EP1597014A1 - Procede de securisation d'un processus de percage - Google Patents

Procede de securisation d'un processus de percage

Info

Publication number
EP1597014A1
EP1597014A1 EP03785510A EP03785510A EP1597014A1 EP 1597014 A1 EP1597014 A1 EP 1597014A1 EP 03785510 A EP03785510 A EP 03785510A EP 03785510 A EP03785510 A EP 03785510A EP 1597014 A1 EP1597014 A1 EP 1597014A1
Authority
EP
European Patent Office
Prior art keywords
measuring beam
laser
measuring
sensor
drilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03785510A
Other languages
German (de)
English (en)
Inventor
Tilmann Schmidt-Sandte
Joern Ostrinsky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP1597014A1 publication Critical patent/EP1597014A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Definitions

  • the present invention relates to a method for process security in a drilling process according to the preamble of patent claim 1 and a corresponding device according to the preamble of patent claim 9.
  • process emissions - such as process lighting (plasma) or acoustic signals - are recorded with appropriate sensors and the measurement signals are analyzed using evaluation algorithms.
  • a breakthrough sensor is preferably used in laser precision drilling in order to be able to detect the moment of piercing (breakthrough) of the workpiece with the laser beam on the basis of the intensity of the process lighting. This information can then be used, for example, to make statements about the drilling process and determine the drilling times required to complete the desired diameter of the drilling.
  • One criterion for a breakthrough when drilling with short-pulse laser radiation e.g. ns pulses
  • a process light that arises when drilling with ultra-short pulse laser radiation changes in its measurable intensity when the workpiece is first broken through, but only to a very small extent and can therefore only be detected with relatively complex sensor devices.
  • the conventional breakthrough sensor can therefore hardly be used in an economically sensible manner for breakthrough detection when laser drilling small bores of less than 500 ⁇ m in workpieces with a thickness of 0.5 to 1 mm to be pierced.
  • the aim of the present invention is to be able to detect the breakthrough of ultrashort pulse laser radiation when laser drilling holes with diameters in particular smaller than 500 ⁇ m, in order to achieve process security even when ultrashort pulse laser drilling.
  • the method according to the invention serves to secure the process in a drilling process, preferably a laser drilling process.
  • a hole is created in a workpiece to be machined by means of a laser drilling device.
  • a source for generating a measuring beam and a sensor for detecting this measuring beam are also used. It is provided according to the invention to arrange the workpiece, the source and the sensor relative to one another in such a way that the measurement beam is not detected until a breakthrough has occurred in the bore.
  • the measuring beam generated by the source can pass through the bore and thus the workpiece and be detected by the sensor. In this way, it is particularly easy to make a clear statement about the presence of an opening in the bore within a workpiece.
  • the laser beam and the measuring beam are guided along an identical beam path, at least in sections, in particular in the region of the bore.
  • the laser beam and the measuring beam can be guided along an identical beam path in the same or in the opposite light direction. This makes it possible, for example, to arrange the measuring beam source and the drilling device on the same or on the opposite side of the workpiece to be machined, as a result of which an available space can be optimally used if necessary.
  • the drilling method in particular the laser drilling method, can be monitored particularly efficiently.
  • the sensor used here senses the measuring beam. This enables the exact time of the breakthrough to be documented. This measure offers the possibility, for example, of switching the latter off at the moment of breakthrough by means of a suitable connection between the sensor and the laser beam.
  • the laser beam and the measuring beam have different wavelengths. This prevents the sensor from confusing the measuring beam with the laser beam in a particularly simple manner.
  • the frequency of the measuring beam can preferably be selected such that it is outside a frequency range in which process lighting produced during drilling is emitted. This prevents the sensor from confusing process lights with the measuring beam.
  • the method can be used in particular if the laser beam is designed as an ultrashort pulse laser beam. Ultrashort pulse laser beams have pulse lengths on the order of a few femtoseconds to a few picoseconds.
  • a sensor according to the invention can be designed as a spectrometer or can comprise a plurality of sensors, the frequency of which can be used to detect predetermined signals by means of the sensor.
  • the sensor is preferably matched or calibrated to frequencies of the measuring beam or the measuring signal. It expediently does not respond to the frequency of the laser beam used or to the frequencies of the process lighting occurring in the course of a drilling process.
  • optical elements such as mirrors or optics or optical elements along the beam paths of the laser beam and the measuring beam.
  • Optical elements which can be provided here include, for example, mirrors which reflect or deflect both the direction of the measuring beam and the laser beam, and / or mirrors which reflect or deflect one of the beams, preferably the laser beam, in its direction *, but preferably for the other beam the measuring beam are transparent.
  • optical elements can be provided which reflect, deflect or transmit one of the beams, preferably the measuring beam, and the other beam, preferably absorb the laser beam.
  • the measuring beam used according to the invention radiates through the bore and is detected with a suitable sensor. Based on the measured intensity or amount of energy of the measuring beam, it can be determined whether or when the hole was breached. In particular, it is possible to quantitatively assess the order of magnitude of the narrowest diameter of the bore. Even when drilling with ultra-short pulses (pulse lengths in the range fs to ps seconds), the breakthrough can be determined reliably or in real time. An evaluation of the drilling progress is possible online. Using ultra-short pulse laser drilling, micro-holes can be created with the highest precision and targeted conicity. It should be pointed out (by way of example only) that such micro bores are used, for example, as injection bores for diesel nozzles or valves.
  • FIG. 2 shows a diagram to illustrate the intensity signals that can be used according to the invention
  • FIG. 3 shows a further diagram to illustrate further usable according to the invention
  • Figure 4 is a diagram of the exemplary
  • Figures la to lc each show alternative embodiments of the device according to the invention in a schematically simplified side view.
  • a laser beam 3 is guided here via a mirror 7 and the optics 5 onto a workpiece 4.
  • the aim here is to pierce the workpiece 4.
  • a source 1 emits a measuring beam la.
  • the wavelength of the measuring beam la does not correspond to that of the laser beam 3, but ideally lies in a frequency range in which is generated during drilling Process lights not or only slightly emitted.
  • a sensor 2 also includes optical elements for beam guidance for the measurement signal la.
  • the sensor 2 can be designed as a spectrometer or can also comprise a plurality of individual sensors which detect predetermined signals in their frequency.
  • the laser beam 3 is applied downward via the deflecting mirror 7 (in the direction of the drawing) via the optics 5 to the workpiece 4 to be machined.
  • the measuring beam la generated by the source 1 strikes the workpiece 4 from below in an optic 6 after corresponding U steering, the laser beam 3 and the measuring beam la running in opposite directions on the same axis 11.
  • the use of the optics 6 has the task of directing the measuring beam la onto the underside of the workpiece, and in doing so protecting the source 1 from the laser beam 3 after it has completely pierced the workpiece 4.
  • the measuring beam la passes through the bore thus produced, and in the opposite direction to the laser beam 3 through the optics 5 and the deflecting mirror 7, which is transparent or transmissive to the frequency of the measuring beam la the sensor 2.
  • the measuring beam la is detected as a measuring signal 1b.
  • the measuring beam la is superimposed on the laser beam 3 on an optical element 7a, so that the laser beam 3 and the measuring beam la after deflecting through the mirror 7b and passing through the optics 5 in the same direction hit the workpiece 4.
  • both beams pass through the hole and reach an optical system 6, which absorbs or transmits the laser beam 3 and reflects the measuring beam la.
  • the measuring beam la After the measuring beam la has passed through the bore again due to this reflection, it is transmitted through the mirror 7b and detected by the sensor 2 as a measuring signal 1b.
  • the mirror 7b is expediently designed to be semitransparent with respect to the measuring beam la, so that part of the intensity of the measuring beam emerging from the source 1, together with the laser beam 3, is reflected onto the workpiece 4 and then the optics 6, the effects on the optics 6 reflected intensity of the measuring beam la partially passes the mirror 7b to reach the sensor 2.
  • the laser beam 3 is reflected or deflected at a mirror 7.
  • the measuring beam la the source 1 of which is arranged here above the mirror 7, passes through the mirror 7 without deflection. Both beams are superimposed on one another in the same direction on the workpiece 4.
  • the optical beam 6 deflects the measuring beam la onto the sensor 2 and detects it as a measuring signal 1b.
  • the laser beam 3 is transmitted into the optics 6 or absorbed by the latter.
  • the sensor 2 measures the amount of energy or intensity of the measuring beam la or measuring signal lb incident on it.
  • the intensity of the measuring beam la is set so that the sensor 2 does not overdrive when the hole is as large as possible.
  • no portion of the measuring beam la can strike the sensor 2 because the bore is not yet broken.
  • the process lighting also emits at a frequency of the measuring beam la, so that the start signal of the sensor 2 is not equal to zero.
  • parts of the measuring beam la reach sensor 2 and are detected as measuring signal lb.
  • the senor 2 can only detect the measurement signal 1 b when the measurement beam 1 a can propagate freely through the bore. The progress of a laser drilling can thus be reliably observed in its chronological sequence.
  • the intensity I for the radiation is plotted against the time t.
  • Measuring lines are entered in the diagrams 20, 30: the measuring lines 20a, 30a (dotted) result from the intensity of the radiation of the plasma, the measuring lines 20b, 30b (solid) result from the intensity of the measuring radiation and the measuring lines 20c, 30c (dashed) result from the intensity of the laser beam.
  • the diagram 20 shown in FIG. 2 shows measurement lines 20a, 20b, 20c resulting from a large bore with a drill core (diameter approx. 300 ⁇ m).
  • a drill core diameter approx. 300 ⁇ m.
  • first openings section 21 of measurement line 20a
  • second openings section 22
  • the intensity for the measuring beam increases only slightly from the first breakthroughs (section 21), which, as mentioned, can close again.
  • the core section 23
  • the intensity of the Measuring beam (measuring line 20a) jumps up and can be detected in a particularly simple manner.
  • the diameter of the bore is expanded (section 24). If the signal of the measuring beam remains constant, the bore has reached its final diameter (section 25).
  • measuring lines 30a, 30b, 30c are shown when drilling a small bore without a core (diameter approx. 100 ⁇ m).
  • the breakthrough area is much larger than the total bore area, so that the first breakthrough (section 31) results in a significant increase in the intensity of the measurement signal (measurement line 30b).
  • the axis for the area A of the bore is plotted in ⁇ m 2 over the axis I for the intensity signal of the measuring beam.
  • the measuring points 41 originate from bores with diameters of less than 100 ⁇ m, the measuring points 42 from bores of medium diameter and the measuring points 43 from bores with larger diameters (between 250 ⁇ m to 350 ⁇ m).
  • the intensity of the measurement signal depends on the irradiation of the hole and therefore correlates with the area of the narrowest diameter of the hole. Disturbances for the signal are the shielding effect of a possible plasma (in the borehole), fluctuations in intensity of the measuring beam source and diffraction as well as reflection effects in the borehole.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

L'invention concerne un procédé de sécurisation d'un processus de perçage, notamment d'un processus de perçage laser, au moyen d'un faisceau de mesure. Tandis qu'un faisceau laser est appliqué à une zone de la pièce, le faisceau de mesure est dirigé dans le perçage en cours de formation, dans ladite zone. Dès que le perçage est traversant, le faisceau de mesure peut traverser le perçage et être détecté par un capteur destiné à cet effet. De cette manière, il est possible de détecter précisément si le perçage est traversant et l'instant auquel le passage est réalisé.
EP03785510A 2003-02-13 2003-11-14 Procede de securisation d'un processus de percage Withdrawn EP1597014A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10305875 2003-02-13
DE10305875A DE10305875A1 (de) 2003-02-13 2003-02-13 Verfahren zur Prozesssicherung bei einem Bohrprozess
PCT/DE2003/003779 WO2004071704A1 (fr) 2003-02-13 2003-11-14 Procede de securisation d'un processus de perçage

Publications (1)

Publication Number Publication Date
EP1597014A1 true EP1597014A1 (fr) 2005-11-23

Family

ID=32863801

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03785510A Withdrawn EP1597014A1 (fr) 2003-02-13 2003-11-14 Procede de securisation d'un processus de percage

Country Status (5)

Country Link
US (1) US20060237406A1 (fr)
EP (1) EP1597014A1 (fr)
JP (1) JP2006513861A (fr)
DE (1) DE10305875A1 (fr)
WO (1) WO2004071704A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007015351B4 (de) * 2007-03-30 2013-06-20 Leibniz-Institut für Oberflächenmodifizierung e.V. Verfahren und Vorrichtung zur präzisen Positionierung eines Ionenstrahles bei gleichzeitiger Bestimmung seines Abtragsprofiles
US8674259B2 (en) * 2008-05-28 2014-03-18 Caterpillar Inc. Manufacturing system for producing reverse-tapered orifice
US8237081B2 (en) * 2008-05-28 2012-08-07 Caterpillar Inc. Manufacturing system having delivery media and GRIN lens
US20090294416A1 (en) * 2008-05-28 2009-12-03 Caterpillar Inc. Laser manufacturing system having real-time feedback
US8440933B2 (en) * 2009-04-17 2013-05-14 University Of Connecticut Systems and methods for enhanced control of laser drilling processes
US8525073B2 (en) * 2010-01-27 2013-09-03 United Technologies Corporation Depth and breakthrough detection for laser machining
US20140251533A1 (en) * 2013-03-11 2014-09-11 Samsung Display Co., Ltd. Substrate peeling device, method for peeling substrate, and method for fabricating flexible display device
US9981763B2 (en) * 2013-08-28 2018-05-29 Odds, Llc System and method for overwrapping foods products using laser perforated film
DE102017107935B4 (de) * 2017-04-12 2020-10-01 Eissmann Automotive Deutschland Gmbh Verfahren zum Einbringen einer definierten Schwächungslinie durch Materialabtrag an einem Überzugsmaterial mit einem gepulsten Laserstrahl
DE102020209589A1 (de) 2020-07-30 2022-02-03 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zum Erkennen eines Fehlschnitts beim trennenden Bearbeiten eines Werkstücks

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2112586A5 (fr) * 1970-10-20 1972-06-23 Comp Generale Electricite
CA1138936A (fr) * 1979-01-08 1983-01-04 Franklin H. Fribourg Methode et outil de percage au laser
JPS5952035B2 (ja) * 1981-06-16 1984-12-17 株式会社東芝 レ−ザ加工装置
JPS59127983A (ja) * 1982-12-24 1984-07-23 Toshiba Corp レ−ザ加工装置
JPS63108980A (ja) * 1986-10-24 1988-05-13 Mitsubishi Electric Corp レ−ザ加工装置
US5126532A (en) * 1989-01-10 1992-06-30 Canon Kabushiki Kaisha Apparatus and method of boring using laser
US5049723A (en) * 1990-03-20 1991-09-17 Cincinnati Incorporated System for detecting penetration of a blank
FR2667810B1 (fr) * 1990-10-10 1995-02-17 Framatome Sa Procede et dispositif de travail au laser avec controle a distance.
US6054673A (en) * 1997-09-17 2000-04-25 General Electric Company Method and apparatus for laser drilling
CA2328743C (fr) * 1999-12-22 2006-08-22 Honda Giken Kogyo Kabushiki Kaisha Methode d'usinage par perforation a l'aide d'un faisceau laser
US6720567B2 (en) * 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004071704A1 *

Also Published As

Publication number Publication date
WO2004071704A1 (fr) 2004-08-26
DE10305875A1 (de) 2004-09-16
US20060237406A1 (en) 2006-10-26
JP2006513861A (ja) 2006-04-27

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