EP1849038A2 - Systeme de microscope utilise pour verifier les semi-conducteurs - Google Patents

Systeme de microscope utilise pour verifier les semi-conducteurs

Info

Publication number
EP1849038A2
EP1849038A2 EP06719077A EP06719077A EP1849038A2 EP 1849038 A2 EP1849038 A2 EP 1849038A2 EP 06719077 A EP06719077 A EP 06719077A EP 06719077 A EP06719077 A EP 06719077A EP 1849038 A2 EP1849038 A2 EP 1849038A2
Authority
EP
European Patent Office
Prior art keywords
under test
video signal
device under
video
windows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06719077A
Other languages
German (de)
English (en)
Inventor
Peter Andrews
David Hess
Robert New
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Beaverton Inc
Original Assignee
Cascade Microtech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cascade Microtech Inc filed Critical Cascade Microtech Inc
Publication of EP1849038A2 publication Critical patent/EP1849038A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to a system that includes an imaging device for effectively positioning a probe for testing a semiconductor wafer.
  • Processing semiconductor wafers include processes which form a large number of devices within and on the surface of the semiconductor wafer (hereinafter referred to simply as "wafer"). After fabrication these devices are typically subjected to various electrical tests and characterizations. In some cases the electrical tests characterize the operation of circuitry and in other cases characterize the semiconductor process. By characterizing the circuitry and devices thereon the yield of the semiconductor process may be increased.
  • a probe station comprises a base 10 (shown partially) which supports a platen 12 through a number of jacks 14a, 14b, 14c, 14d which selectively raise and lower the platen vertically relative to the base by a small increment (approximately one-tenth of an inch) for purposes to be described hereafter. Also supported by the base 10 of the probe station is a motorized positioner 16 having a rectangular plunger 18 which supports a movable chuck assembly 20 for supporting a wafer or other test device.
  • the chuck assembly 20 passes freely through a large aperture 22 in the platen 12 which permits the chuck assembly to be moved independently of the platen by the positioner 16 along X, Y and Z axes, i.e., horizontally along two mutually-perpendicular axes X and Y, and vertically along the Z axis.
  • the platen 12 when moved vertically by the jacks 14, moves independently of the chuck assembly 20 and the positioner 16.
  • Mounted atop the platen 12 are multiple individual probe positioners such as 24 (only one of which is shown), each having an extending member 26 to which is mounted a probe holder 28 which in turn supports a respective probe 30 for contacting wafers and other test devices mounted atop the chuck assembly 20.
  • the probe positioner 24 has micrometer adjustments 34, 36 and 38 for adjusting the position of the probe holder 28, and thus the probe 30, along the X, Y and Z axes, respectively, relative to the chuck assembly 20.
  • the Z axis is exemplary of what is referred to herein loosely as the "axis of approach" between the probe holder 28 and the chuck assembly 20, although directions of approach which are neither vertical nor linear, along which the probe tip and wafer or other test device are brought into contact with each other, are also intended to be included within the meaning of the term "axis of approach.”
  • a further micrometer adjustment 40 adjustably tilts the probe holder 28 to adjust planarity of the probe with respect to the wafer or other test device supported by the chuck assembly 20.
  • each supporting a respective probe may be arranged on the platen 12 around the chuck assembly 20 so as to converge radially toward the chuck assembly similarly to the spokes of a wheel.
  • each individual positioner 24 can independently adjust its respective probe in the X, Y and Z directions, while the jacks 14 can be actuated to raise or lower the platen 12 and thus all of the positioners 24 and their respective probes in unison.
  • An environment control enclosure is composed of an upper box portion
  • an electrically conductive resilient foam gasket 46 preferably composed of silver or carbon-impregnated silicone, is interposed peripherally at their mating juncture at the front of the enclosure and between the lower portion 44 and the platen 12 so that an EMI, substantially hermetic, and light seal are all maintained despite relative vertical movement between the two box portions 42 and 44.
  • a similar gasket 47 is preferably interposed between the portion 42 and the top of the platen to maximize sealing.
  • each panel 42 comprises an octagonal steel box 48 having eight side panels such as 49a and 49b through which the extending members 26 of the respective probe positioners 24 can penetrate movably.
  • Each panel comprises a hollow housing in which a respective sheet 50 of resilient foam, which maybe similar to the above-identified gasket material, is placed.
  • Slits such as 52 are partially cut vertically in the foam in alignment with slots 54 formed in the inner and outer surfaces of each panel housing, through which a respective extending member 26 of a respective probe positioner 24 can pass movably.
  • the slitted foam permits X, Y and Z movement of the extending members 26 of each probe positioner, while maintaining the EMI, substantially hermetic, and light seal provided by the enclosure.
  • the foam sheet 50 is sandwiched between a pair of steel plates 55 having slots 54 therein, such plates being slidable transversely within the panel housing through a range of movement encompassed by larger slots 56 in the inner and outer surfaces of the panel housing.
  • a circular viewing aperture 58 is provided, having a recessed circular transparent sealing window 60 therein.
  • a bracket 62 holds an apertured sliding shutter 64 to selectively permit or prevent the passage of light through the window.
  • a stereoscope (not shown) connected to a CRT monitor can be placed above the window to provide a magnified display of the wafer or other test device and the probe tip for proper probe placement during set-up or operation.
  • the window 60 can be removed and a microscope lens (not shown) surrounded by a foam gasket can be inserted through the viewing aperture 58 with the foam providing EMI, hermetic and light sealing.
  • the upper box portion 42 of the environment control enclosure also includes a hinged steel door 68 which pivots outwardly about the pivot axis of a hinge 70 as shown in FIG. 2A.
  • the hinge biases the door downwardly toward the top of the upper box portion 42 so that it forms a tight, overlapping, sliding peripheral seal 68a with the top of the upper box portion.
  • the sealing integrity of the enclosure is likewise maintained throughout positioning movements by the motorized positioner 16 due to the provision of a series of four sealing plates 72, 74, 76 and 78 stacked slidably atop one another.
  • the sizes of the plates progress increasingly from the top to the bottom one, as do the respective sizes of the central apertures 72a, 74a, 76a and 78a formed in the respective plates 72, 74, 76 and 78, and the aperture 79a formed in the bottom 44a of the lower box portion 44.
  • the central aperture 72a in the top plate 72 mates closely around the bearing housing 18a of the vertically-movable plunger 18.
  • the next plate in the downward progression, plate 74 has an upwardly-projecting peripheral margin 74b which limits the extent to which the plate 72 can slide across the top of the plate 74.
  • the central aperture 74a in the plate 74 is of a size to permit the positioner 16 to move the plunger 18 and its bearing housing 18 a transversely along the X and Y axes until the edge of the top plate 72 abuts against the margin 74b of the plate 74.
  • the size of the aperture 74a is, however, too small to be uncovered by the top plate 72 when such abutment occurs, and therefore a seal is maintained between the plates 72 and 74 regardless of the movement of the plunger 18 and its bearing housing along the X and Y axes.
  • This combination of sliding plates and central apertures of progressively increasing size permits a full range of movement of the plunger 18 along the X and Y axes by the positioner 16, while maintaining the enclosure in a sealed condition despite such positioning movement.
  • the EMI sealing provided by this structure is effective even with respect to the electric motors of the positioner 16, since they are located below the sliding plates.
  • the chuck assembly 20 is a modular construction usable either with or without an environment control enclosure.
  • the plunger 18 supports an adjustment plate 79 which in turn supports first, second and third chuck assembly elements 80, 81 and 83, respectively, positioned at progressively greater distances from the probe(s) along the axis of approach.
  • Element 83 is a conductive rectangular stage or shield 83 which detachably mounts conductive elements 80 and 81 of circular shape.
  • the element 80 has a planar upwardly-facing wafer-supporting surface 82 having an array of vertical apertures 84 therein.
  • apertures communicate with respective chambers separated by O-rings 88, the chambers in turn being connected separately to different vacuum lines 90a, 90b, 90c (FIG. 6) communicating through separately-controlled vacuum valves (not shown) with a source of vacuum.
  • the respective vacuum lines selectively connect the respective chambers and their apertures to the source of vacuum to hold the wafer, or alternatively isolate the apertures from the source of vacuum to release the wafer, in a conventional manner.
  • the separate operability of the respective chambers and their corresponding apertures enables the chuck to hold wafers of different diameters.
  • auxiliary chucks such as
  • Each auxiliary chuck 92, 94 is detachably mounted on the corners of the element 83 by screws (not shown) independently of the elements 80 and 81 for the purpose of supporting contact substrates and calibration substrates while a wafer or other test device is simultaneously supported by the element 80.
  • Each auxiliary chuck 92, 94 has its own separate upwardly-facing planar surface 100, 102 respectively, in parallel relationship to the surface 82 of the element 80. Vacuum apertures 104 protrude through the surfaces 100 and 102 from communication with respective chambers within the body of each auxiliary chuck.
  • Each of these chambers in turn communicates through a separate vacuum line and a separate independently-actuated vacuum valve (not shown) with a source of vacuum, each such valve selectively connecting or isolating the respective sets of apertures 104 with respect to the source of vacuum independently of the operation of the apertures 84 of the element 80, so as to selectively hold or release a contact substrate or calibration substrate located on the respective surfaces 100 and 102 independently of the wafer or other test device.
  • An optional metal shield 106 may protrude upwardly from the edges of the element 83 to surround the other elements 80, 81 and the auxiliary chucks 92, 94.
  • All of the chuck assembly elements 80, 81 and 83, as well as the additional chuck assembly element 79, are electrically insulated from one another even though they are constructed of electrically conductive metal and interconnected detachably by metallic screws such as 96.
  • the electrical insulation results from the fact that, in addition to the resilient dielectric O-rings 88, dielectric spacers 85 and dielectric washers 86 are provided. These, coupled with the fact that the screws 96 pass through oversized apertures in the lower one of the two elements which each screw joins together thereby preventing electrical contact between the shank of the screw and the lower element, provide the desired insulation. As is apparent in FIG.
  • the dielectric spacers 85 extend over only minor portions of the opposing surface areas of the interconnected chuck assembly elements, thereby leaving air gaps between the opposing surfaces over major portions of their respective areas. Such air gaps minimize the dielectric constant in the spaces between the respective chuck assembly elements, thereby correspondingly minimizing the capacitance between them and the ability for electrical current to leak from one element to another.
  • the spacers and washers 85 and 86 are constructed of a material having the lowest possible dielectric constant consistent with high dimensional stability and high volume resistivity.
  • a suitable material for the spacers and washers is glass epoxy, or acetyl homopolymer marketed under the trademark Delrin by E. I. DuPont.
  • the chuck assembly 20 also includes a pair of detachable electrical connector assemblies designated generally as 108 and 110, each having at least two conductive connector elements 108a, 108b and 110a, 110b, respectively, electrically insulated from each other, with the connector elements 108b and HOb preferably coaxially surrounding the connector elements 108a and 110a as guards therefor.
  • the connector assemblies 108 and 110 can be triaxial in configuration so as to include respective outer shields 108c, HOc surrounding the respective connector elements 108b and 110b, as shown in FIG. 7.
  • the outer shields 108c and 110c may, if desired, be connected electrically through a shielding box 112 and a connector supporting bracket 113 to the chuck assembly element 83, although such electrical connection is optional particularly in view of the surrounding EMI shielding enclosure 42, 44.
  • the respective connector elements 108a and 110a are electrically connected in parallel to a connector plate 114 matingly and detachably connected along a curved contact surface 114a by screws 114b and 114c to the curved edge of the chuck assembly element 80.
  • the connector elements 108b and 110b are connected in parallel to a connector plate 116 similarly matingly connected detachably to element 81.
  • the connector elements pass freely through a rectangular opening 112a in the box 112, being electrically insulated from the box 112 and therefore from the element 83, as well as being electrically insulated from each other.
  • Set screws such as 118 detachably fasten the connector elements to the respective connector plates 114 and 116.
  • triaxial cables 118 and 120 form portions of the respective detachable electrical connector assemblies 108 and 110, as do their respective triaxial detachable connectors 122 and 124 which penetrate a wall of the lower portion 44 of the environment control enclosure so that the outer shields of the triaxial connectors 122, 124 are electrically connected to the enclosure.
  • Further triaxial cables 122a, 124a are detachably connectable to the connectors 122 and 124 from suitable test equipment such as a Hewlett-Packard 4142B modular DC source/monitor or a Hewlett-Packard 4284A precision LCR meter, depending upon the test application.
  • the cables 118 and 120 are merely coaxial cables or other types of cables having only two conductors, one conductor interconnects the inner (signal) connector element of a respective connector 122 or 124 with a respective connector element 108a or 110a, while the other conductor connects the intermediate (guard) connector element of a respective connector 122 or 124 with a respective connector element 108b, HOb.
  • U.S. Pat. No. 5,532,609 discloses a probe station and chuck and is hereby incorporated by reference.
  • a microscope In order to position probes for testing semiconductors, typically on a conductive pad, a microscope may be used. The process for positioning the microscope on the semiconductor is time consuming and laborious. A wide angle field of view objective lens for the microscope is selected and installed. Then the probe is brought into the general field of view of the microscope with the semiconductor thereunder with the objective lens focused on the upper region of the probe. Hence, the upper region of the probe farther away from the probe tip is generally in focus. The lower regions of the probe and the probe tip are generally not in focus due to the limited depth of field of the objective lens. Also, at this point only the larger features of the semiconductor are discernable.
  • the zoom of the microscope may be increased by the operator and the microscope shifted to focus on a further distant part of the probe which provides a narrower field of view so that a middle region of the microscope is in focus.
  • the upper region of the probe and the probe tip region are generally not in focus when viewing the middle region of the probe due to the limited depth of field of the objective lens.
  • the zoom of the microscope may be increased by the operator and the microscope shifted to fucus on the probe tip which provides an increasingly narrower field of view so that the probe tip region is generally in focus together with the corresponding devices under test.
  • the lower regions of the probe and the upper regions of the probe are generally not in focus when viewing the probe tip region of the probe due to the limited depth of field of the objective lens.
  • the operator will desire to use a higher magnification microscope, which requires the microscope to be retracted, the objective lens changed, and the microscope moved back into position. Unfortunately, if any movement of the wafer relative to the probe occurs due to even slight vibration, the probe will not longer be in close alignment. Thus, the objective lens will typically be changed back to one with a lower magnification and the process started all over again.
  • One embodiment of the invention includes a probing system for a device under test, including an objective lens sensing the device under test through a single optical path, a first imaging device sensing a first video sequence of the device under test at a first magnification from the single optical path, a second imaging device sensing a second video sequence of the device under test at a second magnification from the single optical path, a third imaging device sensing a third video sequence of the device under test at a third magnification from the single optical path and providing a video signal to a display that simultaneously presents the first video signal, the second video signal, and the third video signal to a monitor.
  • FIG. 1 is a partial front view of an exemplary embodiment of a wafer probe station constructed in accordance with the present invention.
  • FIG. 2 is a top view of the wafer probe station of FIG. 1.
  • FIG. 2A is a partial top view of the wafer probe station of FIG. 1 with the enclosure door shown partially open.
  • FIG. 3 is a partially sectional and partially schematic front view of the probe station of FIG. 1.
  • FIG. 3 A is an enlarged sectional view taken along line 3A--3A of FIG.
  • FIG. 4 is a top view of the sealing assembly where the motorized positioning mechanism extends through the bottom of the enclosure.
  • FIG. 5 A is an enlarged top detail view taken along line 5A--5A of FIG.
  • FIG. 5B is an enlarged top sectional view taken along line 5B--5B of
  • FIG. 6 is a partially schematic top detail view of the chuck assembly, taken along line 6 ⁇ 6 of FIG. 3. IU
  • FIG. 7 is a partially sectional front view of the chuck assembly of FIG.
  • FIG. 8 illustrates a probing system together with a microscope.
  • FIG. 9 illustrates another probing system together with a microscope.
  • FIG. 10 illustrates a graphical user interface
  • FIG. 11 illustrates another graphical user interface.
  • FIG. 12 illustrates another graphical user interface.
  • FIG. 13 illustrates another graphical user interface.
  • FIG. 14 illustrates another graphical user interface.
  • FIG. 15 illustrates a pattern of devices under test.
  • FIG. 16 illustrates a pattern of devices under test and a set of automatically populated windows.
  • a probing system may include a probing environment 200 having a support 202 for a wafer 204 together with a microscope 206.
  • the microscope 206 preferably includes a single optical path 210 that passes through an objective lens 212.
  • the system preferably only includes a single optical path for imaging the device under test. By including a single optical path 210 from the device under test the registration and alignment that would have been otherwise necessary between different objective lens from a plurality of microscopes is alleviated.
  • the optical path may pass through a first lens 214 which images the light from the device under test on a first imaging device 216, such as a charge coupled device.
  • An optical splitting device 218 may be used to direct a portion 220 of the light from being imaged on the first imaging device 216.
  • the light 220 may be reflected by a mirror 221 and pass through a second lens 222.
  • An optical splitting device 226 and mirror 230 may be used to direct a portion 228 of the light being imaged on a second imaging device 224. Accordingly, the light from the second lens 222 images the light on a second imaging device 224.
  • the light passing through the optical splitting device 226 passes through a lens 232 and is imaged on a third imaging device 234.
  • the first imaging device 216 images the device under test at a first magnification based upon the objective lens 212 and the first lens 214. Normally the first imaging device 216 images a relatively wide field of view.
  • the second imaging device 224 images the device under test at a second magnification based upon the objective lens 212, the first lens 214, and the second lens 222. Normally the second imaging device 216 images a medium field of view, being of a greater magnification than the relatively wide field of view of the first imaging device 216.
  • the third imaging device 234 images the device under test at a third magnification based upon the objective lens 212, the first lens 214, the second lens 222, and the third lens 232. Normally the third imaging device 234 images a narrow field of view, being of a greater magnification than the medium field of view of the second imaging device 224.
  • the three imaging devices provide different fields of view of the same device.
  • the use of a single optical path 212 increases the likelihood that each of the images from each of the imaging devices are properly aligned with each other, such as centered one within another. Internal to the microscope there may be multiple optical paths.
  • the microscope 206 includes an output 238 connected to a cable 240, such as a gigabit network cable.
  • a cable 240 such as a gigabit network cable.
  • the multiple video signals in the cable 240 are preferably simultaneous video sequences captured as a series of frames from each of the respective imaging devices 216, 224, 234.
  • the video signals are preferably simultaneously transmitted, albeit they may be multiplexed within the cable 240.
  • the microscope 206 may have multiple outputs and multiple cables, with one for each imaging device and video signal, although it is preferable that the microscope 206 includes a single output for the video signals.
  • the multiple video signals transmitted within the cable 240 are provided to a computing device 250.
  • the input feeds in many cases are provided to a graphics card connected to an AGP interconnection or PCI interconnection. Accordingly, the computing device receives a plurality of simultaneous video streams.
  • Each of the video streams may be graphically enhanced, as desired, such as by sharpening and using temporal analysis to enhance details.
  • the three video feeds may be combined into a single composite video feed with a portion of each video feed being illustrated on the composite video feed and provided to a single display for presentation to the viewer. In this case, each of the viewers would be able to observe multiple video feeds on a single display.
  • the three video feeds may be provided to a plurality of monitors 260, 262, such as two or three monitors.
  • the video signal to one or more of the monitors may include a composite of two or more video streams from the microscope.
  • the composite video stream indicates that multiple video streams are presented. This is normally done by combining the signals into a single video stream but other techniques may be used, even including presenting two separate video streams on the same monitor.
  • the probe 304 and device under test 306 in a first window 302 of a display 300 using the first imaging device 216.
  • the probe 304 may be generally aligned with the device under test 306. This permits the operator to view a large region of devices under test and align the probe 304 with the desired device under test out of a group of devices under test.
  • the second imaging device 224 By using the second imaging device 224 a narrower field of view may be observed of the probe 304 and the device under test 306.
  • the details of the device under test 306 may be observed in the second window 310 which permits the probe 304 to be more accurately aligned with the device under test 306.
  • the third imaging device 234 an even narrower field of view may be observed of the probe 304 and the device under test 306.
  • the details of the device under test 306 may be observed in the third window 320 which permits the probe 304 to be more accurately aligned with the device under test 306. This permits the operator to view a large region of devices under test and align the probe 304 using the first window 302, to view a narrower region of the device under test to align the probe 304 with the second window 310, and to further accurately position the probe 304 on the device under test 306 using the third window 320.
  • the operator can roughly guide the probe using the first window 302, further guide the probe more accurately using the second window 310, and then guide the probe to the device under test using the third window 320, without the need to zoom in and out to maintain the focus of the probe.
  • Additional windows and imaging devices may be used, as desired.
  • the video for each of the windows may be provided by a single imaging device, two imaging devices, or three or more imaging devices.
  • the probe 304 and the device under test 306 comes into view in the first window 302. Thereafter, as the operator moves the probe 304 closer to the device under test 306, the probe 304 comes into view in the second window 310. The operator may thus move the probe 304, while simultaneously viewing the probe 304 and the device under test 306 in the second window 310. Then, as the operator moves the probe closer to the device under test 306, the probe 304 comes into view in the third window 320. The operator may thus move the probe 304, while simultaneously viewing the probe 304 and the device under test 306 in the third window 320, such that the probe is positioned on the device under test. Accordingly, the x, y, and z tip of the probe 304 may be effectively aligned with the device under test 306.
  • the system may include a zoom 402 feature for a window 400 to zoom in and out on the device under test.
  • the range of the zoom may be scaled from 0 to 100, with zero being the widest angle and 100 being the narrowest angle.
  • the first imaging device 216 may be used as the basis upon which to provide a digital zoom for the zoom of images within range A.
  • the 'native' imaging mode of the first imaging device 216 is at the zero point.
  • the second imaging device 224 may be used as the basis upon which to provide a digital zoom for the zoom of images within range B.
  • the 'native' imaging mode of the second imaging device 224 may be at the 1/3 point.
  • the third imaging device 234 may be used as the basis upon which to provide a digital zoom for the zoom of images within range C.
  • the 'native' imaging mode of the third imaging device 234 may be at the 2/3 point. Using a digital zoom based upon the best available image quality (next lower native mode) provides a higher quality digital zoom, such as using the third imaging device 234 for a digital zoom of 80%.
  • the 'native' mode generally refers to a non-digitally zoomed image from the imaging device.
  • a quality mode 410 may be selected.
  • the available zooms may be set at 0, 1/3, and 2/3 which represent that 'native' non- digitally zoomed images from the respective imaging devices.
  • some imaging devices may have multiple 'native' non-digitally zoomed images depending on the sampling used to acquire the images.
  • other selected zooms may be provided, such as for example, Vz way in each of the A, B, and C ranges.
  • the zoom feature 402 may be limited to less than all of the available digital zooms to maintain image quality that may otherwise not result from excess digital zooming. For example, there may be one or more regions of the zoom range of 5% or more (based upon a scale of 0 to 100) each that are not selectable by the operator.
  • the system may also include multiple windows
  • Window 400 may be any zoom but is preferably the widest view. In this manner, the operator may be able to simultaneously observe multiple regions of the device under test, each of which may be associated with a different probe testing a different device under test.
  • the principal window 400 may be updated at a video frame rate and each of the windows 420, 422, 424 may likewise be updated at the video frame rate.
  • the images may be updated at a rate slower than the video frame rate, if desired.
  • a vertical mode 430 may be selected that presents a set of windows 432 that are arranged in a vertical arrangement of 3x2 windows.
  • window 434A would relate to a ground path of a left probe
  • window 434B would relate to a signal path of the left probe
  • window 434C would relate to a ground path of the left probe
  • window 434D would relate to a ground path of a right probe
  • window 434E would relate to a signal path of the right probe
  • window 434F would relate to a ground path of the right probe.
  • the windows 434A-F are oriented in a similar orientation to the pair of probes being used on the devices under test.
  • a horizontal mode 438 may be selected that presents a set of windows 436 that are arranged in a vertical arrangement of 2x3 windows.
  • window 440A would relate to a ground path of a upper probe
  • window 440B would relate to a signal path of the upper probe
  • window 440C would relate to a ground path of the upper probe
  • window 440D would relate to a ground path of a lower probe
  • window 440E would relate to a signal path of the lower probe
  • window 440F would relate to a ground path of the lower probe.
  • the windows 440 A-F are oriented in a similar orientation to the pair of probes being used on the devices under test.
  • the operator may need a particular configuration of windows to correspond with a particular probing configuration of probe.
  • the user may select layout 450, which permits the user to layout a set of windows on the screen in any desirable configuration.
  • the user may save and retrieve these custom layouts for future use.
  • a region of the video 500 of the image that includes a set of probe pads 502 thereon.
  • a set of needles or contacts are arranged with a pattern matching that of the probe pads 502.
  • the operator aligns a needle with the one of the pads, such as the upper left pad 504.
  • the operator aligns a needle with one of the other contacts, such as the lower right pad 506.
  • the operator aligns the lower left needle 508 and the upper right needle 510.
  • the operator may likewise align the central needles with an upper central pad 512 and a lower central pad 514.
  • each of the needles typically needs to be checked and re-checked several times in order to ensure proper alignment.
  • the user may select a region including the devices under test by drawing a box 520 around the desired devices under test 502.
  • the box 520 is preferably indicated by selecting a pair of opposing corners closely surrounding the devices under test 502.
  • Based upon the box 520 an upper left region 522, a lower left region 528, an upper right region 520, and a lower right region 532 may be automatically selected free from user selection.
  • These regions 520, 522, 528, and 532 are provided in respective larger windows so that the operator can more easily view the respective regions.
  • the larger windows are likewise arranged in a manner consistent with the devices under test so that each region is more easily identified.
  • the needles of the probes or probe card can be aligned with the devices under test 502 while viewing the larger windows which easily illustrate the alignment of the probes without the need to move the microscope. In this manner, the operator can view the probes at all four corners.
  • the system provides indications of a central region, such as regions 524 and 530. In this manner, the operator can view the probes at all four corners and the central regions also.
  • the system may permit the user to modify the size and location of each of the regions 522, 524, 526, 528, 530, 532. Other configurations and selections may likewise be automatically populated, as desired.
  • the video may originate with a single imaging device or may be displayed from multiple different imaging devices to achieve increased image quality.
  • the probe needles comes into view in one or more of the windows.
  • the user may adjust the x, y, z, and theta of the probe card so that the needles are aligned on the pads shown in the larger windows. In this manner, the user probe is effectively aligned without the need to move the microscope back and forth.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne un système comprenant un dispositif d'imagerie qui permet de positionner de manière efficace une sonde servant à vérifier une tranche de semi-conducteur.
EP06719077A 2005-01-31 2006-01-19 Systeme de microscope utilise pour verifier les semi-conducteurs Withdrawn EP1849038A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US64895205P 2005-01-31 2005-01-31
US64895105P 2005-01-31 2005-01-31
US64874705P 2005-01-31 2005-01-31
PCT/US2006/002109 WO2006083581A2 (fr) 2005-01-31 2006-01-19 Systeme de microscope utilise pour verifier les semi-conducteurs

Publications (1)

Publication Number Publication Date
EP1849038A2 true EP1849038A2 (fr) 2007-10-31

Family

ID=36777745

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06719077A Withdrawn EP1849038A2 (fr) 2005-01-31 2006-01-19 Systeme de microscope utilise pour verifier les semi-conducteurs

Country Status (5)

Country Link
EP (1) EP1849038A2 (fr)
JP (1) JP2008529304A (fr)
DE (1) DE202006020618U1 (fr)
TW (1) TWI304625B (fr)
WO (1) WO2006083581A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI418818B (zh) * 2012-10-29 2013-12-11 King Yuan Electronics Co Ltd 具改良式壓柱之測試座及其測試系統
TWI548876B (zh) * 2015-01-13 2016-09-11 京元電子股份有限公司 半導體元件測試裝置及其測試設備
JP7240913B2 (ja) * 2019-03-18 2023-03-16 株式会社キーエンス 画像測定装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244803A (ja) * 1984-05-21 1985-12-04 Disco Abrasive Sys Ltd 自動精密位置合せシステム
US5051825A (en) * 1989-04-07 1991-09-24 Pressco, Inc. Dual image video inspection apparatus
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US6469746B1 (en) * 1992-12-28 2002-10-22 Sanyo Electric Co., Ltd. Multi-vision screen adapter
US5880772A (en) * 1994-10-11 1999-03-09 Daimlerchrysler Corporation Machine vision image data acquisition system
JPH09186917A (ja) * 1995-12-29 1997-07-15 Kokusai Electric Co Ltd 撮像装置
JP2001284416A (ja) * 2000-03-30 2001-10-12 Nagase & Co Ltd 低温試験装置
JP3627914B2 (ja) * 2000-05-23 2005-03-09 シャープ株式会社 車両の周囲監視システム
JP2002335435A (ja) * 2001-05-11 2002-11-22 Fujitsu Ltd 映像撮影装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2006083581A3 *

Also Published As

Publication number Publication date
TW200703535A (en) 2007-01-16
TWI304625B (en) 2008-12-21
JP2008529304A (ja) 2008-07-31
DE202006020618U1 (de) 2009-03-12
WO2006083581A3 (fr) 2007-07-05
WO2006083581A2 (fr) 2006-08-10

Similar Documents

Publication Publication Date Title
US7656172B2 (en) System for testing semiconductors
US7535247B2 (en) Interface for testing semiconductors
US7348787B2 (en) Wafer probe station having environment control enclosure
EP0574149B1 (fr) Station de test pour galette de silicium ayant des systèmes intégrés de garde, de connexion de prise de température et de blindage
US7514915B2 (en) Chuck for holding a device under test
US6313649B2 (en) Wafer probe station having environment control enclosure
EP2545358B1 (fr) Système pour tester des semi-conducteurs
US20060169897A1 (en) Microscope system for testing semiconductors
EP1849038A2 (fr) Systeme de microscope utilise pour verifier les semi-conducteurs
WO2004107400A2 (fr) Mandrin servant a maintenir un dispositif soumis a un essai

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20070822

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

DAX Request for extension of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR GB NL

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Effective date: 20110127