Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R33/00—Arrangements or instruments for measuring magnetic variables
  • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
  • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
  • G01R33/09—Magnetoresistive devices
  • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B82—NANOTECHNOLOGY
  • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
  • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R33/00—Arrangements or instruments for measuring magnetic variables
  • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
  • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
  • G01R33/09—Magnetoresistive devices
  • G01R33/096—Magnetoresistive devices anisotropic magnetoresistance sensors
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S19/00—Satellite radio beacon positioning systems; Determining position, velocity or attitude using signals transmitted by such systems
  • G01S19/01—Satellite radio beacon positioning systems transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
  • G01S19/13—Receivers
  • G01S19/14—Receivers specially adapted for specific applications
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
  • G01S19/00—Satellite radio beacon positioning systems; Determining position, velocity or attitude using signals transmitted by such systems
  • G01S19/01—Satellite radio beacon positioning systems transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
  • G01S19/13—Receivers
  • G01S19/35—Constructional details or hardware or software details of the signal processing chain
  • G01S19/36—Constructional details or hardware or software details of the signal processing chain relating to the receiver frond end

Definitions

• Magneto-Resistive Sensor naming as inventors Lonny L. Berg and William F. Witcraft;
• Resistive Sensor naming as inventors Mark D. Amundson and William F. Witcraft;
• Resistive Sensor Device naming as inventors William F. Witcraft, Hong Wan, Cheisan J. Yue, and Ta ara K. Bratland.
• the present application also incorporates each of these
• the present invention relates in general to magnetic field and current sensing, and
• Magnetic field sensors have applications in magnetic compassing, ferrous metal
• detection and current sensing. They may be used to detect variations in the magnetic
• AMR anisotropic magneto-resistive
• GMR giant magneto-resistive
• CMR colossal magneto-resistive
• hall effect sensor a fluxgate sensor, or a coil
• Magneto-resistive sensors may be formed using typical integrated circuit fabrication techniques.
• Permalloy a ferromagnetic alloy containing nickel and
• iron is typically used as the magneto-resistive material. Often, the permalloy is arranged
• magnetization direction of the strip may form an angle with the direction of current flow.
• Strip resistance reaches a maximum when the
• magnetization direction is parallel to the current flow, and reaches minimum when the
• magnetization direction is perpendicular to the current flow.
• permalloy strips may be electrically connected together.
• the permalloy strips may be electrically connected together.
• the permalloy strips may be electrically connected together.
• bar-pole biasing configuration may force the current in a strip to flow at a 45 -degree angle to the long axis of the strip.
• Magnetic sensors often include a number of straps through which current may be run for controlling and adjusting sensing characteristics. For example, magnetic sensor
• Such circuitry has typically been located off-chip from the magnetic sensor,
• circuitry for example, are typically located off-chip. Although such off-chip circuitry is not
• GPS Global Positioning System
• GPS receivers can also determine heading using the same signals used to determine position. However, in order to obtain
• the GPS receiver must be moving at a speed of at least 10 mph.
• GPS has been successfully used for positioning in both handheld and vehicle- mounted systems, as well as for navigation in vehicle mounted systems (when traveling at
• GPS receiver a user can determine both direction (from the magnetic field sensing
• SUMMARY One exemplary embodiment provides a single package sensor device.
• the single package sensor device is comprised of GPS receiver circuitry and a magnetic field sensing device adjacent to the GPS receiver circuitry.
• the single-package integration of the GPS receiver circuitry and the magnetic field sensing device can be accomplished in the following two ways: (1) a single-die, single package solution and (2) a multiple-die, single-package solution. Because such an integrated device may be manufactured as a single package, the user may realize advantages that include possible cost reduction, reduced size, and increased functionality, among others.
• FIGs. 1A-1C are simplified block diagrams illustrating embodiments of the
• FIGs. 2A-2C are simplified block diagrams illustrating embodiments of the
• FIG. 3 is a simplified block diagram illustrating a GPS receiver and a magneto-
• FIG. 4 is a simplified block diagram illustrating a device-architecture for a GPS receiver and a magneto-resistive sensor integrated in a single die in accordance with an
• FIG. 5 is a simplified block diagram illustrating a magneto-resistive sensor with
• FIG. 6 is a simplified block diagram illustrating a typical GPS receiver
• FIG. 7 is a simplified block diagram illustrating an exemplary use for an integrated circuit
• FIG. 8 is a simplified block diagram illustrating an exemplary use for an integrated circuit
• FIGs. 1A-1C are block diagrams illustrating an integration of a GPS receiver with
• a magnetic field sensing device i.e. a magneto-resistive sensor.
• IA and IB includes a first portion 102, including a magneto-resistive sensor and wiring,
• the second portion 104 also includes signal conditioning circuitry and circuitry for ESD
• the second portion 104 is particularly amenable to standard
• the first and second portions 102, 104 are included within a single chip, so that the device 100 is a discrete, one-chip design.
• magneto-resistive sensor have typically involved at least two chips placed separately on a
• this integrated design allows a user to determine a compass heading
• GPS both while stationary and while moving.
• GPS and other satellite-based systems
• the GPS receiver to be moving at an approximate velocity of at least 10 m.p.h. relative to the surface of the earth in order to allow the GPS receiver to determine a compass
• the one-chip design of device 100 could allow a user to determine both position and
• the first and second portions 102, 104 of the device 100 may be manufactured
• CMOS complementary metal-oxide-semiconductor
• GaAs gallium-arsenide
• BiCMOS bipolarCMOS
• InP indium phosphide
• SOI silicon-on-dielectric
• MOI micro wave-on-insulator
• the first portion 102 is manufactured using standard lithography,
• the second portion 104 is preferably manufactured using Honeywell's MOI-5 0.35 micron processing, or another RF/microwave method,
• FIGs. IA illustrates a first
• GPS receiver 104 and possibly other circuitry, such as signal conditioning and ESD
• FIG. IB illustrates a second way in which a magnetic field sensing device can be integrated with a GPS receiver.
• a magneto-resistive sensor 102 is fabricated
• GPS receiver 104 and signal conditioning circuitry are fabricated
• first die and the second die may then be placed in close proximity to
• GPS receiver 104 and magneto-resistive sensor 102 may simply be
• FIG. lC. illustrates a second embodiment of a single die integration wherein a magneto-resistive sensor 102 and a GPS receiver 104 and other circuitry are
• wiring 108 is contained in a single die. However, in the embodiment illustrated in FIG. 1C, wiring 108 is contained in a single die. However, in the embodiment illustrated in FIG. 1C, wiring 108
• GPS receiver circuitry and signal conditioning circuitry may generate
• the device 100 may need to be physically separated from parts of the second portion 104 in
• FIG. 2 A illustrates three exemplary configurations for such a shield.
• the device 200 of FIG. 2 A is
• the shielding layer 206 a single die integration of a magnetic field sensing device 202 and a GPS receiver 204 with a shielding layer 206 located substantially between the two.
• the shielding layer 206
• first and second portions 202, 204 may extend over some of or over the entire interface between the first and second portions 202, 204, depending on the characteristics of the electromagnetic fields and the location
• FIG. 2B illustrates a single die integrated magnetic field sensing device 202
• GPS receiver 204 with a shielding layer 208 located within the second portion 204.
• Shielding layer 208 is a localized shield which might be beneficial where the majority of
• the magnetic field effects originate from a relatively small part of the second portion 204.
• the shield 208 may also be advantageous in designs having electrical connections between the first and second portions 202, 204. However, shielding layer 208 could be
• FIG. 2C illustrates a multiple die, integrated magnetic field sensing device 202 and GPS receiver 204 with a shielding layer 210 located substantially between the
• the magnetic field sensing device 202 may extend over some of or over the entire interface between the magnetic field sensing device 202 and the GPS receiver 204, depending on the characteristics of the
• the sensing device 202, the GPS receiver 204, and the shielding layer 210 are contained in a
• shielding layer may comprise metal or a magnetic material (e.g. NiFe film),
• FIG. 3 illustrates an exemplary architecture of a device 300, in which a GPS
• GPS receiver 302 may be implemented with a magnetic field sensing device 304 on a single die.
• the GPS receiver circuitry (along with any signal conditioning circuitry and drivers for set and/or offset straps associated with the magnetic field sensing device portion) may
• sensor 304 may be fabricated above the planar dielectric layer 306. Also shown in FIG. 3
• contacts 308 for connecting the GPS receiver underlayer 302 with the magneto-
• NiFe permalloy structures 310 which are part of the
• the GPS receiver underlayer 302 may be fabricated
• a substantially planar dielectric layer 306 i.e. contact glass is then deposited on the GPS receiver underlayer 302, on top of which the magneto-resistive sensor 304 is then
• the GPS receiver underlayer 302 is fabricated first because its fabrication
• planar dielectric layer 306 is to provide a substantially planar surface on which the
• magneto-resistive sensor can be fabricated, as well as to electrically isolate the GPS receiver underlayer 302 from the magneto-resistive sensor 304.
• FIG. 4 illustrates a detailed view of an exemplary architecture of a device 400, in which a GPS receiver may be implemented with a magnetic field sensing device on a
• the GPS receiver circuitry (along with any signal conditioning circuitry and
• CMOS/Bipolar underlayers 402 may be fabricated largely within the CMOS/Bipolar underlayers 402, while a
• magneto-resistive sensor may be fabricated in layers 404-408, above the planar dielectric
• NiFe permalloy structures NiFe permalloy structures, a 1 st dielectric layer 408, a second dielectric layer 406, and a
• layers 404-408 are formed using standard lithography, metallization, and etch processes, while layers 410 and 402 are formed using
• magneto-resistive sensor such as set, reset, and offset straps; signal conditioning circuitry, and ESD protection circuitry
• signal conditioning circuitry such as set, reset, and offset straps; signal conditioning circuitry, and ESD protection circuitry
• including two sensor units is formed from magneto-resistive material having a crystal
• Means are provided for setting a direction of magnetization in the elements of the first and
• An output of the first sensor unit is representative of magnetic field
• Pant et al. provides a magnetic field sensor that isotropically senses an incident
• the magneto-resistive material used is preferably isotropic,
• the resulting image may be a CMR material or some form of a GMR material. Because the sensor elements are circular in shape, shape anisotropy is minimized. Thus, the resulting image
• the magnetic field sensor includes a first leg and
• the first leg is connected between an output net and a first power supply
• the second leg is connected between the output net and a second power supply
• At least one circular shaped sensor element formed from a magneto-resistive material is incorporated into at least one
• first and second legs Preferably, two or more circular shaped magneto-resistive sensor elements are incorporated into either the first leg or second leg, with the other leg
• the two or more circular shaped sensor formed from a non-magneto-resistive material.
• elements are preferably connected in a series configuration via a number of non-magneto- resistive connectors to form the corresponding leg.
• the circular shaped magnetic sensor device To maximize the sensitivity of the magnetic sensor device, the circular shaped
• sensor elements are preferably formed from a CMR material. However, it is
• GMR materials may also be used.
• Illustrative CMR materials are those
• the Colossal MR material is LaCaMnO, having concentrations of La
• the magnetic field sensor includes a first leg, a
• the first and second legs preferably are connected between a first output net and a second output net, respectively, and a first power supply terminal.
• the third and fourth legs preferably are connected between the
• first and fourth legs are each formed from
• the corresponding two or more circular shaped sensor elements are preferably connected in a series configuration via a number of non-magneto-resistive connectors to form the
• the circularly shaped magneto-resistive sensor elements are preferably
• Integral Coils for Producing Magnetic Fields Wan provides both a setting/resetting feature and an independent feature of
• Wan uses an extremely-small, low-power device that includes a
• opposing bridge elements may be set in the same or opposite direction depending on the particular design.
• the current strap produces a known magnetic field at the magnetic field sensing elements.
• the known magnetic field is used for functions such as testing,
• Witcraft et al. provides a method that includes (i) fabricating a magnetic field
• Pant et al. II includes a device for setting and resetting the magnetic
• a current strap is provided for setting the directions of magnetization in opposing bridge
• a second current strap produces a
• the known magnetic field is a known magnetic field at the magnetic field sensing elements.
• the known magnetic field is a known magnetic field at the magnetic field sensing elements.
• Witcraft et al. //provides a method for manufacturing a magnetic field sensor that
• the sensor includes a substrate, a current strap, and the magnetic field sensing
• Witcraft et al. II also provides either a set-reset strap or an offset strap as the
• This embodiment may also include both a set-reset strap and an offset strap
• the magnetic field sensing structure also includes Permalloy strips electrically connected to one another and to an output terminal,
• the 360-degree rotary position sensor is comprised of a Hall
• the 360-degree rotary position sensor is located on a rotating shaft. The 360-degree rotary position sensor is located
• the Hall sensor detects a polarity
• the magneto-resistive sensor detects an angular position of the
• an output from the magneto-resistive sensor provides sensing of the angular position of
• Resistor or a Plurality of Magnetoresistive Resistors provides a single magnetic-field-dependent resistor comprising
• the highly-conductive thin-film conductor strip is provided with a meandering structure. To create a resistance under current flow,
• the magneto-resistive film strips are
• the magnetic field sensors can be operated in immediate proximity to each other.
• the remagnetization conductor also has a very low inductance, so
• the self-magnetization in the areas of the magneto-resistive resistor is set in a certain manner, hi this state, the magnetic field that
• the output voltage is smaller than in the case without a magnetic field.
• magneto-resistive film strip in another embodiment.
• the current through these highly-resistive film strip is
• conductive film strips is controlled by the sensor output voltage such that the applied
• resistive magnetic field sensor acts as a zero detector.
• the output quantity of the resistive magnetic field sensor acts as a zero detector.
• resistors each comprising a plurality of regions, are provided above the thin-layer
• the regions are provided with Barber pole structures of an alternating positive and negative angle from the longitudinal direction of the magneto-resistive film strip such that they respectively begin with alternating regions of a positive and negative Barber pole structure angle.
• the four resistors are connected to form a Wheatstone bridge. If the remagnetization conductor is again operated with pulses of altematingly opposite directions, an AC voltage signal appears at the bridge output. Only one direct voltage signal, which results from the possibly non-identical four resistance values of the bridge, is supe ⁇ osed over this signal. This direct voltage component is, however, significantly smaller than in the use of a single resistor, which permits simpler evaluation.
• the bridge arrangement can comprise four resistors formed from an even number of regions. Only the sequence of the angle of the Barber pole structure changes from one resistor to the other. The remagnetization direction is set in the regions by a first, strong current pulse through the remagnetization conductor.
• the sensor bridge is thus magnetic field-sensitive, and can be used in a conventional manner without further remagnetization. Because all four resistors of the bridge comprise identical regions, identical changes are to be expected in all resistors when the temperature of the sensor arrangement is variable. This also applies for the change component that arises because of the variable layer voltages and, subsequently, because of the magnetostriction.
• the sensor bridge therefore has a reduced zero point compared to known sensor bridge arrangements, and is therefore also suited for measuring smaller fields in conventional operation.
• a constant current through the remagnetization conductor can serve to generate a certain stabilization magnetic field, via which a certain sensor sensitivity is set.
• the arrangement of Dettmann et al therefore, can be used advantageously in the application of different evaluation methods for magnetic field measurement.
• FIG. 5 illustrates a plan view of one embodiment of a device 500 in which a GPS
• Exemplary parts of the device 500 include a magnetoresistive bridge 502, set/reset straps 504, offset straps 506, set/reset circuitry 508, 510,
• FIG. 6 is a simplified block diagram of a GPS receiver 600.
• the GPS receiver 600 receives signals 602 from at least three different GPS satellites received by an
• the received signals 602 are then usually filtered by a passive
• bandpass prefilter 604 to reduce out-of-band RF interference and preamplified 604.
• the RF signals are typically downconverted to an intermediate frequency (IF) 606, and
• DSP DSP processor
• FIG. 7 illustrates one application 700 for the integrated GPS receiver and magnetic field sensing device set forth herein.
• a user 702 is shown with a cell phone 704 having a single-chip integrated GPS receiver and magnetic field sensing device.
• the user 702 is able to obtain location and heading information by orienting the cell phone 704 in the direction the user 702 is facing, for example.
• the magnetic field sensing device is able to determine direction while the GPS receiver is able to determine the user's 702 location.
• the combination provides synergistic effects, such as the ability to perform database lookups to combine directions with yellow page information.
• a user 702 could obtain a phone number for a business or residence the user is facing by causing the cell phone 704 to transmit location and heading information to a network server, which could respond with the phone number.
• FIG. 8 illustrates another application 800 for the integrated GPS receiver and magnetic field sensing device set forth herein.
• a user 802 is show with a video camera 804 having a single-chip integrated GPS receiver and magnetic field sensing device.
• the user 802 is able to obtain location and heading information by orienting the video camera 804 in the direction the user is facing.
• the magnetic field sensing device is able to tell the user 802 what direction he is facing, while the GPS receiver is able to determine the user's 802 location.
• the combination provides synergistic effects, such as the ability to record location and heading information which correlates to the footage being recorded by the user 802.
• the user 802 could allow the user 802 to later identify buildings or other landmarks that that were recorded, as well as allow the user 802 to later find the same area where particular footage was recorded. Of course, many other uses are possible as well. Because only one chip is needed, rather than two or more, the overall size of the user's 802 device (e.g. digital camera, cell phone, portable device, watch, etc.) may be kept.
• the overall size of the user's 802 device e.g. digital camera, cell phone, portable device, watch, etc.
• Table 1 shows a simplified exemplary process for integrating a GPS
• the semiconductor device processing i.e. CMOS,
• Bipolar, GaAs, etc. is done at the front end, while the metal interconnect and the
• Table 1 is intended to be

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Remote Sensing (AREA)
• General Physics & Mathematics (AREA)
• Radar, Positioning & Navigation (AREA)
• Computer Networks & Wireless Communication (AREA)
• Chemical & Material Sciences (AREA)
• Nanotechnology (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Crystallography & Structural Chemistry (AREA)
• Signal Processing (AREA)
• Measuring Magnetic Variables (AREA)
• Hall/Mr Elements (AREA)
• Position Fixing By Use Of Radio Waves (AREA)

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• 2004
  • 2004-04-13 WO PCT/US2004/011318 patent/WO2005017456A1/en active Application Filing
  • 2004-04-13 EP EP04775885A patent/EP1613927A1/de not_active Withdrawn
  • 2004-04-14 TW TW093110411A patent/TW200510754A/zh unknown

Non-Patent Citations (1)

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