265
  • the dopants are chosen to have an absorption band comprising the emission wavelength of the light-emitting diode 16: the dopants are charged in energy at the emission of the light-emitting diode and restore this energy in luminous form to one or more wavelengths of their own.
  • the dopants By choosing the dopants adequately so that they re-emit with a wavelength in the visible range, for example substantially equal to the emission wavelength of the light-emitting diode used, the latter can only be switched on intermittently, since, between these "on" periods, the dopants re-emit and provide continuity in the luminous indication of the card.
  • the dopants are chosen to have long remanence properties, that is to say they re-emit the absorbed energy for a long time, for example several minutes in the examples mentioned above.
  • the resin 32 the desired shape which allows to control the light path.
  • the resin takes the form of a dome close to that of an optical lens. This is made possible by the "dispensing" deposition technique in which the resin is deposited with a needle along a desired path. It is thus easy to give it the desired shape.
  • the thickness and viscosity parameters of the resin, and the radius of curvature of the outer layer thereof it is possible to modify the optical parameters of the resin coating. It may be envisaged to modify the position of the point / focal plane of the optical assembly constituted by the resin relative to the light emitting diode to vary the diffusion cone of the emitted light.
  • the light electronic module 1 thus created is integrated in the smart card body (less than 1 mm thick). Several techniques exist.
  • the body 36 of the chip card comprises a cavity 38.
  • the embedding consists in integrating, into the cavity, the electronic module 1.
  • the cavity 38 may optionally comprise a filling as an adhesive.
  • This filler material is preferably chosen to be transparent.
  • translucent / transparent polymer sheets 40 are laminated on the card providing mechanical protection and transmission of emitted light.
  • the coating consists of the stack of three sheets 40.
  • opaque polymer sheets is also possible, in which case they are extremely thin which allows all or part of the light to pass: these very thin leaves can be considered to be translucent. As the amount of light passing may be small, the light-emitting diode is then more visible in the dark.
  • the chip 10 is embedded in the card body 36.
  • the body of the card or object containing the module is designed in whole or in part to allow the passage of the light emitted by the light emitting diode 16 of the module 1 which is integrated, for example by the use of a transparent or translucent material: transparent card body, translucent polymer sheets, ...
  • the plastic support of the card is designed as a light waveguide which guides the light to the desired location.
  • the light is guided to the outer edge of a contact card when it is plugged into a reader and the chip is not visible.
  • the interface between the card body 36 and the upper and lower layers 40 is partly reflective, which ensures the propagation of the wave in the body of the card 36. It is particularly interesting that this interface has a high reflectivity (index greater than 50%, for example 80%) thus limiting the attenuation of the signal during the spread.
  • the rays being transmitted in the layers 40 can be absorbed or transmitted to the outside of the card.
  • an aluminum coating can be used on either side of the card body 38. The light wave is then entirely reflected without attenuation of the light signal.
  • the substrate of the electronic module 1 is a transparent insulator on which is present a conductive circuit or conductive tracks, in particular copper.
  • the substrate of the module 1 incorporates a reflecting layer, mirror type
  • the light-emitting diode makes it possible to indicate any transaction carried out with a reader, or even to inform the transfer rate by using a flashing frequency of the light-emitting diode.
  • Several light-emitting diodes of different colors are also used to indicate different information.
  • the light-emitting diode (41 provided with the curved-shaped encapsulating resin) contained in the module 1 can be used as an indicator of the presence of an electromagnetic field 42 issued by a reader 44 of contactless card.
  • the light diffuses from the diode and through the resin 41.
  • the feed antenna 30 is connected to the two contact pads 46 and 48 electrically separated by an insulating part 50.
  • the invention can also be implemented in memory type USB sticks, in particular manufactured in whole or in part according to chip card technology in accordance with patents of the applicant.
  • the USB module has contact pads in USB format, in particular the contact pads are linear (next to each other) and parallel.
  • the light-emitting diode is connected in series with a resistor between the Data + and Data- terminals of the USB contacts.
  • the light-emitting diode lights up when the module is powered from the USB port.
  • the card can also combine contact (transmission by electrical contact) and contact (radio frequency) functions.
  • the electronic module may comprise two communication interfaces and include an antenna on the module as well as the aforementioned conductive tracks and electrical contact pads. In the case of a card having a communication function with electrical contacts, the latter is introduced into the reader and the operating activity (power supply) can be visible on the edge of the card notably via a waveguide previously described. or through the body of the card and the reader if it is transparent.
  • the indicator also reliably records the presence of an electromagnetic field or the transfer of data.
  • the light-emitting diode (16) can be provided in different forms.
  • the light-emitting chip (16) can itself be mounted on a support having connection tracks and a second translucent protective coating, said diode being connected to the module by second electrical connections.
  • connections (seconds) of the diode to the conductive tracks of the module which can be made in particular by soldered wire, or other, need to be protected as well as the connections (first) of the integrated circuit chip that may be present.
  • the diode chip is coated in the case of the CMS, it is not the case of subsequent connections connecting the connection tracks of the CMS to the conductive tracks of the module.
  • the invention makes it possible to protect the assembly comprising at least the CMS, the subsequent connections and at least partially the conductive tracks of the substrate or module.
  • this function can be performed by at least one optical fiber or equivalent arranged in the support relative to the diode so as to form at least one waveguide in the medium 36 for the light emitted by said light-emitting diode (16).
  • the waveguide may emit transversely and / or in the plane of the support.
  • the optical fiber may extend to a cavity containing the coating and / or the module.
  • the waveguide may also extend to the coating in the absence of a cavity in the case where the module is embedded in the material of the support.
  • the integrated circuit chip is omitted leaving only a diode electroluminescent (for example in CMS or bare form ...) on the support with conductive tracks of the support forming an electromagnetic flat antenna or coil.
  • the coating is dispensed so as to cover the assembly formed by the diode, the electrical connections of the diode to the tracks and at least partially the conductive tracks (or preferably entirely for a good mechanical strength of the module).
  • the LED module has exclusively an information function according to the presence or absence of an electromagnetic field.
  • the module can therefore be used without the integrated circuit chip including performing communication functions.
  • the electromagnetic antenna may or may not be arranged on the module, in particular around the LED or under the LED; the LED can have different shapes or constructions. If necessary, the coil (antenna) may also be at least partially coated so as to offer good mechanical strength.
  • This LED module powered by coil with or without integrated circuit chip has the advantage of being easily introduced as an insert in a support body (for example less than 1 mm thick) in particular by lamination or injection. It requires no connection as it can be coupled to another coil in the holder without having to make a connection to the carrier coil.
  • This possibility of electromagnetic coupling also allows a positioning latitude of the module in the support.
  • This LED module has the advantage of being self-powered because of its coil and to be able to be manufactured according to chip card module technology.
  • the latter may already comprise a path of waveguides or optical fibers representing preferably one or more information (word, letter, numbers, logo ).
  • the module or the support may comprise several LEDs (distinct colors if necessary) and associated coils so as to display different information as a function of the electromagnetic frequency to which it is subjected.
  • the card may comprise several LEDs each associated with information, for example an optical fiber letter. And information can be selected and / or displayed according to the frequency transmitted by a terminal.

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Abstract

The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module (1) comprising at least one integrated circuit chip (10) which is connected to the conductor tracks of an insulating support and at least one light-emitting diode (16). According to one aspect of the invention, the assembly formed by the integrated circuit (10) and the light-emitting diode (16) is coated with a translucent resin (32), thereby forming an element for the mechanical protection of the assembly and for the transmission of the light emitted by the diode (16). According to another aspect of the invention, the coated assembly comprises at least one indicator light (LED) and a radio-frequency coil (preferably in the module).

Description

MODULE ÉLECTRONIQUE ET CARTE À PUCE AVEC INDICATEUR LUMINEUX ELECTRONIC MODULE AND CHIP CARD WITH LUMINOUS INDICATOR
La présente invention se rapporte au domaine des dispositifs comportant des puces de matériau semi-conducteur et réalisant une fonction d'indicateur lumineux.The present invention relates to the field of devices comprising chips of semiconductor material and performing a function of light indicator.
La présente invention concerne plus particulièrement la fabrication d'un dispositif électronique comportant une puce de circuit intégré et un indicateur lumineux de type diode électroluminescente. Elle s'applique particulièrement à l'indication d'activité dans des dispositifs électroniques tels que des cartes à puce avec ou sans contact, ou des clés USB (Universal Sériai Bus) .The present invention relates more particularly to the manufacture of an electronic device comprising an integrated circuit chip and a light-emitting diode-type indicator. It is particularly applicable to the indication of activity in electronic devices such as smart cards with or without contact, or USB keys (Universal Serial Bus).
Avec l'émergence des dispositifs amovibles et des terminaux personnels comprenant plusieurs modules échangeables ou encore des connexions sans fil, il est difficile de connaître et contrôler le fonctionnement des divers éléments interagissant. Il existe des clés USB qui permettent de rendre compte du transfert de données. Au contraire, pour les cartes à puce, il n'y a pas d'indicateur fiable précisant que la carte communique effectivement.With the emergence of removable devices and personal terminals comprising several exchangeable modules or wireless connections, it is difficult to know and control the operation of the various interacting elements. There are USB sticks that can report data transfer. On the contrary, for smart cards, there is no reliable indicator that the card actually communicates.
Certaines solutions proposent des indicateurs de transfert de données déportés sur les lecteurs de carte, par exemple .Some solutions offer remote data transfer indicators on card readers, for example.
La demande de brevet WO 02 / 023 357 décrit un procédé et un dispositif pour le transfert de données entre un port USB et une carte à puce reliée à ce port via un lecteur. Le but de cette invention est de générer un signal pilotant une diode électroluminescente et reflétant l'activité transactionnelle USB. La diode électroluminescente est fixée sur le lecteur de carte, le lecteur ayant un connecteur USB. Dans cette solution et de façon générale, l'indicateur lumineux fait partie intégrante du lecteur de carte et est dissocié de la puce réalisant le transfert de données. Ces solutions ne sont pas satisfaisantes car l'indicateur lumineux du lecteur ne constitue pas un témoin fiable de l'activité de communication de données de la carte .The patent application WO 02/023357 describes a method and a device for transferring data between a USB port and a smart card connected to this port via a reader. The object of this invention is to generate a signal driving a light emitting diode and reflecting the USB transactional activity. The light-emitting diode is attached to the card reader, the reader having a USB connector. In this solution and in general, the indicator light is an integral part of the card reader and is dissociated from the chip carrying the data transfer. These solutions are not satisfactory because the indicator light of the reader is not a reliable indicator of the data communication activity of the card.
La présente invention entend remédier aux inconvénients de l'art antérieur en proposant un indicateur lumineux restituant de façon fiable l'activité de la carte ou autre dispositif et qui soit simple et le plus économique possible à fabriquer.The present invention intends to overcome the disadvantages of the prior art by providing a light indicator reliably releasing the activity of the card or other device and which is simple and the most economical to manufacture.
L'invention consiste selon un premier aspect à associer un indicateur directement à une puce de circuit intégré (de préférence au niveau d'un module de carte à puce) dont on souhaite contrôler l'activité. Pour cela, on réalise une protection mécanique commune de la puce de circuit intégré et de l'indicateur qui assure également la transmission de la lumière émise par la diode électroluminescente .According to a first aspect, the invention consists in associating an indicator directly with an integrated circuit chip (preferably at the level of a smart card module) whose activity it is desired to control. For this purpose, a common mechanical protection is provided for the integrated circuit chip and the indicator which also transmits the light emitted by the light-emitting diode.
Selon un second aspect l'invention consiste également à associer ensemble un indicateur lumineux (LED) et une antenne radiofréquence (de préférence au niveau d'un module du type module de carte à puce sans contact) . En outre, une protection mécanique commune de l'indicateur, des connexions électriques de l'indicateur à l'antenne et le cas échéant au moins partiellement ou en totalité des spires d'antenne, assure également la transmission de la lumière émise par la diode électroluminescente. L'invention est économique car elle peut utiliser la technologie de fabrication des modules de carte à puce. En outre, un seul enrobage suffit pour assurer la protection mécanique et une fonction de guide d'onde, de préférence de forme lenticulaire ou bombée.According to a second aspect, the invention also consists in associating together a light indicator (LED) and a radiofrequency antenna (preferably at the level of a module of the type of contactless smart card module). In addition, a common mechanical protection of the indicator, the electrical connections of the indicator to the antenna and, where appropriate, at least partially or totally of the antenna turns, also ensures the transmission of the light emitted by the diode. emitting. The invention is economical because it can use the manufacturing technology of smart card modules. In addition, a single coating is sufficient to provide mechanical protection and a waveguide function, preferably of lenticular or curved shape.
Grâce notamment au positionnement de la diode à proximité de puce de circuit intégré et l'enrobage commun, l'invention a l'avantage de satisfaire à des critères de résistance mécanique en flexion/torsion spécifiques notamment à la technologie carte à puce.Thanks in particular to the positioning of the diode in the vicinity of an integrated circuit chip and the common coating, the invention has the advantage of satisfying specific bending / torsion strength criteria, in particular with chip card technology.
La connexion de la diode électroluminescente LED peut s'effectuer sur le même film diélectrique qui est fourni en bobine de film pour fabriquer un module de carte à puce.The LED light-emitting diode can be connected to the same dielectric film that is supplied in a film reel for manufacturing a smart card module.
Le film support diélectrique peut déjà comprendre de préférence des pistes conductrices pouvant former tout ou partie d'un circuit électrique (bobine et/ou capacité et/ou résistance) et/ou simplement des plages de contacts ohmique ou des pistes de connexion destinées à recevoir une jonction telle une soudure ou matière conductrice adhésive.The dielectric support film may already preferably comprise conductive tracks that can form all or part of an electrical circuit (coil and / or capacitance and / or resistance) and / or simply ohmic contact pads or connection tracks intended to receive a junction such as a solder or adhesive conductive material.
Aux différents postes de report de composants et connexion, on peut reporter et connecter au moins une LED, et le cas échéant une puce nue de circuit intégré à proximité de la LED. Une diode électroluminescente peut être en principe environ 2 à 5 fois moins volumineuse qu'une puce de circuit intégré même en étant sous forme de composant monté en surface (CMS) .At the various component transfer and connection stations, at least one LED can be carried over and connected, and possibly an integrated circuit chip close to the LED. In principle, a light-emitting diode may be about 2 to 5 times less bulky than an integrated circuit chip even if it is in the form of a surface-mounted component (SMD).
Et au poste d'enrobage, on peut enrober d'une seule opération et même protection translucide l'ensemble électrique choisi avec la LED.And at the coating station, can be coated with a single operation and even translucent protection the electrical assembly selected with the LED.
Le film diélectrique peut être remplacé par tout autre support isolant tel que, feuille de polymère, du papier, un support de circuit imprimé; le support peut avoir des dimensions égales ou supérieures à un module de carte à puce à contact ou sans contact...The dielectric film can be replaced by any other insulating support such as, polymer sheet, paper, a printed circuit board; the support may have dimensions equal to or greater than a contactless or contactless smart card module ...
Les pistes conductrices peuvent être réalisées par tout procédé connus notamment par gravure, sérigraphie, dépôt conducteur, jet de matière conductrice.The conductive tracks can be made by any known method including etching, screen printing, conductive deposition, jet conductive material.
À cet effet, l'invention a pour objet un module électronique comportant au moins une puce nue de circuit intégré connectée à des pistes conductrices d'un support isolant par des premières connexions électriques et au moins une diode électroluminescente connectée aux pistes conductrices par des secondes connexions électriques, caractérisé en ce que l'ensemble formé par le circuit intégré, la diode électroluminescente, les première et seconde connexions électriques, est enrobé d'une résine translucide formant un élément de protection mécanique dudit ensemble et de transmission de la lumière émise par ladite diode électroluminescente.To this end, the subject of the invention is an electronic module comprising at least one bare chip of an integrated circuit connected to conductive tracks of an insulating support by first electrical connections and at least one light-emitting diode connected to the conductive tracks by seconds. electrical connections, characterized in that the assembly formed by the integrated circuit, the light-emitting diode, the first and second electrical connections, is coated with a translucent resin forming a mechanical protection element of said assembly and transmission of light emitted by said light emitting diode.
L'invention a également pour objet un module électronique comportant au moins une diode électroluminescente connectée à des pistes conductrices d'un support isolant formant au moins une bobine électromagnétique par des secondes connexions électriques, caractérisé en ce que l'ensemble formé par au moins la diode électroluminescente (16) , les secondes connexions électriques et au moins partiellement la bobine, est enrobé d'une résine (32) translucide formant un élément de protection mécanique dudit ensemble et de transmission de la lumière émise par ladite diode électroluminescente.The invention also relates to an electronic module comprising at least one light-emitting diode connected to conductive tracks of an insulating support forming at least one electromagnetic coil by second electrical connections, characterized in that the assembly formed by at least one light-emitting diode (16), the second electrical connections and at least partially the coil, is coated with a translucent resin (32) forming a mechanical protection element of said assembly and transmission of light emitted by said light-emitting diode.
Ainsi, il est pratique et simple de fabriquer un dispositif à indicateur lumineux et de l'insérer dans un autre corps support (corps de carte, clé USB...) sans autre connexion électrique du fait de la présence d'une bobine à bord du module.Thus, it is practical and simple to manufacture a device with indicator light and insert it into another support body (card body, USB key ...) without further electrical connection due to the presence of a coil on board the module.
Dans un mode de réalisation, ladite diode électroluminescente est une puce de matériau semi-conducteur issue directement d'une galette (wafer) sciée.In one embodiment, said light-emitting diode is a chip of semiconductor material directly from a sawed wafer.
Également, ladite diode électroluminescente est connectée en parallèle audit circuit intégré.Also, said light emitting diode is connected in parallel with said integrated circuit.
Dans un mode de réalisation, ladite protection présente une forme bombée.In one embodiment, said protection has a curved shape.
Dans un mode de réalisation particulier, ladite forme bombée présente un point focal dans le plan de ladite diode électroluminescente .In a particular embodiment, said curved shape has a focal point in the plane of said light emitting diode.
Plus particulièrement, ladite résine est transparente et/ou comprend des pigments dont la bande de transmission comprend la longueur d'onde d'émission de ladite diode électroluminescente .More particularly, said resin is transparent and / or comprises pigments whose transmission band comprises the emission wavelength of said light-emitting diode.
Éventuellement, ladite résine comprend des dopants ayant des propriétés de rémanence et une bande d'excitation comprenant la longueur d'onde d'émission de ladite diode électroluminescente, les dopants étant aptes à se charger en énergie à l'émission de ladite diode électroluminescente et à restituer cette énergie, sur un intervalle de temps, sous forme lumineuse à une ou plusieurs longueurs d'onde propres.Optionally, said resin comprises dopants having remanence properties and an excitation band comprising the emission wavelength of said light-emitting diode, the dopants being able to charge energy at the emission of said light-emitting diode and to restore this energy, over a period of time, in light form at one or more specific wavelengths.
Dans un mode de réalisation, ledit module comprend, en outre, une résistance en série avec ladite diode électroluminescente .In one embodiment, said module further comprises a resistor in series with said light emitting diode.
Selon une réalisation de l'invention, ledit circuit intégré est une puce sans contact.According to one embodiment of the invention, said integrated circuit is a contactless chip.
Dans un mode de réalisation, ladite diode électroluminescente est directement alimentée par une boucle d'induction comprise ou non dans ledit module. Plus particulièrement, ledit module comprend un détecteur de champ magnétique et un circuit de commande de ladite diode électroluminescente en fonction de la détection dudit champ électromagnétique. Ledit circuit de commande peut délivrer un signal électrique à ladite diode électroluminescente dont la fréquence est fonction de l'intensité du champ électromagnétique détecté.In one embodiment, said light-emitting diode is directly powered by an induction loop included or not in said module. More particularly, said module comprises a magnetic field detector and a control circuit of said light-emitting diode according to the detection of said electromagnetic field. Said control circuit can deliver an electrical signal to said light-emitting diode whose frequency is a function of the intensity of the detected electromagnetic field.
Dans une variante, ladite diode électroluminescente est directement connectée aux bornes d'alimentation dudit module .In a variant, said light-emitting diode is directly connected to the supply terminals of said module.
L'invention concerne également un dispositif électronique comprenant un tel module électronique. Dans un mode de réalisation, le dispositif est de type carte à puce et il comprend un support plastique ayant une cavité apparente dans laquelle est encarté ledit module électronique .The invention also relates to an electronic device comprising such an electronic module. In one embodiment, the device is of the smart card type and it comprises a plastic support having an apparent cavity in which said electronic module is encased.
Dans une variante, la puce dudit module électronique a une fonction de communication sans contact (radio fréquence par exemple) et le module électronique est noyé dans le corps de ladite carte à puce lors des étapes de lamination de la carte.In a variant, the chip of said electronic module has a contactless communication function (radio frequency for example) and the electronic module is embedded in the body of said smart card during card lamination steps.
Éventuellement, ledit support plastique forme un guide d'onde apte à transmettre la lumière émise par ladite diode électroluminescente .Optionally, said plastic support forms a waveguide capable of transmitting the light emitted by said light-emitting diode.
Ledit dispositif peut simplement consister en une clé USB fabriquée en tout ou partie selon la technologie carte à puce .Said device can simply consist of a USB key manufactured in whole or in part according to the smart card technology.
L'invention concerne également, un procédé de fabrication d'un module électronique destiné à un dispositif électronique, le module comportant au moins une puce de circuit intégré connectée à des pistes conductrices d'un support isolant et au moins une diode électroluminescente. Le procédé comprend une étape d'enrobage de l'ensemble formé par au moins le circuit intégré, la diode électroluminescente, et leurs connexions respectives aux pistes conductrices du module par une résine isolante et translucide .The invention also relates to a method of manufacturing an electronic module intended for an electronic device, the module comprising at least one integrated circuit chip connected to conductive tracks of a insulating support and at least one light emitting diode. The method comprises a step of coating the assembly formed by at least the integrated circuit, the light-emitting diode, and their respective connections to the conductive tracks of the module by an insulating and translucent resin.
Selon une mise en œuvre, lors de ladite étape d' encapsulation, ladite résine est déposée de manière à lui donner un rayon de courbure, par exemple par distribution (dispense) de la résine sous forme de goutte (glob top) . La résine peut également être surmoulée localement en étant centrée sur l'ensemble. La résine présente de préférence une forme bombée ou lenticulaire centrée sur l'ensemble de circuit électrique ou électronique à protéger.According to one embodiment, during said encapsulation step, said resin is deposited so as to give it a radius of curvature, for example by distribution (dispensing) of the resin in the form of a drop (glob top). The resin can also be overmolded locally by being centered on the assembly. The resin preferably has a convex or lenticular shape centered on the electrical or electronic circuit assembly to be protected.
On comprendra mieux l'invention à l'aide de la description, faite ci-après à titre purement explicatif, d'un mode de réalisation de l'invention, en référence aux figures annexées où : - la figure 1 représente le plan de montage d'un module de carte à puce sans contact dans un mode de réalisation de l'invention ;The invention will be better understood by means of the description, given below for purely explanatory purposes, of one embodiment of the invention, with reference to the appended figures in which: FIG. 1 represents the assembly plan a contactless smart card module in one embodiment of the invention;
- la figure 2 illustre l'architecture d'un module de carte à puce réalisé selon la présente invention ; - la figure 3 illustre une résine d'enrobage de forme dôme dans un mode de réalisation de l'invention ;FIG. 2 illustrates the architecture of a smart card module produced according to the present invention; FIG. 3 illustrates a dome-shaped coating resin in one embodiment of the invention;
- la figure 4 représente un exemple de carte à puce mettant en œuvre la présente invention ; etFIG. 4 represents an example of a smart card embodying the present invention; and
- la figure 5 illustre une utilisation de l'invention.- Figure 5 illustrates a use of the invention.
En faisant référence à la figure 1, le module 1 de carte à puce sans contact comprend une puce sans contact 10, deux connexions 12 et 14, et une diode électroluminescente 16. La diode 16 est intégrée au module 1 sous la forme d'une puce de matériau semi-conducteur issue directement d'une galette de matériau semi-conducteur (wafer) et a une tension de fonctionnement de 3 à 5 V. Des connexions électriques 18, par exemple des fils d'or, permettent l'interconnexion électrique de la diode 16 et de la puce 10.With reference to FIG. 1, the non-contact smart card module 1 comprises a contactless chip 10, two connections 12 and 14, and a light emitting diode 16. The diode 16 is integrated in the module 1 in the form of a chip of semiconductor material directly from a semiconductor wafer and has an operating voltage of 3 to 5 V. Connections 18, for example gold wires, allow the electrical interconnection of the diode 16 and the chip 10.
La diode électroluminescente 16 est choisie pour être compatible en tension et intensité avec l'énergie qui peut être transférée dans le cas d'une puce sans contact : quelques volts et quelques milliampères sont les valeurs couramment utilisées.The light-emitting diode 16 is chosen to be compatible in voltage and intensity with the energy that can be transferred in the case of a non-contact chip: a few volts and a few milliamperes are the values commonly used.
Éventuellement, une résistance en série avec la diode électroluminescente 16 peut être ajoutée afin de limiter l'intensité circulant dans la diode électroluminescente.Optionally, a resistance in series with the light emitting diode 16 may be added to limit the current flowing in the light emitting diode.
Dans un mode de réalisation similaire, la puce 10 utilisée dans le module est une puce fonctionnant par contact électrique en parallèle de laquelle sont connectées plusieurs diodes électroluminescentes 16 émettant dans le spectre visible (400 à 750 nm) ou l'invisible, par exemple l'ultraviolet (10 à 400 nm) . Éventuellement, les diodes électroluminescentes 16 choisies sont de couleurs différentes ce qui offre une lisibilité accrue des informations transmises par celles-ci : par exemple, une diode renseigne de l'alimentation en énergie du module 1, une autre de l'activité sortante et une troisième de l'activité entrante dans le module.In a similar embodiment, the chip 10 used in the module is a chip operating by electrical contact in parallel with which are connected several light-emitting diodes 16 emitting in the visible spectrum (400 to 750 nm) or the invisible, for example the ultraviolet (10 to 400 nm). Optionally, the light-emitting diodes 16 chosen are of different colors, which makes the information transmitted by them more legible: for example, one diode informs of the power supply of the module 1, another of the outgoing activity and one third of the incoming activity in the module.
En référence à la figure 2, le circuit intégré ou puce 10 et la diode électroluminescente 16 sont interconnectés électriquement à l'aide d'un substrat isolant comportant un circuit conducteur 20 de cuivre. Des procédés classiques de montage de la diode 16 et/ou de la puce 10 sont utilisés pour réaliser ces connexions électriques : soudure de fils d'or 18 entre les composants 10 et 16 et les parties conductrices 20 du substrat, collage conducteur, flip chipWith reference to FIG. 2, the integrated circuit or chip 10 and the light-emitting diode 16 are electrically interconnected by means of an insulating substrate comprising a copper conductor circuit. Conventional methods for mounting diode 16 and / or chip 10 are used to make these electrical connections: welding of gold wires 18 between the components 10 and 16 and the conductive parts 20 of the substrate, conductive bonding, flip chip
(puce retournée, non représenté) . Les connexions respectives de la diode ou de la puce de circuit intégré aux pistes conductrices du substrat du module peuvent comprendre de la matière conductrice adhésive.(flipped chip, not shown). The respective connections of the diode or integrated circuit chip to the conductive tracks of the module substrate may comprise adhesive conductive material.
La diode électroluminescente 16 est connectée en parallèle de la puce 10. Ce substrat est un support isolant pouvant être un diélectrique, des feuilles de polymère, du papier, un support de circuit imprimé...The light-emitting diode 16 is connected in parallel with the chip 10. This substrate is an insulating support that can be a dielectric, polymer sheets, paper, a printed circuit support, etc.
La diode électroluminescente 16 se compose d'un semiconducteur optoélectronique 26 et, d'une anode 22 et d'une cathode 24 de part et d'autre du semi-conducteur 26. La tension appliquée par l'anode et la cathode au semiconducteur, excite ce dernier qui émet alors de la lumière 28.The light-emitting diode 16 consists of an optoelectronic semiconductor 26 and, an anode 22 and a cathode 24 on either side of the semiconductor 26. The voltage applied by the anode and the cathode to the semiconductor, excites the latter which then emits light 28.
L'art antérieur comporte d'autres structures de diode électroluminescente dont certaines intègrent un miroir (couche d'aluminium) pour augmenter la brillance.The prior art has other light emitting diode structures some of which integrate a mirror (aluminum layer) to increase the brightness.
Le dispositif comprend également une antenne 30 de type boucle d'induction convertissant l'énergie électromagnétique de l'environnement en énergie électrique nécessaire au fonctionnement de la puce et d'autres composants. L'antenne 30 est également utilisée pour transmettre des données à des fréquences élevées (13,56 MHz ou 915 MHz par exemple) . L'antenne est placée directement dans le corps de la carte à puce et est électriquement connectée aux bornes d'alimentation du module 1. Dans une variante, le dispositif comprend deux antennes 30, l'une dédiée aux fréquences basses, de l'ordre de quelques hertz, pour la conversion de l'énergie du champ électromagnétique en énergie électrique et la seconde dédiée aux hautes fréquences pour le transfert de données.The device also includes an induction loop type antenna 30 that converts the electromagnetic energy of the environment into electrical energy necessary for the operation of the chip and other components. The antenna 30 is also used to transmit data at high frequencies (13.56 MHz or 915 MHz for example). The antenna is placed directly in the body of the smart card and is electrically connected to the power supply terminals of the module 1. In a variant, the device comprises two antennas 30, one dedicated to low frequencies, of the order of a few hertz, for the conversion of the energy of the electromagnetic field in electrical energy and the second dedicated to high frequencies for data transfer.
Dans un mode de réalisation, l'antenne 30 est directement intégrée dans le module 1, par exemple sur le substrat.In one embodiment, the antenna 30 is directly integrated in the module 1, for example on the substrate.
La puce 10 pilote la diode électroluminescente 16 en régulant la tension aux bornes et/ou l'intensité traversant la diode électroluminescente 16. Ce pilotage peut s'effectuer en fonction de diverses politiques selon l'information que l'on désire transmettre à l'utilisateur via l' éclairement de la diode électroluminescente 16. Par exemple, lorsque la puce 10 reçoit ou émet des données par l'antenne 30, elle alimente en parallèle la diode électroluminescente qui s'allume. D'autres politiques sont envisageables :The chip 10 drives the light-emitting diode 16 by regulating the voltage at the terminals and / or the intensity crossing the light-emitting diode 16. This control can be carried out according to various policies according to the information that it is desired to transmit to the By example, when the chip 10 receives or transmits data via the antenna 30, it supplies the light-emitting diode which lights up in parallel in parallel with the illumination of the light-emitting diode. Other policies are possible:
- réguler l'alimentation de la diode électroluminescente en fonction du taux de transfert de données, en fonction de transactions. On entend par transaction, tout échange de données ou d'informations aussi bien par voie électrique que par voie radiofréquence .- regulate the supply of the light emitting diode according to the data transfer rate, depending on transactions. Transaction means any exchange of data or information both electrically and radiofrequency.
- mettre la diode électroluminescente en « passante », c'est-à-dire allumée, dès que la puce est alimentée en énergie. Cette politique permet notamment d'informer l'utilisateur que sa carte à puce sans contact entre dans le champ électromagnétique d'un lecteur.- Put the light emitting diode "pass", that is to say, lit, as soon as the chip is powered. This policy makes it possible in particular to inform the user that his contactless smart card enters the electromagnetic field of a reader.
- allumer la diode électroluminescente uniquement sur le transfert de certaines données (données cryptées par exemple) , ...- turn on the light-emitting diode only on the transfer of certain data (encrypted data for example), ...
La diode électroluminescente peut également être alimentée par la puce de façon intermittente. La fréquence de clignotement de la diode électroluminescente peut être utilisée comme indicateur du taux de transfert de données ou de l'intensité du champ électromagnétique détecté par l'antenne (plus on est loin du lecteur, plus la fréquence de clignotement est faible) .The light emitting diode may also be intermittently fed by the chip. The flashing frequency of the light-emitting diode may be used as an indicator of the data transfer rate or the intensity of the electromagnetic field detected by the antenna (the further one is from the reader, the lower the blinking frequency).
Dans un mode de réalisation particulièrement simple, la diode électroluminescente 16 est directement reliée à l'antenne 30, c'est-à-dire sans être couplée à la puce.In a particularly simple embodiment, the light emitting diode 16 is directly connected to the antenna 30, that is to say without being coupled to the chip.
Ainsi lorsque la carte à puce est introduite dans un champ électromagnétique, la diode 16 est alimentée par le courant converti du champ électromagnétique par l'antenne et la diode s'allume donc.Thus when the smart card is introduced into an electromagnetic field, the diode 16 is powered by the converted current of the electromagnetic field by the antenna and the diode is therefore lit.
Toujours en référence à la figure 2, une résine électriquement isolante et translucide 32 est déposée en même temps sur la puce 10, la diode électroluminescente 16 et les soudures 18. On entend par « translucide », la faculté de la résine à laisser passer de la lumière, même partiellement .Still with reference to FIG. 2, an electrically insulating and translucent resin 32 is deposited at the same time on the chip 10, the light-emitting diode 16 and the welds 18. By "translucent" is meant the ability of the resin to pass through light, even partially.
L'enrobage de ces éléments (10, 16, 18) par la résine peut être réalisé par des procédés connus, par exemple la technique du remplissage à l'aide de deux résines de viscosité différente (aussi appelée Dam and FiIl) par dépôt.The coating of these elements (10, 16, 18) by the resin can be carried out by known methods, for example the technique of filling with two resins of different viscosity (also called Dam and FiIl) by deposition.
Dans l'art antérieur, l'utilité de cette résine est simple : la protection des éléments enrobés (puce et soudures) contre des dommages environnementaux, mécaniques ou électriques. Dans la présente invention, cette résine 32 présente un avantage supplémentaire : elle forme un moyen de diffusion de la lumière émise par la diode. En jouant sur les différents paramètres (viscosité de la résine, vitesse d'écoulement, polymérisation pour bloquer l'étalement de la résine) , on travaille le rayon de courbure, ce qui peut permettre d'obtenir une lentille pour la transmission de tout ou partie de la lumière émise par la diode électroluminescente 16. II est possible d'utiliser une résine dont on peut activer des chemins conducteurs dans la résine par laser pour réaliser les connexions électriques;In the prior art, the utility of this resin is simple: the protection of the coated elements (chip and solder) against environmental damage, mechanical or electrical. In the present invention, this resin 32 has an additional advantage: it forms a means of diffusing the light emitted by the diode. By varying the various parameters (viscosity of the resin, flow rate, polymerization to block the spreading of the resin), the radius of curvature is worked, which can make it possible to obtain a lens for the transmission of all or part of the light emitted by the light-emitting diode 16. It is possible to use a resin which can be activated in the laser conductive paths to make the electrical connections;
La résine 32 est choisie transparente pour une meilleure transmission de la lumière ; elle peut être notamment à base de silicone, d' époxy ou de polyuréthane .The resin 32 is chosen to be transparent for better transmission of light; it may be especially based on silicone, epoxy or polyurethane.
Selon différents modes de réalisation envisagés, la résine 32 comprend des dopants assurant la dispersion de la lumière ou présente des pigments dont la bande de transmission comprend la longueur d'onde d'émission de la diode électroluminescente.According to various embodiments envisaged, the resin 32 comprises dopants which ensure the dispersion of light or has pigments whose transmission band comprises the emission wavelength of the light-emitting diode.
Selon un mode de réalisation, la résine 32 possède des propriétés de rémanence, par exemple par l'utilisation de dopants ayant des propriétés d'absorption et de réémission comme cela est décrit plus en détail dans le document EP 265According to one embodiment, the resin 32 has remanence properties, for example by the use of dopants having absorption and re-emission properties as described in more detail in EP 265
323. Les dopants sont choisis pour avoir une bande d'absorption comprenant la longueur d'onde d'émission de la diode électroluminescente 16 : les dopants se chargent en énergie à l'émission de la diode électroluminescente et restituent cette énergie sous forme lumineuse à une ou plusieurs longueurs d'onde qui leur sont propres.323. The dopants are chosen to have an absorption band comprising the emission wavelength of the light-emitting diode 16: the dopants are charged in energy at the emission of the light-emitting diode and restore this energy in luminous form to one or more wavelengths of their own.
Cette propriété de rémanence offre plusieurs avantages à la présente invention :This property of remanence offers several advantages to the present invention:
- réduire la consommation d'énergie si besoin. En choisissant les dopants de façon adéquate à ce qu'ils réémettent avec une longueur d'onde dans le visible, par exemple sensiblement égale à la longueur d'onde d'émission de la diode électroluminescente utilisée, cette dernière ne peut être allumée que de façon intermittente puisque, entre ces périodes « allumée », les dopants réémettent et assurent une continuité dans l'indication lumineuse de la carte.- reduce energy consumption if necessary. By choosing the dopants adequately so that they re-emit with a wavelength in the visible range, for example substantially equal to the emission wavelength of the light-emitting diode used, the latter can only be switched on intermittently, since, between these "on" periods, the dopants re-emit and provide continuity in the luminous indication of the card.
- continuer à émettre la lumière après le retrait de la puce sans contact du champ électromagnétique du lecteur ou mettre en évidence une utilisation antérieure de la carte, par exemple à l'insu de son propriétaire. Les dopants sont choisis pour avoir des propriétés de rémanence longue, c'est-à-dire qu'ils réémettent l'énergie absorbée pendant une durée longue, par exemple plusieurs minutes dans les exemples mentionnées précédemment.- continue to emit the light after removal of the non-contact chip from the reader's electromagnetic field or highlight an earlier use of the card, for example without the knowledge of its owner. The dopants are chosen to have long remanence properties, that is to say they re-emit the absorbed energy for a long time, for example several minutes in the examples mentioned above.
En référence à la figure 3, on donne à la résine 32 la forme que l'on désire ce qui permet de contrôler le trajet lumineux. Par exemple la résine prend la forme d'un dôme proche de celle d'une lentille optique. Cela est rendu possible grâce à la technique de dépôt dite de « dispense » dans laquelle la résine est déposée à l'aide d'une aiguille le long d'un trajet désiré. Il est ainsi aisé de lui donner la forme souhaitée. En jouant sur les paramètres d'épaisseur et de viscosité de la résine, et de rayon de courbure de la couche externe de celle-ci, il est possible de modifier les paramètres optiques de l'enrobage de résine. Il peut être envisagé de modifier la position du point/plan focal de l'ensemble optique constitué par la résine par rapport à la diode électroluminescente pour faire varier le cône de diffusion de la lumière émise.Referring to Figure 3, we give the resin 32 the desired shape which allows to control the light path. For example, the resin takes the form of a dome close to that of an optical lens. This is made possible by the "dispensing" deposition technique in which the resin is deposited with a needle along a desired path. It is thus easy to give it the desired shape. By adjusting the thickness and viscosity parameters of the resin, and the radius of curvature of the outer layer thereof, it is possible to modify the optical parameters of the resin coating. It may be envisaged to modify the position of the point / focal plane of the optical assembly constituted by the resin relative to the light emitting diode to vary the diffusion cone of the emitted light.
Le module électronique lumineux 1 ainsi créé est intégré au corps de carte à puce (d'épaisseur inférieure à 1 mm) . Plusieurs techniques existent.The light electronic module 1 thus created is integrated in the smart card body (less than 1 mm thick). Several techniques exist.
En référence à la figure 4, le corps 36 de la carte à puce, de type plastique, comprend une cavité 38. L'encartage consiste à intégrer, dans la cavité, le module électronique 1. La cavité 38 peut éventuellement comprendre un matériau de remplissage tel un adhésif. Ce matériau de remplissage est choisi, de préférence, transparent. Dans le cadre d'une carte à puce sans contact, des feuilles de polymère translucides/transparentes 40 sont laminées sur la carte assurant une protection mécanique et la transmission de la lumière émise. Dans l'exemple de la figure 4, le revêtement est constitué de l'empilement de trois feuilles 40. L'utilisation de feuilles de polymères opaques est également possible, auquel cas, elles sont extrêmement fines ce qui permet à tout ou partie de la lumière de passer : ces feuilles très fines peuvent être considérées comme étant translucides. La quantité de lumière passante pouvant être faible, la diode électroluminescente est alors plus visible dans l'obscurité.With reference to FIG. 4, the body 36 of the chip card, of plastic type, comprises a cavity 38. The embedding consists in integrating, into the cavity, the electronic module 1. The cavity 38 may optionally comprise a filling as an adhesive. This filler material is preferably chosen to be transparent. In the context of a contactless smart card, translucent / transparent polymer sheets 40 are laminated on the card providing mechanical protection and transmission of emitted light. In the example of Figure 4, the coating consists of the stack of three sheets 40. The use of opaque polymer sheets is also possible, in which case they are extremely thin which allows all or part of the light to pass: these very thin leaves can be considered to be translucent. As the amount of light passing may be small, the light-emitting diode is then more visible in the dark.
Dans une variante, lors du processus de création de la carte à puce sans contact par lamination des différentes couches, la puce 10 est noyée dans le corps de carte 36.In a variant, during the process of creating the contactless chip card by lamination of the various layers, the chip 10 is embedded in the card body 36.
De façon générale, le corps de la carte ou de l'objet contenant le module est conçu en tout ou partie de manière à permettre le passage de la lumière émise par la diode électroluminescente 16 du module 1 qui est intégré, par exemple par l'utilisation d'un matériau transparent ou translucide : corps de carte transparent, feuilles de polymères translucides, ...In general, the body of the card or object containing the module is designed in whole or in part to allow the passage of the light emitted by the light emitting diode 16 of the module 1 which is integrated, for example by the use of a transparent or translucent material: transparent card body, translucent polymer sheets, ...
Dans un mode de réalisation, le support plastique de la carte est conçu comme un guide d'onde lumineuse ce qui permet de guider la lumière à l'endroit désiré. Par exemple, la lumière est guidée vers la tranche extérieure d'une carte à contact lorsque celle-ci est enfichée dans un lecteur et que la puce n'est pas visible.In one embodiment, the plastic support of the card is designed as a light waveguide which guides the light to the desired location. For example, the light is guided to the outer edge of a contact card when it is plugged into a reader and the chip is not visible.
Pour réaliser ce guide d'onde, l'interface entre le corps de carte 36 et les couches supérieure et inférieure 40 est en partie réfléchissante, ce qui assure la propagation de l'onde dans le corps de la carte 36. Il est particulièrement intéressant que cette interface ait un fort pouvoir réfléchissant (indice supérieur à 50%, par exemple 80%) limitant ainsi l'atténuation du signal lors de la propagation. Les rayons étant transmis dans les couches 40 peuvent être absorbés voire transmis vers l'extérieur de la carte .To achieve this waveguide, the interface between the card body 36 and the upper and lower layers 40 is partly reflective, which ensures the propagation of the wave in the body of the card 36. It is particularly interesting that this interface has a high reflectivity (index greater than 50%, for example 80%) thus limiting the attenuation of the signal during the spread. The rays being transmitted in the layers 40 can be absorbed or transmitted to the outside of the card.
Dans un mode de réalisation, il peut être utilisé un revêtement d'aluminium de part et d'autre du corps de carte 38. L'onde lumineuse est alors entièrement réfléchie sans atténuation du signal lumineux.In one embodiment, an aluminum coating can be used on either side of the card body 38. The light wave is then entirely reflected without attenuation of the light signal.
Également, le substrat du module électronique 1 est un isolant transparent sur lequel est présent un circuit conducteur ou des pistes conductrices, notamment de cuivre.Also, the substrate of the electronic module 1 is a transparent insulator on which is present a conductive circuit or conductive tracks, in particular copper.
Cela permet notamment que la lumière émise par la diode électroluminescente soit visible dans l'espace situé entre les plages de contact d'un module de carte à puce. Dans un autre mode de réalisation, le substrat du module 1 intègre une couche réfléchissante, type miroirThis allows in particular that the light emitted by the light emitting diode is visible in the space between the contact pads of a smart card module. In another embodiment, the substrate of the module 1 incorporates a reflecting layer, mirror type
(couche d'aluminium), pour augmenter la brillance de la diode vue du dessus.(aluminum layer), to increase the brightness of the diode seen from above.
L'utilisation de la présente invention est multiple.The use of the present invention is multiple.
Dans le cas d'une carte à puce, la diode électroluminescente permet d'indiquer toute transaction effectuée avec un lecteur, voire renseigner du taux de transfert en utilisant une fréquence de clignotement de la diode électroluminescente. Plusieurs diodes électroluminescentes de couleur différentes sont également utilisées pour indiquer des informations différentes.In the case of a smart card, the light-emitting diode makes it possible to indicate any transaction carried out with a reader, or even to inform the transfer rate by using a flashing frequency of the light-emitting diode. Several light-emitting diodes of different colors are also used to indicate different information.
Lorsque la carte à puce est sans contact, en référence à la figure 5, la diode électroluminescente (41 munie de la résine d'enrobage de forme bombée) contenue dans le module 1 peut être utilisée comme indicatrice de la présence d'un champ électromagnétique 42 émis par un lecteur 44 de carte sans contact. La lumière diffuse à partir de la diode et au travers de la résine 41. L'antenne d'alimentation 30 est reliée aux deux plages de contact 46 et 48 séparées électriquement par une partie isolante 50.When the smart card is non-contact, with reference to FIG. 5, the light-emitting diode (41 provided with the curved-shaped encapsulating resin) contained in the module 1 can be used as an indicator of the presence of an electromagnetic field 42 issued by a reader 44 of contactless card. The light diffuses from the diode and through the resin 41. The feed antenna 30 is connected to the two contact pads 46 and 48 electrically separated by an insulating part 50.
L'invention peut également être mise en œuvre dans des clés USB de type mémoire, notamment fabriquée en tout ou partie selon la technologie des cartes à puce conformément à des brevets du demandeur. Le module USB possède des plages de contact au format USB, notamment les plages de contact sont linéaires (les unes à côté des autres) et parallèles.The invention can also be implemented in memory type USB sticks, in particular manufactured in whole or in part according to chip card technology in accordance with patents of the applicant. The USB module has contact pads in USB format, in particular the contact pads are linear (next to each other) and parallel.
La diode électroluminescente est connectée en série avec une résistance entre les bornes Data+ et Data- des contacts USB.The light-emitting diode is connected in series with a resistor between the Data + and Data- terminals of the USB contacts.
Dans ce cas, la diode électroluminescente s'allume à l'alimentation du module par le port USB.In this case, the light-emitting diode lights up when the module is powered from the USB port.
La carte peut également cumuler des fonctions contact (transmission par contact électrique) et sans contact (radio fréquence) . Le module électronique peut comprendre deux interfaces de communication et comprendre une antenne sur le module au même titre que les pistes conductrices susmentionnées et des plages de contact électrique. Dans le cas d'une carte ayant une fonction de communication à contacts électriques, cette dernière est introduite dans le lecteur et l'activité de fonctionnement (alimentation) peut être visible sur la tranche de la carte notamment via un guide d' onde décrit précédemment ou encore à travers le corps de la carte et le lecteur si ce dernier est transparent.The card can also combine contact (transmission by electrical contact) and contact (radio frequency) functions. The electronic module may comprise two communication interfaces and include an antenna on the module as well as the aforementioned conductive tracks and electrical contact pads. In the case of a card having a communication function with electrical contacts, the latter is introduced into the reader and the operating activity (power supply) can be visible on the edge of the card notably via a waveguide previously described. or through the body of the card and the reader if it is transparent.
Dans le cas de la carte sans contact, l'indicateur renseigne de façon également fiable la présence d'un champ électromagnétique ou le transfert de données. Selon un mode de réalisation du module électronique, la diode électroluminescente (16) peut être fournie sous différentes formes. Ainsi, on peut recourir à une diode de du type CMS ( (composant monté en surface) . Selon ce type la puce électroluminescente (16) peut être elle-même montée sur un support comportant des pistes de connexion et un second enrobage de protection translucide, ladite diode étant connectée au module par des secondes connexions électriques .In the case of the contactless card, the indicator also reliably records the presence of an electromagnetic field or the transfer of data. According to one embodiment of the electronic module, the light-emitting diode (16) can be provided in different forms. Thus, it is possible to use a diode of the SMD type ((surface-mounted component) According to this type the light-emitting chip (16) can itself be mounted on a support having connection tracks and a second translucent protective coating, said diode being connected to the module by second electrical connections.
Les connexions (secondes) de la diode aux pistes conductrices du module, qui peuvent être réalisées notamment par fil soudé, ou autre, nécessitent d'être protégées au même titre que les connexions (premières) de la puce de circuit intégré éventuellement présent.The connections (seconds) of the diode to the conductive tracks of the module, which can be made in particular by soldered wire, or other, need to be protected as well as the connections (first) of the integrated circuit chip that may be present.
Bien que la puce diode soit enrobée dans le cas du CMS, il n'en est rien des connexions ultérieures connectant les pistes de connexions du CMS aux pistes conductrices du module. L'invention permet de protéger l'ensemble comprenant au moins le CMS, les connexions ultérieures et au moins partiellement les pistes conductrices du substrat ou module. Dans le cas où le support plastique (36) contenant le module présente une fonction de guide d'onde visée précédemment, cette fonction peut être réalisée par au moins une fibre optique ou équivalent agencée dans le support par rapport à la diode de manière à former au moins un guide d'onde dans le support 36 pour la lumière émise par ladite diode électroluminescente (16) . De préférence, le guide d'onde peut émettre transversalement et/ou dans le plan du support .Although the diode chip is coated in the case of the CMS, it is not the case of subsequent connections connecting the connection tracks of the CMS to the conductive tracks of the module. The invention makes it possible to protect the assembly comprising at least the CMS, the subsequent connections and at least partially the conductive tracks of the substrate or module. In the case where the plastic support (36) containing the module has a waveguide function referred to above, this function can be performed by at least one optical fiber or equivalent arranged in the support relative to the diode so as to form at least one waveguide in the medium 36 for the light emitted by said light-emitting diode (16). Preferably, the waveguide may emit transversely and / or in the plane of the support.
Par exemple, la fibre optique peut s'étendre jusqu'à une cavité contenant l'enrobage et/ou le module. Le guide d'onde peut aussi s'étendre jusqu'à l'enrobage en l'absence de cavité dans le cas où le module est noyé dans la matière du support .For example, the optical fiber may extend to a cavity containing the coating and / or the module. The waveguide may also extend to the coating in the absence of a cavity in the case where the module is embedded in the material of the support.
Ainsi, il est possible d'afficher sur le support plastique (36) un motif quelconque, une information lumineuse par le passage de la lumière dans des guides d'ondes ménagées dans le corps du support.Thus, it is possible to display on the plastic support (36) any pattern, a light information by the passage of light in waveguides formed in the body of the support.
Dans un mode de réalisation, la puce de circuit intégré est omise laissant uniquement une diode électroluminescente (par exemple sous forme CMS ou nue...) sur le support avec des pistes conductrices du support formant une antenne plate électromagnétique ou bobine. L'enrobage est dispensé de manière à couvrir l'ensemble formé par la diode, les connexions électriques de la diode aux pistes et au moins partiellement les pistes conductrices (ou de préférence en totalité pour une bonne tenue mécanique du module) . Ainsi le module à LED a exclusivement une fonction d'information selon la présence ou non d'un champ électromagnétique.In one embodiment, the integrated circuit chip is omitted leaving only a diode electroluminescent (for example in CMS or bare form ...) on the support with conductive tracks of the support forming an electromagnetic flat antenna or coil. The coating is dispensed so as to cover the assembly formed by the diode, the electrical connections of the diode to the tracks and at least partially the conductive tracks (or preferably entirely for a good mechanical strength of the module). Thus, the LED module has exclusively an information function according to the presence or absence of an electromagnetic field.
Le module peut donc être utilisé sans la puce de circuit intégré réalisant notamment des fonctions de communication. L'antenne électromagnétique peut être disposée ou non sur le module notamment autour de la LED ou sous la LED ; la LED peut avoir différente formes ou constructions. Le cas échéant la bobine (antenne) peut également être enrobée au moins partiellement de manière à offrir une bonne résistance mécanique.The module can therefore be used without the integrated circuit chip including performing communication functions. The electromagnetic antenna may or may not be arranged on the module, in particular around the LED or under the LED; the LED can have different shapes or constructions. If necessary, the coil (antenna) may also be at least partially coated so as to offer good mechanical strength.
Ce module à LED alimentée par bobine avec ou sans puce de circuit intégré a l'avantage de pouvoir être introduit aisément comme insert dans un corps support (par exemple d'épaisseur inférieure à 1 mm) notamment par lamination ou injection. Il ne requiert aucune connexion dans la mesure où il peut être couplé à une autre bobine disposée dans le support sans avoir besoin d'effectuer une connexion à la bobine du support.This LED module powered by coil with or without integrated circuit chip has the advantage of being easily introduced as an insert in a support body (for example less than 1 mm thick) in particular by lamination or injection. It requires no connection as it can be coupled to another coil in the holder without having to make a connection to the carrier coil.
Cette possibilité de couplage électromagnétique permet aussi une latitude de positionnement du module dans le support. Ce module LED a l'avantage d'être auto alimenté du fait de sa bobine et de pouvoir être fabriqué selon la technologie module pour carte à puce.This possibility of electromagnetic coupling also allows a positioning latitude of the module in the support. This LED module has the advantage of being self-powered because of its coil and to be able to be manufactured according to chip card module technology.
A la place ou en plus d'une bobine passive ci-dessus du corps support, ce dernier peut déjà comprendre un parcours de guides d'onde ou fibres optiques représentant de préférence une information ou plusieurs informations (mot, lettre, chiffres, logo...) . Le module ou le support peut comprendre plusieurs LED (couleurs distinctes le cas échéant) et bobines associées de manière à afficher une information différente en fonction de la fréquence électromagnétique auquel il est soumis.Instead of or in addition to a passive coil above the support body, the latter may already comprise a path of waveguides or optical fibers representing preferably one or more information (word, letter, numbers, logo ...). The module or the support may comprise several LEDs (distinct colors if necessary) and associated coils so as to display different information as a function of the electromagnetic frequency to which it is subjected.
Différentes applications d'information à l'utilisateur peuvent être envisagées comme une indication d'un accès particulier selon un code couleur de la LED activée (parmi plusieurs LED contenues) à l'approche d'une borne électromagnétique (aéroport, gare...) . La carte peut comprendre plusieurs LED associées chacune à une information par exemple une lettre en fibre optique. Et une information peut être sélectionnée et/ou affichée selon la fréquence émise par une borne. Different applications of information to the user can be envisaged as an indication of a particular access according to a color code of the activated LED (among several LEDs contained) at the approach of an electromagnetic terminal (airport, station, etc.). ). The card may comprise several LEDs each associated with information, for example an optical fiber letter. And information can be selected and / or displayed according to the frequency transmitted by a terminal.

Claims

REVENDICATIONS
1. Module électronique (1) comportant au moins une puce nue de circuit intégré (10) connectée à des pistes conductrices d'un support isolant par des premières connexions électriques et au moins une diode électroluminescente (16) connectée aux pistes conductrices par des secondes connexions électriques, caractérisé en ce que l'ensemble formé par au moins le circuit intégré (10), la diode électroluminescente (16) , les première et seconde connexions électriques et au moins partiellement les pistes conductrices, est enrobé d'une résine (32) translucide formant un élément de protection mécanique dudit ensemble et de transmission de la lumière émise par ladite diode électroluminescente (16) .An electronic module (1) comprising at least one bare-chip integrated circuit (10) connected to conductive tracks of an insulating support by first electrical connections and at least one light-emitting diode (16) connected to the conductive tracks by seconds. electrical connections, characterized in that the assembly formed by at least the integrated circuit (10), the light-emitting diode (16), the first and second electrical connections and at least partially the conductive tracks, is coated with a resin (32 ) translucent forming a mechanical protection element of said assembly and transmission of light emitted by said light emitting diode (16).
2. Module électronique (1) comportant au moins un diode électroluminescente (16) connectée par des secondes connexions électriques à des pistes conductrices d'un support isolant, lesdites pistes formant au moins une bobine électromagnétique, caractérisé en ce que l'ensemble formé par au moins la diode électroluminescente (16) , les secondes connexions électriques et au moins partiellement des pistes conductrices, est enrobé d'une résine (32) translucide formant un élément de protection mécanique dudit ensemble et de transmission de la lumière émise par ladite diode électroluminescente (16) .2. Electronic module (1) comprising at least one light-emitting diode (16) connected by second electrical connections to conductive tracks of an insulating support, said tracks forming at least one electromagnetic coil, characterized in that the assembly formed by at least the light-emitting diode (16), the second electrical connections and at least partially conductive tracks, is coated with a translucent resin (32) forming a mechanical protection element of said assembly and transmitting the light emitted by said light-emitting diode (16).
3. Module électronique (1) selon l'une des revendications 1 ou 2, caractérisé en ce que ladite diode électroluminescente (16) est une puce de matériau semiconducteur issue directement d'une galette de matériau semiconducteur (wafer) . 3. Electronic module (1) according to one of claims 1 or 2, characterized in that said light emitting diode (16) is a chip of semiconductor material directly from a wafer of semiconductor material.
4. Module électronique (1) selon l'une des revendications 1 ou 2, caractérisé en ce que ladite diode électroluminescente (16) est du type CMS en ayant la puce électroluminescente (16) elle-même montée sur un support comportant des pistes de connexion et un second enrobage de protection translucide, ladite diode étant connectée au module par des secondes connexions électriques .4. Electronic module (1) according to one of claims 1 or 2, characterized in that said light-emitting diode (16) is of the CMS type having the light-emitting chip (16) itself mounted on a support comprising tracks of connection and a second translucent protective coating, said diode being connected to the module by second electrical connections.
5. Module électronique (1) selon l'une des revendications 1 à 4, caractérisé en ce que ladite diode électroluminescente (16) est connectée en parallèle audit circuit intégré (10) .5. Electronic module (1) according to one of claims 1 to 4, characterized in that said light emitting diode (16) is connected in parallel with said integrated circuit (10).
6. Module électronique (1) selon l'une des revendications 1 à 5, caractérisé en ce que ladite première protection présente une forme bombée au dessus de 1' ensemble .6. Electronic module (1) according to one of claims 1 to 5, characterized in that said first protection has a curved shape above 1''et ensemble.
7. Module électronique (1) selon l'une des revendications 1 à 3, caractérisé en ce que ladite résine7. Electronic module (1) according to one of claims 1 to 3, characterized in that said resin
(32) est transparente.(32) is transparent.
8. Module électronique (1) selon l'une des revendications 1 ou 2, caractérisé en ce que ladite résine (32) comprend des pigments dont la bande de transmission comprend la longueur d'onde d'émission de ladite diode électroluminescente (16) .8. Electronic module (1) according to one of claims 1 or 2, characterized in that said resin (32) comprises pigments whose transmission band comprises the emission wavelength of said light-emitting diode (16) .
9. Module électronique (1) selon l'une des revendications 1 ou 2, caractérisé en ce que ladite résine9. Electronic module (1) according to one of claims 1 or 2, characterized in that said resin
(32) comprend des dopants ayant des propriétés de rémanence et une bande d' excitation comprenant la longueur d' onde d'émission de ladite diode électroluminescente (16), les dopants étant aptes à se charger en énergie à l'émission de ladite diode électroluminescente (16) et à restituer cette énergie, sur un intervalle de temps, sous forme lumineuse à une ou plusieurs longueurs d'onde propres.(32) comprises dopants having remanence properties and an excitation band comprising the emission wavelength of said light - emitting diode (16), the dopants being capable of charging energy at the emission of said light-emitting diode (16) and to restore this energy, over a period of time, in light form at one or more clean wavelengths.
10. Module électronique (1) selon l'une des revendications 1 ou 2, caractérisé en ce qu'il comprend, en outre, une résistance en série avec ladite diode électroluminescente (16) .10. Electronic module (1) according to one of claims 1 or 2, characterized in that it further comprises a resistance in series with said light emitting diode (16).
11. Module électronique (1) selon la revendication 1, caractérisé en ce que ledit circuit intégré (10) est une puce sans contact.11. Electronic module (1) according to claim 1, characterized in that said integrated circuit (10) is a contactless chip.
12. Module électronique (1) selon la revendication précédente, caractérisé en ce que ladite diode électroluminescente (16) est directement alimentée par une boucle d'induction (30) comprise ou non dans ledit module12. Electronic module (1) according to the preceding claim, characterized in that said light-emitting diode (16) is directly supplied by an induction loop (30) included or not in said module
(D •(D •
13. Module électronique (1) selon la revendication 11, caractérisé en ce que ledit module (1) comprend un détecteur de champ magnétique (42) et un circuit de commande de ladite diode électroluminescente (16) en fonction de la détection dudit champ électromagnétique (42).13. Electronic module (1) according to claim 11, characterized in that said module (1) comprises a magnetic field detector (42) and a control circuit of said light-emitting diode (16) as a function of the detection of said electromagnetic field. (42).
14. Module électronique (1) selon la revendication précédente, caractérisé en ce que ledit circuit de commande délivre un signal électrique à ladite diode électroluminescente (16) dont la fréquence est fonction de l'intensité du champ électromagnétique (42) détecté.14. Electronic module (1) according to the preceding claim, characterized in that said control circuit delivers an electrical signal to said light emitting diode (16) whose frequency is a function of the intensity of the electromagnetic field (42) detected.
15. Module électronique (1) selon la revendication 1, caractérisé en ce que ladite diode électroluminescente (16) est directement connectée aux bornes d'alimentation dudit module (1) .15. Electronic module (1) according to claim 1, characterized in that said light-emitting diode (16) is directly connected to the power terminals of said module (1).
16. Dispositif électronique comprenant un module électronique (1) selon l'une quelconque des revendications précédentes .An electronic device comprising an electronic module (1) according to any one of the preceding claims.
17. Dispositif électronique de type carte à puce selon la revendication précédente, caractérisé en ce qu'il comprend un support plastique (36) ayant une cavité apparente et en ce que ledit module électronique (1) est encarté dans ladite cavité.17. Electronic chip card type device according to the preceding claim, characterized in that it comprises a plastic support (36) having an apparent cavity and in that said electronic module (1) is embedded in said cavity.
18. Dispositif électronique de type carte à puce selon la revendication 17, caractérisé en ce que la puce (10) dudit module électronique (1) a une fonction de communication sans contact et le module électronique (1) est noyé dans le corps de ladite carte à puce lors des étapes de lamination de la carte.18. Electronic chip card type device according to claim 17, characterized in that the chip (10) of said electronic module (1) has a non-contact communication function and the electronic module (1) is embedded in the body of said smart card during card lamination steps.
19. Dispositif électronique de type carte à puce selon la revendication précédente, caractérisée en ce que ledit support plastique (36) forme un guide d'onde apte à transmettre la lumière émise par ladite diode électroluminescente (16) .19. Electronic chip card type device according to the preceding claim, characterized in that said plastic support (36) forms a waveguide capable of transmitting the light emitted by said light emitting diode (16).
20. Dispositif électronique selon l'une des revendications 16 à 17, caractérisé en ce qu'il constitue une clé USB.20. Electronic device according to one of claims 16 to 17, characterized in that it constitutes a USB key.
21. Procédé de fabrication d'un module électronique (1) comportant au moins une puce de circuit intégré (10) connectée à des pistes conductrices d'un support isolant et au moins une diode électroluminescente (16) , caractérisé en ce qu'il comprend une étape d'enrobage de l'ensemble formé par au moins le circuit intégré (10) et la diode électroluminescente (16), par une résine (32) isolante et translucide .Method for manufacturing an electronic module (1) comprising at least one integrated circuit chip (10) connected to conductive tracks of an insulating support and at least one light-emitting diode (16), characterized in that it comprises a step of coating the assembly formed by at least the integrated circuit (10) and the light-emitting diode (16) by an insulating and translucent resin (32).
22. Procédé selon la revendication précédente, caractérisé en ce que, lors de ladite étape d'enrobage, ladite résine (32) est déposée de manière à lui donner un rayon de courbure désiré. 22. Method according to the preceding claim, characterized in that, during said coating step, said resin (32) is deposited so as to give it a desired radius of curvature.
EP06725120A 2005-03-22 2006-03-17 Electronic module and chip card with indicator light Ceased EP1861813A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0502844A FR2883653B1 (en) 2005-03-22 2005-03-22 ELECTRONIC MODULE AND CHIP CARD WITH LUMINOUS INDICATOR
PCT/EP2006/060817 WO2006100206A1 (en) 2005-03-22 2006-03-17 Electronic module and chip card with indicator light

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EP1861813A1 true EP1861813A1 (en) 2007-12-05

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US (1) US20080296606A1 (en)
EP (1) EP1861813A1 (en)
CN (1) CN101180640A (en)
FR (1) FR2883653B1 (en)
WO (1) WO2006100206A1 (en)

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FR2883653B1 (en) 2007-05-25
FR2883653A1 (en) 2006-09-29
WO2006100206A1 (en) 2006-09-28
CN101180640A (en) 2008-05-14
US20080296606A1 (en) 2008-12-04

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