Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/10—Bump connectors; Manufacturing methods related thereto
  • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
  • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
  • H01L2224/161—Disposition
  • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
  • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
  • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
  • H01L2224/321—Disposition
  • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73201—Location after the connecting process on the same surface
  • H01L2224/73203—Bump and layer connectors
  • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Definitions

• the present invention relates to a method of manufacturing a prelaminated inlet, an inlet obtained by this process and a card comprising such an inlet.
• a microelectronic radiofrequency (RF) component is used connected to an antenna.
• This RF assembly is integral with a substrate, generally made of plastic.
• the entire RF component, antenna and substrate is called the inlet by the smart card industry.
• This inlet is then laminated between several layers of plastic to give the thickness and rigidity necessary for the contactless card.
• the outer layers receive an impression of patterns which is then protected by a thin sheet of transparent plastic called "overlay”.
• the inlets are presented in different ways, either in the form of a flexible substrate on which the RF component and the antenna are deposited, or in the form of a relatively thick substrate in which the RF component and the antenna are inserted.
• the production is carried out by laminating several layers, hence the name of prelaminated inlet.
• prelaminated inlets For the manufacture of prelaminated inlets, it is usual to use electronic components previously encapsulated in an interconnection circuit, the assembly being called module. The module is then connected to the antenna which has been previously etched on the substrate.
• the RF component is soldered directly to the substrate and the antenna according to the so-called "flip-chip” technology.
• this technology has the disadvantage of being more fragile because the component is not protected by the interconnection circuit.
• the antenna is first deposited and glued to the substrate, or etched on it, or else inserted by an ultrasonic process.
• the component is placed on the substrate and welded to the antenna before a plastic sheet covers everything by rolling to protect the assembly and obtain a constant thickness of the inlet.
• the current process has many drawbacks. It is expensive and complex because it requires the use of many plastic sheets, often of different thickness and quality. In addition, it is necessary to plan the machining of cavities on the different layers in order to allow the insertion of the component, these cavities having to be filled with a resin plugging the residual voids between the component and the plastic layer.
• the object of the invention is therefore to propose a new method for manufacturing the prelaminated inlets which is simple to implement and therefore inexpensive.
• the object of the invention is a process for manufacturing a prelaminated inlet, comprising the following steps:
• a cavity of a size greater than or equal to the size of this RF component is produced in the upper surface of the first support to receive the latter;
• a cavity of a size greater than or equal to the size of the RF component is produced in the second support prior to its installation;
• the first and second supports are made of plastic having a softening point below 90 ° C;
• the plastic of the first and second supports is chosen from the group comprising:
• one of the supports is made of plastic having a melting point below 90 ° C and the other support is made of plastic having a melting point above 150 ° C;
• a third sheet composed of a plastic having a softening point greater than 150 ° C is laminated with all of the first two supports, so that the support composed of a plastic having a softening point less than 90 ° C is interposed between the two sheets composed of a plastic having a softening point greater than 150 ° C;
• the plastic having a softening point greater than 150 ° C. is of the PC or PET type;
• the RF component is composed of an active silicon component encapsulated in an interconnection circuit
• the RF component is composed of an active silicon component mounted directly on a substrate according to the flip-chip method.
• the invention also relates to a contactless integrated circuit card comprising an inlet, and the corresponding inlet manufactured according to the method of the invention.
• FIG. 1 is a sectional view of a single-layer inlet, the RF component of which is mounted in a "flip-chip" according to the prior art
• - Figure 2 is a sectional view of a single-layer inlet whose RF component is encapsulated in a module according to the prior art
• - Figures 3A, 3B, 3C and 3D are sectional views illustrating the successive stages of an embodiment of the invention
• FIGS. 4A, 4B, 4C, 4D, 4E and 4F are sectional views illustrating the successive stages of a second embodiment of the invention
• - Figures 5A, 5B, 5C and 5D are the sectional views illustrating the successive steps of a third embodiment of the invention.
• FIG. 1 During the manufacture of an inlet with a component mounted in “flip chip” according to the prior art, FIG. 1, the component 1 is welded on a plastic support 2 on which has been previously deposited an antenna 3 comprising at least two contact pads 4. The welding is done so that electrical continuity is ensured between the pads 4 of the antenna and the contact areas of the component 1. A resin 5, electrically insulating, is deposited between the component 1 and the support 2 to ensure the mechanical strength of the assembly.
• FIG. 2 When the component 1 is mounted in a module, FIG. 2, it is previously deposited on a support called “lead-frame” comprising areas 6 of electrical contact and wires 7 are welded between these areas 6 of contacts and the pads of the component 1.
• a resin 5 is deposited on the whole in order to protect the component 1 and its electrical connections 7.
• the module is welded to the support 2 on which has been previously deposited an antenna 3 comprising at least two contact pads 8 intended to electrically connect the antenna 3 to the module via the contact zones 6.
• Figure 2 illustrates an embodiment in which the module contacts are on the same face as the component. As a result, a cavity 9 must be made in the support 2 in order to allow the zones 6 and 8 to come into contact.
• the module has its contact zones on the face of the lead frame opposite to that on which the component is bonded. This allows the module to be welded to the Pinlet support without first practicing a cavity.
• Pinlet obtained has a thickness, equal to the sum of the thickness of the module and the thickness of the support 2, greater than that of Pinlet obtained in the embodiment of FIG. 2.
• a first plastic sheet 10, FIG. 3A is prepared to receive an RF component 11 in the form of a module, FIG. 3B.
• the component 11 is then positioned on the support 10, the antenna 12, with its contact pads 13 is deposited in a conventional manner on the assembly, FIG. 3C.
• the antenna is engraved on the support 10, but it can also be wound and then glued to the support or inserted by a conventional ultrasound technique.
• the RF component is electrically connected to the antenna by the contact pads 13.
• a second plastic layer 14 is then deposited on the assembly and the whole is laminated in order to obtain a one-piece assembly having a constant thickness as illustrated in FIG. 3D. It is remarkable to note that a judicious choice of plastic for the layer 14 makes it possible to avoid the machining of a preliminary cavity to accommodate the component 11. It is therefore necessary to choose a plastic which is sufficiently soft so that it deforms and conforms to the contours of component 11 during rolling.
• Plastics with a softening point, or VICAT point, below 90 ° C are particularly suitable for such use and among these plastics good results have been obtained with polyvinyl chloride (PVC), glycol polyester (PETg) or acrylonitrile-butadiene-styrene (ABS) plastics, or PVC / ABS mixtures.
• PVC polyvinyl chloride
• PETg glycol polyester
• ABS acrylonitrile-butadiene-styrene
• This choice can also be extended to the first support 10, which has the advantage of distributing the stresses and deformations during rolling on the two supports.
• FIG. 5D a single layer 16 of resistant plastic is added.
• Plastics with softening points higher than 150 ° C such as polycarbonate (PC) or polyethylene terephthalate (PET) offer the necessary mechanical resistance and allow to obtain resistances at 15000 flexions instead of the resistances at 1000 flexions usually encountered with a traditional prelaminate.
• PC polycarbonate
• PET polyethylene terephthalate
• FIGS. 4A, 4B, 4C, 4D, 4E and 4F A second embodiment of the invention is illustrated in FIGS. 4A, 4B, 4C, 4D, 4E and 4F.
• a cavity 20 is machined, FIG. 4A.
• the size of this cavity 20 is such that a module 11 can be inserted therein.
• a second support 16 is positioned under the first support and a drop of resin 17 is deposited in the cavity formed by the first and second supports.
• the cavity machined in the support 10 can have the shape of a plugged hole, the drop of resin then being deposited at the bottom of this hole.
• the module 11 is positioned in the cavity, FIG. 4C. The drop of resin 17 thus maintains the module 11 in position and fills the voids left in the cavity by the module 11.
• the antenna 12, 13 is then deposited on the support 10 and connected to the module 11 by the studs 13 as in the first embodiment, FIG. 4D.
• a second drop of resin 18 is deposited on the top of the module 11.
• two plastics layers 14 and 19, FIG. 4E, are pre-glued together and a second cavity 21 is machined in the layer 14 to a size greater than or equal to the size of the module 11.
• the layer 14 preferably has a thickness equal to or slightly greater than the height of the part of the module 11 which protrudes from the cavity of the support 10.
• This assembly is then deposited, FIG. 4F, on the first support 10 and the whole is laminated.
• the drop of resin 18 will then fill the voids in the second cavity 21 left by the upper part of the module 11.
• a cavity 20 is machined in the first support 10 as for the second embodiment, FIG. 5A.
• the module 11 is then positioned inside the cavity.
• the thickness of the first support 10 and of the lead-frame of the module 11 are substantially identical, FIG. 5B.
• the antenna 12 is then deposited, FIG. 5C, and connected to the module 11.
• the assembly is then laminated between an upper layer 14 of relatively soft plastic and a lower layer 16 of relatively hard plastic which ensures the mechanical strength of the assembly, FIG. 5D.
• the third embodiment can be combined with the machining of a cavity in the upper layer allowing the use of a relatively hard plastic for the latter.

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• 2004
  • 2004-05-04 US US10/555,457 patent/US20060285301A1/en not_active Abandoned
  • 2004-05-04 WO PCT/IB2004/001575 patent/WO2004100063A1/fr not_active Application Discontinuation
  • 2004-05-04 EP EP04731071A patent/EP1623367A1/de not_active Withdrawn

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