EP1834377A1 - Antenna array for a radar transceiver - Google Patents

Antenna array for a radar transceiver

Info

Publication number
EP1834377A1
EP1834377A1 EP05817033A EP05817033A EP1834377A1 EP 1834377 A1 EP1834377 A1 EP 1834377A1 EP 05817033 A EP05817033 A EP 05817033A EP 05817033 A EP05817033 A EP 05817033A EP 1834377 A1 EP1834377 A1 EP 1834377A1
Authority
EP
European Patent Office
Prior art keywords
antenna
chip
arrangement according
antenna arrangement
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05817033A
Other languages
German (de)
French (fr)
Inventor
Klaus VOIGTLÄNDER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1834377A1 publication Critical patent/EP1834377A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
    • H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H01Q1/405—Radome integrated radiating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/22—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of a single substantially straight conductive element
    • H01Q19/24—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using a secondary device in the form of a single substantially straight conductive element the primary active element being centre-fed and substantially straight, e.g. H-antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

  • the invention relates to an antenna arrangement for a radar transceiver, in particular for distance and / or speed determination in the environment of motor vehicles according to the preamble of claim 1.
  • Such radar transceivers are used in the microwave and millimeter-wave range for locating objects in space or for speed determination, in particular of motor vehicles.
  • Such radar transceivers are used in particular for driver assistance systems, which are used, for example, to determine the distance of a vehicle ahead of another vehicle and for distance control.
  • a radar transceiver for locating objects in space and determining the speed emits highest-frequency signals in the form of electromagnetic waves, which are reflected by the target object, and are received by the radar transceiver and further processed.
  • several of these radar transceivers are interconnected to form a complete module.
  • frequencies in a range of 76 to 81 GHz are preferably used.
  • the antenna comprises a first part arranged on the chip and a second part arranged at a distance from the first part and radiation-coupled to the first part.
  • the second part is in this case arranged, for example, on a radome.
  • the two antenna parts can be formed by a patch or a dipole or by a slot, wherein the patch or the dipole is excited by a further patch, a slot or a dipole opposite it.
  • the invention is therefore based on the object of developing an antenna arrangement for a radar transceiver of the generic type to the effect that with a simple assembly of the components of the radar transceiver and in particular its antenna even in frequency ranges around 77, 120 or 140 GHz high reproducibility and high reliability is given.
  • the basic idea of the invention is to arrange the second part of the antenna on an antenna carrier or a further chip, which itself is fastened over the first part by flip-chip connections.
  • the second part of the antenna is therefore not, as known from the prior art, attached to a housing part which is arranged by mechanical mounting over the first, the radiation part of the antenna forming part of the antenna. Due to the surface tension caused by flip-chip connections self-focusing effect of the antenna carrier or the further chip and thus the second part of the antenna are aligned on the first arranged on the chip antenna part. Tolerances of less than 20 ⁇ m can be realized here.
  • the antenna carrier can be made of a variety of materials. In an advantageous embodiment, it is provided that the antenna carrier is formed by a soft-boar substrate. But it can also be realized from a metallized ceramic carrier.
  • the chip on which the first part of the antenna is arranged can likewise consist of a softboard substrate. It can also be a ceramic or a low-temperature cofired ceramic (LTCC).
  • LTCC low-temperature cofired ceramic
  • the chip and the further chip can be formed by a silicon and / or silicon germanium and / or silicon germanium chip. Such a chip can in turn be mounted on a carrier made of softboard, ceramic or LTCC. Chip and carrier form a unit in this case.
  • the flip-chip connections are advantageously realized by substantially cut off spherical solder joints, so-called bumps.
  • bumps In case of R. 310719 4
  • Bumps with a ball diameter of 100 microns in this way tolerances between the first and second antenna part of less than 20 microns can be realized.
  • At least part of the solder joints forms a shielding compound, which is electrically conductively connected to a ground of the chip.
  • a shielding compound which is electrically conductively connected to a ground of the chip.
  • the shielding can be very advantageously further improved in that the solder joints, the so-called bumps, have a distance from one another which is smaller than 1/10 of the wavelength of the radiation emitted by the antenna.
  • the arrangement of the antenna carrier in flip-chip connection technology over the first part of the antenna on a chip has the great advantage that due to the self-focusing described a very accurate reproducibility can be realized.
  • an assembly of the antenna carrier is parallel to the chip surface on which the first part of the antenna is arranged, even still feasible if the chip itself is mounted obliquely.
  • Fig. 1 shows schematically a sectional view of an embodiment of one of the
  • FIG. 2 is a perspective view of the antenna arrangement shown in FIG. 1; FIG.
  • FIG. 3 shows schematically another exemplary embodiment of an antenna arrangement of a radar transceiver in slot-patch coupling making use of the invention
  • FIG. 4 shows a further exemplary embodiment of an antenna arrangement making use of the invention for a radar transceiver in patch-symmetrical dipole coupling
  • FIG. 5 shows an exemplary embodiment of an antenna arrangement making use of the invention for a radar transceiver in patch patch coupling with ground edge.
  • a radar transceiver shown in FIG. 1 and FIG. 2 comprises a chip 101 which is arranged on a carrier 100, for example a softboard substrate or a ceramic. On the softboard substrate, a first part 110 of an antenna is arranged. Arranged above the first part 110 of the antenna, for example a patch, is a second, metallic antenna part 210, which is carried by an antenna carrier 400, for example likewise a softboard substrate.
  • another chip 420 carrying the antenna part may also be provided.
  • the antenna carrier 400 or the further chip 420 are mounted on the chip 101 or the carrier 100 by means of so-called bumps 300, ie solder joints, which have a substantially cut-off spherical shape, on contact surfaces 203, 403 in flip-chip technology. Due to the surface tension caused self-focusing effect is achieved by this type of attachment a very high precision of the alignment of the two antenna parts to each other. Thus, with a diameter of the bumps 300 of 100 microns tolerances of less than 20 microns can be realized. As a result, the second part 210 of the antenna, the metallic antenna structure is very R. 310719 6
  • the further chip 420 can be controlled very advantageously by the bumps, it can also be arranged in principle even on a further carrier (not shown).
  • a slot 112 is arranged as a first antenna part instead of a patch.
  • a symmetrical dipole 114, 115 is arranged on the chip, which forms the first antenna part.
  • the patch 210 is arranged as a second antenna part.
  • the invention is not limited to the illustrated antenna structures, but purely in principle, any other shapes such as rectangular, round, beveled patches or dipoles can be provided.
  • various forms of slot couplings are possible, for example, rectangular, round, waveguide feeds and the like.
  • Fig. 5 differs from the embodiment shown in Fig. 1 and Fig. 2 in that in addition to the two antenna parts 110, 210 an additional Masseumrandung 220 is provided on the antenna carrier 400, which is electrically connected to the arranged on the chip 101 mass is. R. 310719 7
  • the chip 101 may be a silicon, silicon germanium or silicon germanium: C chip. It can also be formed by a CMOS device.
  • the carrier 100 and the further carrier (not shown) on which the further chip 420 can be arranged are preferably formed by a softboard, a ceramic or a low-temperature co-fired ceramic (LTCC).
  • the distance of the bumps 300 from each other can be chosen arbitrarily in principle. In order to achieve an additional shielding effect, the spacing of the bumps should be less than 1/10 of the wavelength emitted by the antenna arrangement.

Abstract

The invention relates to an antenna array for a radar transceiver, especially for distance and/or speed detection in the surroundings of motor vehicles. Said antenna array comprises at least one first part (110; 112; 114, 115), arranged on a chip (101), and a second part (210) which is arranged at a distance to the first part (110; 112; 114, 115) and which is indirectly fed by the first part (110; 112; 114, 115). The inventive array is characterized in that the second part (210) of the antenna is mounted on an antenna support (400) or an additional chip (420) which is mounted above the first part (110; 112; 114, 115) by means of flip-chip connections (300).

Description

R. 310719 1R. 310719 1
Antennenanordnung für einen Radar-TransccivcrAntenna arrangement for a radar transceiver
Stand der TechnikState of the art
Die Erfindung betrifft eine Antennenanordnung für einen Radar-Transceiver, insbesondere zur Abstands- und/oder Geschwindigkeitsermittlung im Umfeld von Kraftfahrzeugen nach dem Oberbegriff des Anspruchs 1.The invention relates to an antenna arrangement for a radar transceiver, in particular for distance and / or speed determination in the environment of motor vehicles according to the preamble of claim 1.
Derartige Radar-Transceiver, das heißt Sende-/Empfängermodule, kommen im Mikrowellen- und Millimeterwellenbereich zur Ortung von Gegenständen im Raum oder zur Geschwindigkeitsbestimmung, insbesondere von Kraftfahrzeugen zum Einsatz. Solche Radar-Transceiver werden insbesondere für Fahrerassistenzsysteme verwendet, welche beispielsweise zur Bestimmung des Abstands eines vor einem Fahrzeug vorausfahrenden weiteren Fahrzeugs und zur Abstandsregelung eingesetzt werden. Dabei sendet ein solcher Radar-Transceiver zur Ortung von Gegenständen im Raum und zur Geschwindigkeitsbestimmung höchstfrequente Signale in Form elektromagnetischer Wellen aus, die vom Zielgegenstand reflektiert werden, und von dem Radar-Transceiver wieder empfangen und weiterverarbeitet werden. Nicht selten werden dabei mehrere dieser Radar- Transceiver zu einem Gesamtmodul verschaltet. Bei einem Einsatz in Automobilen werden bevorzugt Frequenzen in einem Bereich von 76 bis 81GHz verwendet. R. 310719 2Such radar transceivers, that is to say transceiver modules, are used in the microwave and millimeter-wave range for locating objects in space or for speed determination, in particular of motor vehicles. Such radar transceivers are used in particular for driver assistance systems, which are used, for example, to determine the distance of a vehicle ahead of another vehicle and for distance control. In this case, such a radar transceiver for locating objects in space and determining the speed emits highest-frequency signals in the form of electromagnetic waves, which are reflected by the target object, and are received by the radar transceiver and further processed. Not infrequently, several of these radar transceivers are interconnected to form a complete module. When used in automobiles, frequencies in a range of 76 to 81 GHz are preferably used. R. 310719 2
Aus der DE 19648 203 Al ist ein mehrstrahliges Kraftfahrzeug-Radarsystem bekannt geworden. Bei diesem Radarsystem sind die Sende- und Empfangseinheiten sowie die Antenne auf unterschiedlichen Trägern angeordnet.From DE 19648 203 Al a multi-beam automotive radar system has become known. In this radar system, the transmitting and receiving units and the antenna are arranged on different carriers.
Aus der nicht vorveröffentlichten Anmeldung der Anmelderin mit der Rollennummer 309374 geht eine technisch einfache und kostengünstig herzustellende Antennenanordnung für einen Einchip-Radar-Transceiver mit insbesondere sehr dünner elektrisch wirksamer Oxidschicht hervor, der bei hohen Arbeitsfrequenzen, besonders in einem Bereich von 76 bis 81 GHz eine große Reproduzierbarkeit, eine hohe Zuverlässigkeit und eine hohe Bandbreite vermittelt. Hierzu ist vorgesehen, daß die Antenne einen ersten, auf dem Chip angeordneten Teil und eine in einem Abstand von dem ersten Teil angeordneten und an den ersten Teil strahlungsgekoppelten zweiten Teil umfaßt. Der zweite Teil ist hierbei beispielsweise an einem Radom angeordnet.From the not previously published application of the applicant with the roll number 309374 a technically simple and inexpensive to manufacture antenna assembly for a single-chip radar transceiver with particular very thin electrically effective oxide layer shows that at high operating frequencies, especially in a range of 76 to 81 GHz great reproducibility, high reliability and high bandwidth. For this purpose, it is provided that the antenna comprises a first part arranged on the chip and a second part arranged at a distance from the first part and radiation-coupled to the first part. The second part is in this case arranged, for example, on a radome.
Die beiden Antennenteile können durch einen Patch oder einen Dipol oder auch durch einen Schlitz gebildet werden, wobei das Patch bzw. der Dipol durch ein ihm gegenüberliegendes weiteres Patch, einen Schlitz oder einen Dipol angeregt wird.The two antenna parts can be formed by a patch or a dipole or by a slot, wherein the patch or the dipole is excited by a further patch, a slot or a dipole opposite it.
Durch die Anordnung eines toleranzbehafteten Gehäuseteils mit Antennenstruktur auf einem ebenfalls toleranzbehafteten strahlenden MittelVUnterteil, welches darüber hinaus Positioniertoleranzen aufweist, entstehen hohe Toleranzketten. Diese sind in Frequenzbereichen von kleiner als 30 GHz noch beherrschbar, sie steigen jedoch bei höheren Frequenzen, insbesondere im Frequenzbereich über 76 GHz stark an und können nur mit großem Aufwand berücksichtigt werden. Empirische Untersuchungen haben eine absolute Toleranz von ca. 20 μmbei 122 GHz ergeben. Ein solches Toleranzmaß ist mechanisch nur außerordentlich schwer zu realisieren.The arrangement of a toleranced housing part with antenna structure on a likewise toleranced radiating MittelVUnterteil, which also has positioning tolerances, resulting in high tolerance chains. These are still manageable in frequency ranges of less than 30 GHz, but they increase sharply at higher frequencies, in particular in the frequency range above 76 GHz, and can only be taken into account with great effort. Empirical studies have shown an absolute tolerance of about 20 μm at 122 GHz. Such a degree of tolerance is mechanically extremely difficult to realize.
Der Erfindung liegt daher die Aufgabe zugrunde, eine Antennenanordnung für einen Ra- dar-Transceiver der gattungsgemäßen Art dahingehend weiterzubilden, daß bei einer einfachen Montage der Komponenten des Radar-Transceivers und insbesondere seiner Antenne auch noch in Frequenzbereichen um 77, 120 oder 140 GHz eine hohe Reproduzierbarkeit und eine hohe Zuverlässigkeit gegeben ist. R. 310719 3The invention is therefore based on the object of developing an antenna arrangement for a radar transceiver of the generic type to the effect that with a simple assembly of the components of the radar transceiver and in particular its antenna even in frequency ranges around 77, 120 or 140 GHz high reproducibility and high reliability is given. R. 310719 3
Vorteile der ErfindungAdvantages of the invention
Diese Aufgabe wird durch eine Antennenanordnung für einen Radar-Transceiver mit den Merkmalen des Anspruchs 1 gelöst.This object is achieved by an antenna arrangement for a radar transceiver having the features of claim 1.
Grundidee der Erfindung ist es, den zweiten Teil der Antenne auf einem Antennenträger oder einem weiteren Chip anzuordnen, der selbst über dem ersten Teil durch Flip-Chip- Verbindungen befestigt ist. Der zweite Teil der Antenne wird also nicht, wie aus dem Stand der Technik bekannt, an einem Gehäuseteil befestigt, das durch mechanische Montage über dem ersten, den Strahlungsteil der Antenne bildenden Teil der Antenne angeordnet wird. Durch die bei Flip-Chip- Verbindungen aufgrund der Oberflächenspannung hervorgerufene selbstfokussierende Wirkung werden der Antennenträger oder der weitere Chip und damit der zweite Teil der Antenne auf den ersten auf dem Chip angeordneten Antennenteil ausgerichtet. Hierbei sind Toleranzmaße kleiner als 20 μm realisierbar.The basic idea of the invention is to arrange the second part of the antenna on an antenna carrier or a further chip, which itself is fastened over the first part by flip-chip connections. The second part of the antenna is therefore not, as known from the prior art, attached to a housing part which is arranged by mechanical mounting over the first, the radiation part of the antenna forming part of the antenna. Due to the surface tension caused by flip-chip connections self-focusing effect of the antenna carrier or the further chip and thus the second part of the antenna are aligned on the first arranged on the chip antenna part. Tolerances of less than 20 μm can be realized here.
Der Antennenträger kann aus den unterschiedlichsten Materialien bestehen. Bei einer vorteilhaften Ausführungsform ist vorgesehen, daß der Antennenträger durch ein Softbo- ard-Substrat gebildet wird. Er kann aber auch aus einem metallisierten keramischen Träger realisiert werden.The antenna carrier can be made of a variety of materials. In an advantageous embodiment, it is provided that the antenna carrier is formed by a soft-boar substrate. But it can also be realized from a metallized ceramic carrier.
Der Chip, auf dem der erste Teil der Antenne angeordnet ist, kann ebenfalls aus einem Softboard-Substrat bestehen. Er kann auch eine Keramik- oder eine Low-Temperature- Cofired-Ceramic (LTCC) sein.The chip on which the first part of the antenna is arranged can likewise consist of a softboard substrate. It can also be a ceramic or a low-temperature cofired ceramic (LTCC).
Der Chip und der weitere Chip können durch einen Silizium und/oder SiliziumGermani- um und/oder SiliziumGermanium-Chip gebildet werden: Ein solcher Chip kann dann wiederum auf einem Träger aus Softboard, Keramik oder LTCC montiert sein. Chip und Träger bilden in diesem Fall eine Einheit.The chip and the further chip can be formed by a silicon and / or silicon germanium and / or silicon germanium chip. Such a chip can in turn be mounted on a carrier made of softboard, ceramic or LTCC. Chip and carrier form a unit in this case.
Die Flip-Chip- Verbindungen werden vorteilhafterweise durch im wesentlichen abgeschnittene kugelförmige Lötverbindungen, sogenannte Bumps realisiert. Im Falle von R. 310719 4The flip-chip connections are advantageously realized by substantially cut off spherical solder joints, so-called bumps. In case of R. 310719 4
Bumps mit einem Ball-Durchmesser von 100 μm sind auf diese Weise Toleranzen zwischen erstem und zweitem Antennenteil von kleiner als 20 μm realisierbar.Bumps with a ball diameter of 100 microns in this way tolerances between the first and second antenna part of less than 20 microns can be realized.
Bei einer vorteilhaften Ausführungsform ist vorgesehen, daß wenigstens ein Teil der Lötverbindungen eine Abschirmmasse bildet, die mit einer Masse des Chips elektrisch leitend verbunden ist. Hierdurch ist eine zusätzliche obere Abschirmmasse realisierbar, die auf die Schaltung des Radar-Transceivers geführt ist.In an advantageous embodiment it is provided that at least part of the solder joints forms a shielding compound, which is electrically conductively connected to a ground of the chip. As a result, an additional upper shielding compound is realized, which is guided on the circuit of the radar transceiver.
Die Abschirmung kann sehr vorteilhaft dadurch noch weiter verbessert werden, daß die Lötverbindungen, die sogenannten Bumps, einen Abstand voneinander aufweisen, der kleiner ist als 1/10 der Wellenlänge der durch die Antenne abgestrahlten Strahlung.The shielding can be very advantageously further improved in that the solder joints, the so-called bumps, have a distance from one another which is smaller than 1/10 of the wavelength of the radiation emitted by the antenna.
Die Anordnung des Antennenträgers in Flip-Chip- Verbindungstechnik über dem ersten Teil der Antenne auf einem Chip weist den großen Vorteil auf, daß aufgrund der beschriebenen Selbstfokussierung eine sehr genaue Reproduzierbarkeit realisierbar ist. Darüber hinaus ist eine Montage des Antennenträgers parallel zur Chip-Oberfläche, auf der der erste Teil der Antenne angeordnet ist, auch dann noch realisierbar, wenn der Chip selbst schief montiert ist.The arrangement of the antenna carrier in flip-chip connection technology over the first part of the antenna on a chip has the great advantage that due to the self-focusing described a very accurate reproducibility can be realized. In addition, an assembly of the antenna carrier is parallel to the chip surface on which the first part of the antenna is arranged, even still feasible if the chip itself is mounted obliquely.
Durch die kompakte Bauweise können neben dem Antennenträger beispielsweise Bond- Verbindungen auf andere Teile, Durchkontaktierungen, tieferliegende Leiterbahnen im Falle von Multilayersubstraten und dergleichen ausgebildet werden.Due to the compact design, for example, bonding connections to other parts, plated-through holes, underlying conductor tracks in the case of multilayer substrates and the like can be formed in addition to the antenna carrier.
Weitere Vorteile und Merkmale der Erfindung sind Gegenstand der nachfolgenden Beschreibung sowie der zeichnerischen Darstellung von Ausführungsbeispielen.Further advantages and features of the invention are the subject of the following description and the drawings of exemplary embodiments.
Zeichnungdrawing
In der Zeichnung zeigen:In the drawing show:
Fig. 1 schematisch eine Schnittdarstellung eines Ausführungsbeispiels einer von derFig. 1 shows schematically a sectional view of an embodiment of one of the
Erfindung Gebrauch machenden Antennenanordnung eines Radar-Transceivers in Patch-Patch-Kopplung; R. 310719 5Invention utilizing antenna array of a radar transceiver in patch-patch coupling; R. 310719 5
Fig. 2 schematisch die in Fig. 1 dargestellte Antennenanordnung in perspektivischer Ansicht;FIG. 2 is a perspective view of the antenna arrangement shown in FIG. 1; FIG.
Fig. 3 schematisch ein anderes Ausfuhrungsbeispiel einer von der Erfindung Gebrauch machende Antennenanordnung eines Radar-Transceivers in Schlitz-Patch- Kopplung;3 shows schematically another exemplary embodiment of an antenna arrangement of a radar transceiver in slot-patch coupling making use of the invention;
Fig 4 ein weiteres Ausfuhrungsbeispiel einer von der Erfindung Gebrauch machenden Antennenanordnung für einen Radar-Transceiver in Patch-symmetrischer Dipol- Kopplung und4 shows a further exemplary embodiment of an antenna arrangement making use of the invention for a radar transceiver in patch-symmetrical dipole coupling and
Fig. 5 ein Ausfuhrungsbeispiel einer von der Erfindung Gebrauch machenden Antennenanordnung für einen Radar-Transceiver in Patch-Patch-Kopplung mit Masserand.5 shows an exemplary embodiment of an antenna arrangement making use of the invention for a radar transceiver in patch patch coupling with ground edge.
Beschreibung von AusführungsbeispielenDescription of exemplary embodiments
Ein in Fig. 1 und Fig. 2 dargestellter Radar-Transceiver umfaßt einen Chip 101, der auf einem Träger 100, beispielsweise einem Softboard-Substrat oder einer Keramik angeordnet ist. Auf dem Softboard-Substrat ist ein erster Teil 110 einer Antenne angeordnet. Über dem ersten Teil 110 der Antenne, beispielsweise einem Patch, ist ein zweites, metallisches Antennenteil 210 angeordnet, das von einem Antennenträger 400, beispielsweise ebenfalls einem Softboard-Substrat, getragen wird.A radar transceiver shown in FIG. 1 and FIG. 2 comprises a chip 101 which is arranged on a carrier 100, for example a softboard substrate or a ceramic. On the softboard substrate, a first part 110 of an antenna is arranged. Arranged above the first part 110 of the antenna, for example a patch, is a second, metallic antenna part 210, which is carried by an antenna carrier 400, for example likewise a softboard substrate.
Statt eines Antennenträgers 400 kann auch ein weiterer, das Antennenteil tragender Chip 420 vorgesehen sein.Instead of an antenna carrier 400, another chip 420 carrying the antenna part may also be provided.
Der Antennenträger 400 bzw. der weitere Chip 420 sind auf dem Chip 101 bzw. dem Träger 100 mittels sogenannter Bumps 300, d.h. Lötverbindungen, die im wesentlichen abgeschnittene kugelförmige Gestalt aufweisen, auf Kontaktflächen 203, 403 in Flip- Chip-Technik befestigt. Durch die aufgrund der Oberflächenspannung hervorgerufene selbstfokussierende Wirkung wird durch diese Art der Befestigung eine sehr hohe Präzision der Ausrichtung der beiden Antennenteile zueinander erzielt. So sind bei einem Durchmesser der Bumps 300 von 100 μm Toleranzen von kleiner als 20 μm realisierbar. Hierdurch ist der zweite Teil 210 der Antenne, die metallische Antennenstruktur sehr R. 310719 6The antenna carrier 400 or the further chip 420 are mounted on the chip 101 or the carrier 100 by means of so-called bumps 300, ie solder joints, which have a substantially cut-off spherical shape, on contact surfaces 203, 403 in flip-chip technology. Due to the surface tension caused self-focusing effect is achieved by this type of attachment a very high precision of the alignment of the two antenna parts to each other. Thus, with a diameter of the bumps 300 of 100 microns tolerances of less than 20 microns can be realized. As a result, the second part 210 of the antenna, the metallic antenna structure is very R. 310719 6
präzise über dem ersten Teil 110 der Antenne, dem auf dem Chip 101 bzw. dem Trägerprecisely over the first part 110 of the antenna, that on the chip 101 or the carrier
100 angeordneten Patch befestigbar.100 arranged patch fastened.
Der weitere Chip 420 ist durch die Bumps sehr vorteilhaft kontrollierbar, er kann ferner auch rein prinzipiell selbst auf einem weiteren Träger angeordnet sein (nicht dargestellt).The further chip 420 can be controlled very advantageously by the bumps, it can also be arranged in principle even on a further carrier (not shown).
Bei den in Fig. 3, 4 und 5 dargestellten Ausführungsbeispielen sind gleiche Elemente wie in Fig. 1 und Fig. 2 mit den gleichen Bezugszeichen versehen, so daß bezüglich deren Beschreibung auf das Vorstehende Bezug genommen wird. Im Gegensatz zu dem in Fig. 1 und Fig. 2 dargestellten Ausführungsbeispiel ist bei dem in Fig. 3 dargestellten Ausführungsbeispiel eine sogenannte Schlitz-Patch-Kopplung vorgesehen, d.h. auf dem ChipIn the embodiments shown in Figs. 3, 4 and 5, the same elements as in Fig. 1 and Fig. 2 are given the same reference numerals, so that with respect to their description to the above reference is made. In contrast to the embodiment shown in FIG. 1 and FIG. 2, in the embodiment shown in FIG. 3, a so-called slot-patch coupling is provided, i. on the chip
101 ist statt eines Patches ein Schlitz 112 als erstes Antennenteil angeordnet.101, a slot 112 is arranged as a first antenna part instead of a patch.
Das in Fig. 4 dargestellte Ausführungsbeispiel zeigt eine symmetrische Dipol-Patch- Kopplung. Hierbei ist auf dem Chip ein symmetrischer Dipol 114, 115 angeordnet, der den ersten Antennenteil bildet. Über diesem ist der Patch 210 als zweiter Antennenteil angeordnet.The embodiment shown in Fig. 4 shows a symmetrical dipole-patch coupling. Here, a symmetrical dipole 114, 115 is arranged on the chip, which forms the first antenna part. Above this, the patch 210 is arranged as a second antenna part.
Es versteht sich, daß die Erfindung nicht auf die dargestellten Antennenstrukturen beschränkt ist, sondern rein prinzipiell auch alle beliebigen anderen Formen wie rechteckige, runde, abgeschrägte Patches oder Dipole vorgesehen sein können. Darüber hinaus sind unterschiedlichste Formen der Schlitzkopplungen möglich, beispielsweise rechteckige, runde, Hohlleiterspeisungen und dergleichen.It is understood that the invention is not limited to the illustrated antenna structures, but purely in principle, any other shapes such as rectangular, round, beveled patches or dipoles can be provided. In addition, various forms of slot couplings are possible, for example, rectangular, round, waveguide feeds and the like.
Die Anzahl der Lötpunkte, der sogenannten Bumps 300, kann willkürlich gewählt werden. Die Bumps 300 können aber auch gezielt dazu eingesetzt werden, eine Masseumrandung auf dem Antennenträger zu einer unteren Masse hindurchzuführen. Hierdurch ergibt sich eine bessere Abschirmung gegenüber unerwünschter Strahlung, wie es beispielhaft in Fig. 5 dargestellt ist. Fig. 5 unterscheidet sich von dem in Fig. 1 und Fig. 2 dargestellten Ausführungsbeispiel dadurch, daß neben den beiden Antennenteilen 110, 210 eine zusätzliche Masseumrandung 220 auf dem Antennenträger 400 vorgesehen ist, die mit der auf dem Chip 101 angeordneten Masse elektrisch leitend verbunden ist. R. 310719 7The number of solder points, the so-called bumps 300, can be chosen arbitrarily. The bumps 300 can also be used specifically to pass a ground border on the antenna support to a lower mass. This results in a better shielding against unwanted radiation, as shown by way of example in Fig. 5. Fig. 5 differs from the embodiment shown in Fig. 1 and Fig. 2 in that in addition to the two antenna parts 110, 210 an additional Masseumrandung 220 is provided on the antenna carrier 400, which is electrically connected to the arranged on the chip 101 mass is. R. 310719 7
Der Chip 101 kann ein Silizium-, Silizium-Germanium- oder Silizium-Germanium:C- Chip sein. Er kann auch durch ein CMOS-Bauelement gebildet werden. Der Träger 100 und der weitere (nicht dargestellte) Träger, auf dem der weitere Chip 420 angeordnet sein kann, wird bevorzugt durch ein Softboard, eine Keramik oder eine Low-Temperatur- Cofired-Ceramic (LTCC) gebildet.The chip 101 may be a silicon, silicon germanium or silicon germanium: C chip. It can also be formed by a CMOS device. The carrier 100 and the further carrier (not shown) on which the further chip 420 can be arranged are preferably formed by a softboard, a ceramic or a low-temperature co-fired ceramic (LTCC).
Der Abstand der Bumps 300 voneinander kann im Prinzip beliebig gewählt werden. Um eine zusätzliche Abschirmwirkung zu erzielen, sollte der Abstand der Bumps kleiner als 1/10 der Wellenlänge sein, die von der Antennenanordnung abgestrahlt wird. The distance of the bumps 300 from each other can be chosen arbitrarily in principle. In order to achieve an additional shielding effect, the spacing of the bumps should be less than 1/10 of the wavelength emitted by the antenna arrangement.

Claims

R. 310719 8Patentansprüche R. 310719 8Patentansprüche
1. Antennenanordnung für einen Radar-Transceiver, insbesondere zur Abstands- und/oder Geschwindigkeitsermittlung im Umfeld von Kraftfahrzeugen mit wenigstens einer Antenne, die wenigstens einen ersten, auf einem Chip (101) angeordneten Teil (110; 112; 114, 115) und einen in einem Abstand von dem ersten Teil (110; 112; 114, 115) angeordneten und an den ersten Teil (110; 112; 114, 115) strahlungsgekoppelten zweiten Teil (210) umfaßt, dadurch gekennzeichnet, daß der zweite Teil (210) der Antenne auf einem Antennenträger (400) oder einem weiteren Chip (420) angeordnet ist, der über dem ersten Teil (110; 112; 114, 115) durch Flip-Chip- Verbindungen (300) befestigt ist.1. Antenna arrangement for a radar transceiver, in particular for distance and / or speed determination in the environment of motor vehicles with at least one antenna, the at least one first, on a chip (101) arranged part (110; 112; 114, 115) and a comprising a second part (210) arranged at a distance from the first part (110; 112; 114,115) and radiation-coupled to the first part (110; 112; 114,115), characterized in that the second part (210) of the Antenna is disposed on an antenna carrier (400) or another chip (420) which is fixed over the first part (110; 112; 114, 115) by flip-chip connections (300).
2. Antennenanordnung nach Anspruch 1, dadurch gekennzeichnet, daß der Antennenträger (400) ein Softboard-Substrat ist.2. Antenna arrangement according to claim 1, characterized in that the antenna carrier (400) is a softboard substrate.
3. Antennenanordnung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß der Chip (101) und/oder der weitere Chip (420) aus einem oder mehreren der folgenden Materialien bestehen: Silizium-, Silizium-Germanium-, Silizium-Germanium:C-Chip; CMOS-Baustein.3. Antenna arrangement according to claim 1 or 2, characterized in that the chip (101) and / or the further chip (420) consist of one or more of the following materials: silicon, silicon germanium, silicon germanium: C- Chip; CMOS device.
4. Antennenanordnung nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß der Chip (101) auf einem Träger (100) aus einer oder mehreren der folgenden Materialien angeordnet ist: Softboard-Substrat; Keramik; Low-Temperatur- Cofired-Ceramic (LTCC).4. Antenna arrangement according to one of the preceding claims, characterized in that the chip (101) on a support (100) of one or more of the following materials is arranged: Softboard substrate; ceramics; Low Temperature Cofired Ceramic (LTCC).
5. Antennenanordnung nach einem der vorstehenden Ansprüche, dadurch gekennzeichnet, daß die Flip-Chip- Verbindungen im wesentlichen abgeschnittenen kugelförmige Lötverbindungen (300) sind. R. 310719 95. Antenna arrangement according to one of the preceding claims, characterized in that the flip-chip connections are substantially cut off spherical solder joints (300). R. 310719 9
6. Antennenanordnung nach Anspruch 5, dadurch gekennzeichnet, daß der weitere Chip (420) durch die Lötverbindungen (300) kontaktierbar ist.6. Antenna arrangement according to claim 5, characterized in that the further chip (420) by the solder joints (300) is contactable.
7. Antennenanordnung nach Anspruch 5 oder 6, dadurch gekennzeichnet, daß wenigstens ein Teil der Lötverbindungen (300) eine Abschirmmasse (220) bilden, die mit einer Masse des Chips (101) elektrisch leitend verbunden ist.7. Antenna arrangement according to claim 5 or 6, characterized in that at least part of the solder joints (300) form a shielding compound (220) which is electrically conductively connected to a ground of the chip (101).
8. Antennenanordnung nach einem der Ansprüche 5 bis 7, dadurch gekennzeichnet, daß der Abstand der Lötverbindungen (300) untereinander kleiner als 1/10 der Wellenlänge der durch die Antenne abgestrahlten Strahlung ist. 8. Antenna arrangement according to one of claims 5 to 7, characterized in that the distance of the solder joints (300) with each other is less than 1/10 of the wavelength of the radiation emitted by the antenna.
EP05817033A 2004-12-30 2005-11-28 Antenna array for a radar transceiver Withdrawn EP1834377A1 (en)

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