Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
  • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/0772—Physical layout of the record carrier
  • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
  • H01L2224/0554—External layer
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
  • H01L2224/0554—External layer
  • H01L2224/0556—Disposition
  • H01L2224/05568—Disposition the whole external layer protruding from the surface
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
  • H01L2224/0554—External layer
  • H01L2224/05573—Single external layer
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/02—Bonding areas; Manufacturing methods related thereto
  • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
  • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
  • H01L2224/0554—External layer
  • H01L2224/05599—Material
  • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
  • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/05644—Gold [Au] as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01025—Manganese [Mn]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01057—Lanthanum [La]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01077—Iridium [Ir]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

• Structure comprising an electronic device for the manufacture of a security document
• the present invention relates to a structure comprising an electronic device, in particular for the manufacture of a security document and / or value or securing an article.
• an article which may be for example a packaging device, an electronic device capable, for example, of being used as an anti-theft device or an authentication or tracing means.
• GB 2 279 907 discloses a smart card made by assembling lower and upper layers with a central structure carrying an electronic device, which comprises an integrated circuit and a coil connected to the circuit. To achieve this central structure, the electronic device is sandwiched between two polyester layers each coated on one side with a thermo-activatable adhesive. This central structure is itself sandwiched between two lower and upper PVC layers. The assembly of the constituent layers of the central structure with the electronic device as well as that of the central structure with the lower and upper layers takes place during the manufacture of the card. Under the action of pressure and temperature, the electronic device sinks into the adjacent layers, which makes it possible to compensate for its thickness while the different layers are bonded together. This patent application does not describe a pre-assembled central structure.
• No. 6,305,609 discloses a smart card made by assembling lower and upper layers with a central structure carrying an electronic device.
• This central structure comprises a support film carrying the electronic device, which comprises an integrated circuit and a coil connected to this circuit.
• This device protrudes on both sides of the support film.
• the projecting parts are compensated in thickness thanks to a thermoplastic liquid crosslinked under UV radiation.
• This liquid is introduced at the last moment during assembly of the central structure with the aforementioned lower and upper layers.
• the latter and the support film are made of thermoplastic material.
• This type of central structure which has extra thicknesses requires specific equipment for the final assembly in the card or for example between two lower and upper layers of fibrous nature.
• 6,233,818 discloses a smart card made by assembling lower and upper layers with a central structure carrying an electronic device.
• This central structure comprises a thermoplastic support film with a window in which is placed the electronic device, which comprises a module with an integrated circuit and a copper coil which is connected to this circuit and inserted on the surface of the film via a ultrasonic process.
• the film, PVC, PC or PET-G is then directly laminatable with lower and upper layers printed for the manufacture of the smart card on a specific equipment generating pressure and temperature.
• this type of structure is not adapted to a direct integration between the cover of a passport and the sheet booklet for example, binding binders currently used being applied cold and in liquid form.
• Patent EP 1 010 155 discloses a security tag comprising, within the latter, an antitheft device.
• an expandable layer containing a polymeric resin and comprising a window
• An electronic device is introduced into the window of the expandable layer, in contact with the antenna.
• An encapsulating resin is deposited in the window.
• the expandable layer has a reserve at the chip to avoid oversize.
• it is also relatively easy to peel the label of its support after application, this without evidence of forgery.
• such a construction does not allow to disguise the electronic device, that is to say the chip and its antenna, during an observation in transmitted light.
• the company SMARTRAC markets structures called “Prelaminated Inlays” comprising polycarbonate or PET layers, intended to be integrated in a security document.
• the AONTEC company also markets structures called “Prelaminated Inlays” intended to be laminated with layers of a security document, these structures comprising layers of PVC or PC.
• the invention aims in particular to propose, in one of its aspects, a structure comprising an electronic device which makes it more difficult, if not impossible, any attempt to falsify an article or a security document or a document containing a security document. such structure, and that can be easily assembled with the article or the rest of the document.
• the subject of the invention is, according to one of its aspects, a method of manufacturing a structure, in particular intended for the production of a security and / or value document or the securing of an article, the structure comprising at least one electronic device and at least one layer, preferably at least partially fibrous, with a window for at least partially receiving the electronic device, the method comprising the following steps: arranging the electronic device at least partially in the window of the layer, and then depositing a resin in the window so as to at least partially encapsulate the electronic device.
• electronic device any device for storing and / or exchanging information, in particular by a wireless link.
• the electronic device may in particular be an RFID device.
• the electronic device may comprise an antenna, which may be for example in the form of a coil, wired or printed.
• the electronic device may comprise a flip-chip electronic chip. This comprises in a manner known per se contact pads, or "bumps" in English, which can be arranged on conductive tracks of a support or substrate on which the chip is fixed.
• the electronic device can be put in place in the aforementioned window without being encapsulating resin, which makes it possible to introduce the electronic device into the window in a simpler way, in particular without having to crush the layer of the structure because the electronic device may have smaller dimensions than if it already had a resin encapsulation.
• the relative positioning of the electronic device with the corresponding window of the layer is easier when the dimensions of the electronic device are sufficiently small compared to those of the window of the layer.
• the layer of the structure is at least partially fibrous, it may be altered if an attempt is made to separate the electronic device from said layer, the encapsulation resin ensuring satisfactory anchoring of the electronic device within the layer. . This reinforces the protection of the structure against an attempt to falsify.
• the layer contains papermaking fibers, for example cellulosic and / or fibers of synthetic nature.
• the above layer may serve as an interlayer that can be sandwiched between two adjacent layers of the structure.
• the resin is a thermosetting resin, for example an epoxy resin.
• the resin is deposited, preferably cast, in the window in the liquid or viscous state, this resin can completely fill the window of the layer.
• the electronic device may comprise an electronic chip of flip-chip type and, where appropriate, a support made for example of epoxy glass carrying the electronic chip.
• the electronic chip is fixed on the support before assembly thereof with the layer of the structure.
• the contact pads or "bumps" are preferably soldered on conductive tracks of the support.
• the electronic device may comprise an antenna, especially a wired antenna.
• the antenna can be connected to the conductive track, in particular by welding, before assembling the support with the layer of the structure.
• the antenna is fixed on a layer, in particular a fibrous layer, of the structure before being electrically connected to the electronic chip.
• the electronic device may have a thickness of less than 500 ⁇ m, in particular less than 250 ⁇ m, and / or an area greater than 1 mm 2 , in particular greater than 4 mm 2 .
• the subject of the invention is also, independently or in combination with the foregoing, a structure particularly intended for the manufacture of a security and / or value document or the securing of an article, comprising: an electronic device, a layer, preferably at least partially fibrous, for example entirely fibrous, with a window in which at least partially extends the electronic device, an encapsulation resin of the device adhering to said layer, especially since the resin is deposited in the window only after the placement of the electronic device in the window of the layer.
• the invention thus allows a better anchoring of the device within the structure due to the adhesion of the encapsulating resin with the layer.
• the encapsulating resin has a sufficiently high adhesion and coherency that an attempt to separate the electronic device from said layer alters at least said layer.
• the electronic device comprises a flip-chip chip and the encapsulating resin may at least partially embed the electrical contact pads or "bumps" of the chip, in order to especially protect against mechanical shocks.
• the encapsulating resin is a thermosetting resin, in particular an epoxy resin.
• the resin may be a heat-resistant resin for example.
• the structure comprises an adhesive layer in contact with said layer, for example a hot-melt adhesive.
• the structure may comprise an adjacent layer joined to the above-mentioned layer via the adhesive layer, the adhesive having adhesiveness and a coherence sufficiently high that an attempt to separate the two layers alters at least one of them.
• the adjacent layer may be one of a layer having a window, a masking layer and a carrier of the electronic device.
• the structure comprises a removable release film for protecting the adhesive layer.
• the structure may comprise at least one outer fibrous layer to be assembled with a fibrous layer of the security document and / or value.
• the invention further relates, independently or in combination with the foregoing, to a structure, in particular intended for the manufacture of a security or value document or to the securing of an article, comprising: an electronic device, a at least partially fibrous interlayer with a window in which the electronic device at least partially extends, an adhesive layer in contact with the interlayer.
• the adhesive layer may allow for example to assemble the interlayer with an adjacent layer of the structure or with an adjacent layer of a security document or value in which the structure is integrated or to fix the structure on an article .
• the adhesive has a sufficiently high adhesion and coherency that an attempt to separate the interlayer from the aforementioned adjacent layer at least alters the interlayer.
• the structure according to the invention may for example be used for the production of an identity document, for example a passport, or a visa label.
• the structure can be devoid of substantial thickness if desired, the electronic device can be fully housed in the window of the intermediate layer.
• the structure can easily be assembled, with the choice, with different types of security documents, without being provided with a specific element to compensate for the thickness of the electronic device, as is the case for example for the smart card described. in the aforementioned US Pat. No. 6,305,609.
• the structure according to the invention also has the advantage that an attempt to falsify it is relatively difficult, if not impossible, because the interlayer is easily impaired in case of attempt to peel the structure, which could not be the case for a security document or value made with a central structure as described for example in US Patent 6,233,818 or in WO 00/42569.
• the electronic device is housed at least partially in a window of the intermediate layer, the electronic device is protected against mechanical shocks.
• the aforementioned adjacent layer is for example one of an additional interlayer, a masking layer and a support of the electronic device, this list not being limiting.
• the aforementioned adhesive layer is advantageously covered with a protective anti ⁇ adhesive film, removable.
• the structure comprises at least one outer fibrous layer intended to be assembled with a fibrous layer of the security document or of value.
• the structure can be assembled with at least one fibrous layer of the security or value document in a relatively easy manner, in particular without the use of a particular adhesive or setting up particular laminating conditions such as those usually encountered in the manufacture of smart cards (lamination time 30 minutes at 150 ° C), and limiting curl problems since the fibrous layers to be assembled of the structure and the document are similar in nature or compatible.
• the intermediate layer is entirely fibrous, which can facilitate for example the incorporation into it of security elements and which can also facilitate its alteration in case of attempted forgery.
• the intermediate layer is chosen so that the intermediate layer is opaque in transmitted light.
• the intermediate layer can be used to at least partially mask the electronic device when the structure is observed in transmitted light.
• the interlayer may further be arranged to reflect light, which also at least partially obscure the electronic device when the structure is observed in reflected light or transmitted.
• the intermediate layer may be white or, alternatively, be colored.
• the interlayer may comprise a colored core with a white coating.
• the dye (s) and / or pigments present in the intermediate layer are preferably retained in the interlayer with a force sufficient to prevent migration of the dye (s) or pigment (s) into adjacent layers of the structure and / or the security document or value on which the structure is assembled.
• the interlayer may be metallized or laminated with at least one metal film, which may allow to opacify it.
• the window passes through the intermediate layer but alternatively the window is non-through.
• the structure is arranged to detect on the security document or value, through the window of the intermediate layer, visually, possibly under a particular lighting, or to using a detection device, a security element carried by the structure, this security element may in particular be present on the electronic device, for example in the form of an inscription or a coating such as for example a varnish.
• the structure may for example include a thermochromic coating detectable on the security document or value through the window.
• the structure in particular at least one of the interlayer, of a possible masking layer and of the adhesive layer, comprises at least one of the following security elements: an authentication element, an element for evidencing a falsification, this or these security elements being visible and / or detectable with the aid of a detection device.
• the structure in particular at least one of the interlayer, of a possible masking layer of the structure and of the adhesive layer, advantageously comprises at least one security element chosen from: a variable optical effect element and / or diffractive, such as a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibers, tracers detectable by magnetic resonance, tracers detectable by X-ray fluorescence, printing of a varnish or ink, luminescent or fluorescent tracers, photochromic, thermochromic, electroluminescent and / or piezochromic compounds and / or which change color with contact with one or more predetermined products, in particular acids, bases or oxidants or solvents.
• a variable optical effect element and / or diffractive such as a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibers, tracers detectable by magnetic resonance, tracers detectable by X-ray fluorescence, printing of a varnish or ink, luminescent
• the window and / or the interlayer has a shape imitating an image, a logo or an inscription, so as to define additional security of the structure and the document equipped with the structure.
• the window can thus be non-rectangular, for example.
• the electronic device comprises a support carrying an electronic chip and an antenna connected to the electronic chip, the electronic chip extending at least partially in the window of the intermediate layer.
• the antenna provides a power supply to the chip and read and / or write data, without contact, in the chip.
• the latter may include one or more integrated circuits, including a memory.
• the support can be flexible.
• the support may be made of a mineral or organic material, natural or synthetic, for example a fibrous layer, in particular a layer of paper.
• the support may also be made for example of a material containing a polymer, in particular PET.
• the support may alternatively be made of PVC, AB S / PC or PC, this list not being limiting.
• the electronic chip fixed on the support may comprise an encapsulating resin or not.
• the antenna may be of wired type or be engraved, printed or made by stamping, or even using an electrolytic growth process.
• the antenna may extend at least in part on the chip.
• the antenna is wired, it is advantageously maintained by a layer of an adhesive, which can be used to assemble two layers of the structure.
• the adhesive layer then advantageously has a thickness greater than that of the wire of the antenna.
• the support may comprise on one side a coating containing a security element such as, for example, an irreversible thermochromic compound which changes color, for example passes from colorless to a predefined color, for example pink or red, when the temperature exceeds a predefined value, for example about 65 ° C. This reveals a thermal attack of the structure.
• a security element such as, for example, an irreversible thermochromic compound which changes color, for example passes from colorless to a predefined color, for example pink or red, when the temperature exceeds a predefined value, for example about 65 ° C. This reveals a thermal attack of the structure.
• the support is sandwiched between two layers of the structure.
• the structure may comprise a single intermediate layer.
• the structure may comprise at least one additional interlayer in which the support of the electronic device is housed at least partially.
• This may include a module with a connection portion intended to be connected to an antenna and an electronic chip, in particular of the flip-chip type, embedded in an encapsulating resin.
• the additional interlayer may include a window at least partially housing the connection portion of the module, the encapsulating resin being housed in the window of the other intermediate layer.
• the antenna of the electronic device can be carried if necessary by this additional intermediate layer.
• the different windows may have different dimensions, for example to adapt to the shape of the electronic device.
• the protection of the latter against shocks can be strengthened.
• the structure comprises two interlayers, one of them may comprise a smaller window than that of the other intermediate layer.
• the windows of the two layers have identical sizes.
• the structure may have a maximum thickness of about 500 microns, for example.
• the structure comprises at least one masking layer disposed at least in line with a window of a spacer layer, so as to at least partially mask the electronic device when the structure is observed in transmitted light and / or reflected light.
• the structure may have increased security against counterfeiting, making it more difficult to attempt to reproduce the structure.
• the masking layer may be white or colored.
• the masking layer may comprise a colored core with a white coating.
• the masking layer may be metallized or laminated with at least one metal film.
• the masking layer may be a fibrous layer or not.
• the adhesive layer is chosen to allow a cold or hot assembly of the interlayer with the adjacent layer of the structure.
• the adhesive layer may comprise a heat-sensitive adhesive for example.
• the adhesive layer may be colored so as to at least partially mask the electronic device when the structure is observed in transmitted and / or reflected light.
• the adhesion between two adjacent layers of the structure is greater than the internal cohesion of at least one of said layers.
• the internal cohesion of a layer corresponds in particular to its ability to withstand internal delamination. Thus, an attempt to separate one of the layers of the structure causes the alteration thereof.
• the structure comprising two interlayers, one of them has a lower internal cohesion than the other intermediate layer.
• the intermediate layer advantageously has an internal cohesion less than or equal to that of the masking layer that may be present.
• the internal cohesion of the support may be less than or equal to that of the intermediate layer.
• the structure provides security against an attempt to falsify by tearing or delamination between the interlayer and the masking layer or between the interlayer and the support, especially if the latter has the same dimensions as the intermediate layer, to try to isolate the electronic device.
• the structure may comprise a release film, intended to be removed when the structure is to be stuck on a document or an object, such as for example a packaging.
• the structure can be coated on its two opposite sides with a layer of an adhesive.
• Each layer of adhesive may be protected by a removable protective release film, especially when the adhesive is sensitive to pressure.
• a release film may not be necessary.
• the structure especially when it comprises a non-stick film for protecting the adhesive layer, may constitute a visa intended to be stuck on a passport sheet.
• the structure may include a security element visible on its edge.
• the subject of the invention is also, according to another of its aspects, independently or in combination with the foregoing, a structure, in particular intended for the manufacture of a security or value document or the securing of an article, comprising:
• This layer may be an interlayer as defined above.
• the subject of the invention is also, according to another of its aspects, independently or in combination with the foregoing, a structure, in particular intended for the manufacture of a security or value document or the securing of an article, comprising:
• an adhesive layer in contact with the interlayer for example enabling the device to be assembled with an adjacent layer of the structure or of a security or value document, at least one of the interlayer and of the adhesive layer comprising at least one security element arranged so that a signal visible under a predetermined illumination or detectable by a suitable detection system, in particular optical or not, is modified when the intermediate layer or the adhesive layer is impaired, in particular by tearing, delamination, etching or thermal attack.
• the subject of the invention is also, independently or in combination with the foregoing, a structure, in particular for the manufacture of a security or value document or the securing of an article, comprising: an electronic device, a support of the electronic device, this support being of fibrous or mineral nature, a particularly fibrous layer with a window in which at least partially extends the electronic device.
• the support may in particular comprise a thermochromic security element capable of irreversibly changing the color in case of thermal attack.
• the subject of the invention is also, independently or in combination with the foregoing, a structure, in particular for a security document or a value document, comprising:
• an adhesive layer in contact with the intermediate layer for example making it possible to assemble the device with an adjacent layer of the structure or of a document, the structure comprising at least one security element arranged to be detectable, in particular visually , on the edge of the structure.
• the subject of the invention is also, independently or in combination with the foregoing, a structure intended for the manufacture of a security or value document or the securing of an article, comprising: an electronic device, a first layer intermediate part comprising a window in which the electronic device at least partially extends, an adhesive layer, a second intermediate layer comprising a window in which the electronic device extends at least partially, the adhesive layer ensuring the maintenance of the two interlayers and that of an antenna of the electronic device.
• the subject of the invention is also, independently or in combination with the foregoing, a structure intended for the manufacture of a security or value document or the securing of an article, comprising: an electronic device, an interlayer having a window in which the electronic device at least partially extends; a masking layer preventing to see through it the electronic device.
• the invention also relates to a security document or value comprising one of the structures as defined above or constituted by such a structure, which may be the case especially when the document is a visa.
• the security document may constitute an identity document, a visa label or a passport booklet, including a passport leaflet or cover, this list not being exhaustive.
• the valuable document can be a means of payment.
• the document may comprise a receiving layer intended to be assembled with the structure and the internal cohesion of this layer is preferably greater than that of the intermediate layer of the structure and possibly that of the masking layer of the structure, intended to be assembled. with the receiving layer of the document.
• the adhesion between, on the one hand, the receiving layer of the document and, on the other hand, the interlayer or the optional masking layer is greater than the internal cohesion of the intermediate layer or of the optional masking layer.
• a structure according to the invention, especially pre-assembled, may be intended to be sandwiched between two fibrous layers, including two jets of paper.
• the invention further relates, in another of its aspects, independently or in combination with the foregoing, to a security or value document comprising:
• an interlayer with a window in which the electronic device at least partially extends at least one first security element visible in daylight, in transmission or in reflection, this first security element being for example defined by the shape of the window of the intermediate layer of the structure,
• this second security element being for example visible under UV or IR lighting
• At least one third security element detectable by a non-optical device, for example an electromagnetic device, for example a magnetic resonance detection or X-ray fluorescence detection device.
• a non-optical device for example an electromagnetic device, for example a magnetic resonance detection or X-ray fluorescence detection device.
• the invention further relates, in another of its aspects, independently or in combination with the foregoing, to a security or value document comprising:
• the aforementioned structure may comprise a security element which remains apparent on a slice of the document after assembly of the various layers thereof.
• the invention further relates, in another of its aspects, independently or in combination with the foregoing, to a security or value document comprising:
• the invention further relates, independently or in combination with the foregoing, to a passport comprising:
• a structure comprising: an electronic device,
• an interlayer comprising a window in which the electronic device at least partially extends
• the object of the invention is also, independently or in combination with the foregoing, a method of manufacturing a structure intended for the production of a security or value document, or to be reported on a security document, this method comprising the following steps:
• a spacer layer with a window, preferably a through window
• an adhesive layer making it possible to assemble the interlayer with an adjacent layer of the structure, the adhesive having a sufficiently high adhesion and cohesion so that an attempt to separate the layer interlayer of the adjacent layer alters the interlayer
• the method can comprise the following steps:
• the method may further comprise the following steps:
• the method comprises the following steps:
• the method may comprise the following step:
• the method can comprise the following steps:
• the subject of the invention is also a method for producing a security or value document, characterized in that it comprises the following steps:
• This method may comprise the following step:
• the method can comprise the following steps:
• the method may comprise the following steps:
• the method may comprise the following step:
• the seam is performed on a support of the electronic device of the structure, outside of an antenna and an electronic chip.
• the method can comprise the following steps:
• the structure is embedded in the document only when the layer or layers of the document are correctly printed or the security element correctly reported.
• the method may comprise the following steps: assembling the structure with a layer of the document, and then printing or depositing a security element on the document layer.
• FIG. 1 represents, schematically and partially, a structure according to an exemplary implementation of the invention
• FIG. 2 schematically and partially, in cross-section along H-II, the structure of FIG. 1,
• FIG. 3 is a diagrammatic and partial cross-sectional view of a security or value document assembled with the structure of FIG. 2;
• FIG. 4 is a view, schematically and partially, in transverse section, of a structure according to another example of implementation of the invention.
• FIGS. 5 and 6 show, schematically and partially, in cross-section, two security or value documents assembled with the structure of FIG. 4,
• FIG. 7 represents, schematically and partially, in cross-section, a structure according to another example of implementation of the invention.
• FIG. 8 is a diagrammatic and partial view, in cross-section, of a security or value document with the structure of FIG. 7,
• FIG. 9 represents, schematically and partially, in cross-section, a structure according to another example of implementation of the invention
• FIG. 10 represents, schematically and partially, in cross-section, a security or value document, with the structure of FIG. 9,
• FIG. 11 schematically and partially shows, in transverse section, a structure according to another example of implementation of the invention.
• FIG. 12 is a diagrammatic and partial cross-section of a security or value document with the structure of FIG. 11,
• FIG. 13 represents, schematically and partially, a window of an intermediate layer according to the invention
• FIG. 14 illustrates, schematically and partially, a security document according to the invention with a structure sewn on it
• FIG. 15 schematically and partially shows a set of sheets and a structure intended to be sewn together to form the document of FIG. 14,
• FIG. 16 is a diagrammatic and partial cross-sectional representation of a structure according to another embodiment of the invention.
• FIGS. 17 to 22 illustrate, schematically and partially, various steps of manufacturing a structure according to the invention.
• FIG. 23 shows schematically and partially in cross section, a structure according to an alternative embodiment of the invention.
• FIG. 1 a structure 1 according to the invention for the realization of a security document or value.
• the structure 1 comprises an intermediate layer 2 having a through orifice defining a window 4.
• the window 4 has a rectangular shape, but it is not beyond the scope of the present invention when the window 4 has another shape, for example having a star shape, as illustrated in FIG. 'a Generally, the window 4 may have a shape imitating an image, a logo or an inscription.
• the intermediate layer 2 is a fibrous layer, in particular a layer of paper, for example with a density of about 215 g / m 2 and a thickness of 280 microns.
• the intermediate layer 2 may incorporate a dye, for example of black type with sulfur conferring a black color, this dye having a satisfactory fixation in the interlayer 2, which prevents migration of the dye to other layers when the intermediate layer 2 is in contact with an adhesive and / or is subjected to an elevated temperature and / or a humid atmosphere.
• a dye for example of black type with sulfur conferring a black color
• the intermediate layer 2 is, in the example considered, opaque in transmitted light and may comprise a visually detectable security element, possibly under a predetermined illumination, for example UV or IR, or, alternatively, with the aid of a predetermined detection device, for example magnetism detection.
• a visually detectable security element possibly under a predetermined illumination, for example UV or IR, or, alternatively, with the aid of a predetermined detection device, for example magnetism detection.
• the intermediate layer 2 comprises detectable tracers with a suitable detection device, for example tracers marketed by the company Microtag, detectable by magnetic resonance.
• the interlayer 2 may have a cohesion value of about 150 Scott units, measured on the Scott Bond apparatus.
• the intermediate layer 2 may comprise any other security element such as, for example: a variable and / or diffractive optical effect element such as, for example, a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibers, tracers detectable by magnetic resonance, tracers detectable by X-ray fluorescence, printing of a varnish or an ink, luminescent or fluorescent tracers, photochromic, thermochromic, electroluminescent and / or piezochromic compounds and / or which change color by contact of one or more predetermined products.
• a variable and / or diffractive optical effect element such as, for example, a holographic, iridescent or liquid crystal element, a magnetic or crystalline coating, magnetic fibers, tracers detectable by magnetic resonance, tracers detectable by X-ray fluorescence, printing of a varnish or an ink, luminescent or fluorescent tracers, photochromic, thermochromic, electroluminescent and / or piezochromic
• an adhesive layer 6 is deposited on the underside of the intermediate layer 2, to allow the assembly thereof with a support 7 of an electronic device 8 of the contactless type.
• the thickness of the intermediate layer is greater than or equal, as the case may be, to that of the bare chip, encapsulated or to a part of a module including the chip.
• the size of the window is greater than or equal, as the case may be, to that of the bare chip, encapsulated or to a part of the module comprising the chip.
• the adhesive 6 is a pressure-sensitive adhesive.
• the adhesive 6 may be of any other type, for example a heat-sensitive adhesive.
• the adhesive layer 6 contains a permanent adhesive containing a solvent, for example of acrylic nature and has a thickness of about 25 microns.
• the adhesive layer 6 is initially in the form of a transfer film and is cold-rolled on the intermediate layer 2.
• the adhesion strength and the cohesion of the adhesive layer 6 are greater than the internal cohesion of the intermediate layer 2.
• the electronic device 8 comprises, besides the support 7, an electronic chip 10.
• the chip 10 is a chip sold under the name Picotag 16 KS by Inside and has a square shape with a section of about 4 mm 2 and a thickness of about 200 microns.
• the chip 10 is connected to an antenna 11, which is made of aluminum and etched on the support 7.
• the latter comprises a film made of transparent PET with a thickness of about 40 microns.
• the chip 10 may be made of silicon or, alternatively, based on a polymer.
• the support 7 has on one of its faces a coating or primer attachment containing an irreversible thermochromic compound that changes color when the temperature exceeds 65 ° C, for example from colorless to red rosé.
• the structure 1 comprises a release film 15 fixed to the support 7 via an adhesive layer 16.
• the latter is identical to the adhesive layer 6.
• the non-stick film 15 is intended to be removed before assembling the structure on a document or an article.
• the adhesive layer 6 fixed on a release film (not shown) is cold-rolled on the lower face of the intermediate layer 2.
• An opening is made in the assembly consisting of the interlayer 2, the adhesive layer 6 and the release film, using a cutting machine provided with a punch, this opening being intended to form the window 4 of the structure 1.
• the release film is then separated.
• the intermediate layer 2 with the adhesive layer 6 on it, the support 7 with the antenna 11 on it, the adhesive layer 16 and the non-stick film 15 are assembled by cold rolling on a specific machine, the chip 8 housed in the window 4, without overflowing thereof, as can be seen in Figures 1 and 2.
• the structure 1 thus obtained can be used for the manufacture of a security document.
• FIG. 3 shows a document 20 such as a visa label, comprising a fibrous layer 21, made of paper, this layer 21 being cold-rolled on the upper face of the structure 1, via a pressure sensitive adhesive layer 22.
• the document 20 may furthermore receive a security element, for example a holographic patch, an ink reactive with apolar solvents, an irreversible thermochromic ink changing color when the temperature reaches 65 ° C., these security elements being preferably made in outside the portion 21a of the layer 21 located opposite the window 4 of the structure 1.
• a security element for example a holographic patch, an ink reactive with apolar solvents, an irreversible thermochromic ink changing color when the temperature reaches 65 ° C.
• the fibrous layer 21 may comprise other security elements such as fluorescent colored visible security fibers, fluorescent invisible boards for authentication and chemical reagents such as acids, bases, oxidants and polar solvents reagents to prevent any attempted tampering with chemicals.
• security elements such as fluorescent colored visible security fibers, fluorescent invisible boards for authentication and chemical reagents such as acids, bases, oxidants and polar solvents reagents to prevent any attempted tampering with chemicals.
• the document 20 can thus have the following advantages:
• a first-level security visible fibers, for example a star-shaped window visible in transmitted light
• the structure may have a different shape.
• FIG. 16 shows a structure 1 differing from the structure 1 previously described in that it comprises on each side of the intermediate layer 2 an adhesive layer 16.
• Each layer of adhesive 16 is covered with a non-stick film 15 that can be removed when assembling the structure 1 to a document or article.
• FIG. 4 shows a structure 23 intended for the production of a security document according to another exemplary implementation of the invention.
• the structure 23 comprises:
• a support 7 'of the electronic device 8 this support 7' extending only over a part of the intermediate layer 2, to the right of the adhesive layer 6 ', an adhesive layer 24 extending over the entire lower face of the intermediate layer 2,
• the structure 23 may be incorporated in a security document 25 as illustrated in FIG. 5, being laminated between two layers of paper 26 through two layers of adhesives 27.
• the latter may comprise a heat-sensitive adhesive.
• the intermediate layer 2 has an internal cohesion less than or equal to that of the paper layer 26 on which the layer 2 is assembled. Thus, an attempt to detach the paper layer may cause delamination of the intermediate layer 2.
• the masking layer 15 ' has an internal cohesion less than or equal to that of the adjacent paper layer 26.
• the adhesion between the interlayer 2 and the masking layer 15 'between the interlayer 2 and the adjacent layer 26, and between the masking layer 15' and the adjacent paper layer 26, is greater than the cohesion of the interlayer 2 and that of the masking layer 15 '.
• the intermediate layer 2 and the masking layer 15 ' have similar cohesions.
• the adhesive layer 24 has an adhesive power and a cohesion greater than the cohesion of the intermediate layer 2 and the cohesion of the masking layer 15 '.
• the security against forgery is enhanced when the intermediate layers 2 or masking 15 'having security elements because, an alteration of the intermediate layer 2 and / or the masking layer 15' can cause deterioration of the security elements or the modification of an optical, electrical or magnetic signal that can be easily detected.
• the structure 23 can be further incorporated into a document 25 ', as illustrated in FIG. 6, by previously treating the external faces of the interlayer 2 and the masking layer 15' so as to provide them with hot-swappable adhesive properties. .
• the layers of paper 26 are then hot-rolled on the structure 23.
• FIG. 7 shows a structure 27 successively comprising: an intermediate layer 2, an adhesive layer 6, a support 7 of the electronic device 8, this support 7 extending over the entire lower face of the intermediate layer 2.
• the antenna is printed by screen printing on the support 7 and the chip housed in the window 4.
• Such a structure 27 can be used, for example, to produce a security or value document 28, as illustrated in FIG. 8.
• the structure 27 can be laminated to be assembled with two layers of paper 26 through two layers of adhesive 29.
• Each layer of adhesive 29 is initially for example in the form of a transfer film sandwiched between two release films, for example of the type comprising a paper layer with a silicone coating.
• FIG. 9 shows a structure 30 comprising successively:
• the masking layers 31 and 37 each comprise, for example, a black core covered on their outer face with a white coating coating capable of receiving an impression.
• the white coating may comprise, for example, fluorescent particles known as Hilites, detectable under UV illumination with a wavelength of approximately 365 nm.
• the white coating may further comprise security fibers, for example UV fluorescence-resistant security fibers respectively at 254 nm and 365 nm.
• security fibers for example UV fluorescence-resistant security fibers respectively at 254 nm and 365 nm.
• the masking layers 31 and 37 may also comprise, embedded in the black core, tracers for example of the Microtag type, detectable with a portable detection device.
• the masking layers 31 and 37 advantageously have sufficient opacity to render the electronic device 42 undetectable in transmitted light.
• the adhesive layers 32, 34 and 36 contain, for example, a pressure sensitive type adhesive.
• the adhesive layers 32 and 36 may be previously deposited in liquid form on the masking layers 31 and 37, on their inner face, that is to say on the respective black core.
• the adhesive layer 34 is for example initially in the form of a transfer film.
• the adhesive layers 32 and 36 have a thickness of approximately 25 ⁇ m.
• the layer 34 may have a greater thickness, so as to compress the thickness of the antenna, for example a thickness slightly greater than 100 microns.
• the electronic device 42 comprises for example a module 43 marketed under the name MOA4 by Philips.
• This module 43 occupies an area of approximately 42 mm 2 and has a total thickness of 410 ⁇ m.
• This module 43 comprises at its lower part an integrated circuit, or alternatively several, and a connection circuit 44 with connection tabs 45 connected to a wire-type copper antenna 46, deposited on the intermediate layer 35, and at its upper part an encapsulating resin 47.
• the intermediate layer 33 is, in the example considered, a fibrous layer based on cellulose fibers having a density of about 320 g / m 2 and a thickness of about 400 microns.
• the window 40 of this intermediate layer 33 receives the encapsulation resin 47 of the module 43, this encapsulation resin 47 having a thickness of about 330 ⁇ m and occupying an area of about 25 mm 2 in the illustrated example.
• the intermediate layer 33 has, in the example under consideration, a white color and may contain security elements, for example yellow fluorescent invisible glow tracers, detectable with a UV lamp with a wavelength of about 365 nm.
• security elements for example yellow fluorescent invisible glow tracers, detectable with a UV lamp with a wavelength of about 365 nm.
• This intermediate layer 33 further comprises, for example, detectable tracers with a portable device by X-ray fluorescence, these tracers can be those marketed by the company KeyMasters Technologies.
• the interlayer 35 is, in the example considered, a fibrous layer, for example based on cellulose fibers, for example of white color, having for example a density of about 90 g / m 2 for a thickness of 125 microns.
• the window 41 of the intermediate layer 35 receives the connection circuit 44 of the module, this connection circuit 44 having for example a thickness of about 120 microns.
• the intermediate layer 35 may comprise security elements such as, for example, fluorescent red fluorescent tracers detectable with a UV lamp with a wavelength of 365 nm.
• the intermediate layer 35 has a cohesion, measured thanks to the Scott Bond device, less than or equal to that of the intermediate layer 33 and that of the masking layers 31 and 37.
• the adhesive layer 34 has a superior adhesion and cohesion to the internal cohesion of the intermediate layers 33 and 35.
• the adhesive layer 34 is initially sandwiched between two removable release films (not shown). After separation of one of the two release films, the adhesive layer 34 is cold rolled on one side of the intermediate layer 33.
• a window is then made in the assembly consisting of the interlayer 33, the adhesive layer 34 and the release film on this adhesive layer 34.
• This window can be made with a cutting machine provided with a punch.
• a window is also made in the intermediate layer 35.
• the wired antenna 46 of the electronic device 42 is deposited on one side of the intermediate layer 35.
• the module 43 is introduced into the window 41 of the intermediate layer 35 so that the connection circuit 44 is completely housed therein, being connected by the connection tabs 45 to the antenna 46.
• This connection can be made for example by welding.
• the release film still present on the adhesive layer 34 is removed.
• the assembly consisting of the intermediate layer 33 and the adhesive layer 34 is assembled with the intermediate layer 35 so that the encapsulation resin 47 of the module 43 is housed in the window 40 of the intermediate layer 33 and the antenna is sandwiched between the intermediate layers 33 and 35.
• the adhesive layer 34 can participate in maintaining the antenna when it is not printed but wired.
• the masking layers 31 and 37 having previously received the adhesive layers 32 and 36 that are sensitive to pressure are laminated on the assembly comprising the intermediate layers 33 and 35.
• the structure thus obtained may for example receive an impression of one or more inks, especially one or more chemical reactive inks, one or more optically variable inks, and may further receive a holographic patch.
• the structure thus obtained can be introduced between two transparent plastic layers 48, and be hot rolled with these layers 48 through adhesive layer 49, as illustrated in FIG.
• An identity document 39 is thus obtained in the form of a card comprising the electronic device which is ready for use.
• the structure 30 assembled in the document extends to the edge of this document so that the security elements present in particular in the intermediate layers 33 and 35 are visible on the wafer and can be detected thereon by means adapted, or visually.
• FIG. 11 shows a structure 50 in accordance with another example of implementation of the invention, and intended for the production of a security or value document, as will be seen later.
• the structure 50 comprises successively: a first intermediate layer 51 with a first window 58, a first layer of adhesive 52, a second intermediate layer 53 with a second window 59, larger than the first window 58, a second layer of adhesive 54, and a masking layer 55.
• the first intermediate layer 51 is for example a fibrous layer based on cellulose fibers, with a density of 270 g / m 2 and a thickness of 350 microns.
• the first intermediate layer 51 is for example white, comprising security elements such as, for example, SC4 commercial yellow fluorescent invisible fluorescent tracers marketed by Angstrom, visually detectable with a lamp emitting UV radiation with a wavelength of 365. nm, as well as quantitatively with a scanner marketed by Angstrom.
• security elements such as, for example, SC4 commercial yellow fluorescent invisible fluorescent tracers marketed by Angstrom, visually detectable with a lamp emitting UV radiation with a wavelength of 365. nm, as well as quantitatively with a scanner marketed by Angstrom.
• the structure 50 further comprises an electronic device 60, of the non-contact type, comprising a support 61 made of mineral material and having a thickness of about 130 microns.
• the device 60 further comprises a chip protected by an encapsulating resin 62, the latter having for example a thickness of about 330 microns.
• the support 61 carries a wired antenna 63 made of copper.
• the support 61 may have, for example, a section of 4.7 cm by 12 cm.
• the window 58 of the intermediate layer 51 receives the encapsulation resin 62.
• the second intermediate layer 53 is, in the example under consideration, a fibrous layer based on cellulose fibers with a density of 100 g / m 2 and a thickness of approximately 130 ⁇ m, this thickness being substantially equal to that of the support 61.
• the intermediate layer 53 is for example a white paper, and may comprise security elements such as fluorescent red fluorescent invisible SClO tracers and visually detectable with a UV lamp emitting UV radiation of 365 nm wavelength, as well as quantitatively with a scanner marketed by Angstrom.
• security elements such as fluorescent red fluorescent invisible SClO tracers and visually detectable with a UV lamp emitting UV radiation of 365 nm wavelength, as well as quantitatively with a scanner marketed by Angstrom.
• the intermediate layer 51 has an internal cohesion less than or equal to that of the intermediate layer 53.
• the latter has an internal cohesion less than or equal to that of the masking layer 55.
• the adhesion between the first layer intermediate layer 51 and the second intermediate layer 53 is greater than the cohesion of the intermediate layer 51.
• the adhesion between the masking layer 55 and the intermediate layer 53 is greater than the cohesion of the intermediate layer 53.
• the adhesive layers 52 and 54 exhibit superior adhesion and cohesion to the cohesion of the spacer layers 51 and 53 and the masking layer 55.
• the masking layer 55 is black, the dye or pigment used for the coloring being preferably resistant to migration under predetermined temperature and humidity conditions, for example with 80% relative humidity, 65 ° C and a contact pressure, for example less than 1 kg / cm 2 .
• the adhesive layers 52 and 54 comprise an adhesive which is, for example, of the pressure-sensitive type and is applied in liquid form. These adhesive layers have for example a thickness of the order of 25 microns.
• the intermediate layer 51 receives on its inner face an adhesive layer 52 in liquid form.
• the masking layer 55 also receives on its inner face an adhesive layer 54 in liquid form.
• a window is then made in particular using a cutting machine provided with a laser, in the assembly consisting of the intermediate layer 51, the adhesive layer 52 and a non-stick film attached to the adhesive layer 52.
• a window is also made in the intermediate layer 53.
• the interlayer 51 after removal of the release film on the adhesive layer 52, is assembled with the electronic device 60, the intermediate layer 53 and the masking layer 55, on a specific machine.
• the support 61 of the electronic device is housed in the window 59 of the intermediate layer 53 and the chip with the encapsulation resin 62 is housed in the window 58 of the intermediate layer 51.
• the structure 50 thus obtained can be used for the manufacture of a passport booklet 80, for example.
• the manufacture of the passport booklet 80 may comprise the following steps, implemented on a mounting machine: assembly of the structure 50 with a set of sheets 81 comprising visa pages and security films, this assembly being performed at the level of the cover sheet by means of a liquid glue 82, as illustrated in FIG. 15, the sewing operation of all the sheets 81 and of the structure 50 in a centered manner, the stitching being carried out in such a way that set of sheets and a part of the support 61 of the electronic device 60 are sewn together, as illustrated in Figure 15.
• the seam 84 is made outside the antenna 63 and the electronic chip of the device 60, so that not affect the operation of the electronic device 60, assembly of the structure and sheets 81 sewn with a sheet 85 of textile type coated with a liquid glue 82 so that the structure 50 so it is sandwiched between the paper sheets and the coated textile sheet, as illustrated in Figure 14, embellishment of the final cover on its face coated by foil heat transfer, and the folding of the booklet at the level of the sewing.
• the security document thus produced may have the following advantages: security of tampering against mechanical attacks:
• any attempt to remove the electronic device by peeling and removing the sewing thread causes a visible delamination of the intermediate layer 51 or 53 and affects the recognition of the yellow and red fluorescence on the edge of the cover, whether visually or automatically with the Angstrom scanner.
• the electronic device is not seen in transmission or reflection in the cover of the final passport booklet.
• the structure 50 may alternatively be incorporated into a security document 70 by being laminated between two paper layers 71 through two layers of adhesive 72, as illustrated in FIG.
• the solder may be for example gold-on-gold type, the contact pads or "bumps" of the chip being in particular made of gold.
• An insulating adhesive may then be added to hold the chip 102 on the support 100.
• a wire antenna 105 is connected to the conductive tracks 101, preferably by welding.
• the electronic device 106 thus produced, comprising the support 100, the chip 102 and the antenna 105, is assembled with a fibrous layer 108, comprising a window 109 intended to completely receive the chip 102, as illustrated in FIG.
• the assembly of the device 106 with the layer 108 is carried out using an adhesive layer 110, comprising for example a heat-fusible adhesive.
• the antenna 105 comes into contact with the adhesive layer 110.
• an epoxy encapsulation resin 112 is poured into the window 109 so as to coat the chip 102 as well as the contact pads 103 and the conductive tracks 101.
• the resin 112 makes it possible to ensure the cohesion of the electronic device 106, as well as the anchoring thereof within the layer 108 to which the resin 112 adheres.
• the resulting assembly 115 forms a laminatable structure with two layers of paper 116 through two layers of adhesive 117 to form a security and / or value document 118, as illustrated in FIG. 22.
• FIG. 23 shows a structure 30 'according to another example of implementation of the invention which differs from the structure 30 described with reference to FIG. 9, by the fact that the structure 30' comprises an electronic device 120 with a flip-chip type electronic chip 121 initially devoid of encapsulating resin.
• the contact pads 122 of the chip 121 are fixed on conductive tracks 123 made on a support 124, for example made of epoxy glass, housed in the window 41 of the intermediate layer 35.
• the support 124 does not carry the antenna 126, the latter being deposited on the second intermediate layer 35 and connected to the conductive tracks 123 of the support 124 by connecting tabs 128.
• An encapsulating resin 130 is deposited in the first and second windows 40 and 41 once the chip 121 and the support 124 are in place therein.

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• 2004
  • 2004-10-29 FR FR0452488A patent/FR2877462B1/fr not_active Expired - Fee Related
• 2005
  • 2005-10-28 WO PCT/FR2005/050914 patent/WO2006048577A1/fr active Application Filing
  • 2005-10-28 CA CA002585335A patent/CA2585335A1/fr not_active Abandoned
  • 2005-10-28 BR BRPI0518077-5A patent/BRPI0518077A/pt not_active IP Right Cessation
  • 2005-10-28 EP EP05815663A patent/EP1805696A1/de not_active Withdrawn
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