EP1662068A1 - Floor and floor construction - Google Patents

Floor and floor construction Download PDF

Info

Publication number
EP1662068A1
EP1662068A1 EP05077539A EP05077539A EP1662068A1 EP 1662068 A1 EP1662068 A1 EP 1662068A1 EP 05077539 A EP05077539 A EP 05077539A EP 05077539 A EP05077539 A EP 05077539A EP 1662068 A1 EP1662068 A1 EP 1662068A1
Authority
EP
European Patent Office
Prior art keywords
floor
flanges
supports
tiles
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP05077539A
Other languages
German (de)
French (fr)
Other versions
EP1662068B1 (en
Inventor
Martinus Maria Van Den Ekart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Van Geel Legrand BV
Original Assignee
Van Geel Legrand BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Van Geel Legrand BV filed Critical Van Geel Legrand BV
Publication of EP1662068A1 publication Critical patent/EP1662068A1/en
Application granted granted Critical
Publication of EP1662068B1 publication Critical patent/EP1662068B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/06Flooring or floor layers composed of a number of similar elements of metal, whether or not in combination with other material
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/024Sectional false floors, e.g. computer floors
    • E04F15/02405Floor panels
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/024Sectional false floors, e.g. computer floors
    • E04F15/02405Floor panels
    • E04F15/02411Floor panels with integrated feet
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00Flooring
    • E04F15/02Flooring or floor layers composed of a number of similar elements
    • E04F15/024Sectional false floors, e.g. computer floors
    • E04F15/02447Supporting structures
    • E04F15/02452Details of junctions between the supporting structures and the panels or a panel-supporting framework

Definitions

  • the invention relates to a floor which is constructed from floor tiles which are supported by supports resting on a substructure, wherein the floor tiles are provided on their longitudinal edges with bent flanges which are received in the upper ends of grooves arranged in the supports such that a flange of a first floor tile and a flange of an adjacent floor tile lie in one groove.
  • the invention has for its object to obtain a floor of the above stated type wherein, while maintaining an effective clamping of the flanges of the floor tiles in the grooves of the support, the floor can follow possible unevenness in the surface of the ground on which the support rest, while in addition the floor tiles can be arranged and removed in simple manner.
  • the tiles When a floor according to the invention is applied the tiles can follow a sloping floor surface, since the parts of the flanges lying in the grooves can, within certain limits, pivot relative to each other. Movements between the floor tiles occurring for instance as a result of temperature changes and/or stresses in the floor can further be absorbed by the space present between the floor tiles.
  • the interspacing is preferably in the order of 0.4 to 1 mm, this space being found adequate for a sufficient pivoting to make it possible to follow slopes in the ground surface occurring in (office) buildings, as well as to absorb expansion of commonly occurring materials, wherein deforming of the tiles is prevented since they are always arranged without mutual contact.
  • the flanges can be connected continuously along their whole length to the remaining parts of the floor tiles, so that a reliable connection is obtained between flanges and floor plates, which will prevent undesirable deformation of the flanges.
  • the floor tiles are electrically conductive and the supports are provided with electrical conducting means which make contact with the floor tiles for electrical interconnection thereof.
  • an electrical earthing of the floor tiles is thus obtained for the purpose of greater safety.
  • the electrical conducting means preferably comprise a conductive profile, such as a metal sleeve or extrusion profile, in which the grooves are arranged.
  • the flanges on the side of the floor tile are provided with scraping protrusions which are in contact with the electrical conducting means.
  • the scraping protrusions also provide a clamping for a more robust fixing of the tiles in the supports.
  • the supports are preferably provided with damping means, whereby vibrations from footsteps and the like are absorbed.
  • the floor tiles are provided on the underside with centring protrusions which drop into centring openings in the top side of the supports. This construction is found to provide a more robust and precise fixing and positioning.
  • Figure 8 shows a side view in cross-section of a groove having therein two flanges in a sixth preferred embodiment
  • Figures 9 to 12 show further preferred embodiments of floor tiles according to the present invention.
  • Figures 1 and 2 show a first preferred embodiment of an assembly 1 according to the present invention, comprising rectangular or square floor tiles 2 having bent flanges 4 on the edges.
  • the flanges drop into grooves 6 which are arranged for this purpose in an upper outer end of support 8, with which the assembly rests on a ground surface which is further not shown.
  • floor tile 2 has a square form with four flanges 4 on the edges of floor tile 2 and bent at right angles relative thereto. Flanges 4 are arranged connecting to floor tile 2 along their whole length and end close to the corner points of floor tile 2.
  • centring holes 10 Arranged in the upper outer end of support 8 at equal distances from each other are four centring holes 10 into which drop centring protrusions (not shown) arranged on the underside of floor tiles 2 for the purpose of positioning floor tile 2 in correct manner relative to support 8.
  • electrical conducting means in a first preferred embodiment a contact ring 12 which is pressed by means of a spring construction 14 against flanges 4 for electrical interconnection thereof.
  • a floor constructed from floor tiles 2 and supports 8 of assembly 1 are earthed electrically on at least one floor tile. Owing to the interconnection provided by the electrical conducting means the whole floor is thus earthed for greater safety.
  • a further provision is an interspace 16 which in the assembled situation is present between the edges and flanges 4 of adjacent floor tiles 2.
  • This gap is preferably larger than 0.2 mm and up to for instance 2 mm, and most preferably in the order of 0.5 mm.
  • flanges 4 are preferably provided on the side directed toward floor tile 2 with protrusions 18 with which the flanges are arranged clampingly in the groove 6 which in side view is diabolo-shaped.
  • the gap 16 is advantageous in making the upper surfaces of floor tiles 2 sufficiently pivotable relative to each other to be able to follow slopes and other unevenness in the ground surface. Gap 16 also ensures that possible expansion of floor tiles 2, as a consequence of for instance temperature, is absorbed without deformation of the floor tiles occurring, this due to the absence of contact between the floor tiles. This pivotability is also made possible by the diabolo shape of the side walls of grooves 6 (Fig. 2).
  • a floor is constructed from an assembly 28 comprising floor tiles 30 with bent flanges 32 on the side edges thereof as according to the above described first embodiment.
  • the flanges drop into grooves 34 of supports 36.
  • a gap 38 is present between floor tiles 30 and between flanges 32 which has the advantages and features in accordance with the above described gap 16.
  • the flanges are further fixed clampingly by protrusions 40 into the groove 34 which in side view is diabolo-shaped (Fig. 4).
  • the electrical conducting means are formed in this second variant by a peripheral contact wire 42 which is arranged running around the top end of support 36 and touches the centring holes 44 therein.
  • Floor tiles 30 are herein provided with threaded pins 46 which fall into centring holes 44 for the purpose of positioning the floor tiles relative to the supports and which also contact the contact wire 42 for electrical interconnection of the floor tiles.
  • the floor tiles are herein manufactured from an electrically conductive material, for instance a metal or preferably galvanized steel.
  • a third embodiment variant relates to a floor constructed from an assembly 50 as shown in figure 5A.
  • the assembly comprises floor tiles 52 having bent flanges 54 on the side edges thereof, which flanges are arranged connecting along practically the whole length to floor tiles 52.
  • the bent flanges 54 drop into grooves 56 arranged in supports 58 for the purpose of supporting the floor tiles at a height relative to a ground surface 60.
  • the flanges of the floor tiles are interrupted at some distance before the end of floor tile 52.
  • a standing cylindrical projection 59 is arranged in the middle of support 58.
  • the projection takes a form corresponding to the outer ends 55 of flanges 54, so that it acts as a stop against which the flanges of the floor tiles come to rest (fig. 5B).
  • the projection thus also provides the correct gap between the floor tiles, preferably about 0.4 - 1 mm.
  • a support 58 in this third variant comprises a bottom mat 62 of a suitable material.
  • these bottom mats 62 are approximately round and mutually connected by a grid of strips 64, which enables quicker laying of the floor.
  • a support preferably comprises a roughly cylindrical steel sleeve 66 which provides the electrical interconnection of floor tiles 52 arranged therein, so that these tiles are earthed electrically despite the gap present between them.
  • a cup-shaped damper 68 of an appropriate material such as plastic is arranged inside sleeve 66 for the purpose of damping shocks caused by for instance footsteps on the floor.
  • Grooves 56 are arranged continuously in both sleeve 66 and damper 68.
  • the flanges 72 arranged on floor tiles 70 are provided in a preferred embodiment with protrusions 74 which make a scraping contact with edges 76 of a groove arranged in the support (Fig. 7).
  • grooves are arranged in a support, with in each case a groove 80 and a second groove 82 separated by a dividing wall 84 with a width preferably lying between about 0.4 and 1 mm (Fig. 8).
  • Floor tiles 86 once again have bent flanges 88 provided with protrusions 90 which come into scraping contact with walls 92, 94 of grooves 80, 82 respectively. Electrical interconnection is obtained in that floor tiles 86 and protrusions 90, as well as a part of the supports, are electrically conductive. Sufficient space is present here in grooves 80, 82 to ensure that floor tiles 86 are at least slightly pivotable relative to the support, and that (thermal) expansion of the floor tiles can also be absorbed (Fig. 8).
  • a floor 100 herein comprises floor tiles 102, only a fourth part of which is shown here, which floor tiles comprise on the edges bent flanges 104 which rest in groove-like recesses 106 in supports 108. Close to the corner points of floor tiles 102 centring protrusion 110 are arranged by being pressed through which drop into openings 112 arranged in the top side of supports 108.
  • the supports comprise an extrusion form 114 of a suitable material such as plastic, aluminium or zamak.
  • the extrusion form 114 has a practically cylindrical outer surface, and continuous openings 116 are arranged therein along the whole length which correspond with centring openings 112.
  • a damper 118 is arranged on top of extrusion form 114.
  • the damper is roughly cylindrical and grooves 106 are arranged therein at angles of 90° to each other, and a centring opening 112 is arranged in each case between the grooves.
  • Damper 118 serves to damp shocks and is preferably manufactured from a conductive plastic which provides a correct damping and also for electrical interconnection of floor tiles 102 (Fig. 6).
  • Figures 9 to 12 show further possible preferred embodiments of floor tiles.
  • Fig. 9 thus shows a practical embodiment of a floor tile 140, which in practice has sides in the order of 200 to 300 mm.
  • the supports 142 are arranged with a mutual spacing in the order of 125 mm and are optionally provided with a reinforcement.
  • Also shown are connecting pieces 114 for mutual connection of supports 142.
  • Fig. 10 shows a tile 140 as in Fig. 9 provided with supports 142, wherein a foot connecter 144 is also shown which on the upper side has four square recesses in which the square supports 142 come to rest.
  • a further foot connecter 146 is also shown wherein an earth clip 148 is arranged in the middle thereof for electrical interconnection of the supports resting on foot connecter 146 for the purpose of earthing thereof.
  • Fig. 11 shows a larger floor tile 160 with sides of for instance 450 mm. Supports 162 are arranged at a mutual spacing of 150 mm.
  • a larger tile 170 has for instance sides in the order of 600 mm and is arranged on a plurality of supports 172 which are arranged not only at the corner points of tile 170 but also therebetween, at a mutual distance of for instance 133 mm.
  • the height of the foot is in this case the same as that of the above stated feet, but can also amount to about 55 mm.
  • Such larger tiles have in the middle of the tile a support (not shown) arranged on the underside.
  • the thickness of the tile is further in the order of 2 mm, just as the above mentioned tiles.

Abstract

The present invention provides a modular floor (1) constructed from floor tiles (2) which are supported by supports (8) resting on a ground surface, wherein the floor tiles are provided on their longitudinal edges with bent flanges (4) which are received in grooves (6) arranged in the upper ends of the supports such that a flange of a first floor tile and a flange of an adjacent floor tile lie in one groove, wherein at least some measure of interspacing is present between flanges lying opposite each other in the groove.

Description

  • The invention relates to a floor which is constructed from floor tiles which are supported by supports resting on a substructure, wherein the floor tiles are provided on their longitudinal edges with bent flanges which are received in the upper ends of grooves arranged in the supports such that a flange of a first floor tile and a flange of an adjacent floor tile lie in one groove.
  • The invention has for its object to obtain a floor of the above stated type wherein, while maintaining an effective clamping of the flanges of the floor tiles in the grooves of the support, the floor can follow possible unevenness in the surface of the ground on which the support rest, while in addition the floor tiles can be arranged and removed in simple manner.
  • This can be achieved according to the invention in that at least some measure of interspacing is present between flanges lying opposite each other in the groove.
  • When a floor according to the invention is applied the tiles can follow a sloping floor surface, since the parts of the flanges lying in the grooves can, within certain limits, pivot relative to each other. Movements between the floor tiles occurring for instance as a result of temperature changes and/or stresses in the floor can further be absorbed by the space present between the floor tiles.
  • The interspacing is preferably in the order of 0.4 to 1 mm, this space being found adequate for a sufficient pivoting to make it possible to follow slopes in the ground surface occurring in (office) buildings, as well as to absorb expansion of commonly occurring materials, wherein deforming of the tiles is prevented since they are always arranged without mutual contact.
  • The flanges can be connected continuously along their whole length to the remaining parts of the floor tiles, so that a reliable connection is obtained between flanges and floor plates, which will prevent undesirable deformation of the flanges.
  • In a preferred embodiment the floor tiles are electrically conductive and the supports are provided with electrical conducting means which make contact with the floor tiles for electrical interconnection thereof. In addition to the above stated advantages, an electrical earthing of the floor tiles is thus obtained for the purpose of greater safety.
  • The electrical conducting means preferably comprise a conductive profile, such as a metal sleeve or extrusion profile, in which the grooves are arranged.
  • In a further preferred embodiment the flanges on the side of the floor tile are provided with scraping protrusions which are in contact with the electrical conducting means. In addition to an electrical connection for earthing of the tiles, the scraping protrusions also provide a clamping for a more robust fixing of the tiles in the supports.
  • The supports are preferably provided with damping means, whereby vibrations from footsteps and the like are absorbed.
  • In yet another preferred embodiment the floor tiles are provided on the underside with centring protrusions which drop into centring openings in the top side of the supports. This construction is found to provide a more robust and precise fixing and positioning.
  • The invention will be further elucidated hereinbelow with reference to the accompanying figures, in which:
    • Figure 1 shows a top view of an assembly of support and floor tiles according to a first preferred embodiment of the present invention;
    • Figure 2 shows a side view in cross-section of the assembly of figure 1;
    • Figure 3 shows a top view of an assembly of support and floor tiles according to a second preferred embodiment of the present invention;
    • Figure 4 shows a side view in cross-section of the assembly of figure 3;
    • Figure 5A is a perspective view of a third preferred embodiment of a floor according to the present invention;
    • Figure 5B is a side view in cross-section of a stop of the floor tile of figure 5A against a projection of a support;
    • Figure 6 is a perspective view of a fourth preferred embodiment according to the present invention;
    • Figure 7 shows a side view in cross-section of a groove having therein two adjacent flanges in a fifth preferred embodiment;
  • Figure 8 shows a side view in cross-section of a groove having therein two flanges in a sixth preferred embodiment; and
  • Figures 9 to 12 show further preferred embodiments of floor tiles according to the present invention.
  • Figures 1 and 2 show a first preferred embodiment of an assembly 1 according to the present invention, comprising rectangular or square floor tiles 2 having bent flanges 4 on the edges. In the assembled situation the flanges drop into grooves 6 which are arranged for this purpose in an upper outer end of support 8, with which the assembly rests on a ground surface which is further not shown.
  • In the exemplary embodiment shown in the figures floor tile 2 has a square form with four flanges 4 on the edges of floor tile 2 and bent at right angles relative thereto. Flanges 4 are arranged connecting to floor tile 2 along their whole length and end close to the corner points of floor tile 2.
  • Arranged in the upper outer end of support 8 at equal distances from each other are four centring holes 10 into which drop centring protrusions (not shown) arranged on the underside of floor tiles 2 for the purpose of positioning floor tile 2 in correct manner relative to support 8.
  • In a side view are shown electrical conducting means, in a first preferred embodiment a contact ring 12 which is pressed by means of a spring construction 14 against flanges 4 for electrical interconnection thereof. A floor constructed from floor tiles 2 and supports 8 of assembly 1 are earthed electrically on at least one floor tile. Owing to the interconnection provided by the electrical conducting means the whole floor is thus earthed for greater safety.
  • A further provision is an interspace 16 which in the assembled situation is present between the edges and flanges 4 of adjacent floor tiles 2. This gap is preferably larger than 0.2 mm and up to for instance 2 mm, and most preferably in the order of 0.5 mm. In order to fix floor tiles 2 with sufficient clamping so as to prevent vibrations and loosening by vibration, flanges 4 are preferably provided on the side directed toward floor tile 2 with protrusions 18 with which the flanges are arranged clampingly in the groove 6 which in side view is diabolo-shaped.
  • The gap 16 is advantageous in making the upper surfaces of floor tiles 2 sufficiently pivotable relative to each other to be able to follow slopes and other unevenness in the ground surface. Gap 16 also ensures that possible expansion of floor tiles 2, as a consequence of for instance temperature, is absorbed without deformation of the floor tiles occurring, this due to the absence of contact between the floor tiles. This pivotability is also made possible by the diabolo shape of the side walls of grooves 6 (Fig. 2).
  • In a second preferred embodiment according to the present invention a floor is constructed from an assembly 28 comprising floor tiles 30 with bent flanges 32 on the side edges thereof as according to the above described first embodiment. The flanges drop into grooves 34 of supports 36. In the assembled situation a gap 38 is present between floor tiles 30 and between flanges 32 which has the advantages and features in accordance with the above described gap 16. The flanges are further fixed clampingly by protrusions 40 into the groove 34 which in side view is diabolo-shaped (Fig. 4).
  • The electrical conducting means are formed in this second variant by a peripheral contact wire 42 which is arranged running around the top end of support 36 and touches the centring holes 44 therein. Floor tiles 30 are herein provided with threaded pins 46 which fall into centring holes 44 for the purpose of positioning the floor tiles relative to the supports and which also contact the contact wire 42 for electrical interconnection of the floor tiles. The floor tiles are herein manufactured from an electrically conductive material, for instance a metal or preferably galvanized steel.
  • A third embodiment variant relates to a floor constructed from an assembly 50 as shown in figure 5A. The assembly comprises floor tiles 52 having bent flanges 54 on the side edges thereof, which flanges are arranged connecting along practically the whole length to floor tiles 52. The bent flanges 54 drop into grooves 56 arranged in supports 58 for the purpose of supporting the floor tiles at a height relative to a ground surface 60.
  • At both outer ends the flanges of the floor tiles are interrupted at some distance before the end of floor tile 52. A standing cylindrical projection 59 is arranged in the middle of support 58. The projection takes a form corresponding to the outer ends 55 of flanges 54, so that it acts as a stop against which the flanges of the floor tiles come to rest (fig. 5B). The projection thus also provides the correct gap between the floor tiles, preferably about 0.4 - 1 mm.
  • A support 58 in this third variant comprises a bottom mat 62 of a suitable material. In the shown variant these bottom mats 62 are approximately round and mutually connected by a grid of strips 64, which enables quicker laying of the floor. A support preferably comprises a roughly cylindrical steel sleeve 66 which provides the electrical interconnection of floor tiles 52 arranged therein, so that these tiles are earthed electrically despite the gap present between them. A cup-shaped damper 68 of an appropriate material such as plastic is arranged inside sleeve 66 for the purpose of damping shocks caused by for instance footsteps on the floor. Grooves 56 are arranged continuously in both sleeve 66 and damper 68.
  • In order to ensure an electrical contact between the floor tiles and the conductive sleeve or the conductive part of the support, the flanges 72 arranged on floor tiles 70 are provided in a preferred embodiment with protrusions 74 which make a scraping contact with edges 76 of a groove arranged in the support (Fig. 7).
  • It remains possible here to arrange a gap 78 between the floor tiles, wherein an electric contact is still ensured and sufficient clamping is obtained.In a further preferred embodiment grooves are arranged in a support, with in each case a groove 80 and a second groove 82 separated by a dividing wall 84 with a width preferably lying between about 0.4 and 1 mm (Fig. 8). Floor tiles 86 once again have bent flanges 88 provided with protrusions 90 which come into scraping contact with walls 92, 94 of grooves 80, 82 respectively. Electrical interconnection is obtained in that floor tiles 86 and protrusions 90, as well as a part of the supports, are electrically conductive. Sufficient space is present here in grooves 80, 82 to ensure that floor tiles 86 are at least slightly pivotable relative to the support, and that (thermal) expansion of the floor tiles can also be absorbed (Fig. 8).
  • The embodiments described with reference to figures 7 and 8 can also be combined with a further variant shown in Fig. 6. A floor 100 herein comprises floor tiles 102, only a fourth part of which is shown here, which floor tiles comprise on the edges bent flanges 104 which rest in groove-like recesses 106 in supports 108. Close to the corner points of floor tiles 102 centring protrusion 110 are arranged by being pressed through which drop into openings 112 arranged in the top side of supports 108.
  • The supports comprise an extrusion form 114 of a suitable material such as plastic, aluminium or zamak. In the shown form the extrusion form 114 has a practically cylindrical outer surface, and continuous openings 116 are arranged therein along the whole length which correspond with centring openings 112. A damper 118 is arranged on top of extrusion form 114. The damper is roughly cylindrical and grooves 106 are arranged therein at angles of 90° to each other, and a centring opening 112 is arranged in each case between the grooves. In the middle of damper 118 is arranged a cylindrical projection 120 against which the corner points of floor tiles 102 come to rest for the purpose of better positioning thereof. Damper 118 serves to damp shocks and is preferably manufactured from a conductive plastic which provides a correct damping and also for electrical interconnection of floor tiles 102 (Fig. 6).
  • Figures 9 to 12 show further possible preferred embodiments of floor tiles. Fig. 9 thus shows a practical embodiment of a floor tile 140, which in practice has sides in the order of 200 to 300 mm. In the shown embodiment the supports 142 are arranged with a mutual spacing in the order of 125 mm and are optionally provided with a reinforcement. Also shown are connecting pieces 114 for mutual connection of supports 142.
  • Fig. 10 shows a tile 140 as in Fig. 9 provided with supports 142, wherein a foot connecter 144 is also shown which on the upper side has four square recesses in which the square supports 142 come to rest. A further foot connecter 146 is also shown wherein an earth clip 148 is arranged in the middle thereof for electrical interconnection of the supports resting on foot connecter 146 for the purpose of earthing thereof.
  • Fig. 11 shows a larger floor tile 160 with sides of for instance 450 mm. Supports 162 are arranged at a mutual spacing of 150 mm.
  • A larger tile 170 has for instance sides in the order of 600 mm and is arranged on a plurality of supports 172 which are arranged not only at the corner points of tile 170 but also therebetween, at a mutual distance of for instance 133 mm. The height of the foot is in this case the same as that of the above stated feet, but can also amount to about 55 mm. Such larger tiles have in the middle of the tile a support (not shown) arranged on the underside. The thickness of the tile is further in the order of 2 mm, just as the above mentioned tiles.
  • The present invention is not limited to the above described preferred embodiments thereof, in which many modifications can be envisaged within the scope of the appended claims.

Claims (12)

  1. Floor constructed from floor tiles which are supported by supports resting on a ground surface, wherein the floor tiles are provided on their longitudinal edges with bent flanges which are received in grooves arranged in the upper ends of the supports such that a flange of a first floor tile and a flange of an adjacent floor tile lie in one groove, wherein at least some measure of interspacing is present between flanges lying opposite each other in the groove.
  2. Floor as claimed in claim 1, wherein the interspacing is in the order of 0.5 mm.
  3. Floor as claimed in either of the foregoing claims, wherein a floor tile is constructed from a floor plate and flanges extending at right angles on the edges of this floor plate and formed integrally with the floor plate, wherein the flanges are connected continuously along their whole length to the floor plate.
  4. Floor as claimed in any of the foregoing claims, wherein the floor tiles are electrically conductive and wherein the supports are provided with electrical conducting means which make contact with the floor tiles for electrical interconnection thereof.
  5. Floor as claimed in claim 4, wherein the electrical conducting means comprise a conductive profile, such as a metal sleeve or extrusion profile, in which the grooves are arranged.
  6. Floor as claimed in either of the foregoing claims 4 or 5, wherein the flanges on the side of the floor tile are provided with scraping protrusions which are in contact with the electrical conducting means.
  7. Floor as claimed in any of the foregoing claims, wherein the supports are provided with damping means.
  8. Floor as claimed in any of the foregoing claims, wherein the electrical conducting means comprise a peripheral contact ring or contact wire arranged in the support.
  9. Floor as claimed in any of the foregoing claims, wherein the floor tiles are provided on the underside with centring protrusions which drop into centring openings in the top side of the supports.
  10. Support evidently intended for use in a floor as claimed in any of the foregoing claims.
  11. Floor tile evidently intended for use in a floor as claimed in any of the foregoing claims.
  12. Assembly of two or more floor tiles and one or more supports for the purpose of constructing a floor, wherein the supports are provided with a groove and the floor tiles are provided with flanges fitting into the groove, wherein the groove and/or flanges are embodied such that the flanges engage in clamping manner on walls of the groove, and in the assembled situation are pivotable relative the groove due to a gap present between the flanges.
EP05077539A 2004-11-04 2005-11-04 Floor and floor construction Active EP1662068B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1027424A NL1027424C2 (en) 2004-11-04 2004-11-04 Floor and assembly.

Publications (2)

Publication Number Publication Date
EP1662068A1 true EP1662068A1 (en) 2006-05-31
EP1662068B1 EP1662068B1 (en) 2009-08-12

Family

ID=34974496

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05077539A Active EP1662068B1 (en) 2004-11-04 2005-11-04 Floor and floor construction

Country Status (5)

Country Link
EP (1) EP1662068B1 (en)
AT (1) ATE439490T1 (en)
DE (1) DE602005015928D1 (en)
DK (1) DK1662068T3 (en)
NL (1) NL1027424C2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107002414A (en) * 2014-12-02 2017-08-01 飞利浦灯具控股公司 Solid-state floor illumination unit and system
US11428015B2 (en) 2020-09-03 2022-08-30 Wearwell, Llc Modular platform system and method of assembly

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2501758A1 (en) * 1981-03-13 1982-09-17 Plaquettes Indles Sa Tiles of cellular sheet with slightly divergent metal covers - give panels which maintain lateral contact despite small dimensional fluctuations
EP0381571A1 (en) * 1989-02-03 1990-08-08 Alain René Emile Ducroux Floor structure, especially for spaces provided with computer equipment
FR2703385A1 (en) * 1993-03-31 1994-10-07 Belbenoit Maurice Device for mounting the tiles of a false floor on vertical supports
US5499476A (en) * 1993-08-31 1996-03-19 Interface, Inc. Low profile raised panel flooring with metal support structure
US5749188A (en) * 1993-03-31 1998-05-12 Belbenoit; Maurice Raised floor with modular slabs
GB2330595A (en) * 1996-07-31 1999-04-28 Kyodo Ky Tec Corp Floor panel having support and construction method therefor
EP1143083A1 (en) * 2000-03-31 2001-10-10 Martin Lange Assembly of moulded plates including moulded plates and supporting modules and its building method
FR2813906A1 (en) * 2000-09-12 2002-03-15 Infra Sa Raised floor comprises square slabs on independent legs resting on ground, each slab has vertical assembly flanges fitting into slits in legs

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2501758A1 (en) * 1981-03-13 1982-09-17 Plaquettes Indles Sa Tiles of cellular sheet with slightly divergent metal covers - give panels which maintain lateral contact despite small dimensional fluctuations
EP0381571A1 (en) * 1989-02-03 1990-08-08 Alain René Emile Ducroux Floor structure, especially for spaces provided with computer equipment
FR2703385A1 (en) * 1993-03-31 1994-10-07 Belbenoit Maurice Device for mounting the tiles of a false floor on vertical supports
US5749188A (en) * 1993-03-31 1998-05-12 Belbenoit; Maurice Raised floor with modular slabs
US5499476A (en) * 1993-08-31 1996-03-19 Interface, Inc. Low profile raised panel flooring with metal support structure
GB2330595A (en) * 1996-07-31 1999-04-28 Kyodo Ky Tec Corp Floor panel having support and construction method therefor
EP1143083A1 (en) * 2000-03-31 2001-10-10 Martin Lange Assembly of moulded plates including moulded plates and supporting modules and its building method
FR2813906A1 (en) * 2000-09-12 2002-03-15 Infra Sa Raised floor comprises square slabs on independent legs resting on ground, each slab has vertical assembly flanges fitting into slits in legs

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107002414A (en) * 2014-12-02 2017-08-01 飞利浦灯具控股公司 Solid-state floor illumination unit and system
CN107002414B (en) * 2014-12-02 2020-09-15 飞利浦灯具控股公司 Solid state floor lighting unit and system
US11428015B2 (en) 2020-09-03 2022-08-30 Wearwell, Llc Modular platform system and method of assembly
US11808046B2 (en) 2020-09-03 2023-11-07 Wearwell, Llc Modular platform system and method of assembly

Also Published As

Publication number Publication date
DK1662068T3 (en) 2009-10-26
NL1027424C2 (en) 2006-05-08
EP1662068B1 (en) 2009-08-12
ATE439490T1 (en) 2009-08-15
DE602005015928D1 (en) 2009-09-24

Similar Documents

Publication Publication Date Title
EP0716723B1 (en) Low profile raised panel flooring with metal support structure
EP2382361B1 (en) Modular floor system
KR100243400B1 (en) A frame-work for a pipe laying of a hypocaust
WO2011092460A2 (en) Loft flooring system
JP6714594B2 (en) Flooring module
EP1662068B1 (en) Floor and floor construction
KR100698848B1 (en) Floor panel
WO1998004795A1 (en) Floor panel having support and construction method therefor
RU2440474C2 (en) Ventilated wall comprising supporting elements and facing structure for them
GB2485181A (en) An insulation panel support member
EP0296238A1 (en) A floor covering of electrically conducting type
GB2188955A (en) Base plates for pedestals of access type raised floor
WO2003066995A1 (en) Flooring system
KR101975227B1 (en) Prefabricated electric flooring panel
CN112443121A (en) Base/support for raised floors
KR101190668B1 (en) Heating floor panel capable of easily piping work
KR20020060915A (en) panel for laying heating pipe
KR20190085210A (en) Ondol-heating device having spacer plate and construction method thereof
KR100213561B1 (en) Synthetic deck plate for a building
GB2591267A (en) Surfacing assembly
WO2004099520A1 (en) A consumable assembly for forming a concrete wall structure, a concrete wall structure formed with the assembly and a side plate for use in the assembly
KR101975226B1 (en) Electric flooring panel
JP3086672B2 (en) Deck panel
KR20230057488A (en) Retaining clip and cmposte material aluminium deck therewith and method for constructing using the same
KR200398407Y1 (en) Floor panel

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

17P Request for examination filed

Effective date: 20061129

17Q First examination report despatched

Effective date: 20061229

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AXX Extension fees paid

Extension state: HR

Payment date: 20061129

Extension state: YU

Payment date: 20061129

Extension state: AL

Payment date: 20061129

Extension state: MK

Payment date: 20061129

Extension state: BA

Payment date: 20061129

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 602005015928

Country of ref document: DE

Date of ref document: 20090924

Kind code of ref document: P

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

LTIE Lt: invalidation of european patent or patent extension

Effective date: 20090812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091123

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091212

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091212

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091112

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20091130

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

26N No opposition filed

Effective date: 20100517

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20091130

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20091130

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20091104

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20091113

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20091104

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20100213

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20090812

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DK

Payment date: 20131129

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 20131126

Year of fee payment: 9

Ref country code: DE

Payment date: 20131128

Year of fee payment: 9

Ref country code: GB

Payment date: 20131128

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 20131127

Year of fee payment: 9

Ref country code: NL

Payment date: 20131129

Year of fee payment: 9

Ref country code: IT

Payment date: 20131126

Year of fee payment: 9

Ref country code: FR

Payment date: 20131125

Year of fee payment: 9

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602005015928

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20150601

REG Reference to a national code

Ref country code: DK

Ref legal event code: EBP

Effective date: 20141130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141130

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 439490

Country of ref document: AT

Kind code of ref document: T

Effective date: 20141104

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20141104

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20150731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150601

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141104

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141130

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141104

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150602

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20141104