EP1563330A1 - Dispositif a diodes electroluminescentes a reflecteur - Google Patents

Dispositif a diodes electroluminescentes a reflecteur

Info

Publication number
EP1563330A1
EP1563330A1 EP03772259A EP03772259A EP1563330A1 EP 1563330 A1 EP1563330 A1 EP 1563330A1 EP 03772259 A EP03772259 A EP 03772259A EP 03772259 A EP03772259 A EP 03772259A EP 1563330 A1 EP1563330 A1 EP 1563330A1
Authority
EP
European Patent Office
Prior art keywords
reflector
light
submount
led
reflector body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03772259A
Other languages
German (de)
English (en)
Inventor
Hans Kragl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Diemount GmbH
Original Assignee
Diemount GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diemount GmbH filed Critical Diemount GmbH
Publication of EP1563330A1 publication Critical patent/EP1563330A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4298—Coupling light guides with opto-electronic elements coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a light-emitting diode arrangement with a reflector, consisting of a submount on which a light-emitting diode chip is mounted, and a reflector which is aligned with the submount and has a reflector surface located in the beam path of the light-emitting diode chip.
  • Lighting with light from light-emitting diodes has a number of advantages over lighting with light from conventional light sources, especially incandescent lamps: the lifespan of LEDs is up to 100,000 hours many times longer than that of light bulbs, and the color can change Selection of a suitable LED can be chosen almost arbitrarily, the color temperature of a lamp composed of differently colored LEDs can be set electronically and the electro-optical efficiency of LED spotlights is now higher than the efficiency of classic incandescent lamps. For these reasons, LED-based lighting devices are on the advance in almost all industries and product fields.
  • An LED chip typically emits light from the chip surface isotropically, ie evenly in every direction. At a certain distance from the chip, a so-called Lambert-shaped beam distribution is obtained: perpendicular to the chip surface, the light intensity is greatest and it decreases in every direction proportional to the cosine of the angle with respect to the vertical. (Physical explanation for this eg in Gerthsen, Kneser, Vogel: Physik, 13th edition, p. 417f.) The consequence of this is that the LED chip radiates the greatest optical power in total at an angle of 45 ° perpendicular to its surface, since the product of cosine ( Lambert radiation) and sine (spherical surface element) has its maximum at 45 °. These physically given radiation conditions must be taken into account when designing lamps and lighting fixtures.
  • a lighting device which consists of a disk made of a light-conducting material, on one edge of which several LEDs are coupled next to one another via individual coupling elements, wherein the coupling elements each have a recess with a paraboloidal, mirrored wall and a submount carrying an LED is arranged at the base of the recess.
  • the same publication also describes a coupling arrangement in which the submount carrying an LED is designed as a microreflector and a coupling element for connecting an optical waveguide, which has a parabolic deflection mirror in order to connect the optical waveguide flat, is aligned with it.
  • a leadframe consists of a leadframe, the individual conductors of which are insulated from one another and connected to one another by a casting compound, which at the same time forms a reflector surface, and an optoelectric semiconductor element which is mounted directly on the leadframe and is bonded thereto.
  • a lens can be placed on the body formed by the potting compound, which lens is centered on the body and faces the semiconductor element at a distance, the space being filled with a transparent potting compound.
  • Diebond technology is known for this, however, with the help of which it is not possible to achieve placement accuracies better than ⁇ 70 ⁇ m.
  • the space that is available in the illustrated component for accommodating the semiconductor element allows such tolerances.
  • the light from the emitter must be coupled into the optical waveguide, which, however, only transmits light up to a certain maximum angle against the optical waveguide axis.
  • Light that is incident at larger angles is not guided by the fiber optic cable, but is emitted.
  • the light source feeding the optical waveguide this means that it ideally couples light into the optical waveguide only in such a way that it is passed on by the optical waveguide. This means that the light source should not exceed a certain maximum radiation angle, which depends on the type of the optical waveguide.
  • the coupling of light into an optical fiber with high efficiency is also important for optical data transmission.
  • Fig. 1 shows this structure.
  • a reflector is arranged around the LED chip, but this only reflects the light emitted to the side by the LED to a small extent in the direction of the axis.
  • the light emitted at an angle of 45 ° strikes the inner wall of the plastic body and is emitted from there after total reflection at an angle of approximately 60 °. For a light source that is supposed to emit directed light, this light is mostly lost.
  • the critical angle of total reflection for PMMA is 42 ° , which means that light which is emitted at less than 48 ° with respect to the vertical of the chip and falls on the vertical wall of the plastic body is totally reflected.
  • the reason for The flat design of the reflector according to FIG. 1 lies essentially in the technological restrictions given by the leadframe technology and the simple die-bonding in the flat reflector.
  • reflectors are known in the prior art which can be placed on the plastic housing.
  • the reflector with a diameter of 12mm is already quite large, its extension, and thus the closer concentration of the light, would lead to very bulky component sizes.
  • the exposed, sensitive inner mirror surface of the reflector attachment is only suitable to a limited extent for components exposed to harsh environmental conditions.
  • Gaggione SA, France presented a more elegant solution at the Optatec 2002 trade fair.
  • the 5mm LED is inserted into a hole in the focal point of a parabolic reflector made from non-reflecting, solid, transparent plastic.
  • Light that emerges from the 5mm LED body at too large an angle is reflected to the front by total reflection in the plastic body.
  • the arrangement is well protected against external influences (dirt, water, etc.), but the reflector is also very large in terms of its directivity.
  • a lot of light is lost due to reflections at the transition point between the 5mm LED and the reflector.
  • the invention is based on the object of specifying a light-emitting diode arrangement which can be used as a lamp in which the light from the LED is concentrated in a relatively narrow beam cone with high efficiency. This object is achieved by the features specified in claim 1. Further developments of the invention are the subject of the dependent claims.
  • the invention allows use e.g. as a signal lamp of a rail vehicle, which ideally only lights in the direction of the rails. But also a spotlight that specifically shines on an object to be illuminated (exhibits in museums, cigarette lighter in a motor vehicle, food lighting in a supermarket, etc.) needs directional light if possible.
  • the invention discloses an arrangement of a microstructured submount, consisting of a receiving opening for precise, precisely fitting mounting of the LED chip in the focal point of a paraboloid, which is formed in the submount as a metallic reflector mirror around the LED chip.
  • An extension reflector is placed or inserted on the submount, which takes on the beam formation outside the reflector in the submount.
  • the LED chip is contacted with at least one bonding wire, which is contacted through a slot in the submount on a carrier carrying the electrical leads.
  • FIG. 1 schematically shows, on an enlarged scale, a 5 mm plastic housing with an LED chip according to the prior art accommodated therein,
  • FIG. 2 shows in cross section the basic illustration of a first embodiment of the invention
  • FIG. 3 shows in cross section the solution corresponding to FIG. 2, supplemented by a housing for supporting the reflector body;
  • FIG. 4 shows a lighting fixture with a plurality of LED chips attached to the edge of a light-conducting plate with a parabolic cross section as a reflector body
  • Fig. 5 shows an arrangement comparable to Fig. 4, but with a circular disc of parabolic axial section as a reflector body
  • FIG. 6 shows an arrangement in which the reflector body is delimited by four side surfaces which form right angles with one another in sectional planes perpendicular to the perpendicular to the LED chip, but each have a parabolic curvature in a plane parallel to the perpendicular to the LED chip ,
  • FIG. 2 A first embodiment of the invention is shown in principle in FIG. 2.
  • the drawing shows a microstructured submount 1 which has a cylindrical, flat blind hole 2 for the exact fitting of an LED chip 3.
  • a space can be seen to the right and left of the chip 3 because the blind hole 2 adjusts the chip 3 over its corners.
  • the submount 1 is placed on a carrier substrate 4, such as a printed circuit board, leadframe, TO housing or the like.
  • the LED chip 3 is contacted by means of at least one bonding wire 5 from the chip surface to the carrier substrate 4. So that the bond wire 5 can be guided to the carrier substrate 4, a slot 6 is formed in the microstructured submount 1, through which the bond wire 5 is guided.
  • the second contact is either realized by means of a second bonding wire (insulating LED substrates such as sapphire) or else the chip 3 is connected to its back contact via the electrically conductive carrier substrate 4 and the electrically conductive submount 1.
  • the submount 1 there is also a parabolic reflector 7 which is designed such that the focal point of the paraboloid lies exactly in the middle of the surface of the LED chip 3.
  • the submount 1 with its reflector 7 must therefore be matched to the geometric shape of the LED chip 3.
  • this gives the technical possibility of starting beam shaping in the immediate vicinity of chip 3, which can ultimately be used to optimize the size and height.
  • a reflector body 8 made of transparent plastic (for example PMMA or PC) or clear glass is inserted into the reflector opening of the submount 1, said reflector body 8 being exactly (ie a few ⁇ m accurate!)
  • a transparent liquid plastic 9 is filled between the LED chip 3 and the reflector body 8 and fills the entire free interior of the submount 1 without bubbles.
  • the arrangement according to the invention now has the further advantage that the light losses caused by the necessary slot 6 passing through the reflector surface 7 of the submount 1 can be at least partially compensated for by reflection on the reflector body 8.
  • the reflector body 8 projects as far as possible into the submount 1 to a minimum distance from the bonding wire 5 of the LED chip 3. The light losses through the slot 6 are minimized.
  • the reflector body 8 is preferably a plastic injection-molded part, the length and diameter of which can be flexibly adapted to the respective requirements of the task at its light-emitting outer opening 11.
  • glass in particular quartz glass, can also be used as the material for the reflector body.
  • a modification of the submount 1, which is more complex to produce, is not necessary. If e.g. the beam angle is to be reduced, one only has to place another reflector body 8 on the submount 1.
  • the circumferential wall of the reflector body 8, which extends between the irradiation surface and the radiation surface and forms the reflector surface 10, is preferably high-gloss.
  • the arrangement in the outer region is preferably mechanically secured by a housing 12.
  • This should preferably also be centered on the submount 1, so that the entire component results in an arrangement as in FIG. 3.
  • 3 shows a housing 12 which touches the reflector body 8 as little as possible, so that on the Point of contact does not emit light from the reflector body 8.
  • a mechanical fixation must of course be given.
  • a weakly refractive material 13 should be located between the reflector body 8 and the housing 12 so that the reflector body 8 totally reflects the impinging steels even at larger angles of incidence.
  • the reflector body 8 can be extended upwards beyond the submount 1. It then advantageously consists, for example, of a piece of optical fiber, the end section of which has the desired paraboloid cross section.
  • a ferrule construction can be used (not shown) which centers on the submount 1, a ferrule which has a bore which receives the free end section of the reflector body 8 projecting from the submount 1 and which has such a length that it can also accommodate the end section of an optical waveguide with a precise fit.
  • the opposing end faces of the reflector body 8 and the optical waveguide are preferably ground and polished perpendicular to their axes and abut one another directly. Possibly. a transparent adhesive film can also be present between the end faces mentioned.
  • the construction according to the invention still gives manageable sizes of, for example, 10 mm length and 5 mm opening diameter and a maximum beam angle of ⁇ 14 °.
  • the radiation angle can be reduced by more than a factor of 2 with the same overall height. At the same time, there is a significant reduction in the reflector diameter.
  • Fig. 4 shows a reflector geometry, which consists of a flat plate 8a, of which Fig. 4a shows a cross section and Fig. 4b shows a plan view. It can be seen that on the edge at which the two surfaces 15, which are parabolically curved in section, approach each other, a plurality of LEDs are in each case mounted next to one another via their submounts 1, so that they can shine together into the reflector body 8a: the radiating surface facing this edge End face 1 1 a then appears as a light band.
  • the openings of the submounts 1 are not designed to be rotationally symmetrical, but instead have two reflecting surfaces which are opposite one another in mirror image, and which each form parabolic cutting lines with an imaginary cutting plane running perpendicular to them.
  • the embodiment according to FIGS. 5a and 5b can be used, for example, as an all-round beacon for maritime applications or for illuminating only one room level in living or office spaces.
  • the reflector body 8b is a disk with an opening 16 inside, which is delimited by a cylindrical light entry surface.
  • the upper and lower side surfaces of the reflector body 8b in the drawing have such a curvature that they form mirror-image, parabolic cut lines with each other with an axial section plane, and they approach each other in the direction of the edge of the opening 16.
  • a plurality of LED chips are attached next to one another in a star-shaped orientation, each via their submounts 1, comparable to the embodiment of FIG.
  • the submounts 1 have no rotationally symmetrical depressions, but are designed in the manner as explained above with reference to the exemplary embodiment of FIGS. 4a and 4b.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un dispositif à diodes électroluminescentes comprenant une embase, sur laquelle une puce à diodes électroluminescentes est montée, et un réflecteur disposé sur l'embase et présentant une surface à réflecteur se trouvant dans le trajet du faisceau de la puce à diodes électroluminescentes. Le réflecteur est formé d'une paroi latérale d'un corps solide (8, 8a, 8b, 8c) dans une matière transparente, qui présente une petite surface irradiée opposée à la puce à diodes électroluminescentes (3) et une grande surface réfléchissante (11, 11a), opposée, de manière espacée, à celle-ci, et entre lesquelles s'étend une paroi latérale formant la surface à réflecteur (10). Ladite embase (1) présente un orifice, dans lequel le corps réflecteur (8) est introduit, la surface irradiée étant située en avant.
EP03772259A 2002-10-29 2003-10-24 Dispositif a diodes electroluminescentes a reflecteur Withdrawn EP1563330A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10250383A DE10250383B4 (de) 2002-10-29 2002-10-29 Leuchtdiodenanordnung mit Reflektor
DE10250383 2002-10-29
PCT/EP2003/011840 WO2004040346A1 (fr) 2002-10-29 2003-10-24 Dispositif a diodes electroluminescentes a reflecteur

Publications (1)

Publication Number Publication Date
EP1563330A1 true EP1563330A1 (fr) 2005-08-17

Family

ID=32114930

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03772259A Withdrawn EP1563330A1 (fr) 2002-10-29 2003-10-24 Dispositif a diodes electroluminescentes a reflecteur

Country Status (4)

Country Link
US (2) US20060104060A1 (fr)
EP (1) EP1563330A1 (fr)
DE (1) DE10250383B4 (fr)
WO (1) WO2004040346A1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8360615B2 (en) * 2000-05-08 2013-01-29 Farlight, Llc LED light module for omnidirectional luminaire
JP2005353816A (ja) * 2004-06-10 2005-12-22 Olympus Corp 発光デバイス、発光デバイスの製造方法、発光デバイスを用いた照明装置、及び、プロジェクタ
DE102004047324A1 (de) * 2004-09-29 2006-04-13 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
US7329982B2 (en) 2004-10-29 2008-02-12 3M Innovative Properties Company LED package with non-bonded optical element
US7304425B2 (en) 2004-10-29 2007-12-04 3M Innovative Properties Company High brightness LED package with compound optical element(s)
BRPI0620397A2 (pt) 2005-12-22 2011-11-16 Cree Led Lighting Solutions dispositivo de iluminação
EP2002488A4 (fr) * 2006-01-20 2012-05-30 Cree Inc Deplacer un contenu spectral dans des emetteurs de lumiere a semi-conducteurs en separant des films de luminophores dans l'espace
US8441179B2 (en) 2006-01-20 2013-05-14 Cree, Inc. Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources
RU2425432C2 (ru) * 2006-06-14 2011-07-27 Конинклейке Филипс Электроникс Н.В. Осветительное устройство
US20080025037A1 (en) * 2006-07-28 2008-01-31 Visteon Global Technologies, Inc. LED headlamp
CN101689583A (zh) * 2006-12-05 2010-03-31 纳诺泰拉公司 边发射发光二极管阵列及其制备和使用方法
US20080198572A1 (en) 2007-02-21 2008-08-21 Medendorp Nicholas W LED lighting systems including luminescent layers on remote reflectors
CN101442086A (zh) * 2007-11-23 2009-05-27 富准精密工业(深圳)有限公司 发光二极管组合
US8434913B2 (en) * 2008-05-30 2013-05-07 Koninklijke Philips Electronics N.V. Round illumination device
US8165434B2 (en) 2009-03-17 2012-04-24 LumenFlow Corp. High efficiency optical coupler
US8066417B2 (en) * 2009-08-28 2011-11-29 General Electric Company Light emitting diode-light guide coupling apparatus
US8466611B2 (en) 2009-12-14 2013-06-18 Cree, Inc. Lighting device with shaped remote phosphor
DE202012011537U1 (de) 2012-11-29 2014-03-06 Novomatic Ag Leuchtrahmensystem
DE102013004773A1 (de) * 2013-03-20 2014-09-25 Jenoptik Polymer Systems Gmbh Beleuchtungsmodul
DE102014205705B4 (de) 2014-03-27 2020-11-05 Carl Zeiss Industrielle Messtechnik Gmbh Leuchttisch geeignet für Anwendungen in der Metrologie sowie Koordinatenmessgerät mit einem solchen Leuchttisch
EP3472936B1 (fr) 2016-06-21 2020-07-08 Dr. Schneider Kunststoffwerke GmbH Dispositif comportant au moins une zone pouvant être éclairée

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68923240T2 (de) * 1988-10-05 1995-11-09 Hewlett Packard Co Nichtabbildende Lichtquelle.

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE385419B (sv) * 1974-03-22 1976-06-28 Asea Ab Lysdiodanordning for utsendande av stralning i en forutbestemd riktning
GB2198867A (en) * 1986-12-17 1988-06-22 Philips Electronic Associated A liquid crystal display illumination system
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
US5764845A (en) * 1993-08-03 1998-06-09 Fujitsu Limited Light guide device, light source device, and liquid crystal display device
US5727108A (en) * 1996-09-30 1998-03-10 Troy Investments, Inc. High efficiency compound parabolic concentrators and optical fiber powered spot luminaire
DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
DE20007434U1 (de) * 2000-04-22 2000-07-20 Hess Form & Licht Gmbh & Co Lichtpoller
US6527411B1 (en) * 2000-08-01 2003-03-04 Visteon Corporation Collimating lamp
DE10065624C2 (de) * 2000-12-29 2002-11-14 Hans Kragl Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler
US6560038B1 (en) * 2001-12-10 2003-05-06 Teledyne Lighting And Display Products, Inc. Light extraction from LEDs with light pipes
US7112916B2 (en) * 2002-10-09 2006-09-26 Kee Siang Goh Light emitting diode based light source emitting collimated light
DE10257128B3 (de) * 2002-12-05 2004-05-27 Schott Glas Vorrichtung zur Einkopplung von Licht in einen Lichtleiter
US6880962B2 (en) * 2002-12-09 2005-04-19 Osram Sylvania, Inc. LED light source mimicking a filamented lamp
US7009213B2 (en) * 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
JP4773048B2 (ja) * 2003-09-30 2011-09-14 シチズン電子株式会社 発光ダイオード

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68923240T2 (de) * 1988-10-05 1995-11-09 Hewlett Packard Co Nichtabbildende Lichtquelle.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2004040346A1 *

Also Published As

Publication number Publication date
DE10250383A1 (de) 2004-05-19
DE10250383B4 (de) 2007-05-10
US20050190559A1 (en) 2005-09-01
US20060104060A1 (en) 2006-05-18
WO2004040346A1 (fr) 2004-05-13

Similar Documents

Publication Publication Date Title
EP1563330A1 (fr) Dispositif a diodes electroluminescentes a reflecteur
DE60205806T2 (de) Linse für Leuchtdioden
EP1859196B1 (fr) Module emetteur de lumiere equipe de diodes electroluminescentes et de goujons d'assemblage permettant de monter un element optique
DE102005061431B4 (de) LED-Einheit der Art Seitenausstrahlung
DE102005056654B4 (de) Licht emittierende Vorrichtung, die eine Mehrzahl überlappender Tafeln aufweist, die Ausnehmungen bilden, aus denen Licht emittiert wird
DE102012223854A1 (de) Remote-Phosphor-Konvertereinrichtung
WO2006045277A2 (fr) Dispositif d'eclairage, phares de vehicules automobiles et procede de production d'un dispositif d'eclairage
WO2013178597A1 (fr) Dispositif d'éclairage comprenant des sources de lumière à semi-conducteur et diffuseur commun
DE102012210743A1 (de) Leuchtvorrichtung mit lichtsensor
DE102009047487A1 (de) Leuchtmodul
DE102006001490A1 (de) Beleuchtungseinrichtung
DE102014114125A1 (de) Licht-emittierendes Modul, sowie das Licht-emittierende Modul benutzende Beleuchtungslichtquelle und Leuchtvorrichtung
DE10044455A1 (de) Signalleuchte
DE102004004778A1 (de) Leuchtdioden-Beleuchtungsmodul und strahlungsformende optische Einrichtung für ein Leuchtdioden-Beleuchtungsmodul
DE102017222649A1 (de) Lichtmodul, anordnung, scheinwerfer und verfahren
DE10129950A1 (de) Leuchte für Fahrzeuge und Verfahren zur Herstellung derselben
WO2016096608A1 (fr) Support à del muni d'une del et lampe munie d'un tel support à del
DE202005009770U1 (de) LED-Beleuchtungsvorrichtung
WO2014009179A1 (fr) Dispositif générateur de rayonnement électromagnétique
DE102010015068A1 (de) Lichtleitsystem
AT518666A4 (de) Kraftfahrzeug-Scheinwerfer
DE112013006624T5 (de) Beleuchtungsvorrichtung
DE10333907A1 (de) LED-Strahler
WO2011039005A1 (fr) Feu de circulation à led
EP2435751B1 (fr) Lampe électrique

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20050524

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: DIEMOUNT GMBH

17Q First examination report despatched

Effective date: 20060620

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 33/60 20100101AFI20120720BHEP

Ipc: H01L 33/58 20100101ALI20120720BHEP

Ipc: G02B 6/42 20060101ALI20120720BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20130215