EP1554553A1 - Ensemble et logement de capteur de pression - Google Patents

Ensemble et logement de capteur de pression

Info

Publication number
EP1554553A1
EP1554553A1 EP03742425A EP03742425A EP1554553A1 EP 1554553 A1 EP1554553 A1 EP 1554553A1 EP 03742425 A EP03742425 A EP 03742425A EP 03742425 A EP03742425 A EP 03742425A EP 1554553 A1 EP1554553 A1 EP 1554553A1
Authority
EP
European Patent Office
Prior art keywords
pressure
pressure sensor
unitary housing
sensing die
tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03742425A
Other languages
German (de)
English (en)
Inventor
Joel Bodin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP1554553A1 publication Critical patent/EP1554553A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation

Definitions

  • the present invention relates in general to sensors, and more particularly, to a pressure sensor housing and assembly.
  • Pressure measurements are generally made in process control industries (e.g., paper manufacturer, oil refinery, chemicals manufacturer, etc.), in vehicles (e.g., oil pressure in an engine), in aerospace manufacturing, in utilities and heating, and in other industries. Pressure measurements typically are made as absolute, gauge, or differential measurements. Absolute pressure sensors measure a pressure relative to a vacuum, gauge sensors measure a pressure relative to atmospheric pressure, and differential sensors measure a pressure difference between two inputs.
  • Pressure sensors may incorporate an "up-the-tube” pressure intake design to possibly accommodate differential, gauge, and absolute pressure measurements.
  • An up-the-tube pressure sensor may be able to measure a pressure without harm to components of the sensor.
  • an up-the-tube pressure sensor may prevent fluid from contacting electronics of a sensing die.
  • a typical up-the-tube pressure sensor has a glass header connected (via a laser-weld) to a manifold. Additionally, a printed circuit board is connected upright to the glass header using a flexible printed circuit board bond (i.e., flex-tape). Manufacturing a pressure sensor in this manner reduces the amount of space on the circuit board due to the header laser-weld and the header flex-tape bond because both the laser-weld and the flex-tape connections utilize circuit board real estate.
  • existing up-the-tube pressure sensors are configured such that pressure inputs and electrical outputs flow in opposing directions, causing interference between the inputs and outputs of the sensor.
  • existing up-the-tube pressure sensors may not fulfill manufacturing and performance requirements, and so, a pressure sensor that may be manufactured without such existing difficulties and problems is desired.
  • a unitary housing that has a pressure inlet that is defined through a surface of the unitary housing.
  • the housing also has an elongated tube positioned within the unitary housing.
  • the elongated tube has a first end and a second end. The first end is in pressure communication with the pressure inlet.
  • the housing also has a sensing die attached to the second end of the elongated tube such that pressure present at the pressure inlet is measurable by the sensing die.
  • a pressure sensor assembly has a unitary housing with a first end and a second end.
  • the first end has a surface with a pressure inlet that comprises an elongated tube.
  • the assembly also has a sensing die with a pressure sensitive surface.
  • the sensing die is coupled to the elongated tube and mounted such that the pressure sensitive surface is substantially perpendicular to the surface of the housing with the pressure inlet.
  • the assembly also has a circuit board coupled to the second end of the unitary housing such that the circuit board is substantially perpendicular to the surface of the housing with the pressure inlet.
  • an up-the-tube pressure sensor is provided that has a unitary housing comprising a pressure inlet that is defined through a surface of the unitary housing.
  • the housing also has a sensing die positioned within the unitary housing.
  • the sensing die is in pressure communication with the pressure inlet.
  • the housing further has an elongated Pyrex tube positioned within the unitary housing. The elongated Pyrex tube is in pressure communication with the pressure inlet.
  • FIG. 1 illustrates a back view of one embodiment of a pressure sensor assembly
  • FIG. 2 illustrates a cover for the pressure sensor assembly of FIG. 1;
  • FIGs. 3A-3B illustrate front and back isometric views of a portion of the pressure sensor assembly of FIG. 1;
  • FIG. 3C illustrates a cross-sectional view of a portion of the pressure sensor assembly of FIG. 1;
  • FIG. 4 illustrates a cross-sectional view of the pressure sensor assembly of FIG. 1 and the cover of FIG. 2.
  • an up-the-tube pressure sensor assembly may have a unitary housing that comprises a manifold and a header, which is connected to a circuit board.
  • the unitary housing may eliminate flex-tape bonds or laser- weld joints as in existing up-the-tube pressure sensors in order to increase circuit board space as compared to the existing pressure sensor assemblies.
  • the p-the-tube pressure sensor also isolates the electronics side of a sensing die from process fluid input signals. Therefore, the process fluid input signals may not interfere with electrical output signals using such a configuration.
  • the pressure sensor assembly 100 has a printed circuit board 102, a manifold 104 and a header 106.
  • the manifold 104 and header 106 may comprise one integral unitary pressure sensor housing 108.
  • the manifold 104 and the header 106 may be separate pieces attached or welded together to form the unitary housing 108.
  • the printed circuit board 102 may be attached to the unitary housing 108 using screws 1 l ⁇ (a-b) or their equivalent.
  • the unitary housing 108 has a base 112, the surface 114 of which has an opening to admit pressure signals being measured (the opening is not shown in FIG. 1 for ease of illustration).
  • the unitary housing 108 also has leads
  • solder joints 116 conductively couple the leads to the printed circuit board 102.
  • the printed circuit board 102 may be mounted to the unitary housing 108 so that it is perpendicular to the surface 114 of the base 112 (i.e., in an upright position relative to the unitary housing 108).
  • the base 112 of the unitary housing 108 may be a substantially planar mounting surface that enables the unitary housing 108 to be mounted to any substantially flat surface.
  • the unitary housing 108 may comprise a stainless steel material, although other materials are possible.
  • the pressure sensor assembly 100 includes the header 106 arranged substantially pe ⁇ endicular to the manifold 104.
  • the header 106 and the manifold 104 eliminates attaching the header 106 and manifold 104 together, which may eliminate manufacturing steps and additional parts, such as a laser- weld joint.
  • rotating the header 106 to be substantially pe ⁇ endicular to the manifold 104 allows the printed circuit board 102 to be soldered directly to the header 106, which may eliminate additional manufacturing and processing steps such as a separate flex-tape connection or supplementary connectors.
  • an increased area on the printed circuit board 102 may be available due to the configuration of the pressure sensor assembly 100.
  • Cover 200 may be comprised of steel, metal, ceramic, etc., and can protect the pressure sensor assembly 100 from harsh environments.
  • the cover 200 may slide over the printed circuit board 102 and the unitary housing 108 to enclose and protect them both.
  • the cover 200 may attach to the pressure sensor assembly 100 at the base 112 of the unitary housing 108 by a friction fit, snap-fit, screws, or other means.
  • the enclosure of pressure sensor assembly 100 using cover 200 may provide a sealed package for pressure sensor assembly 100.
  • the sealed package may reduce humidity or moisture effects on the printed circuit board 102 or other electronics of the pressure sensor assembly 100.
  • FIG. 3A illustrates a front isometric view of the unitary housing 108.
  • FIG. 3B illustrates a back isometric sectional view of the unitary housing 108.
  • the header 106 includes pins 300 to attach to the printed circuit board 102.
  • the pins 300 are arranged within corresponding openings of the printed circuit board 102 and may be soldered to the printed circuit board 102.
  • the pins 300 may be small wires. Although only seven pins 300 are shown in FIG. 3B for ease of illustration, any desirable number of pins may be used.
  • the pins 300 may be arranged or located in different positions on the header 106 according to a desired mounting of the printed circuit board 102.
  • FIG. 3C is a cross-sectional view of the unitary housing 108.
  • the unitary housing 108 may have a sensing die 302, an elongated tube 304, a pressure inlet 306 within the base 112, and multiple connecting leads 308.
  • the elongated tube 304 is positioned within a cavity 310 of the unitary housing 108.
  • the elongated tube 304 may be a cylindrical tube with openings on both ends, although other configurations are possible.
  • the elongated tube 304 may be angularly mounted with respect to the base 112 of the unitary housing 108 with the pressure inlet 306. For example, as illustrated in FIG. 3C, the cylindrical portion of the elongated tube 304 is mounted parallel to the base 112 of the unitary housing 108.
  • the elongated tube 304 may be mounted in other arrangements as well.
  • the elongated tube 304 may be epoxied within the cavity 310 or it may be soldered into place.
  • One end 312 of the elongated tube 304 is in communication with the pressure inlet 306.
  • the sensing die 302 is connected to the other end 314 of the elongated tube 304.
  • the sensing die 302 senses pressure at surface 316 and produces an electrical signal proportional to the pressure.
  • An input pressure applied to the sensing die 302 is transmitted through the pressure inlet 306 and through the elongated tube 304, where it reaches surface 316 of sensing die 302.
  • the input pressure may be applied by a liquid or a gas.
  • the sensing die 302 may include a flexible diaphragm with strain gauges either bonded to the diaphragm, or diffused into the diaphragm, performing as resistive elements. Under a pressure-induced strain, the resistive values of the strain gauges change, and this resistive change can be converted to an electrical output proportional to the input pressure using appropriate circuitry.
  • the sensing die 302 may also include a capacitive sensor in which a pressure diaphragm is one plate of a capacitor, the value of which changes due to a pressure-induced displacement.
  • the sensing die 302 may also be a piezoresistive pressure sensor, or silicon cell.
  • a piezoresistive pressure sensor has a diaphragm with piezoresistive strain gauges diffused into the sensing die 302. By measuring a voltage on the piezoresistive strain gauges, a pressure applied to the diaphragm may be determined. Still other variations of the sensing die 302 are possible as well.
  • the sensing die 302 generally measures a difference in pressure between two sides of the diaphragm. Thus, sensing die 302 may be able to measure absolute, differential, or gauge pressure, as required.
  • the elongated tube 304 may be comprised of Pyrex, or other materials that have a coefficient of thermal expansion that is about the same as that of the sensing die 302. This may reduce and/or prevent temperature-induced variations in signal outputs caused by using materials for the sensing die 302 and the elongated tube 304 that have different thermal coefficients of expansion. For example, since the sensing die 302 may be rigidly attached to the elongated tube 304, temperature-induced error in pressure measurements may arise due to an imbalance of coefficients of thermal expansion.
  • Connecting leads 308 extend from the sensing die 302 to the pins 300. The connecting leads 308 may be wire-bonded to the sensing die 302, or connected through other means and soldered to the pins 300.
  • FIG. 4 is a cross-sectional view of the pressure sensor assembly 100 of FIG. 1 with the cover 200 attached.
  • the surface 114 of the unitary housing 108 and the cover 200 form a seal 400.
  • surface 316 of the sensing die 302 is substantially parallel to the printed circuit board 102 and is also substantially pe ⁇ endicular to the surface 114 of the unitary housing 108. Additionally, the surface 114 is substantially pe ⁇ endicular to surface 402 of the printed circuit board 102.
  • Pe ⁇ endicular or parallel relationships between the elements described are not critical to all embodiments of the invention, however, as other arrangements may still achieve the advantages of the invention.
  • FIG. 4 also illustrates an output port 404 of the printed circuit board 102.
  • the output port 404 may be conductively coupled to an end 406 of the printed circuit board 102 opposite the unitary housing 108. However, the output port 404 may also be elsewhere on the pressure sensor assembly 100.
  • pressure sensor assembly 100 illustrated in FIGs. 1-4 and other arrangements described herein are set forth for pu ⁇ oses of example only, and other arrangements and elements can be used instead and some elements may be omitted altogether.
  • selection of materials for use in the pressure sensor assembly 100 may be chosen to withstand high pressures, temperatures, or other environmental conditions.
  • the pressure sensor assembly 100 illustrated in FIGs. 1-4 may be employed as an up-the- tube pressure sensor assembly. However, those skilled in the art will recognize that the pressure sensor assembly 100 may be used in accordance with other pressure sensing techniques also.

Abstract

L'invention porte sur un ensemble et un logement de capteur de pression. Le capteur de pression peut comporter un collecteur et une entrée-sortie intégrant un logement unitaire, ce dernier pouvant avoir un orifice d'admission de pression qui communique avec un tube allongé. Le logement unitaire peut également avoir une matrice de détection couplée au tube allongé de façon à recevoir les signaux d'entrée de pression par l'orifice d'admission de pression. La matrice de détection peut détecter une pression appliquée et dériver un signal électrique provenant de la pression appliquée.
EP03742425A 2002-06-24 2003-06-24 Ensemble et logement de capteur de pression Withdrawn EP1554553A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US173091 1988-03-24
US17309102A 2002-06-24 2002-06-24
PCT/US2003/020947 WO2004001360A1 (fr) 2002-06-24 2003-06-24 Ensemble et logement de capteur de pression

Publications (1)

Publication Number Publication Date
EP1554553A1 true EP1554553A1 (fr) 2005-07-20

Family

ID=29999013

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03742425A Withdrawn EP1554553A1 (fr) 2002-06-24 2003-06-24 Ensemble et logement de capteur de pression

Country Status (4)

Country Link
EP (1) EP1554553A1 (fr)
AU (1) AU2003278572A1 (fr)
CA (1) CA2490262A1 (fr)
WO (1) WO2004001360A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6945120B1 (en) 2004-07-02 2005-09-20 Honeywell International Inc. Exhaust gas recirculation system using absolute micromachined pressure sense die
US7073375B2 (en) 2004-07-02 2006-07-11 Honeywell International Inc. Exhaust back pressure sensor using absolute micromachined pressure sense die
US7077008B2 (en) 2004-07-02 2006-07-18 Honeywell International Inc. Differential pressure measurement using backside sensing and a single ASIC

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019388A (en) * 1976-03-11 1977-04-26 Bailey Meter Company Glass to metal seal
US5287746A (en) * 1992-04-14 1994-02-22 Rosemount Inc. Modular transmitter with flame arresting header
DE4317312A1 (de) * 1993-05-25 1994-12-01 Bosch Gmbh Robert Drucksensor in einem Kunststoffgehäuse und Verfahren zur Herstellung
DE19735892A1 (de) * 1997-05-20 1998-11-26 Bosch Gmbh Robert Drucksensor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004001360A1 *

Also Published As

Publication number Publication date
WO2004001360A1 (fr) 2003-12-31
CA2490262A1 (fr) 2003-12-31
AU2003278572A1 (en) 2004-01-06

Similar Documents

Publication Publication Date Title
EP2189773B1 (fr) Design de capteur de pression différentielle liquide/liquide basé sur un procédé de conditionnement microélectronique
US6023978A (en) Pressure transducer with error compensation from cross-coupling outputs of two sensors
KR102406604B1 (ko) 압력 센서의 보정을 위한 방법 및 장치
CA1230496A (fr) Detecteur de pression differentielle
US7412894B2 (en) Pressure sensing device incorporating pressure sensing chip in resin case
EP2568270B1 (fr) Capteur emballé avec plusieurs éléments de capteurs
US5581038A (en) Pressure measurement apparatus having a reverse mounted transducer and overpressure guard
US6272928B1 (en) Hermetically sealed absolute and differential pressure transducer
US6986285B2 (en) Pressure sensor and a rocket engine incorporating it
JP4044307B2 (ja) 圧力センサ
US20170038272A1 (en) Hermetic pressure sensor
US7930944B2 (en) ASIC compensated pressure sensor with soldered sense die attach
JP2001527210A (ja) 圧力検知装置用の汎用媒体パッケージ
US6041659A (en) Methods and apparatus for sensing differential and gauge static pressure in a fluid flow line
US20190204174A1 (en) Filling body for reducing a volume of a pressure measurement chamber
US6722205B2 (en) Unitary pressure sensor housing and assembly
US5596147A (en) Coplanar pressure sensor mounting for remote sensor
US5034848A (en) Low pressure sensor
EP1554553A1 (fr) Ensemble et logement de capteur de pression
JPH10197316A (ja) 密度補正形液面検出装置
JP3607420B2 (ja) ドライタイプ圧力検出装置
CN114295281A (zh) 差压传感器及其使用方法
JP2006514265A (ja) 圧力センサハウジングおよびアセンブリ
US11359985B2 (en) Oil filled transducers with isolated compensating capsule
EP1552260B1 (fr) Capteur de pression et fabrication de celui-ci

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20041221

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

DAX Request for extension of the european patent (deleted)
RBV Designated contracting states (corrected)

Designated state(s): DE FR GB IT SE

17Q First examination report despatched

Effective date: 20070905

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20080103