EP1685204A1 - Method for gluing two materials using a cross-linking adhesive - Google Patents

Method for gluing two materials using a cross-linking adhesive

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Publication number
EP1685204A1
EP1685204A1 EP04805465A EP04805465A EP1685204A1 EP 1685204 A1 EP1685204 A1 EP 1685204A1 EP 04805465 A EP04805465 A EP 04805465A EP 04805465 A EP04805465 A EP 04805465A EP 1685204 A1 EP1685204 A1 EP 1685204A1
Authority
EP
European Patent Office
Prior art keywords
materials
copolymers
composition
acrylate
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04805465A
Other languages
German (de)
French (fr)
Inventor
Bruno D'herbecourt
Annett Linemann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arkema France SA
Original Assignee
Arkema France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkema France SA filed Critical Arkema France SA
Publication of EP1685204A1 publication Critical patent/EP1685204A1/en
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/12Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Definitions

  • the present invention relates to a method of bonding two materials with a crosslinkable adhesive. More precisely in the process of the invention there is available on the side of the material (A) which has to stick to the other material (B) a composition (A), there is available on the side of the material (B) which must stick on the other material (A) a composition (B), bringing the compositions (A) and (B) into contact with the materials (A) and (B) in the presence of heat and possibly of a pressure exerted on the materials constitutes a cross-linked adhesive that joins the two materials.
  • Hot-melt (adhesive) adhesives are thermoplastic materials which are solid at room temperature and which, on heating, become viscous liquids. These viscous liquids are applied to the surface of a first substrate and then covered with a second surface. By cooling, an adhesion is obtained between the substrate and the second surface. These adhesives are designated by the abbreviation HMA (hot melt adhesives). The bondings thus produced can be used at room temperature and are sufficient. However, when they are subjected to temperatures above ambient temperature and which approach the melting temperature of the adhesive, the adhesion decreases and there is a risk of peeling.
  • HMA hot melt adhesives
  • Patent EP 940461 describes an HMA consisting of polyethylene in which a reactive powder and a crosslinking agent are dispersed and such that they do not react until the polyethylene is melted.
  • Patent EP 326444 describes a textile covered on one of its faces with an HMA adhesive consisting of a polymer in which an encapsulated crosslinking agent is dispersed. This textile is placed on a material (for example another textile) of so that the adhesive is on the side of the material and pressure is applied while heating.
  • Patent JP1249873 (application JP19880079799) describes a crosslinkable adhesive based on a blocked isocyanate and a polyamine.
  • Patent EP 373878 describes an adhesive in the form of an acrylic resin modified with an aminoamide mixed with a polyol and a radical initiator. Crosslinking is caused by heating.
  • Patent GB 2135673 describes a glass fabric, the fibers of which are coated with an epoxy resin, this fabric then being coated with a polyamide with amino endings. This fabric is placed between two materials that are hot pressed to cause them to stick.
  • US Patent 3,409,497 describes a similar process but the fibers are coated with an OH-terminated bisphenol and the fabric is coated with an epoxy resin.
  • the disadvantage of these techniques is that it is necessary either to separate the components of the adhesive well to avoid crosslinking before the bonding of the two materials or to choose the components of the adhesive well so that there is no crosslinking before a determined temperature and / or that the materials are not well placed one against the other to constitute a final assembly.
  • the components of these crosslinkable adhesives are not simple products.
  • the present invention relates to a process for bonding two materials with a crosslinkable adhesive. More precisely in the process of the invention there is the side of the material (A) which must stick to the other material (B) a composition (A), we have the side of the material (B) which must stick on the other material (A) a composition (B), bringing the compositions (A) and (B) into contact materials (A) and (B) in the presence of heat and possibly of a pressure exerted on the materials constitutes a crosslinked adhesive which joins the two materials.
  • compositions (A) and (B) are in the form of a film, a mesh or a nonwoven.
  • the film, the mesh and the nonwoven will be designated by "film” or "web”. According to a particular form the films
  • composition (A) and (B) can be adjacent (and not adherent to each other) but there is no reaction since it is at room temperature.
  • the two films (A) and (B) can be attached with glue dots or by heating the films (A) and (B) at only a few points to make the two films integral and facilitate their handling.
  • the composition (A) is fixed to the part of the material (A) which must stick to the other material (B) and the composition
  • the invention is a method of bonding two materials with a crosslinkable adhesive in which the part of the material (A) which is to stick on the other material (B) is coated with a composition (A) , the part of the material (B) which must stick to the other material (A) is coated with a composition (B), bringing the compositions (A) and (B) into contact in the presence of heat and optionally pressure exerted on the materials constitutes a crosslinked adhesive which joins the two materials.
  • the compositions (A) and (B) can be deposited in the molten state on the materials.
  • At least one of these compositions and preferably both are in the form of film, mesh or nonwoven.
  • the film is fixed on the material by a simple hot pressing without melting the film, then the two materials are brought into contact by their part coated with films and heated, possibly exerting pressure on the materials. It would not go beyond the scope of the invention if only one of the compositions was attached to one of the materials (for example the composition (A) on the material (A)).
  • the process of the invention has many advantages: the materials coated with films are easily prepared, it suffices to bring the two materials possibly coated with their film into contact and to press hot to obtain bonding, the compositions (A) and (B) react irreversibly at the time of bonding, thus the thermal resistance is improved at temperatures above the melting points of the compositions (A) and (B) alone, it is possible to choose compositions (A) and (B) which have respectively good adhesion to materials (A) and (B).
  • the present invention also relates to each of the materials coated with the film (A) or (B) as well as the object resulting from the bonding of the materials (A) and (B).
  • materials (A) and (B) can be any material such as wood, paper, cardboard, metal, plastics and woven or nonwoven textiles. .
  • the invention is particularly when at least one of the materials is a textile.
  • compositions (A) and (B) all the compositions which can be deposited in the molten state on the material or which can be filmed and which by contacting them hot produce a crosslinked adhesive are thus designated . Mention may be made, for example, of the usual HMAs provided that they each have functions which cause crosslinking.
  • the melting temperature of compositions (A) and (B) is of the order of 60 to 150 ° C.
  • the compositions (A) and (B) are polymers or mixtures of polymers. They can be in the form of film, mesh or nonwoven.
  • the film can be made by the usual techniques of thermoplastic polymer technology, namely extrusion blow molding and "cast", that is to say that the molten material is extruded in a flat die and the polymer is cooled and solidified by passage over cooled rollers.
  • the nonwoven can be produced according to the usual techniques from compositions (A) or (B) which have been put in the form of fibers. For example, the compositions are passed in the molten state in dies and the fibers are recovered on a cold plate, the contact of the fibers with each other before their complete cooling binds them together and forms a nonwoven.
  • the mesh it can be considered as a film with holes or a textile woven with fibers.
  • polymers (A) there may be mentioned for example: A1: the copolyamides (CoPA) and the copolymers with copolyamide blocks and polyether blocks,
  • A2 copolyamides with COOH endings and copolymers with copolyamide blocks and polyether blocks with COOH endings
  • A3 copolyamides with NH2 endings and copolymers with copolyamide blocks and polyether blocks with NH2 endings
  • A4 copolyamides terminated by an acid and copolymers containing copolyamide blocks and polyether blocks terminated by an acid, this acid carrying unsaturated bonds,
  • A5 copolymers with copolyamide blocks and polyether blocks in which the polyether blocks are made of polybutadiene, advantageously the polyether blocks and the copolyamide blocks are linked by ester groups originating from the reaction between the OH terminations of the polyether and the acid terminations of the copolyamide blocks .
  • These types A1 to A5 can contain a peroxide type initiator.
  • B1 polymers carrying epoxy functions such as copolymers of ethylene with glycidyl methacrylate (GMA) and optionally with an alkyl (meth) acrylate and copolymers based on epichloridrine
  • B2 polymers carrying anhydride functions of carboxyic acid such as copolymers of ethylene of maleic anhydride (MAH) and optionally of an alkyl (meth) acrylate
  • B2 polymers carrying functions of carboxylic acid such as copolymers of ethylene with acrylic acid and optionally with an alkyl (meth) acrylate
  • B3 isocyanates (or polyisocyanates) encapsulated in a polyolefin matrix
  • ester polyols carrying multiple acrylate groups optionally in a polyolefin matrix
  • (B1) is either a copolymer of ethylene and an unsaturated epoxide or a polyolefin grafted with an unsaturated epoxide.
  • polyolefin grafted with an unsaturated epoxide the term polyolefin is understood to mean polymers comprising olefin units such as, for example, ethylene, propylene, butene-1 units, or any other alpha olefin.
  • polyethylenes such as LDPE, HDPE, LLDPE or VLDPE, polypropylene, ethylene / propylene copolymers, EPRs (ethylene / propylene Rubber) or metallocene PEs (copolymers obtained by catalysis monosite), - styrene / ethylene-butene / styrene block copolymers (SEBS), styrene / butadiene / styrene block copolymers, styrene / isoprene / styrene block copolymers (SIS), styrene / ethylene-propylene block copolymers / styrene, ethylene / propylene / diene (EPDM); - copolymers of ethylene with at least one product chosen from salts or esters of unsaturated carboxylic acids, or vinyl esters of saturated carboxylic acids.
  • EPRs ethylene / propylene
  • the polyolefin is chosen from LLDPE, VLDPE, polypropylene, ethylene / vinyl acetate copolymers or ethylene / alkyl (meth) acrylate copolymers.
  • the density can advantageously be between 0.86 and 0.965
  • the melt index (MFI) can be between 0.3 and 40 (in g / 10 min at 190 ° C. under 2.16 kg).
  • copolymers of ethylene and of an unsaturated epoxide mention may, for example, be made of copolymers of ethylene with an alkyl (meth) acrylate and of an unsaturated epoxide, or copolymers of ethylene, a vinyl ester of saturated carboxyic acid and an unsaturated epoxide.
  • the epoxide amount can be up to 15% by weight of the copolymer and the ethylene amount at least 50% by weight.
  • Advantageously (B1) is a copolymer of ethylene with an alkyl (meth) acrylate and an unsaturated epoxide.
  • the alkyl (meth) acrylate is such that the alkyl has 2 to 10 carbon atoms.
  • the MFI (melt flow index) of (B1) can be for example between 0.1 and 50 (g / 10 min at 190 ° C under 2.16 kg).
  • alkyl acrylate or methacrylate which can be used are in particular methyl methacrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate.
  • unsaturated epoxides which can be used are in particular: - aliphatic glycidyl esters and ethers such as rallylglycidylether, vinyl glycidylether, glycidyl itaconate and maleate, glycidyl acrylate and methacrylate, and - esters and ethers of glycidyl alicyclic glycidyls such as 2-cyclohexene-1-glycidyl ether, cyclohexene-4,5-diglycidylcarboxylate, cyclohexene-4-glycidyl carboxylate, 5-norbornene-2-methyl-2-glycidyl carboxylate and endocis- bicyclo (2,2 , 1) -5-heptene-2,3-diglycidyl dicarboxylate.
  • - aliphatic glycidyl esters and ethers such as rallylglycidylether
  • (B2) is a polymer containing ethylene and an anhydride of unsaturated carboxyic acid.
  • (B2) is either a copolymer of ethylene and of an unsaturated carboxyic acid anhydride or a polyolefin grafted with an unsaturated carboxyic acid anhydride.
  • the polyolefin can be chosen from the polyolefins mentioned above and which have to be grafted with an unsaturated epoxide.
  • Examples of unsaturated dicarboxylic acid anhydrides which can be used as constituents of (B2) are in particular maleic anhydride, itaconic anhydride, citraconic anhydride, tetrahydrophthalic anhydride.
  • copolymers of ethylene with an alkyl (meth) acrylate of an unsaturated carboxyic acid anhydride and copolymers of ethylene, of a vinyl acid ester. saturated carboxy and an unsaturated carboxy anhydride.
  • the amount of unsaturated carboxylic anhydride can be up to 15% by weight of the copolymer and the amount of ethylene at least 50% by weight.
  • Advantageously (B2) is an ethylene copolymer of an alkyl (meth) acrylate and of an unsaturated carboxylic anhydride.
  • the alkyl (meth) acrylate is such that the alkyl has 2 to 10 carbon atoms.
  • the alkyl (meth) acrylate can be chosen from those mentioned above.
  • the MFI of (B) can for example be between 0.1 and 50 (g / 10 min at 190 ° C. under 2.16 kg).
  • Irreversible bonding with very good temperature resistance is obtained by combining: web A1 with web chosen from B1, B2, B3, B4 and B6, web A2 with web chosen from B1, B3 and B6, web A3 with web chosen from B1, B2, B3, B4, B5, B6 and B7, A4 web with web chosen from Blet B7, A5 web with B7 web. Examples
  • Lotader® 7500 designates an ethylene-ethyl acrylate-maleic anhydride copolymer with proportions by weight 80/17/3, of MFI 70 g / 10min at 2.16 kg at
  • Lotader® AX8950 denotes an ethylene-methyl acrylate-glycidyl methacrylate copolymer with proportions by weight 72.2 / 18.8 / 9, of MFI 90 g / 10 min at 2.16 kg at 190 ° C. It is produced by radical polymerization under high pressure.
  • Platamid®1 denotes a copolyamide 6.9 / 12 in mass proportions 30/70 obtained by condensation of hexamethylene diamine, C9 diacid and lauryllactam. It is finished di-COOH, the MFI is 15 g / 10min under 2.16 kg at
  • Piatamid®2 designates a copolyamide essentially based on hexamethylene diamine, caprolactam, adipic acid, C10 diacid and aminoundecanoic acid.
  • the MFI is 9 g / 10 min under 2.16 kg at 150 ° C.

Abstract

The invention relates to a method for gluing two materials using a cross-linking adhesive. More precisely according to the method, a composition (A) is arranged on the side of the material (A), for gluing to the other material (B), a composition (B) is arranged on the side of the material (B), for gluing to the other material (A), the compositions (A) and (B) and the materials (A) and (B) are brought into contact in the presence of heat and, optionally, pressure is exerted on the materials to give a cross-linked adhesive which connects the two materials. According to an advantageous embodiment, the compositions are used in the form of a film, mesh, or non-woven material. In an other embodiment, the composition (A) is fixed to that part of the material (A), for gluing to the other material (B) and the composition (B) is fixed to that part of the material (B), for gluing to the other material (A). In other words, the invention comprises a method for gluing two materials, by means of a cross-linking adhesive in which that part of the material (A) for gluing to the other material (B) is covered with a composition (A), that part of the material (B) for gluing to the material (A) is covered in a composition (B), the two compositions (A) and (B) are brought into contact in the presence of heat and, optionally, a pressure is exerted on the materials to give a cross-linked adhesive connecting the two materials.

Description

PROCÉDÉ DE COLLAGE DE DEUX MATÉRIAUX PAR UN ADHÉSIF RÉTICULABLE Domaine de l'invention La présente invention concerne un procédé de collage de deux matériaux par un adhésif réticulable. Plus précisément dans le procédé de l'invention on dispose du coté du matériau (A) qui doit coller sur l'autre matériau (B) une composition (A), on dispose du coté du matériau (B) qui doit coller sur l'autre matériau (A) une composition (B), la mise en contact des compositions (A) et (B) et des matériaux (A) et (B) en présence de chaleur et éventuellement d'une pression exercée sur les matériaux constitue un adhésif réticulé qui assemble les deux matériaux. L'art antérieur et le problème technique Les colles (adhésifs) thermofusibles sont des matériaux thermoplastiques solides à la température ambiante et qui par chauffage deviennent des liquides visqueux. Ces liquides visqueux sont appliqués sur la surface d'un premier substrat puis on la couvre avec une seconde surface. Par refroidissement, on obtient une adhérence entre le substrat et la deuxième surface. Ces colles sont désignées par l'abréviation HMA (hot melt adhesives). Les collages ainsi réalisés sont utilisables à température ambiante et sont suffisants. Cependant quand ils sont soumis à des températures au delà de la température ambiante et qui se rapprochent de la température de fusion de l'adhésif l'adhésion diminue et il y a risque de décollage. On peut remédier à cet inconvénient en réticulant l'adhésif une fois le collage réalisé ainsi l'adhésif reste à l'état solide quand la température augmente et se rapproche ou dépasse la température de fusion initiale de l'adhésif avant sa réticulation. L'art antérieur a décrit de nombreuses solutions de ce type. Le brevet EP 940461 décrit un HMA constitué de polyéthylène dans lequel sont dispersés une poudre réactive et un agent de réticulation et tels qu'ils ne réagissent pas tant que le polyéthylène n'est pas fondu. Le brevet EP 326444 décrit un textile recouvert sur l'une de ses faces d'un adhésif HMA constitué d'un polymère dans lequel est dispersé un agent de réticulation encapsulé. On pose ce textile sur un matériau (par exemple un autre textile) de telle sorte que l'adhésif soit du coté du matériau et on applique une pression en chauffant. On obtient un collage du textile sur le matériau et simultanément une réticulation de l'adhésif. Le brevet JP1249873 (demande JP19880079799) décrit un adhésif réticulable à base d'un isocyanate bloqué et d'une polyamine. Le brevet EP 373878 décrit un adhésif sous la forme d'une résine acrylique modifiée par un aminoamide mélangée avec un polyol et un initiateur radicalaire. On provoque la réticulation par chauffage. Le brevet GB 2135673 décrit un tissu de verre dont les fibres sont enduites d'une résine époxy, ce tissu étant ensuite enduit d'un polyamide à terminaisons aminés. Ce tissu est disposé entre deux matériaux qu'on presse à chaud pour provoquer leur collage. Le brevet US 3409497 décrit un procédé similaire mais les fibres sont enduites d'un bisphenol à terminaisons OH et le tissu est recouvert d'une résine époxy. L'inconvénient de ces techniques est qu'il faut soit bien séparer les composants de l'adhésif pour éviter une réticulation avant le collage des deux matériaux soit bien choisir les composants de l'adhésif pour qu'il n'y ait pas réticulation avant une température déterminée et/ou que les matériaux ne soient bien disposés l'un contre l'autre pour constituer un assemblage définitif. De plus les composants de ces adhésifs reticulables ne sont pas des produits simples. On a maintenant trouvé un procédé beaucoup plus simple, on dispose du coté du matériau (A) qui doit coller sur l'autre matériau (B) une composition (A), on dispose du coté du matériau (B) qui doit coller sur l'autre matériau (A) une composition (B), la mise en contact des compositions (A) et (B) et des matériaux (A) et (B) en présence de chaleur et éventuellement d'une pression exercée sur les matériaux constitue un adhésif réticulé qui assemble les deux matériaux.Field of the Invention The present invention relates to a method of bonding two materials with a crosslinkable adhesive. More precisely in the process of the invention there is available on the side of the material (A) which has to stick to the other material (B) a composition (A), there is available on the side of the material (B) which must stick on the other material (A) a composition (B), bringing the compositions (A) and (B) into contact with the materials (A) and (B) in the presence of heat and possibly of a pressure exerted on the materials constitutes a cross-linked adhesive that joins the two materials. PRIOR ART AND THE TECHNICAL PROBLEM Hot-melt (adhesive) adhesives are thermoplastic materials which are solid at room temperature and which, on heating, become viscous liquids. These viscous liquids are applied to the surface of a first substrate and then covered with a second surface. By cooling, an adhesion is obtained between the substrate and the second surface. These adhesives are designated by the abbreviation HMA (hot melt adhesives). The bondings thus produced can be used at room temperature and are sufficient. However, when they are subjected to temperatures above ambient temperature and which approach the melting temperature of the adhesive, the adhesion decreases and there is a risk of peeling. This drawback can be remedied by crosslinking the adhesive once the bonding has been completed, thus the adhesive remains in the solid state when the temperature increases and approaches or exceeds the initial melting temperature of the adhesive before it crosslinking. The prior art has described many solutions of this type. Patent EP 940461 describes an HMA consisting of polyethylene in which a reactive powder and a crosslinking agent are dispersed and such that they do not react until the polyethylene is melted. Patent EP 326444 describes a textile covered on one of its faces with an HMA adhesive consisting of a polymer in which an encapsulated crosslinking agent is dispersed. This textile is placed on a material (for example another textile) of so that the adhesive is on the side of the material and pressure is applied while heating. The textile is bonded to the material and at the same time crosslinking of the adhesive. Patent JP1249873 (application JP19880079799) describes a crosslinkable adhesive based on a blocked isocyanate and a polyamine. Patent EP 373878 describes an adhesive in the form of an acrylic resin modified with an aminoamide mixed with a polyol and a radical initiator. Crosslinking is caused by heating. Patent GB 2135673 describes a glass fabric, the fibers of which are coated with an epoxy resin, this fabric then being coated with a polyamide with amino endings. This fabric is placed between two materials that are hot pressed to cause them to stick. US Patent 3,409,497 describes a similar process but the fibers are coated with an OH-terminated bisphenol and the fabric is coated with an epoxy resin. The disadvantage of these techniques is that it is necessary either to separate the components of the adhesive well to avoid crosslinking before the bonding of the two materials or to choose the components of the adhesive well so that there is no crosslinking before a determined temperature and / or that the materials are not well placed one against the other to constitute a final assembly. Furthermore, the components of these crosslinkable adhesives are not simple products. We have now found a much simpler process, we have the side of the material (A) which must stick on the other material (B) a composition (A), we have the side of the material (B) which must stick on the other material (A) a composition (B), bringing the compositions (A) and (B) into contact with the materials (A) and (B) in the presence of heat and possibly of a pressure exerted on the materials constitutes a crosslinked adhesive that joins the two materials together.
Brève description de l'invention La présente invention concerne un procédé de collage de deux matériaux par un adhésif réticulable. Plus précisément dans le procédé de l'invention on dispose du coté du matériau (A) qui doit coller sur l'autre matériau (B) une composition (A), on dispose du coté du matériau (B) qui doit coller sur l'autre matériau (A) une composition (B), la mise en contact des compositions (A) et (B) et des matériaux (A) et (B) en présence de chaleur et éventuellement d'une pression exercée sur les matériaux constitue un adhésif réticulé qui assemble les deux matériaux. C'est à dire qu'entre les matériaux à coller se trouvent les compositions (A) et (B), la composition (A) étant disposée du coté du matériau (A) et la composition (B) étant disposée du coté du matériau (B). Selon une forme avantageuse les compositions se présentent sous forme de film, de maille ou de non tissé. Dans la suite du texte par simplification le film, la maille et le non tissé seront désignés par "film" ou "web". Selon une forme particulière les filmsBRIEF DESCRIPTION OF THE INVENTION The present invention relates to a process for bonding two materials with a crosslinkable adhesive. More precisely in the process of the invention there is the side of the material (A) which must stick to the other material (B) a composition (A), we have the side of the material (B) which must stick on the other material (A) a composition (B), bringing the compositions (A) and (B) into contact materials (A) and (B) in the presence of heat and possibly of a pressure exerted on the materials constitutes a crosslinked adhesive which joins the two materials. That is to say that between the materials to be bonded are the compositions (A) and (B), the composition (A) being disposed on the side of the material (A) and the composition (B) being disposed on the side of the material (B). According to an advantageous form, the compositions are in the form of a film, a mesh or a nonwoven. In the rest of the text for simplicity, the film, the mesh and the nonwoven will be designated by "film" or "web". According to a particular form the films
(A) et (B) peuvent être adjacents (et non adhérents l'un à l'autre) mais il n'y a aucune réaction puisqu'on est à température ambiante. On peut attacher les deux films (A) et (B) par des points de colle ou en chauffant les films (A) et (B) en quelques points seulement pour rendre les deux films solidaires et faciliter leur manipulation. Selon une autre forme de l'invention la composition (A) est fixée sur la partie du matériau (A) qui doit coller sur l'autre matériau (B) et la composition(A) and (B) can be adjacent (and not adherent to each other) but there is no reaction since it is at room temperature. The two films (A) and (B) can be attached with glue dots or by heating the films (A) and (B) at only a few points to make the two films integral and facilitate their handling. According to another form of the invention, the composition (A) is fixed to the part of the material (A) which must stick to the other material (B) and the composition
(B) est fixée sur la partie du matériau (B) qui doit coller sur l'autre matériau (A). C'est à dire que l'invention est un procédé de collage de deux matériaux par un adhésif réticulable dans lequel la partie du matériau (A) qui doit coller sur l'autre matériau (B) est revêtue d'une composition (A), la partie du matériau (B) qui doit coller sur l'autre matériau (A) est revêtue d'une composition (B), la mise en contact des compositions (A) et (B) en présence de chaleur et éventuellement d'une pression exercée sur les matériaux constitue un adhésif réticulé qui assemble les deux matériaux. Les compositions (A) et (B) peuvent être déposées à l'état fondu sur les matériaux. Selon une forme avantageuse au moins l'une de ces compositions et de préférence les deux se présentent sous forme de film, de maille ou de non tissé. Le film est fixé sur le matériau par un simple pressage à chaud sans faire fondre le film, ensuite on met en contact les deux matériaux par leur partie revêtue des films et on chauffe, éventuellement on exerce une pression sur les matériaux. On ne sortirait pas du cadre de l'invention si seulement l'une des compositions était fixée sur l'un des matériaux (par exemple la composition (A) sur la matériau (A)). Le procédé de l'invention présente de nombreux avantages : on prépare facilement les matériaux revêtus des films, il suffit de mettre en contact les deux matériaux éventuellement revêtus de leur film et de presser à chaud pour obtenir le collage, les compositions (A) et (B) réagissent au moment du collage de façon irréversible ainsi la résistance thermique est améliorée aux températures supérieures au points de fusion des compositions (A) et (B) seules, on peut choisir des compositions (A) et (B) qui présentent respectivement une bonne adhésion aux matériaux (A) et (B). La présente invention concerne aussi chacun des matériaux revêtus du film (A) ou (B) ainsi que l'objet résultant du collage des matériaux (A) et (B).(B) is fixed on the part of the material (B) which must stick on the other material (A). That is to say that the invention is a method of bonding two materials with a crosslinkable adhesive in which the part of the material (A) which is to stick on the other material (B) is coated with a composition (A) , the part of the material (B) which must stick to the other material (A) is coated with a composition (B), bringing the compositions (A) and (B) into contact in the presence of heat and optionally pressure exerted on the materials constitutes a crosslinked adhesive which joins the two materials. The compositions (A) and (B) can be deposited in the molten state on the materials. According to an advantageous form at least one of these compositions and preferably both are in the form of film, mesh or nonwoven. The film is fixed on the material by a simple hot pressing without melting the film, then the two materials are brought into contact by their part coated with films and heated, possibly exerting pressure on the materials. It would not go beyond the scope of the invention if only one of the compositions was attached to one of the materials (for example the composition (A) on the material (A)). The process of the invention has many advantages: the materials coated with films are easily prepared, it suffices to bring the two materials possibly coated with their film into contact and to press hot to obtain bonding, the compositions (A) and (B) react irreversibly at the time of bonding, thus the thermal resistance is improved at temperatures above the melting points of the compositions (A) and (B) alone, it is possible to choose compositions (A) and (B) which have respectively good adhesion to materials (A) and (B). The present invention also relates to each of the materials coated with the film (A) or (B) as well as the object resulting from the bonding of the materials (A) and (B).
Description détaillée de l'invention S'agissant des matériaux (A) et (B) il peut s'agir de toute matière telle que du bois, du papier, du carton, du métal, des matières plastiques et des textiles tissés ou non tissés. L'invention est particulièrement quand au moins l'un des matériaux est un textile.Detailed description of the invention With regard to materials (A) and (B), it can be any material such as wood, paper, cardboard, metal, plastics and woven or nonwoven textiles. . The invention is particularly when at least one of the materials is a textile.
S'agissant des compositions (A) et (B) on désigne ainsi toutes compositions qui peuvent être déposées à l'état fondu sur le matériau ou qui peuvent se mettre en film et qui par mise en contact entre elles à chaud produisent un adhésif réticulé. On peut citer par exemple les HMA usuels pourvu qu'ils possèdent chacun des fonctions provoquant la réticulation. La température de fusion des compositions (A) et (B) est de l'ordre de 60 à 150°C. Avantageusement les compositions (A) et (B) sont des polymères ou des mélanges de polymères. Elles peuvent se présenter sous forme de film, de maille ou de non tissé. Le film peut être fabriqué par les techniques habituelles de la technologie des polymères thermoplastiques à savoir l'extrusion soufflage et le "cast" c'est à dire qu'on extrude la matière fondue dans une filière plate et le polymère est refroidi et solidifié par passage sur des rouleaux refroidis. Le non tissé peut être fabriqué selon les techniques usuelles à partir des compositions (A) ou (B) qu'on a mis sous forme de fibres. Par exemple on fait passer les compositions à l'état fondu dans des filières et on récupère les fibres sur une plaque froide, le contact des fibres entre elles avant leur refroidissement complet les solidarise entre elles et forme un non tissé. Quant à la maille on peut la considérer comme un film avec des trous ou un textile tissé avec des fibres.With regard to compositions (A) and (B), all the compositions which can be deposited in the molten state on the material or which can be filmed and which by contacting them hot produce a crosslinked adhesive are thus designated . Mention may be made, for example, of the usual HMAs provided that they each have functions which cause crosslinking. The melting temperature of compositions (A) and (B) is of the order of 60 to 150 ° C. Advantageously, the compositions (A) and (B) are polymers or mixtures of polymers. They can be in the form of film, mesh or nonwoven. The film can be made by the usual techniques of thermoplastic polymer technology, namely extrusion blow molding and "cast", that is to say that the molten material is extruded in a flat die and the polymer is cooled and solidified by passage over cooled rollers. The nonwoven can be produced according to the usual techniques from compositions (A) or (B) which have been put in the form of fibers. For example, the compositions are passed in the molten state in dies and the fibers are recovered on a cold plate, the contact of the fibers with each other before their complete cooling binds them together and forms a nonwoven. As for the mesh, it can be considered as a film with holes or a textile woven with fibers.
S'agissant des polymères (A) on peut citer par exemple: A1 : les copolyamides (CoPA) et les copolymeres à blocs copolyamides et blocs polyethers,As regards the polymers (A), there may be mentioned for example: A1: the copolyamides (CoPA) and the copolymers with copolyamide blocks and polyether blocks,
A2 : les copolyamides à terminaisons COOH et les copolymeres à blocs copolyamides et blocs polyethers à terminaisons COOH, A3 : les copolyamides à terminaisons NH2 et les copolymeres à blocs copolyamides et blocs polyethers à terminaisons NH2,A2: copolyamides with COOH endings and copolymers with copolyamide blocks and polyether blocks with COOH endings, A3: copolyamides with NH2 endings and copolymers with copolyamide blocks and polyether blocks with NH2 endings,
A4 : les copolyamides terminés par un acide et les copolymeres à blocs copolyamides et blocs polyethers terminés par un acide cet acide portant des liaisons insaturées,A4: copolyamides terminated by an acid and copolymers containing copolyamide blocks and polyether blocks terminated by an acid, this acid carrying unsaturated bonds,
A5 : les copolymeres à blocs copolyamides et blocs polyethers dans lesquels les blocs polyéther sont en polybutadiene, avantageusement les blocs polyethers et les blocs copolyamides sont reliés par des groupes esters provenant de la réaction entre les terminaisons OH du polyéther et les terminaisons acides des blocs copolyamides. Ces types A1 à A5 peuvent contenir un initiateur de type peroxide.A5: copolymers with copolyamide blocks and polyether blocks in which the polyether blocks are made of polybutadiene, advantageously the polyether blocks and the copolyamide blocks are linked by ester groups originating from the reaction between the OH terminations of the polyether and the acid terminations of the copolyamide blocks . These types A1 to A5 can contain a peroxide type initiator.
S'agissant des polymères (B) on peut citer par exemple: B1 : les polymères portant des fonctions époxy tels que les copolymeres de l'éthylène du méthacrylate de glycidyle (GMA) et éventuellement d'un (meth)acrylàte d'alkyle et les copolymeres à base d'epichloridrine, B2 : les polymères portant des fonctions anhydrides d'acide carboxyiique tels que les copolymeres de l'éthylène de l'anhydride maleique (MAH) et éventuellement d'un (meth)acrylate d'alkyle, les polymères portant des fonctions acide carboxyiique tels que les copolymeres de l'éthylène de l'acide acrylique et éventuellement d'un (meth)acrylate d'alkyle,As regards the polymers (B), there may be mentioned, for example: B1: polymers carrying epoxy functions such as copolymers of ethylene with glycidyl methacrylate (GMA) and optionally with an alkyl (meth) acrylate and copolymers based on epichloridrine, B2: polymers carrying anhydride functions of carboxyic acid such as copolymers of ethylene of maleic anhydride (MAH) and optionally of an alkyl (meth) acrylate, polymers carrying functions of carboxylic acid such as copolymers of ethylene with acrylic acid and optionally with an alkyl (meth) acrylate,
B3 : les isocyanates (ou les polyisocyanates) encapsulés dans une matrice en polyoléfine,B3: isocyanates (or polyisocyanates) encapsulated in a polyolefin matrix,
B4 : les polycetones,B4: polyketones,
B5 : les polyurées éventuellement dans une matrice de polyoléfine,B5: the polyureas optionally in a polyolefin matrix,
B6 : les polycarbodiimides éventuellement dans une matrice de polyoléfine,B6: the polycarbodiimides optionally in a polyolefin matrix,
B7 : les polyols ester portant des groupements acrylates multiples éventuellement dans une matrice de polyoléfine,B7: the ester polyols carrying multiple acrylate groups optionally in a polyolefin matrix,
Selon une forme particulière de l'invention (B1) est soit un copolymère de l'éthylène et d'un époxyde insaturé soit une polyoléfine greffée par un époxyde insaturé. S'agissant de la polyoléfine greffée par un époxyde insaturé on entend par polyoléfine les polymères comprenant des motifs oléfines tels que par exemple des motifs éthylène, propylène, butène-1 , ou tout autre alpha oléfine. A titre d'exemple, on peut citer - les polyéthylènes tels que les LDPE, HDPE, LLDPE ou VLDPE, le polypropylène, les copolymeres éthylène / propylène, les EPR (éthylène / propylène Rubber) ou encore les PE métallocenes (copolymeres obtenus par catalyse monosite), - les copolymeres blocs styrène / éthylène-butène / styrène (SEBS), les copolymeres blocs styrène / butadiène / styrène (SBS), les copolymeres blocs styrène / isoprène / styrène (SIS), les copolymeres blocs styrène / éthylène- propylène / styrène, les éthylène / propylène / diène (EPDM) ; - les copolymeres de l'éthylène avec au moins un produit choisi parmi les sels ou les esters d'acides carboxyliques insaturés, ou les esters vinyliques d'acides carboxyliques saturés. Avantageusement, la polyoléfine est choisie parmi le LLDPE, le VLDPE, le poiypropylène, les copolymeres éthylène / acétate de vinyle ou les copolymeres éthylène / (méth)acrylate d'alkyle. La densité peut être avantageusement comprise entre 0,86 et 0,965, l'indice de fluidité (MFI) peut être compris entre 0,3 et 40 (en g/10 min à 190°C sous 2,16 kg) . S'agissant des copolymeres de l'éthylène et d'un époxyde insaturé on peut citer par exemple les copolymeres de l'éthylène d'un (meth)acrylate d'alkyle et d'un époxyde insaturé ou les copolymeres de l'éthylène, d'un ester vinylique d'acide carboxyiique saturé et d'un époxyde insaturé. La quantité époxyde peut être jusqu'à 15 % en poids du copolymère et la quantité d'éthylène d'au moins 50 % en poids. Avantageusement (B1) est un copolymère de l'éthylène d'un (meth)acrylate d'alkyle et d'un époxyde insaturé. De préférence le (meth)acrylate d'alkyle est tel que l'alkyle possède 2 à 10 atomes de carbone. Le MFI (indice de fluidité à l'état fondu) de (B1 ) peut être par exemple entre 0,1 et 50 (g/10 min à 190°C sous 2,16 kg). Des exemples d'acrylate ou methacrylate d'alkyle utilisables sont notamment le methacrylate de méthyle, l'acrylate d'éthyle, l'acrylate de n-butyle, l'acrylate d'isobutyle, l'acrylate de 2-éthylhexyle. Des exemples d'époxydes insaturés utilisables sont notamment : - les esters et éthers de glycidyle aliphatiques tels que rallylglycidyléther, le vinylglycidyléther, le maléate et l'itaconate de glycidyle, l'acrylate et le methacrylate de glycidyle, et - les esters et éthers de glycidyle alicycliques tels que le 2-cyclohexène- l-glycidyléther, le cyclohexène-4,5-diglycidylcarboxylate, le cyclohexène-4- glycidyl carboxylate, 5-norbornène-2-méthyl-2-glycidyl carboxylate et endocis- bicyclo(2,2,1 )-5-heptène-2,3-diglycidyl dicarboxylate.According to a particular form of the invention (B1) is either a copolymer of ethylene and an unsaturated epoxide or a polyolefin grafted with an unsaturated epoxide. As regards the polyolefin grafted with an unsaturated epoxide, the term polyolefin is understood to mean polymers comprising olefin units such as, for example, ethylene, propylene, butene-1 units, or any other alpha olefin. By way of example, there may be mentioned - polyethylenes such as LDPE, HDPE, LLDPE or VLDPE, polypropylene, ethylene / propylene copolymers, EPRs (ethylene / propylene Rubber) or metallocene PEs (copolymers obtained by catalysis monosite), - styrene / ethylene-butene / styrene block copolymers (SEBS), styrene / butadiene / styrene block copolymers, styrene / isoprene / styrene block copolymers (SIS), styrene / ethylene-propylene block copolymers / styrene, ethylene / propylene / diene (EPDM); - copolymers of ethylene with at least one product chosen from salts or esters of unsaturated carboxylic acids, or vinyl esters of saturated carboxylic acids. Advantageously, the polyolefin is chosen from LLDPE, VLDPE, polypropylene, ethylene / vinyl acetate copolymers or ethylene / alkyl (meth) acrylate copolymers. The density can advantageously be between 0.86 and 0.965, the melt index (MFI) can be between 0.3 and 40 (in g / 10 min at 190 ° C. under 2.16 kg). As regards the copolymers of ethylene and of an unsaturated epoxide, mention may, for example, be made of copolymers of ethylene with an alkyl (meth) acrylate and of an unsaturated epoxide, or copolymers of ethylene, a vinyl ester of saturated carboxyic acid and an unsaturated epoxide. The epoxide amount can be up to 15% by weight of the copolymer and the ethylene amount at least 50% by weight. Advantageously (B1) is a copolymer of ethylene with an alkyl (meth) acrylate and an unsaturated epoxide. Preferably the alkyl (meth) acrylate is such that the alkyl has 2 to 10 carbon atoms. The MFI (melt flow index) of (B1) can be for example between 0.1 and 50 (g / 10 min at 190 ° C under 2.16 kg). Examples of alkyl acrylate or methacrylate which can be used are in particular methyl methacrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate. Examples of unsaturated epoxides which can be used are in particular: - aliphatic glycidyl esters and ethers such as rallylglycidylether, vinyl glycidylether, glycidyl itaconate and maleate, glycidyl acrylate and methacrylate, and - esters and ethers of glycidyl alicyclic glycidyls such as 2-cyclohexene-1-glycidyl ether, cyclohexene-4,5-diglycidylcarboxylate, cyclohexene-4-glycidyl carboxylate, 5-norbornene-2-methyl-2-glycidyl carboxylate and endocis- bicyclo (2,2 , 1) -5-heptene-2,3-diglycidyl dicarboxylate.
Selon une forme particulière de l'invention (B2) est un polymère contenant de l'éthylène et un anhydride d'acide carboxyiique insaturé. (B2) est soit un copolymère de l'éthylène et d'un anhydride d'acide carboxyiique insaturé soit une polyoléfine greffée par un anhydride d'acide carboxyiique insaturé. La polyoléfine peut être choisie parmi les polyoléfines citées plus haut et devant être greffées par un époxyde insaturé. Des exemples d'anhydrides d'acide dicarboxylique insaturé utilisables comme constituants de (B2) sont notamment l'anhydre maléique, l'anhydride itaconique, l'anhydride citraconique, l'anhydride tétrahydrophtalique. A titre d'exemples on peut citer les copolymeres de l'éthylène d'un (meth)acrylate d'alkyle, d'un anhydride d'acide carboxyiique insaturé et les copolymeres de l'éthylène, d'un ester vinylique d'acide carboxyiique saturé et d'un anhydride d'acide carboxyiique insaturé. La quantité d'anhydre carboxyiique insaturé peut être jusqu'à 15 % en poids du copolymère et la quantité d'éthylène d'au moins 50 % en poids. Avantageusement (B2) est un copolymère de l'éthylène d'un (meth)acrylate d'alkyle et d'un anhydride carboxyiique insaturé. De préférence le (meth)acrylate d'alkyle est tel que l'alkyle possède 2 à 10 atomes de carbone. Le (méth)acrylate d'alkyle peut être choisi parmi ceux cités plus haut. Le MFI de (B) peut être par exemple entre 0,1 et 50 (g/10 min à 190°C sous 2,16 kg).According to a particular form of the invention (B2) is a polymer containing ethylene and an anhydride of unsaturated carboxyic acid. (B2) is either a copolymer of ethylene and of an unsaturated carboxyic acid anhydride or a polyolefin grafted with an unsaturated carboxyic acid anhydride. The polyolefin can be chosen from the polyolefins mentioned above and which have to be grafted with an unsaturated epoxide. Examples of unsaturated dicarboxylic acid anhydrides which can be used as constituents of (B2) are in particular maleic anhydride, itaconic anhydride, citraconic anhydride, tetrahydrophthalic anhydride. By way of examples, mention may be made of copolymers of ethylene with an alkyl (meth) acrylate, of an unsaturated carboxyic acid anhydride and copolymers of ethylene, of a vinyl acid ester. saturated carboxy and an unsaturated carboxy anhydride. The amount of unsaturated carboxylic anhydride can be up to 15% by weight of the copolymer and the amount of ethylene at least 50% by weight. Advantageously (B2) is an ethylene copolymer of an alkyl (meth) acrylate and of an unsaturated carboxylic anhydride. Preferably the alkyl (meth) acrylate is such that the alkyl has 2 to 10 carbon atoms. The alkyl (meth) acrylate can be chosen from those mentioned above. The MFI of (B) can for example be between 0.1 and 50 (g / 10 min at 190 ° C. under 2.16 kg).
Le collage irréversible de très bonne tenue en température est obtenu en combinant : web A1 avec web choisi parmi B1 , B2, B3, B4 et B6, web A2 avec web choisi parmi B1 , B3 et B6, web A3 avec web choisi parmi B1 , B2, B3, B4, B5, B6 et B7, web A4 avec web choisi parmi Blet B7, web A5 avec web B7. ExemplesIrreversible bonding with very good temperature resistance is obtained by combining: web A1 with web chosen from B1, B2, B3, B4 and B6, web A2 with web chosen from B1, B3 and B6, web A3 with web chosen from B1, B2, B3, B4, B5, B6 and B7, A4 web with web chosen from Blet B7, A5 web with B7 web. Examples
On a utilisé les produits suivants :The following products were used:
Lotader® 7500 : désigne un copolymère éthylène-acrylate d'éthyle-anhydride maleique de proportions en poids 80/ 17/ 3, de MFI 70 g/10min sous 2,16 kg àLotader® 7500: designates an ethylene-ethyl acrylate-maleic anhydride copolymer with proportions by weight 80/17/3, of MFI 70 g / 10min at 2.16 kg at
190°C. Il est fabriqué par polymérisation radicalaire sous haute pression.190 ° C. It is produced by radical polymerization under high pressure.
Lotader® AX8950 : désigne un copolymère éthylène-acrylate de méthyle- méthacrylate de glycidyle de proportions en poids 72,2/ 18,8 / 9, de MFI 90 g/10min sous 2,16 kg à 190°C. Il est fabriqué par polymérisation radicalaire sous haute pression.Lotader® AX8950: denotes an ethylene-methyl acrylate-glycidyl methacrylate copolymer with proportions by weight 72.2 / 18.8 / 9, of MFI 90 g / 10 min at 2.16 kg at 190 ° C. It is produced by radical polymerization under high pressure.
Platamid®1: désigne un copolyamide 6.9/ 12 en proportions massiques 30 /70 obtenu par condensation de l'hexamethylene diamine, du diacide en C9 et du lauryllactame. Il est terminé di-COOH, le MFI est 15 g/10min sous 2,16 kg àPlatamid®1: denotes a copolyamide 6.9 / 12 in mass proportions 30/70 obtained by condensation of hexamethylene diamine, C9 diacid and lauryllactam. It is finished di-COOH, the MFI is 15 g / 10min under 2.16 kg at
160°C.160 ° C.
Piatamid®2: désigne un copolyamide essentiellement à base d'hexamethylene diamine, de caprolactame, d'acide adipique, de diacide en C10 et d'acide aminoundecanoïque. Le MFI est 9 g/10min sous 2,16 kg à 150°C.Piatamid®2: designates a copolyamide essentially based on hexamethylene diamine, caprolactam, adipic acid, C10 diacid and aminoundecanoic acid. The MFI is 9 g / 10 min under 2.16 kg at 150 ° C.
Platamid®3: désigne un copolyamide 6 / 6.6 / 12 en proportions 40 / 20 / 40 obtenu par condensation de l'hexamethylene diamine, de l'acide adipique et du lauryllactame. On a fait des films de Platamid® et de Lotader® d'épaisseur 50 μm puis le collage de ces films a été réalisé dans en presse sous les conditions suivantes : 60 sec, 280 dN, T(coté Lotader) = 75°C, T(coté Platamid) = 150°C Les résultats sont reportés sur les tableaux 1 et 2 suivants dans lesquels le taux de gels prouve une réticulation. Tableau 1Platamid®3: denotes a copolyamide 6 / 6.6 / 12 in proportions 40/20/40 obtained by condensation of hexamethylene diamine, adipic acid and lauryllactam. Films of Platamid® and Lotader® with a thickness of 50 μm were made and then the bonding of these films was carried out in a press under the following conditions: 60 sec, 280 dN, T (Lotader side) = 75 ° C., T (Platamid side) = 150 ° C. The results are reported in the following Tables 1 and 2 in which the rate of gels proves crosslinking. Table 1
Tableau 2Table 2

Claims

REVENDICATIONS
1 Procédé de collage de deux matériaux par un adhésif réticulable dans lequel on dispose du coté du matériau (A) qui doit coller sur l'autre matériau (B) une composition (A), on dispose du coté du matériau (B) qui doit coller sur l'autre matériau (A) une composition (B), la mise en contact des compositions (A) et (B) et des matériaux (A) et (B) en présence de chaleur et éventuellement d'une pression exercée sur les matériaux constitue un adhésif réticulé qui assemble les deux matériaux.1 Method of bonding two materials with a crosslinkable adhesive in which there is the side of the material (A) which must stick on the other material (B) a composition (A), there is the side of the material (B) which must sticking on the other material (A) a composition (B), bringing the compositions (A) and (B) into contact with the materials (A) and (B) in the presence of heat and possibly of a pressure exerted on the materials constitute a crosslinked adhesive which joins the two materials.
2 Procédé selon la revendication 1 dans lequel les compositions (A) et (B) se présentent sous forme de film, de maille ou de non tissé (désigné par "film").2 The method of claim 1 wherein the compositions (A) and (B) are in the form of film, mesh or nonwoven (designated by "film").
3 Procédé selon la revendication 2 dans lequel on attache les deux films (A) et (B) par des points de colle pour rendre les deux films solidaires et faciliter leur manipulation.3 The method of claim 2 wherein the two films are attached (A) and (B) by dots of glue to make the two films integral and facilitate their handling.
4 Procédé selon la revendication 2 dans lequel on attache les deux films (A) et (B) en chauffant les films (A) et (B) en quelques points seulement pour rendre les deux films solidaires et faciliter leur manipulation.4 The method of claim 2 wherein the two films are attached (A) and (B) by heating the films (A) and (B) at only a few points to make the two films integral and facilitate their handling.
5 Procédé de collage de deux matériaux par un adhésif réticulable dans lequel la partie du matériau (A) qui doit coller sur l'autre matériau (B) est revêtue d'une composition (A), la partie du matériau (B) qui doit coller sur l'autre matériau (A) est revêtue d'une composition (B), la mise en contact des compositions (A) et (B) en présence de chaleur et éventuellement d'une pression exercée sur les matériaux constitue un adhésif réticulé qui assemble les deux matériaux.5 A method of bonding two materials with a crosslinkable adhesive in which the part of the material (A) which has to stick on the other material (B) is coated with a composition (A), the part of the material (B) which must sticking to the other material (A) is coated with a composition (B), bringing the compositions (A) and (B) into contact in the presence of heat and possibly of a pressure exerted on the materials constitutes a crosslinked adhesive which combines the two materials.
6 Procédé selon la revendication 5 dans lequel les compositions (A) et (B) sont déposées à l'état fondu sur les matériaux. 7 Procédé selon la revendication 5 dans lequel au moins l'une des compositions (A) ou (B) se présente sous forme de film, de maille ou de non tissé (désigné par "film").6 The method of claim 5 wherein the compositions (A) and (B) are deposited in the molten state on the materials. 7 The method of claim 5 wherein at least one of the compositions (A) or (B) is in the form of film, mesh or nonwoven (designated by "film").
8 Procédé selon la revendication 7 dans lequel le film est fixé sur le matériau par un simple pressage à chaud sans faire fondre le film, ensuite on met en contact les deux matériaux par leur partie revêtue des films et on chauffe, éventuellement on exerce une pression sur les matériaux.8 The method of claim 7 wherein the film is fixed on the material by a simple hot pressing without melting the film, then the two materials are brought into contact by their part coated with films and heated, possibly exerting pressure on materials.
9 Procédé selon l'une quelconque des revendications précédentes dans lequel la composition (A) est choisie parmi :9 Method according to any one of the preceding claims, in which the composition (A) is chosen from:
A1 : les copolyamides (CoPA) et les copolymeres à blocs copolyamides et blocs polyethers,A1: copolyamides (CoPA) and copolymers with copolyamide blocks and polyether blocks,
A2 : les copolyamides à terminaisons COOH et les copolymeres à blocs copolyamides et blocs polyethers à terminaisons COOH,A2: the copolyamides with COOH endings and the copolymers with copolyamide blocks and polyether blocks with COOH endings,
A3 : les copolyamides à terminaisons NH2 et les copolymeres à blocs copolyamides et blocs polyethers à terminaisons NH2,A3: copolyamides with NH2 endings and copolymers with copolyamide blocks and polyether blocks with NH2 endings,
A4 : les copolyamides terminés par un acide et les copolymeres à blocs copolyamides et blocs polyethers terminés par un acide cet acide portant des liaisons insaturées,A4: copolyamides terminated by an acid and copolymers containing copolyamide blocks and polyether blocks terminated by an acid, this acid carrying unsaturated bonds,
A5 : les copolymeres à blocs copolyamides et blocs polyethers dans lesquels les blocs polyéther sont en polybutadiene.A5: copolymers with copolyamide blocks and polyether blocks in which the polyether blocks are made of polybutadiene.
10 Procédé selon l'une quelconque des revendications précédentes dans lequel la composition (B) est choisie parmi :10 Method according to any one of the preceding claims, in which the composition (B) is chosen from:
B1 : les polymères portant des fonctions époxy tels que les copolymeres de l'éthylène du methacrylate de glycidyle (GMA) et éventuellement d'un (meth)acrylate d'alkyle et les copolymeres à base d'epichloridrine, B2 : les polymères portant des fonctions anhydrides d'acide carboxyiique tels que les copolymeres de l'éthylène de l'anhydride maleique (MAH) et éventuellement d'un (meth)acrylate d'alkyle, les polymères portant des fonctions acide carboxyiique tels que les copolymeres de l'éthylène de l'acide acrylique et éventuellement d'un (meth)acrylate d'alkyle,B1: polymers carrying epoxy functions such as ethylene copolymers of glycidyl methacrylate (GMA) and optionally of an alkyl (meth) acrylate and copolymers based on epichloridrine, B2: polymers carrying carboxyic acid anhydride functions such as ethylene copolymers of maleic anhydride (MAH) and optionally of an alkyl (meth) acrylate, the polymers carrying carboxyic acid functions such as copolymers of ethylene with acrylic acid and optionally with an alkyl (meth) acrylate,
B3 : les isocyanates (ou les polyisocyanates) encapsulés dans une matrice en polyoléfine,B3: isocyanates (or polyisocyanates) encapsulated in a polyolefin matrix,
B4 : les polycetones,B4: polyketones,
B5 : les polyurées éventuellement dans une matrice de polyoléfine,B5: the polyureas optionally in a polyolefin matrix,
B6 : les polycarbodiimides éventuellement dans une matrice de polyoléfine,B6: the polycarbodiimides optionally in a polyolefin matrix,
B7 : les polyols ester portant des groupements acrylates multiples éventuellement dans une matrice de polyoléfine.B7: ester polyols carrying multiple acrylate groups optionally in a polyolefin matrix.
11 Procédé selon la revendication 10 dans lequel (B1 ) est un copolymère de l'éthylène d'un (meth)acrylate d'alkyle et d'un époxyde insaturé.11 The method of claim 10 wherein (B1) is an ethylene copolymer of an alkyl (meth) acrylate and an unsaturated epoxide.
12 Procédé selon la revendication 10 dans lequel (B2) est un copolymère de l'éthylène d'un (meth)acrylate d'alkyle et d'un anhydride carboxyiique insaturé. 12 The method of claim 10 wherein (B2) is an ethylene copolymer of an alkyl (meth) acrylate and an unsaturated carboxylic anhydride.
EP04805465A 2003-11-21 2004-11-17 Method for gluing two materials using a cross-linking adhesive Withdrawn EP1685204A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0313656 2003-11-21
PCT/FR2004/002928 WO2005061640A1 (en) 2003-11-21 2004-11-17 Method for gluing two materials using a cross-linking adhesive

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EP1685204A1 true EP1685204A1 (en) 2006-08-02

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CN107384296B (en) * 2017-07-05 2020-07-28 林立州 Hot melt adhesive for compounding photovoltaic film and metal
FR3072965B1 (en) * 2017-10-31 2021-11-05 Protechnic COMPOSITION AND STRUCTURE OF A CROSS-LINKABLE MULTI-PHASE ADHESIVE

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US3533877A (en) * 1968-04-12 1970-10-13 Cutler Mail Chute Co Inc Method of applying glue components
US4070225A (en) * 1976-11-17 1978-01-24 H. B. Fuller Company Method of using structural adhesive
US4342613A (en) * 1979-09-21 1982-08-03 Leary James N O Method of bonding surfaces with a solid adhesive
JPS5690867A (en) * 1979-12-26 1981-07-23 Konishi Kk Quick-curing adhesive composition
GB8801813D0 (en) * 1988-01-27 1988-02-24 Raychem Sa Nv Adhesive composition
WO2000071343A1 (en) * 1999-05-20 2000-11-30 Reichhold, Inc. Method of forming laminates

Non-Patent Citations (1)

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Title
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KR20060088563A (en) 2006-08-04
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