EP1805793A1 - Electromigration control - Google Patents
Electromigration controlInfo
- Publication number
- EP1805793A1 EP1805793A1 EP05791928A EP05791928A EP1805793A1 EP 1805793 A1 EP1805793 A1 EP 1805793A1 EP 05791928 A EP05791928 A EP 05791928A EP 05791928 A EP05791928 A EP 05791928A EP 1805793 A1 EP1805793 A1 EP 1805793A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrically conductive
- vacancy
- conductive line
- dams
- electromigration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05791928A EP1805793A1 (en) | 2004-10-22 | 2005-10-17 | Electromigration control |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04300709 | 2004-10-22 | ||
EP05791928A EP1805793A1 (en) | 2004-10-22 | 2005-10-17 | Electromigration control |
PCT/IB2005/053392 WO2006043224A1 (en) | 2004-10-22 | 2005-10-17 | Electromigration control |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1805793A1 true EP1805793A1 (en) | 2007-07-11 |
Family
ID=35429284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05791928A Withdrawn EP1805793A1 (en) | 2004-10-22 | 2005-10-17 | Electromigration control |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1805793A1 (en) |
JP (1) | JP2008518433A (en) |
CN (1) | CN101044612A (en) |
WO (1) | WO2006043224A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3369660B2 (en) * | 1992-08-31 | 2003-01-20 | 株式会社東芝 | Semiconductor device |
JP3415387B2 (en) * | 1997-02-18 | 2003-06-09 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
JP4083921B2 (en) * | 1998-05-29 | 2008-04-30 | 株式会社東芝 | Manufacturing method of semiconductor device |
KR100382544B1 (en) * | 2000-11-22 | 2003-05-09 | 주식회사 하이닉스반도체 | Method for Fabricating Line of Semiconductor Device |
US6579795B1 (en) * | 2002-04-02 | 2003-06-17 | Intel Corporation | Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability |
-
2005
- 2005-10-17 EP EP05791928A patent/EP1805793A1/en not_active Withdrawn
- 2005-10-17 CN CNA2005800360862A patent/CN101044612A/en active Pending
- 2005-10-17 WO PCT/IB2005/053392 patent/WO2006043224A1/en active Application Filing
- 2005-10-17 JP JP2007537439A patent/JP2008518433A/en active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO2006043224A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2008518433A (en) | 2008-05-29 |
WO2006043224A1 (en) | 2006-04-27 |
CN101044612A (en) | 2007-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070522 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK YU |
|
17Q | First examination report despatched |
Effective date: 20080220 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: NXP B.V. |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: NXP B.V. |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20080702 |