EP1618993B9 - Procédé pour meuler et/ou polir des surfaces - Google Patents
Procédé pour meuler et/ou polir des surfaces Download PDFInfo
- Publication number
- EP1618993B9 EP1618993B9 EP04017335A EP04017335A EP1618993B9 EP 1618993 B9 EP1618993 B9 EP 1618993B9 EP 04017335 A EP04017335 A EP 04017335A EP 04017335 A EP04017335 A EP 04017335A EP 1618993 B9 EP1618993 B9 EP 1618993B9
- Authority
- EP
- European Patent Office
- Prior art keywords
- liquid
- gas
- abrasive
- grinding
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0084—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a mixture of liquid and gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
- B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
Definitions
- the invention relates to a method for removing material during the grinding and / or polishing of surfaces of workpieces according to claim 1.
- the removal rate of the surface depends on the size of the abrasive particles in the jet. On the other hand, it depends on the energy and thereby the speed of the particles at the time when they hit the surface.
- the material removal rate per time is considered as the removal rate.
- the removal rate should be set individually as simply as possible.
- This object is achieved by a method for removing material during grinding and / or polishing surfaces according to claim 1. It has surprisingly been found that with increasing proportion of gas with the same size of the abrasive grain and the same process parameters (for example delivery pressure), the removal rate is increased. Therefore, when the device is provided with means for adjusting the gas content in the liquid, the rate of removal can be easily controlled or changed. Thanks to the present invention, it is possible to achieve high removal rates with relatively small grain sizes. By setting a high proportion of gas, the removal rate is increased without the need to use larger abrasive grain.
- the removal rate and also the transition from coarse grinding to fine grinding and polishing can be varied continuously.
- the grain size of the abrasive grains and the delivery pressure of the abrasive liquid for coarse and fine grinding and for polishing can be the same.
- the removal rate is easily controlled and changed as needed. It can be worked with the same delivery pressure and with the same abrasive grain. The change from one grain size to another and the associated cleaning of the machine is eliminated.
- the device for removing material from a surface of a workpiece during grinding or polishing of the surface by means of abrasive particles conveyed by a liquid for this purpose contains a device for adding gas to the liquid.
- This gas is preferably air because air is inexpensive and does not pollute the environment.
- gases or gas mixtures for example argon, helium, nitrogen, CO 2 or oxygen, but can also be used and are not excluded from the invention.
- the gas can be contained either in the form of gas bubbles or in dissolved or bound form in the liquid.
- the present invention has the advantage that with a device as needed a workpiece can be both ground and polished.
- Expensive and procedurally delicate steps such as cleaning the workpiece or the device or the transport of the workpiece from one device to another thus eliminated.
- the advantages of the present invention are particularly advantageous in the grinding and polishing of high precision parts, e.g. Parts of optics or medical technology. Due to the broad applicability of the device and the method, both spherical and aspherical shapes can be precisely ground and polished.
- the device for adding the gas to the liquid comprises an arrangement for adjusting the amount of added gas. It is advantageous if the amount of gas supplied is continuously variable. This can be used e.g. increase the removal rate by increasing the amount of gas. Reducing the amount of gas leads to smaller removal.
- the device for adding the gas to the liquid can be arranged, for example, in a tank for the liquid be. It is also conceivable to install the device in a pump for conveying the liquid or in a conveying line for the liquid. Combinations thereof for more efficient and controlled addition of the gas are advantageous.
- the gas can be added with a propeller in the tank, for example.
- a pressure connection to the line, the tank or the pump can be provided.
- chemically oxidize the gas e.g. to be enclosed with tablets.
- a chemical substance pressed in tablet form can be added to the water, which reacts on contact with water and gives off gaseous reaction products.
- gas to the water electrolytically or to generate gas electrolytically in the water.
- the gas content is controlled and adjusted according to the invention. Typically, the amount of gas (in volume percent) is adjusted to desired levels. In this case, the gas can either be dissolved or bound in the liquid or present in the form of bubbles therein.
- the mixing ratio can be determined by the viscosity of the abrasive fluid. ever the greater the proportion of gas in the liquid, the lower the viscosity.
- the bubble size may be e.g. be determined optically. In order to have a favorable influence on the removal rate, it is advantageous if the resulting gas bubbles are larger than the abrasive particles.
- the measurement preferably takes place between a pump for the abrasive fluid and an outlet port for the fluid.
- the gas content in the liquid controls the removal rate at the surface of the workpiece.
- the removal rate depends on the impact energy of the abrasive particles.
- the transition from grinding to polishing surfaces can be directly controlled by the gas content in the abrasive fluid.
- the transition from grinding to polishing can at the same time correspond to a transition from brittle to ductile removal of material from the surface. (See, eg Appl. Opt. 37, pp. 6771-6773 (1998) )
- the removal rate is increased by the gas content in the liquid, because the gas inclusions are more compressible on impact than the liquid itself.
- the abrasive particles are thus braked faster than the impact of the liquid just before the impact.
- particles that are in a gas bubble are less strongly cooled when hitting the surface than particles that are surrounded by liquid. It is believed that the increased temperature increases the likelihood of cracks forming. As a result, the removal rate is increased, because in the brittle removal of material the erosion is preceded by cracking on the surface.
- the viscosity of the abrasive liquid decreases.
- the abrasive fluid is thereby accelerated more. This acceleration increases the impact energy of the abrasive particles.
- a method according to the preamble of claim 1 is disclosed in document US 5,283,991 described.
- the inventive method is designed to generate a delivery pressure of less than 100 bar, more preferably less than 50 or even less than 20 bar. Since a gas is added to the liquid, the impact energy of the abrasive particles can be increased. This allows a reduction of the delivery pressure with the same removal rate. Compared to high-pressure arrangements energy is thus saved during conveying, which has an economic and ecological advantage. A further reduction of the delivery pressure can also be achieved by appropriate, suitable arrangements for accelerating the abrasive fluid. So, for example an arrangement for accelerating the abrasive liquid are provided, in which the abrasive liquid is advantageously accelerated to a speed of about 20 m / s. As a result, the abrasive particles receive the necessary energy, so that material is removed. The energy of the particles grows quadratically with the speed of the beam.
- the acceleration arrangement can have, for example, one or more nozzles.
- the arrangement for accelerating the abrasive liquid may also include an arrangement for adjusting the distance between at least one exit opening of the liquid and the surface.
- the acceleration is then adjustable between the at least one outlet opening and the surface as a function of the cross section of a liquid feed opening and the cross section of the gap between the surface and the at least one outlet opening.
- the arrangement according to EP 1 409 199 be designed.
- the abrasive particles have an average grain diameter less than 50 microns, preferably 1 to 10 microns ..
- the grain size varies but depending on the application. The finer the surface to be polished, the finer abrasive particles are used.
- the delivery liquid is preferably predominantly water.
- other known liquids are also within the scope of the invention.
- Other liquids e.g. oil or alcohol based may also be suitable.
- gas inclusions of a conveying fluid for abrasive particles for influencing the removal rate when removing material of a surface of a workpiece during grinding or polishing of the surface is also within the scope of the invention.
- the gas is preferably air.
- the removal rate is influenced by the adjustment of the gas content in the pumped liquid, by adding a gas to the abrasive.
- a gas is air, but other gases are not excluded from the invention.
- the abrasive liquid is added to gas from 0 to 70% of the total volume.
- the greater the amount of added gas the greater the removal rate.
- To polish the surface little or no gas is added, since during polishing a low removal rate is desired.
- the reduction of the gas supply is continuous.
- the transition from grinding to polishing is not discrete.
- the delivery pressure of the abrasive liquid is kept constant for grinding and polishing at below 100 bar, advantageously below 50 bar, particularly advantageously below 20 bar. This simplifies the process because the delivery pressure of the liquid does not have to be changed if the removal rate is to be varied.
- FIG. 1 a first embodiment of the invention is shown schematically.
- a workpiece 2 is located on a holder 10 in a closed container 11.
- the surface S which is to be ground and polished, is located on the upper side of the workpiece 2.
- the holder 10 is displaceable along a longitudinal axis and rotatable about a vertical axis. The movement of the holder 10 is indicated by the arrows B.
- a liquid tank 12 In a liquid tank 12 is a liquid 3, in this example water. To the water 3 are added abrasive particles 5 in a concentration of 10% by weight. There are used abrasive particles 5 of silicon carbide with a particle size of 7 microns in diameter. The abrasive liquid 3 is conveyed by a pump 7 in the direction of the arrows 6 through the delivery line 14. The delivery pressure is 12 bar.
- the removal of material takes place at room temperature, ie at about 21 ° C instead. Due to the mechanical stress, the abrasive fluid can heat up to approx. 25 ° C, which does not affect the removal rate negatively.
- the delivery line 14 leads into the interior of the container 11. There, the water 3 is accelerated with a nozzle 9 to about 40 m / s. The nozzle 9 is directed to the surface S, which is moved with the holding device 10 below.
- a pressure tank 13 In a pressure tank 13 is air 4, which can be introduced via a connecting line 16 in the water 3.
- the air supply is varied via a valve 8. The greater the desired removal rate, the more air 4 is added to the water 3.
- the maximum air content in the water 3 is 70% of the total volume.
- the pressure in the tank 13 is 250 bar.
- the air 4 is supplied at a pressure of 14 to 50 bar. It is essential here that the supply pressure of the air is greater than the delivery pressure of the water. For polishing, the air supply is prevented or at least reduced.
- the used water 3 is fed via a drain 15 back into the tank 12.
- the abrasive particles 5 are thus in a closed circuit, which is indicated by the arrows 6.
- the material consumption is kept as low as possible.
- the air supply is calibrated on a reference workpiece (not shown).
- the removal rate can then be adjusted as needed on the workpiece 2 due to this calibration.
- FIG. 2 An alternative embodiment of the device 1 is shown in FIG. 2 shown.
- the abrasive liquid 3 in this embodiment in a closed circuit, which is indicated by the arrows 6.
- the liquid 3 used is again water.
- the abrasive liquid 3 exits through a delivery head 17.
- the acceleration of the water 3 takes place in the gap 18, which is formed between the head 17 and the surface S.
- the holding device 8 as indicated by the arrows B also displaceable in a vertical direction. The acceleration is greater the smaller the area of the gap compared to the cross-sectional area of the delivery line 14.
- the ratio of the cross-sectional area of the delivery line to the area of the gap is 10: 1 in this example.
- the removal rate is controlled by the supply of air 4 in the water 3 in the tank itself.
- Air 4 is located in the tank 12 above the water 3 and is stirred with a propeller 19 under the water 3.
- the propeller 19 is driven by an electric motor M. The speed of the motor M determines the amount of air 4 supplied. Since the water 3 is used in a closed circuit, the level of the water 3 is relatively constant. The propeller 19 is large enough in comparison to the water tank 12 that fluctuations in the water level do not adversely affect the amount of air supplied.
- FIG. 3 shows a device analog FIG. 1 ,
- a device for reducing the air content in the water 3 in the tank 12 is provided for carrying out a method not according to the invention.
- the gas content of water may vary due to environmental parameters. In certain cases, it may be desirable or necessary to reduce the gas content to achieve the desired removal rate. This can be the case, for example, if the surface is to be polished particularly finely.
- ultrasonic transducers 20 are mounted in the tank 12 to reduce the air content in the water. These send out ultrasonic waves 21, which displace the air inclusions in the water 3.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning In General (AREA)
Claims (5)
- Procédé d'enlèvement de matière, notamment de meulage et/ou de polissage, d'une surface (S) d'une pièce au moyen de particules de substance abrasive (5) qui sont transportées par un liquide (3), la proportion de gaz dans le liquide étant ajustée, le liquide abrasif (3) étant pourvu de gaz (4) à raison de 0 à 70 % du volume,
caractérisé en ce que
les particules de substance abrasive (5) présente un diamètre de particule moyen inférieur à 50 µm, de préférence de 1 à 10 µm, et
en ce qu'une pression de transport du liquide abrasif (3) inférieure à 100 bars, notamment inférieure à 50 bars, est produite. - Procédé selon la revendication 1, caractérisé en ce que pendant une première étape de meulage de la surface (S), on mélange du gaz (4) au liquide abrasif (3) et en ce que dans une deuxième étape de polissage de la surface, on ne mélange pas de gaz (4) au liquide abrasif.
- Procédé selon l'une quelconque des revendications précédentes 1 à 2, caractérisé en ce que la pression de transport du liquide abrasif (3) pour le meulage comme pour le polissage est maintenue constante en dessous de 100 bars, notamment en dessous de 50 bars.
- Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce que l'on utilise principalement de l'eau comme liquide (3).
- Procédé selon l'une quelconque des revendications 1 à 4, caractérisé en ce que l'on produit dans le liquide (3) des bulles de gaz qui sont plus grosses que les particules de substance abrasive (5).
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT04017335T ATE411139T1 (de) | 2004-07-22 | 2004-07-22 | Verfahren zum schleifen und/oder polieren von oberflächen |
DE502004008271T DE502004008271D1 (de) | 2004-07-22 | 2004-07-22 | Verfahren zum Schleifen und/oder Polieren von Oberflächen |
EP04017335A EP1618993B9 (fr) | 2004-07-22 | 2004-07-22 | Procédé pour meuler et/ou polir des surfaces |
US11/186,802 US20060019580A1 (en) | 2004-07-22 | 2005-07-22 | Apparatus for removing material, use of gas inclusions in an abrasive liquid and process for grinding and/or polishing surfaces |
US11/775,018 US20080261493A1 (en) | 2004-07-22 | 2007-07-09 | Apparatus for Removing Material, Use of Gas Inclusions in an Abrasive Liquid and Process for Grinding and/or Polishing Surfaces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04017335A EP1618993B9 (fr) | 2004-07-22 | 2004-07-22 | Procédé pour meuler et/ou polir des surfaces |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1618993A1 EP1618993A1 (fr) | 2006-01-25 |
EP1618993B1 EP1618993B1 (fr) | 2008-10-15 |
EP1618993B9 true EP1618993B9 (fr) | 2009-03-18 |
Family
ID=34925871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04017335A Not-in-force EP1618993B9 (fr) | 2004-07-22 | 2004-07-22 | Procédé pour meuler et/ou polir des surfaces |
Country Status (4)
Country | Link |
---|---|
US (2) | US20060019580A1 (fr) |
EP (1) | EP1618993B9 (fr) |
AT (1) | ATE411139T1 (fr) |
DE (1) | DE502004008271D1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4787063B2 (ja) * | 2005-12-09 | 2011-10-05 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
WO2007096973A1 (fr) * | 2006-02-23 | 2007-08-30 | Mitsubishi Materials Corporation | Dispositif d'alimentation en produit de dressage |
DE102006009468A1 (de) * | 2006-02-27 | 2007-08-30 | Aequos Endoprothetik Gmbh | Verfahren und Vorrichtung zur spanenden Bearbeitung eines Werkstückes |
US7749049B2 (en) * | 2006-05-25 | 2010-07-06 | Lightmachinery Inc. | Submerged fluid jet polishing |
CN101422872B (zh) * | 2007-10-30 | 2010-05-26 | 昆明市凯跃机电塑料有限责任公司 | 一种气浮式机械抛光方法 |
WO2009064254A1 (fr) * | 2007-11-13 | 2009-05-22 | Khoon Leong Chong | Système d'ébavurage par abrasion à liquide sous haute pression et processus associé |
KR100965852B1 (ko) * | 2008-04-22 | 2010-06-28 | (주)일신오토클레이브 | 습식 워터젯용 캐치탱크 |
JP2012222107A (ja) * | 2011-04-07 | 2012-11-12 | Toshiba Corp | 半導体装置の製造方法 |
CN103522195A (zh) * | 2013-05-07 | 2014-01-22 | 河南星智发明电子科技有限公司 | 一种研磨抛光的方法 |
US10363648B2 (en) | 2016-08-04 | 2019-07-30 | C.J. Spray | Apparatus, components, methods and systems for use in selectively texturing concrete surfaces |
CN106695576B (zh) * | 2017-03-17 | 2023-08-15 | 河南理工大学 | 前混合式脉冲磨料气体射流冲蚀方法及装置 |
DE102017127934A1 (de) | 2017-11-27 | 2019-05-29 | Sumteq Gmbh | Pulver aus Schaumstoff |
JP7163098B2 (ja) * | 2018-08-07 | 2022-10-31 | 株式会社富士技建 | 湿式ブラスト装置および湿式ブラスト方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US844046A (en) * | 1904-09-12 | 1907-02-12 | Benjamin M Frees | Art of abrading. |
US4555872A (en) * | 1982-06-11 | 1985-12-03 | Fluidyne Corporation | High velocity particulate containing fluid jet process |
DE3469145D1 (en) * | 1984-08-14 | 1988-03-10 | Johan Szucs | Stone and metal cleaning system |
US5203698A (en) * | 1991-04-25 | 1993-04-20 | Blake Thomas S | Wet foam sandblaster |
US5283991A (en) * | 1992-09-08 | 1994-02-08 | Josef Keizers | Sandblasting method and a moist-sand blasting apparatus |
US5700181A (en) * | 1993-09-24 | 1997-12-23 | Eastman Kodak Company | Abrasive-liquid polishing and compensating nozzle |
US5827114A (en) * | 1996-09-25 | 1998-10-27 | Church & Dwight Co., Inc. | Slurry blasting process |
DE10113599A1 (de) * | 2001-03-20 | 2002-10-02 | Fisba Optik Ag St Gallen | Vorrichtung zur abrasiven Bearbeitung von Flächen von optischen Elementen |
-
2004
- 2004-07-22 AT AT04017335T patent/ATE411139T1/de not_active IP Right Cessation
- 2004-07-22 EP EP04017335A patent/EP1618993B9/fr not_active Not-in-force
- 2004-07-22 DE DE502004008271T patent/DE502004008271D1/de active Active
-
2005
- 2005-07-22 US US11/186,802 patent/US20060019580A1/en not_active Abandoned
-
2007
- 2007-07-09 US US11/775,018 patent/US20080261493A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
ATE411139T1 (de) | 2008-10-15 |
US20080261493A1 (en) | 2008-10-23 |
EP1618993A1 (fr) | 2006-01-25 |
US20060019580A1 (en) | 2006-01-26 |
DE502004008271D1 (de) | 2008-11-27 |
EP1618993B1 (fr) | 2008-10-15 |
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