EP1681527A1 - Ensemble des plaques isothermes avec forme prédéterminée et procédé de fabrication - Google Patents

Ensemble des plaques isothermes avec forme prédéterminée et procédé de fabrication Download PDF

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Publication number
EP1681527A1
EP1681527A1 EP05000861A EP05000861A EP1681527A1 EP 1681527 A1 EP1681527 A1 EP 1681527A1 EP 05000861 A EP05000861 A EP 05000861A EP 05000861 A EP05000861 A EP 05000861A EP 1681527 A1 EP1681527 A1 EP 1681527A1
Authority
EP
European Patent Office
Prior art keywords
plate
upper plate
lower plate
isothermal
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05000861A
Other languages
German (de)
English (en)
Other versions
EP1681527B1 (fr
Inventor
Kuo-Len Lin
Hui-Min Tsui
Ken Hsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CpuMate Inc
Original Assignee
CpuMate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CpuMate Inc filed Critical CpuMate Inc
Priority to EP05000861A priority Critical patent/EP1681527B1/fr
Priority to ES05000861T priority patent/ES2287814T3/es
Priority to DE602005001153T priority patent/DE602005001153T2/de
Priority to AT05000861T priority patent/ATE362604T1/de
Priority to DK05000861T priority patent/DK1681527T3/da
Priority to PL05000861T priority patent/PL1681527T3/pl
Publication of EP1681527A1 publication Critical patent/EP1681527A1/fr
Application granted granted Critical
Publication of EP1681527B1 publication Critical patent/EP1681527B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular

Definitions

  • the present invention relates to an isothermal plate assembly with predetermined shape and method for manufacturing the same, and more particularly to an isothermal plate assembly with predetermined shape and manufactured by low cost and high yield process.
  • the conventional isothermal plate for heat-dissipating device of electronic apparatus is manufactured by a high thermally conductive material.
  • the thermally conductive material is manufactured into a flat plate with a hollow accommodation space defined therein and containing wicked structure.
  • the isothermal plate further comprises a wavy supporting unit arranged in the hollow accommodation space and used to support walls between an upper plate and a lower plate. The isothermal plate is then filled with working fluid and the accommodation space is sealed.
  • the isothermal plate described in above-mentioned process can only form plate-like structure because the conventional isothermal plate adopts non-vacuum structure.
  • the conventional isothermal plate has crack problem when it is bent from flat state or its shape is varied due to temperature change. The yield of the conventional isothermal plate is degraded.
  • the electronic apparatus are arranged on one side of the isothermal plate, and the heat-dissipating fins are arranged on another side of the isothermal plate. The heat-dissipating device is difficult to be made compact and the heat-dissipating effect is influenced.
  • the present invention is to provide an isothermal plate assembly with predetermined shape and manufactured by low cost and high yield process, thus meeting requirements of various electronic apparatus.
  • the present invention provides a manufacturing method for an isothermal plate assembly.
  • An upper plate and a lower plate with predetermined shape are provided and an accommodation space is defined therein.
  • a flattened heat pipe is bent into the predetermined shape and placed into the accommodation space.
  • a binding agent is applied on the face between the heat pipe, the upper plate and the lower plate.
  • the upper plate and the lower plate are assembled and then a hot melting process is executed.
  • the resultant product is then cooled to form a finished isothermal plate assembly with predetermined shape.
  • the present invention provides an isothermal plate assembly with predetermined shape, which comprises an upper plate, a lower plate opposite to the upper plate and an accommodation space defined between the upper plate and the lower plate.
  • the upper plate and the lower plate are bent into a predetermined shape.
  • a heat pipe is bent to the predetermined shape and placed into the accommodation space.
  • Fig. 1 shows the flowchart of method for manufacturing the isothermal plate assembly 1 according to a preferred embodiment of the present invention, which comprises following steps:
  • the heat pipe 2 can be firstly subjected to flatten process and then bent according to the shape of the upper plate 11 and the lower plate 12.
  • the isothermal plate assembly can be made with various shapes.
  • the isothermal plate assembly is formed by assembling the upper plate 11 and the lower plate 12.
  • the upper plate 11 and the lower plate 12 are preformed with predetermined bending shape.
  • the heat pipe 2 also has corresponding bending shape and is placed between the upper plate 11 and the lower plate 12 for providing heat conduction. Therefore, the isothermal plate with multiple and various shapes can be made with simple and low cost process.
  • the isothermal plate with multiple shapes can be easily adapted with various electronic devices.
  • the above-mentioned steps 102, 104 and 106 are interchangeable. That is, the heat pipe 2, the upper plate 11 and the lower plate 12 are bent before the heat pipe 2 is placed into the accommodation space 113 formed between the upper plate 11 and the lower plate 12. Alternatively, the heat pipe 2 is firstly placed into the accommodation space 113 formed between the upper plate 11 and the lower plate 12 and then bent together with the upper plate 11 and the lower plate 12. Moreover, a binding agent is selectively applied to contact faces between the heat pipe 2 and the upper plate 11 (and the lower plate 12). The binding agent fills the gap between the heat pipe 2 and the upper plate 11 (and the lower plate 12) by a following-up heating process.
  • step 106 the step of applying binding agent to contact faces between the heat pipe 2 and the upper plate 11 (and the lower plate 12) can be eliminated if the hermetic degree between the heat pipe 2 and the upper plate 11 (and the lower plate 12) is sufficient.
  • the step of applying binding agent to contact faces between the upper plate 11 and the lower plate 12 can also be eliminated.
  • the end product is manufactured in the step 108, wherein the upper plate 11 and the lower plate 12 are assembled. The high temperature heating process can be eliminated.
  • the isothermal plate assembly with multiple shapes comprises an upper plate 11, a lower plate 12 and flattened heat pipe 2 between the upper plate 11 and the lower plate 12.
  • the upper plate 11 and the lower plate 12 are used form a closed isothermal plate assembly 1 and define an accommodation space 13 therein for receiving the flattened heat pipe 2.
  • at least one dent 14 is defined on either the upper plate 11 or the lower plate 12.
  • the upper plate 11 or the lower plate 12 with the dent 14 is assembled with the lower plate 12 or the upper plate 11 with smooth face to form an isothermal plate 1 with the accommodation space 13, as shown in Fig. 3.
  • both the upper plate 11 and the lower plate 12 are provided with dents 14, 14' to define the accommodation space 13 when the upper plate 11 and the lower plate 12 are assembled together.
  • the upper plate 11 and the lower plate 12 provided with dent 14, 14' are assembled by the help of outer coupling plates 111 and 121.
  • the accommodation space 13 is defined by the dents provided by the upper plate 11 and the lower plate 12.
  • the upper plate 11 and the lower plate 12 can be subjected to bending operation of other shape before assembling into the isothermal plate 1.
  • the shape is, for example, L shape in Fig. 2, U shape in Fig. 6 or S shape in Fig. 7.
  • the heat pipe 2 is placed in the accommodation space 13 defined by the dents provided by the upper plate 11 and the lower plate 12 and is functioned to provide heat conduction.
  • the heat pipe 2 is flattened to increase a contact surface between the upper plate 11 and the lower plate 12 and can be bent according to the shape of the upper plate 11 and the lower plate 12. Therefore, the heat pipe 2 has shape corresponding to the shape of the accommodation space 13 between the upper plate 11 and the lower plate 12.
  • the heat pipe 2 can be easily assembled into the accommodation space 13, as shown in Figs. 2 to 5.

Landscapes

  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Adornments (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Tunnel Furnaces (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
EP05000861A 2005-01-17 2005-01-17 Procédé de fabrication d'un ensemble des plaques isothermes avec forme prédéterminée Not-in-force EP1681527B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP05000861A EP1681527B1 (fr) 2005-01-17 2005-01-17 Procédé de fabrication d'un ensemble des plaques isothermes avec forme prédéterminée
ES05000861T ES2287814T3 (es) 2005-01-17 2005-01-17 Procedimiento para fabricar un ensamblaje de placa isotermica con forma predeterminada.
DE602005001153T DE602005001153T2 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme Plattenanordnung mit vorbestimmter Form
AT05000861T ATE362604T1 (de) 2005-01-17 2005-01-17 Herstellungsverfahren für eine isotherme plattenanordnung mit vorbestimmter form
DK05000861T DK1681527T3 (da) 2005-01-17 2005-01-17 Fremgangsmåde til fremstilling af et isotermisk pladeaggregat med forudbestemt form
PL05000861T PL1681527T3 (pl) 2005-01-17 2005-01-17 Sposób wytwarzania zespołu płytki izotermicznej o określonym kształcie

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05000861A EP1681527B1 (fr) 2005-01-17 2005-01-17 Procédé de fabrication d'un ensemble des plaques isothermes avec forme prédéterminée

Publications (2)

Publication Number Publication Date
EP1681527A1 true EP1681527A1 (fr) 2006-07-19
EP1681527B1 EP1681527B1 (fr) 2007-05-16

Family

ID=34933339

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05000861A Not-in-force EP1681527B1 (fr) 2005-01-17 2005-01-17 Procédé de fabrication d'un ensemble des plaques isothermes avec forme prédéterminée

Country Status (6)

Country Link
EP (1) EP1681527B1 (fr)
AT (1) ATE362604T1 (fr)
DE (1) DE602005001153T2 (fr)
DK (1) DK1681527T3 (fr)
ES (1) ES2287814T3 (fr)
PL (1) PL1681527T3 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3508786A4 (fr) * 2016-09-02 2020-06-03 Eidopia, S.L. Système opto-thermique comprenant des plaques thermiques bidimensionnelles
WO2021249970A1 (fr) * 2020-06-11 2021-12-16 Signify Holding B.V. Ensemble chambre à vapeur
US20230191472A1 (en) * 2021-12-16 2023-06-22 Nanjing University Of Aeronautics And Astronautics Free-bending forming apparatus for tubular component made of difficult-to-deform material using differential temperatures and method thereof

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000A1 (de) * 1978-11-22 1980-07-17 Pioneer Electronic Corp Gehaeuse fuer elektronische vorrichtungen
US4461343A (en) * 1982-01-28 1984-07-24 Mcdonnell Douglas Corporation Plated heat pipe
DE3543673A1 (de) * 1985-12-11 1987-06-19 Sueddeutsche Kuehler Behr Einrichtung zum heizen
US4880052A (en) * 1989-02-27 1989-11-14 Thermacore, Inc. Heat pipe cooling plate
JPH04366394A (ja) * 1991-06-11 1992-12-18 Akutoronikusu Kk ハイブリッド型ヒートパイプ平板構造体
EP0881675A2 (fr) * 1997-05-30 1998-12-02 Hewlett-Packard Company Empaquetage semi-conducteur avec caloduc interne
JPH11294981A (ja) * 1998-04-10 1999-10-29 Diamond Electric Mfg Co Ltd ヒートパイプの加工方法
JP2001165584A (ja) * 1999-12-02 2001-06-22 Tokai Rubber Ind Ltd シート状ヒートパイプ
JP2001241869A (ja) * 2000-02-24 2001-09-07 Toshiba Corp ヒートパイプ構造
US20030136551A1 (en) * 2002-01-19 2003-07-24 Bakke Allan P. Light weight flat heat pipe utilizing copper foil container laminated to heat treated aluminum sheets for structural stability

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2947000A1 (de) * 1978-11-22 1980-07-17 Pioneer Electronic Corp Gehaeuse fuer elektronische vorrichtungen
US4461343A (en) * 1982-01-28 1984-07-24 Mcdonnell Douglas Corporation Plated heat pipe
DE3543673A1 (de) * 1985-12-11 1987-06-19 Sueddeutsche Kuehler Behr Einrichtung zum heizen
US4880052A (en) * 1989-02-27 1989-11-14 Thermacore, Inc. Heat pipe cooling plate
JPH04366394A (ja) * 1991-06-11 1992-12-18 Akutoronikusu Kk ハイブリッド型ヒートパイプ平板構造体
EP0881675A2 (fr) * 1997-05-30 1998-12-02 Hewlett-Packard Company Empaquetage semi-conducteur avec caloduc interne
JPH11294981A (ja) * 1998-04-10 1999-10-29 Diamond Electric Mfg Co Ltd ヒートパイプの加工方法
JP2001165584A (ja) * 1999-12-02 2001-06-22 Tokai Rubber Ind Ltd シート状ヒートパイプ
JP2001241869A (ja) * 2000-02-24 2001-09-07 Toshiba Corp ヒートパイプ構造
US20030136551A1 (en) * 2002-01-19 2003-07-24 Bakke Allan P. Light weight flat heat pipe utilizing copper foil container laminated to heat treated aluminum sheets for structural stability

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 244 (M - 1410) 17 May 1993 (1993-05-17) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 01 31 January 2000 (2000-01-31) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 23 10 February 2001 (2001-02-10) *
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 26 1 July 2002 (2002-07-01) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3508786A4 (fr) * 2016-09-02 2020-06-03 Eidopia, S.L. Système opto-thermique comprenant des plaques thermiques bidimensionnelles
WO2021249970A1 (fr) * 2020-06-11 2021-12-16 Signify Holding B.V. Ensemble chambre à vapeur
US20230191472A1 (en) * 2021-12-16 2023-06-22 Nanjing University Of Aeronautics And Astronautics Free-bending forming apparatus for tubular component made of difficult-to-deform material using differential temperatures and method thereof

Also Published As

Publication number Publication date
DK1681527T3 (da) 2007-09-10
ATE362604T1 (de) 2007-06-15
DE602005001153T2 (de) 2008-01-24
EP1681527B1 (fr) 2007-05-16
ES2287814T3 (es) 2007-12-16
PL1681527T3 (pl) 2007-10-31
DE602005001153D1 (de) 2007-06-28

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